Automatic reed placing machine

The design of the automatic slab placement machine has enabled the efficient and automated placement of ceramic medium green slabs, solving the problem of low efficiency in manual placement, improving placement efficiency and ensuring the neat arrangement of green slabs.

CN223521886UActive Publication Date: 2025-11-07FUJIAN RUISHENG ELECTRONIC TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422654539.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-01
Publication Date
2025-11-07
Estimated Expiration
2034-11-01

AI Technical Summary

Technical Problem

The current method of placing ceramic substrate green sheets relies on manual operation, which is inefficient.

Method used

Design an automatic wafer placement machine, including a chip conveying device, a chip pushing device, a wafer dropping and arranging device, and a material handling device. The machine continuously conveys and places ceramic medium green wafers in a mechanized manner. The chip pushing device and the wafer dropping and arranging device neatly arrange the green wafers and stand them up, while the material handling device places them into a sagger.

Benefits of technology

It achieves efficient and automated placement of ceramic medium green pieces, improves placement efficiency, and ensures that the green pieces in the sagger are arranged neatly.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223521886U_ABST
    Figure CN223521886U_ABST
Patent Text Reader

Abstract

The utility model discloses an automatic sheet placing machine which is characterized in that the automatic sheet placing machine comprises a rack, a chip conveying device, a sheet pushing device, a falling sheet arranging device, a material taking and placing device and a plurality of saggars, and the chip conveying device, the sheet pushing device, the falling sheet arranging device and the material taking and placing device are respectively installed on the rack; along the conveying direction of the chip conveying device, the chip pushing device is arranged at a position corresponding to the rear part of the chip conveying device; the chip pushing direction of the chip pushing device is perpendicular to the conveying direction of the chip conveying device. The position of the falling piece arrangement device corresponds to that of the piece pushing device; the material taking and placing device is provided with a material taking station and a material placing station, the material taking station corresponds to the falling piece arranging device in position, and the material placing station of the material taking and placing device corresponds to the saggar capable of containing the ceramic dielectric green body pieces in position. The automatic sheet placing machine can continuously convey and place the ceramic dielectric green sheets in batches, and the sheet placing efficiency is effectively improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic dielectric production equipment, in particular to an automatic wafer placing machine. BACKGROUND

[0002] After the ceramic dielectric green wafer is processed, it needs to be collected and placed in a sagger in batches, and then sent into a sintering furnace for sintering. The existing placement method is usually to manually stack the ceramic dielectric green wafers into a whole strip, and then place them into the sagger one by one. However, this method is troublesome and needs manual placement, and the wafer placing efficiency is low. SUMMARY

[0003] The utility model provides a kind of automatic wafer placing machine, this kind of automatic wafer placing machine can continuously transport and place wafer in batches to the ceramic dielectric green wafer, effectively improve wafer placing efficiency.

[0004] To solve the above technical problems, the technical scheme adopted is as follows:

[0005] An automatic wafer placing machine is characterized by comprising a rack, a chip conveying device, a wafer pushing device, a wafer arranging device, a taking and placing device, and multiple saggers. The chip conveying device, the wafer pushing device, the wafer arranging device, and the taking and placing device are respectively installed on the rack. Along the conveying direction of the chip conveying device, the wafer pushing device is arranged at a position corresponding to the rear part of the chip conveying device. The wafer pushing direction of the wafer pushing device is perpendicular to the conveying direction of the chip conveying device. The wafer arranging device corresponds to the position of the wafer pushing device. The taking and placing device has a taking station and a placing station. The taking station corresponds to the position of the wafer arranging device, and the placing station corresponds to the position of the sagger capable of receiving the ceramic dielectric green wafer.

[0006] When the above-mentioned automatic wafer placing machine places ceramic dielectric wafers, the chip conveying device transports the ceramic dielectric green wafers to the wafer pushing device one by one. After continuous transportation, the ceramic dielectric green wafers are arranged in a row on the wafer pushing device. Then, the wafer pushing device pushes out the whole row of ceramic dielectric green wafers at the same time, so that the row of ceramic dielectric green wafers falls into the wafer arranging device at the same time. The process is repeated in sequence until multiple rows of ceramic dielectric green wafer columns are formed in the wafer arranging device, and the number of ceramic dielectric green wafers in each ceramic dielectric green wafer column is the same. After the number of ceramic dielectric green wafers in each ceramic dielectric green wafer column meets the requirement, the taking and placing device moves to the taking station, takes away all the ceramic dielectric green wafer columns in the wafer arranging device, and places the ceramic dielectric green wafer columns into the sagger when moving to the placing station. This automatic wafer placing machine can continuously transport the ceramic dielectric green wafers in batches, place each ceramic dielectric green wafer, make the ceramic dielectric green wafers stand up and stack, and effectively improve the wafer placing efficiency.

