ADB module

Abstract

The utility model discloses an ADB module. The ADB module comprises an integrated LED chip, a circuit board and a radiator. The integrated LED chip and the circuit board are both connected with the radiator; the circuit board is provided with a window, and the integrated LED chip is arranged in the window and connected with the circuit board. According to the ADB module, the integrated LED chip is directly connected with the radiator, the heat dissipation effect can be greatly enhanced, the circuit board does not need to have the heat dissipation function, other materials with low heat conduction can be selected to replace a metal substrate circuit board, and the overall cost of the whole ADB module can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to ADB car light technical field, concretely relates to a kind of ADB module. BACKGROUND

[0002] In the prior art ADB module, it comprises: LED module, radiator and high thermal conductivity circuit board, the LED module is to single chip is attached to the ceramic substrate with circuit, then fluorescent sheet is attached on the chip surface, and the chip is filled with photoresist barrier layer;LED module is attached on the circuit board by high thermal conductivity adhesive layer, and is connected by pad lead and bottom pad and circuit board;Circuit board controls LED module;Circuit board is attached on the radiator by thermal conductive adhesive layer.Metal as circuit board substrate has conductivity, generally only single-sided wiring can be designed.For higher ADB headlamp of pixel level, PCB single-sided wiring is difficult to meet the design requirements, at the same time, high thermal conductivity metal substrate with strong heat dissipation is often expensive, if using double-sided wiring multilayer metal substrate, the cost will be more expensive. SUMMARY

[0003] In order to overcome the above technical defects, the utility model provides a kind of ADB module, which can reduce cost.

[0004] In order to solve the above problems, the utility model is realized according to the following technical scheme:

[0005] A kind of ADB module, comprising: integrated LED chip, circuit board and radiator

[0006] The integrated LED chip, the circuit board are connected with the radiator;

[0007] The circuit board is provided with window, and the integrated LED chip is arranged in the window and connected with the circuit board.

[0008] As a further improvement of the utility model, the integrated LED chip is connected with the radiator by the first thermal conductive connecting layer.

[0009] As a further improvement of the utility model, the circuit board is connected with the radiator by the second thermal conductive connecting layer.

[0010] As a further improvement of the utility model, the integrated LED chip comprises a plurality of light emitting units arranged in array;

[0011] The surface of the light emitting unit is fixed with fluorescent sheet by adhesive layer.

[0012] As a further improvement of the utility model, the size of the fluorescent sheet is less than the light emitting unit, so that the anode pad of the light emitting unit is exposed to the fluorescent sheet.

[0013] Two sides of the integrated LED chip are provided with negative pads.

[0014] As a further improvement of the utility model, the circuit board is provided with positive pads and negative pads.

[0015] The positive pad of the circuit board is connected with the positive pad of the integrated LED chip through a lead wire.

[0016] The negative pad of the circuit board is connected with the negative pad of the integrated LED chip through a lead wire.

[0017] As a further improvement of the utility model, the lead wire is covered with a lead wire protection layer.

[0018] As a further improvement of the utility model, the window is filled with a light blocking layer at the connection with the integrated LED chip, and the light blocking layer is filled between adjacent light emitting units.

[0019] As a further improvement of the utility model, the height of the light blocking layer is less than the height of the upper surface of the fluorescent sheet.

[0020] Compared with the prior art, the utility model has the following beneficial effects: the integrated LED chip is directly connected with the heat sink, which can greatly enhance the heat dissipation effect, the circuit board does not need to bear the heat dissipation function, other materials with low thermal conductivity can be selected to replace the metal substrate circuit board, and the overall cost of the entire ADB module can be reduced.

[0021] As a further improvement of the utility model, the height of the upper surface of the circuit board is greater than the height of the upper surface of the fluorescent sheet.

[0022] Compared with the prior art, the utility model has the following beneficial effects: the integrated LED chip is directly mounted on the heat sink, which can greatly enhance the heat dissipation effect, the circuit board does not need to bear the heat dissipation function, other materials with low