[0007] In a preferred embodiment, the green sheet arranging device comprises a first sheet blocking plate, a first sheet pushing block, a first translation driving mechanism capable of driving the first sheet pushing block to translate, a sheet swinging seat, a second sheet blocking plate, and a second translation driving mechanism capable of driving the second sheet blocking plate to translate. The first sheet blocking plate, the first translation driving mechanism, and the second translation driving mechanism are respectively mounted on the frame. The first sheet blocking plate is located behind the sheet pushing device and above the sheet swinging seat. A green sheet gap is provided between the first sheet blocking plate and the sheet pushing device. A sheet pushing gap is provided between the first sheet blocking plate and the sheet swinging seat. The first sheet pushing block is located below the sheet pushing device and corresponds to the position of the sheet pushing gap. The sheet swinging seat is provided with a plurality of sheet swinging grooves arranged side by side and extending in the front-rear direction. The sheet swinging seat is located below the first sheet pushing block. The second sheet blocking plate is located behind the first sheet pushing block and corresponds to the position of the first sheet pushing block. The sheet pushing gap is a gap for the green sheet of the ceramic medium to pass through.

[0008] Generally, in the initial state of the green sheet arranging device, the second sheet blocking plate is located behind the first sheet blocking plate, and the first sheet blocking plate is in contact with the second sheet blocking plate. The first sheet pushing block is located below the green sheet gap, and at this time, the first sheet pushing block can be arranged to be in contact with the second sheet blocking plate, or the rear side surface of the first sheet pushing block can be arranged to be flush with the front side surface of the first sheet blocking plate. The cross section of the sheet swinging groove matches the shape of the green sheet of the ceramic medium. Generally, the green sheet of the ceramic medium is circular, and the cross section of the sheet swinging groove is semicircular. The size of the green sheet gap matches the thickness of the green sheet of the ceramic medium, and the green sheet of the ceramic medium is in an upright state in the green sheet gap. When the green sheet of the ceramic medium is located in the sheet swinging groove, the green sheet of the ceramic medium corresponds to the position of the first sheet pushing block.

[0009] The above-mentioned falling piece arrangement device, when working, the pushing piece device pushes out the whole row of ceramic medium green body pieces at the same time, and the ceramic medium green body pieces are located in the falling piece gap and on the first pushing piece block, then the first translation driving mechanism drives the first pushing piece block to translate forward first, so that each ceramic medium green body piece can fall into the placing groove through the bottom of the falling piece gap; then the first translation driving mechanism drives the first pushing piece block to reset backward, in the process of moving backward, the ceramic medium green body piece can enter the pushing piece gap and push the second material blocking plate, so that the second material blocking plate moves backward by a distance of the thickness of a ceramic medium green body piece, at this time, each ceramic medium green body piece in the placing groove keeps standing; the above-mentioned actions are repeated, so that each ceramic medium green body piece falls into the placing groove, and forms multiple rows of ceramic medium green body piece rows in the placing seat; when the number of ceramic medium green body pieces in each ceramic medium green body piece row reaches the requirement, and the taking and placing device takes away all the ceramic medium green body pieces, the second translation driving mechanism drives the second material blocking plate to move forward, and returns to the state of contacting the first material blocking plate, waiting for a new round of placing.

[0010] The above-mentioned second translation driving mechanism can adopt a translation seat, a transmission belt, a driving wheel, a driven wheel and a servo motor, the servo motor is installed on the rack, the driving wheel and the driven wheel are rotatably installed on the rack, the driving wheel is in transmission connection with the output shaft of the servo motor, the transmission belt is tensioned between the driving wheel and the driven wheel, the transmission belt is perpendicular to the conveying direction of the chip conveying device, the translation seat is installed on the forward section of the transmission belt, and the second material blocking plate is installed on the translation seat. Usually, the second translation driving mechanism is arranged below the placing seat, a strip-shaped guide hole is formed in the placing seat, the strip-shaped guide hole is parallel to the conveying direction of the transmission belt, a guide column is arranged on the second material blocking plate, and the guide column passes through the strip-shaped guide hole and is connected with the translation seat. By adopting this arrangement, when the ceramic medium green body pieces are placed, the second translation driving mechanism is not started, at this time, the ceramic medium green body pieces can push the second material blocking plate to move; when the number of ceramic medium green body pieces reaches the requirement, in the process of taking the ceramic medium green body pieces by the taking and placing device, the taking and placing device first enters between the first material blocking plate and the second material blocking plate, and holds the ceramic medium green body piece row; then the second translation driving mechanism drives the second material blocking plate to move backward by a small distance (usually 1-2 thicknesses of the ceramic medium green body pieces), so that the taking and placing device can smoothly take away the ceramic medium green body piece row, and then drives the second material blocking plate to move forward again after the ceramic medium green body pieces are taken away, to return to the state of contacting the first material blocking plate, waiting for a new round of placing.

[0011] In a further preferred embodiment, the lower end of the front side of the second baffle plate is provided with a plurality of baffle blocks, the baffle blocks are the same in number as the number of the swing piece slots and correspond to each other, and the baffle blocks are located in the corresponding swing piece slots. Generally, the shape of the baffle blocks matches the shape of the ceramic medium green sheet. By providing the baffle blocks, when the number of the ceramic medium green sheets reaches the requirement and the taking and placing device needs to take the ceramic medium green sheets, the first baffle plate and the second baffle plate have a large enough gap for the taking and placing device to pass through, which can avoid the taking and placing device from contacting the second baffle plate to hinder the smooth taking of the ceramic medium green sheets.

[0012] In a further preferred embodiment, the piece pushing device comprises a second piece pushing block, a third translation driving mechanism capable of driving the second piece pushing block to translate, and a piece turning plate, the piece turning plate and the third translation driving mechanism are respectively installed on the rack; the moving direction of the second piece pushing block is perpendicular to the conveying direction of the chip conveying device, the second piece pushing block is provided with a downwardly open long strip-shaped piece arranging slot, and the long strip-shaped piece arranging slot and the conveying surface at the rear of the chip conveying device jointly enclose a piece arranging channel; the piece turning plate comprises a horizontal section, an inclined section, and a vertical section, the horizontal section is located at the same horizontal plane as the conveying surface at the rear of the chip conveying device, the front edge of the horizontal section is adjacent to one side of the conveying surface at the rear of the chip conveying device, and the horizontal section corresponds to the position of the second piece pushing block, the upper edge of the inclined section is connected to the rear edge of the horizontal section, the lower edge of the inclined section is connected to the upper edge of the vertical section, and the vertical section and the first baffle plate form the piece falling gap.

[0013] When the ceramic medium green sheets are conveyed to the rear of the chip conveying device, the ceramic medium green sheets can enter the piece arranging channel; when the number of the ceramic medium green sheets in the piece arranging channel reaches a certain number, the third translation driving mechanism drives the second piece pushing block to translate towards the horizontal section of the piece turning plate, thereby pushing the ceramic medium green sheets to translate; when the ceramic medium green sheets move to the rear end of the horizontal section, the ceramic medium green sheets can slide from the downward opening of the long strip-shaped piece arranging slot along the inclined section, and under the action of the inclined section, the ceramic medium green sheets can change from a horizontal state to a vertical state and smoothly enter the piece falling gap between the first baffle plate and the vertical section.

[0014] In a further preferred embodiment, the rack is provided with a counter, and the sensing end of the counter faces the feeding end of the piece arranging channel. The counter can count the ceramic medium green sheets entering the piece arranging channel, and when the number of the ceramic medium green sheets reaches a set number, the third translation driving mechanism drives the second piece pushing block to translate, thereby transferring the ceramic medium green sheets to the piece falling gap between the first baffle plate and the piece turning plate. The above-mentioned counter can adopt an optical proximity switch.

[0015] In a further preferred embodiment, the taking and placing device comprises a taking plate, a lifting driving mechanism capable of driving the taking plate to lift, a fourth translation driving mechanism capable of driving the lifting driving mechanism to translate, and a vacuum pump, the fourth translation driving mechanism is installed on the rack, the lower surface of the taking plate is provided with a plurality of taking grooves arranged side by side, the taking grooves extend along the front-rear direction, the taking grooves are the same in number as the piece placing grooves and correspond to the piece placing grooves one by one; the taking plate has a cavity, the taking plate is provided with an air outlet communicating with the cavity, the vacuum pump is connected with the air outlet of the taking plate, and a plurality of suction holes communicating with the cavity are arranged on the taking grooves along the length direction. Usually, the cross section of the taking groove matches the shape of the ceramic medium green sheet, and generally, the cross section of the piece placing groove is in the shape of a circular arc. The fourth translation driving mechanism drives the lifting driving mechanism to move between the taking station and the placing station; when taking or placing is needed, the lifting driving mechanism drives the taking plate to lift; the taking plate can take and place the ceramic medium green sheet column. When taking the ceramic medium green sheet column, after each ceramic medium green sheet column is embedded in the corresponding taking groove, the vacuum pump is started to form a negative pressure area at the suction hole of each taking groove, so that all the ceramic medium green sheet columns are sucked up together; after the ceramic medium green sheet column is placed in the sagger, the vacuum pump stops working to loosen the ceramic medium green sheet column. The vacuum pump can be installed on the rack or on the lifting driving mechanism.

[0016] In a preferred embodiment, the automatic piece placing machine further comprises a vibrating disc, and the rear end of the discharging track of the vibrating disc is connected with the front end of the piece conveying device. A batch of ceramic medium green sheets are placed in the vibrating disc, and the ceramic medium green sheets are arranged by the vibrating disc, and then are sent out from the rear end of the discharging track one by one and enter the front end of the piece conveying device, and then are continuously conveyed by the piece conveying device.

[0017] The piece conveying device usually further comprises a conveying belt, a driving wheel, a driven wheel and a driving motor, the driving motor is installed on the rack, the driving wheel and the driven wheel are rotatably installed on the rack, the driving wheel is in transmission connection with the output shaft of the driving motor, the conveying belt is tensioned between the driving wheel and the driven wheel, and the rear end of the discharging track of the vibrating disc is above the conveying belt. Usually, the conveying speed of the conveying belt is greater than the speed at which the ceramic medium green sheets are sent out from the vibrating disc. By adopting this arrangement, the ceramic medium green sheets can be prevented from being stacked on the conveying belt during the pushing process of the pushing device.

[0018] In a preferred embodiment, the automatic piece placing machine further comprises a sagger conveying device, the sagger conveying device is installed on the rack, and a plurality of saggars are arranged on the sagger conveying device. The sagger conveying device conveys empty saggars to positions corresponding to the placing stations of the taking and placing device, after the saggars are filled, the sagger conveying device sends out the saggars and simultaneously sends new saggars to the placing stations, and the cycle is repeated.

[0019] In a further preferred embodiment, the automatic tile placing machine further comprises a disc taking device and a saggar stacking frame, the disc taking device and the saggar stacking frame are respectively installed on the frame, the disc taking device has a disc taking station and a disc placing station, the disc taking station of the disc taking device corresponds to the position of the discharge end of the saggar conveying device, and the disc placing station of the disc taking device corresponds to the position of the saggar stacking frame. After the saggar is filled with the ceramic medium, the saggar is conveyed to the discharge end by the saggar conveying device, and then the disc taking device takes the saggar at the disc taking station and places the saggar in the saggar stacking frame for stacking. The disc taking device can be an industrial robot with multiple degrees of freedom, and a robot end effector capable of clamping the saggar is arranged at the end of the mechanical arm of the industrial robot. The robot end effector can be a mechanical claw (for example, a finger cylinder, which has two clamping jaws) driven by a cylinder, and the saggar can be gripped and released by the cylinder.

[0020] The first translation driving mechanism, the third translation driving mechanism, the fourth translation driving mechanism and the lifting driving mechanism can all be cylinders.

[0021] The automatic tile placing machine can continuously transport and place batches of ceramic medium green tiles, effectively improves the placing efficiency, and the ceramic medium green tiles in the saggar are arranged in a relatively neat manner. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 is a top view of the automatic tile placing machine in the embodiment of the utility model;

[0023] Fig. 2 is a sectional view of the tile conveying device, the tile pushing device and the tile falling and arranging device in the embodiment of the utility model;

[0024] Fig. 3 is a structural schematic view of the tile placing seat and the material taking and placing device in the embodiment of the utility model. DETAILED DESCRIPTION

[0025] The utility model will be further described in combination with the drawings and specific embodiments:

[0026] As Figs. 1-3An automatic chip arranging machine is shown, which comprises a frame 1, a chip conveying device 2, a chip pushing device 3, a chip falling and arranging device 4, a taking and placing device 5 and a plurality of sagger 6. The chip conveying device 2, the chip pushing device 3, the chip falling and arranging device 4 and the taking and placing device 5 are respectively installed on the frame 1. Along the conveying direction of the chip conveying device 2, the chip pushing device 3 is arranged at a position corresponding to the rear part of the chip conveying device 2. The pushing direction of the chip pushing device 3 is perpendicular to the conveying direction of the chip conveying device 2. The chip falling and arranging device 4 corresponds to the position of the chip pushing device 3. The taking and placing device 5 has a taking station and a placing station. The taking station corresponds to the position of the chip falling and arranging device 4. The placing station of the taking and placing device 5 corresponds to the position of the sagger 6 capable of receiving the green ceramic medium chip.

[0027] When the automatic chip arranging machine is used to arrange the ceramic medium chips, the chip conveying device 2 conveys the green ceramic medium chips one by one to the chip pushing device 3. After continuous conveying, the green ceramic medium chips are arranged in a row on the chip pushing device 3. Then the chip pushing device 3 pushes the whole row of green ceramic medium chips at the same time, so that the row of green ceramic medium chips falls into the chip falling and arranging device 4 at the same time. The process is repeated in sequence until the green ceramic medium chips form a plurality of rows of green ceramic medium chip columns in the chip falling and arranging device 4, and the number of green ceramic medium chips in each row of green ceramic medium chip column is the same. After the number of green ceramic medium chips in each row of green ceramic medium chip column reaches the requirement, the taking and placing device 5 moves to the taking station to take all the rows of green ceramic medium chip columns in the chip falling and arranging device 4, and then moves to the placing station to place the rows of green ceramic medium chip columns into the sagger 6. The automatic chip arranging machine can continuously convey the green ceramic medium chips in batches, and arrange each green ceramic medium chip to stand and stack, which can effectively improve the chip arranging efficiency.

[0028] The falling piece arranging device 4 comprises a first material blocking plate 401, a first pushing piece block 402, a first translation driving mechanism 403 capable of driving the first pushing piece block 402 to translate, a swinging piece seat 404, a second material blocking plate 405, and a second translation driving mechanism 406 capable of driving the second material blocking plate 405 to translate. The first material blocking plate 401, the first translation driving mechanism 403, and the second translation driving mechanism 406 are respectively mounted on the rack 1. The first material blocking plate 401 is located behind the pushing piece device 3 and above the swinging piece seat 404. The first material blocking plate 401 and the pushing piece device 3 have a falling piece gap 407 therebetween. The first material blocking plate 401 and the swinging piece seat 404 have a pushing piece gap 408 therebetween. The first pushing piece block 402 is located below the pushing piece device 3 and corresponds in position to the pushing piece gap 408. The swinging piece seat 404 is provided with a plurality of swinging piece grooves 4041 arranged side by side and extending in the front-rear direction. The swinging piece seat 404 is located below the first pushing piece block 402. The second material blocking plate 405 is located behind the first pushing piece block 402 and corresponds in position to the first pushing piece block 402. The pushing piece gap 408 refers to a gap for the passage of the ceramic medium green body piece.

[0029] Generally, in the initial state, the second material blocking plate 405 is located behind the first material blocking plate 401, and the first material blocking plate 401 is in contact with the second material blocking plate 405. The first pushing piece block 402 is located below the falling piece gap 407. At this time, the first pushing piece block 402 can be arranged in contact with the second material blocking plate 405, or the rear side surface of the first pushing piece block 402 can be flush with the front side surface of the first material blocking plate 401. The cross section of the swinging piece groove 4041 matches the shape of the ceramic medium green body piece. Generally, the ceramic medium green body piece is circular, and the cross section of the swinging piece groove 4041 is semicircular. The size of the falling piece gap 407 matches the thickness of the ceramic medium green body piece. The ceramic medium green body piece is in an upright state in the falling piece gap 407. When the ceramic medium green body piece is located in the swinging piece groove 4041, the ceramic medium green body piece corresponds in position to the first pushing piece block 402.

[0030] The above-mentioned falling piece arrangement device 4 works as follows: when the pushing piece device 3 pushes out the whole row of ceramic green sheet pieces, the ceramic green sheet pieces will be located in the falling piece gap 407 and on the first pushing piece block 402, then the first translation driving mechanism 403 drives the first pushing piece block 402 to translate forward first, so that each ceramic green sheet piece can fall through the bottom of the falling piece gap 407 and drop into the piece arranging groove 4041; then the first translation driving mechanism 403 drives the first pushing piece block 402 to reset backward, in the process of moving backward, the ceramic green sheet pieces can enter the pushing piece gap 408 and push the second blocking plate 405, so that the second blocking plate 405 moves backward by a distance of the thickness of a ceramic green sheet piece, at this time, each ceramic green sheet piece in the piece arranging groove 4041 keeps standing; the above-mentioned actions are repeated, so that each ceramic green sheet piece falls into the piece arranging groove 4041 and forms multiple rows of ceramic green sheet piece rows in the piece arranging seat 404; when the number of ceramic green sheet pieces in each ceramic green sheet piece row reaches the requirement and the taking and placing device 5 takes away all the ceramic green sheet pieces, the second translation driving mechanism 406 drives the second blocking plate 405 to move forward and return to the state of contacting the first blocking plate 401, waiting for a new round of piece arranging.

[0031] The second translation driving mechanism 406 adopts a translation seat 4061, a transmission belt 4062, a driving wheel 4063, a driven wheel 4064 and a servo motor 4065. The servo motor 4065 is installed on the rack 1, the driving wheel 4063 and the driven wheel 4064 are rotatably installed on the rack 1, the driving wheel 4063 is in transmission connection with the output shaft of the servo motor 4065, the transmission belt 4062 is tensioned between the driving wheel 4063 and the driven wheel 4064, the transmission belt 4062 is perpendicular to the conveying direction of the chip conveying device 2, the translation seat 4061 is installed on the front advancing section of the transmission belt 4062, and the second material blocking plate 405 is installed on the translation seat 4061. The second translation driving mechanism 406 is arranged below the tile seat 404, the tile seat 404 is provided with a strip-shaped guide hole 4042 which is parallel to the conveying direction of the transmission belt 4062, the second material blocking plate 405 is provided with a guide column 4051 which penetrates through the strip-shaped guide hole 4042 and is connected with the translation seat 4061. By adopting this arrangement, when the ceramic medium green tiles are arranged, the second translation driving mechanism 406 is not started, at this time, the ceramic medium green tiles can push the second material blocking plate 405 to move; when the number of the ceramic medium green tiles reaches the requirement, during the taking of the material by the material taking and placing device 5, the material taking and placing device 5 first enters between the first material blocking plate 401 and the second material blocking plate 405 and holds the ceramic medium green tile column; then the second translation driving mechanism 406 can first drive the second material blocking plate 405 to move backward by a small distance (usually 1-2 ceramic medium green tile thicknesses) so that the material taking and placing device 5 can smoothly take away the ceramic medium green tile column, and then the second material blocking plate 405 is driven to move forward again after the ceramic medium green tiles are taken away, to return to the state of contacting with the first material blocking plate 401, to wait for the next round of tile arrangement.

[0032] The front side lower end of the second material blocking plate 405 is provided with a plurality of material blocking blocks 4052 which are the same in number as the tile arrangement grooves 4041 and one-to-one corresponding, and the material blocking blocks 4052 are in the corresponding tile arrangement grooves 4041. Usually, the shape of the material blocking blocks 4052 matches the shape of the ceramic medium green tiles. By arranging the material blocking blocks 4052, when the number of the ceramic medium green tiles reaches the requirement and the material taking and placing device 5 needs to take the material, the gap between the first material blocking plate 401 and the second material blocking plate 405 is large enough for the material taking and placing device 5 to pass through, which can avoid the contact between the material taking and placing device 5 and the second material blocking plate 405 to hinder the smooth taking of the material.

[0033] The pushing device 3 comprises a second pushing block 301, a third translation driving mechanism 302 capable of driving the second pushing block 301 to translate, and a rotating plate 303, wherein the rotating plate 303 and the third translation driving mechanism 302 are respectively installed on the frame 1; the moving direction of the second pushing block 301 is perpendicular to the conveying direction of the chip conveying device 2, the second pushing block 301 is provided with a long strip-shaped chip arranging groove with an opening downward, and the long strip-shaped chip arranging groove and the conveying surface at the rear part of the chip conveying device 2 jointly form a chip arranging channel 23; the rotating plate 303 comprises a horizontal section 3031, an inclined section 3032 and a vertical section 3033, the horizontal section 3031 is in the same horizontal plane as the conveying surface at the rear part of the chip conveying device 2, the front edge of the horizontal section 3031 is adjacent to one side of the conveying surface at the rear part of the chip conveying device 2, and the horizontal section 3031 corresponds to the position of the second pushing block 301, the upper edge of the inclined section 3032 is connected with the rear edge of the horizontal section 3031, the lower edge of the inclined section 3032 is connected with the upper edge of the vertical section 3033, and the vertical section 3033 and the first material blocking plate 401 form a chip falling gap 407.

[0034] When the ceramic medium green sheets are conveyed to the rear part of the chip conveying device 2, the ceramic medium green sheets can enter the chip arranging channel 23; when the ceramic medium green sheets in the chip arranging channel 23 reach a certain number, the third translation driving mechanism 302 drives the second pushing block 301 to translate towards the horizontal section 3031 of the rotating plate 303, so as to push the ceramic medium green sheets to translate; when the ceramic medium green sheets move to the rear end of the horizontal section 3031, the ceramic medium green sheets can slide from the opening below the long strip-shaped chip arranging groove along the inclined section 3032, and under the action of the inclined section 3032, the ceramic medium green sheets can be converted from the horizontal state to the vertical state and smoothly enter the chip falling gap 407 between the first material blocking plate 401 and the vertical section 3033.

[0035] The frame 1 is provided with a counter 101, and the sensing end of the counter 101 faces the feeding end of the chip arranging channel 23. The counter 101 can count the ceramic medium green sheets entering the chip arranging channel 23, and when the number of the ceramic medium green sheets reaches a set number, the third translation driving mechanism 302 drives the second pushing block 301 to translate, so as to transfer the ceramic medium green sheets to the chip falling gap 407 between the first material blocking plate 401 and the rotating plate 303. The above-mentioned counter 101 can adopt an optical proximity switch.

[0036] The taking and placing device 5 comprises a taking plate 501, a lifting driving mechanism 502 capable of driving the taking plate 501 to lift, a fourth translation driving mechanism 503 capable of driving the lifting driving mechanism 502 to translate, and a vacuum pump 504, the fourth translation driving mechanism 503 is installed on the rack 1, the lower surface of the taking plate 501 is provided with a plurality of taking grooves 5011 arranged side by side, the taking grooves 5011 extend along the front-rear direction, the taking grooves 5011 are the same in number as the chip placing grooves 4041 and correspond one by one; the taking plate 501 has a cavity, the taking plate 501 is provided with a suction port communicating with the cavity, the vacuum pump 504 is connected with the suction port of the taking plate 501, and a plurality of suction holes communicating with the cavity are arranged on the taking grooves 5011 along the length direction. The cross section of the taking groove 5011 matches the shape of the ceramic medium green sheet, generally, the cross section of the chip placing groove 4041 is in the shape of an arc. The fourth translation driving mechanism 503 drives the lifting driving mechanism 502 to move between the taking station and the placing station; when taking or placing is needed, the lifting driving mechanism 502 drives the taking plate 501 to lift; the taking plate 501 can take and place the ceramic medium green sheet column. When taking the ceramic medium green sheet column, after each ceramic medium green sheet column is embedded into the corresponding taking groove 5011, the vacuum pump 504 is started to form a negative pressure area at the suction hole of each taking groove 5011, so that all the ceramic medium green sheet columns are sucked together; after the ceramic medium green sheet column is placed into the saggar 6, the vacuum pump 504 stops working to loosen the ceramic medium green sheet column. The vacuum pump 504 can be installed on the rack 1 or the lifting driving mechanism 502.

[0037] The automatic chip placing machine further comprises a vibrating disc 7, the rear end of the discharging track of the vibrating disc 7 is continuous with the front end of the chip conveying device 2. A batch of ceramic medium green sheets are placed into the vibrating disc 7, and the ceramic medium green sheets are arranged by the vibrating disc 7, and are sent out one by one from the rear end of the discharging track and enter the front end of the chip conveying device 2, and are continuously conveyed by the chip conveying device 2.

[0038] The chip conveying device 2 further comprises a conveying belt, a driving wheel, a driven wheel and a driving motor, the driving motor is installed on the rack 1, the driving wheel and the driven wheel are rotatably installed on the rack 1, the driving wheel is in transmission connection with the output shaft of the driving motor, the conveying belt is tensioned between the driving wheel and the driven wheel, and the rear end of the discharging track of the vibrating disc 7 is above the conveying belt. Generally, the conveying speed of the conveying belt is greater than the speed of the ceramic medium green sheet sent out by the vibrating disc 7, and in this way, the ceramic medium green sheets can be prevented from piling up on the conveying belt during the pushing process of the pushing device 3.

[0039] The automatic film placing machine further comprises a sagger conveying device 8, which is installed on the frame 1 and is provided with a plurality of saggars 6. The sagger conveying device 8 conveys the empty saggars 6 to positions corresponding to the sagger loading stations of the material taking and placing device 5. After the saggars 6 are filled with the material, the sagger conveying device 8 sends the saggars 6 out, and at the same time, sends new saggars 6 to the sagger loading stations, and the cycle is repeated.

[0040] The automatic film placing machine further comprises a sagger taking device 9 and a sagger stacking frame 10, which are respectively installed on the frame 1. The sagger taking device 9 is provided with a sagger taking station and a sagger placing station. The sagger taking station of the sagger taking device 9 corresponds to the position of the discharging end of the sagger conveying device 8, and the sagger placing station of the sagger taking device 9 corresponds to the position of the sagger stacking frame 10. After the saggars 6 are filled with the material, the saggars 6 are conveyed to the discharging end by the sagger conveying device 8, and then the sagger taking device 9 takes the saggars 6 away at the sagger taking station and stacks the saggars 6 in the sagger stacking frame 10. The sagger taking device 9 can be an industrial robot with multiple degrees of freedom. The robot end effector at the end of the mechanical arm of the industrial robot can hold the saggars 6. The robot end effector can be a mechanical claw (for example, a finger cylinder with two clamping jaws) driven by a cylinder, which can grip and release the saggars 6 by driving the cylinder.

[0041] The first translation driving mechanism 403, the third translation driving mechanism 302, the fourth translation driving mechanism 503 and the lifting driving mechanism 502 all adopt cylinders.

Claims

1. An automatic wafer prober, characterized by: The device comprises a rack, a chip conveying device, a chip pushing device, a chip arranging device, a material taking and placing device and a plurality of sagger, the chip conveying device, the chip pushing device, the chip arranging device and the material taking and placing device are respectively installed on the rack; along the conveying direction of the chip conveying device, the chip pushing device is arranged at a position corresponding to the rear part of the chip conveying device; the pushing direction of the chip pushing device is perpendicular to the conveying direction of the chip conveying device; the chip arranging device corresponds to the position of the chip pushing device; the material taking and placing device has a material taking station and a material placing station, the material taking station corresponds to the position of the chip arranging device, and the material placing station corresponds to the position of the sagger capable of receiving the green sheet of ceramic medium.

2. An automatic slide stager as claimed in claim 1, characterized in that: The chip arranging device comprises a first material blocking plate, a first chip pushing block, a first translation driving mechanism capable of driving the first chip pushing block to translate, a chip swinging seat, a second material blocking plate and a second translation driving mechanism capable of driving the second material blocking plate to translate, the first material blocking plate, the first translation driving mechanism and the second translation driving mechanism are respectively installed on the rack, the first material blocking plate is located behind the chip pushing device and above the chip swinging seat, the first material blocking plate has a chip falling gap between the chip pushing device and the chip swinging seat, and the first material blocking plate has a chip pushing gap between the chip pushing device and the chip swinging seat; the first chip pushing block is located below the chip pushing device, and the first chip pushing block corresponds to the position of the chip pushing gap; the chip swinging seat is provided with a plurality of chip swinging grooves arranged side by side and extending in the front-rear direction, and the chip swinging seat is located below the first chip pushing block; the second material blocking plate is located behind the first chip pushing block and corresponds to the position of the first chip pushing block.

3. An automatic slide stager as claimed in claim 2, characterized in that: The front side lower end of the second material blocking plate is provided with a plurality of material blocking blocks, the number of the material blocking blocks is the same as that of the chip swinging grooves and corresponds to the chip swinging grooves one by one, and the material blocking blocks are located in the corresponding chip swinging grooves.

4. An automatic slide stager as claimed in claim 2, characterized in that: The chip pushing device comprises a second chip pushing block, a third translation driving mechanism capable of driving the second chip pushing block to translate and a chip turning plate, the chip turning plate and the third translation driving mechanism are respectively installed on the rack; the moving direction of the second chip pushing block is perpendicular to the conveying direction of the chip conveying device, the second chip pushing block is provided with a long strip-shaped chip arranging groove with an opening downward, and the long strip-shaped chip arranging groove and the conveying surface of the rear part of the chip conveying device jointly form a chip arranging channel; the chip turning plate comprises a horizontal section, an inclined section and a vertical section, the horizontal section is located at the same horizontal plane as the conveying surface of the rear part of the chip conveying device, the front edge of the horizontal section is adjacent to one side of the conveying surface of the rear part of the chip conveying device, and the horizontal section corresponds to the position of the second chip pushing block, the upper edge of the inclined section is connected with the rear edge of the horizontal section, the lower edge of the inclined section is connected with the upper edge of the vertical section, and the vertical section forms the chip falling gap with the first material blocking plate.

5. An automatic slide stager as claimed in claim 4, characterized in that: A counter is arranged on the rack, and the sensing end of the counter faces the feeding end of the chip arranging channel.

6. An automatic slide stager as claimed in claim 2, characterized in that: The taking and placing device comprises a taking plate, a lifting driving mechanism capable of driving the taking plate to lift, a fourth translation driving mechanism capable of driving the lifting driving mechanism to translate, and a vacuum pump, the fourth translation driving mechanism is installed on the rack, a lower surface of the taking plate is provided with a plurality of chip taking grooves arranged side by side, the chip taking grooves extend along the front-rear direction, the chip taking grooves are the same in number as the chip placing grooves and correspond to the chip placing grooves one by one; the taking plate has a cavity, the taking plate is provided with a suction port communicating with the cavity, the vacuum pump is connected with the suction port of the taking plate, and a plurality of suction holes communicating with the cavity are arranged on the chip taking grooves along the length direction.

7. The automatic slide stager of claim 1 wherein: The automatic chip placing machine further comprises a vibrating disc, and a rear end of a discharging track of the vibrating disc is connected with a front end of the chip conveying device.

8. The automatic slide stager of claim 1 wherein: The automatic chip placing machine further comprises a saggar conveying device, the saggar conveying device is installed on the rack, and a plurality of saggars are arranged on the saggar conveying device.

9. An automatic slide stager as claimed in claim 8, characterized in that: The automatic chip placing machine further comprises a taking plate device and a saggar stacking frame, the taking plate device and the saggar stacking frame are respectively installed on the rack, the taking plate device has a taking plate station and a placing plate station, the taking plate station of the taking plate device corresponds to a discharging end position of the saggar conveying device, and the placing plate station of the taking plate device corresponds to a position of the saggar stacking frame.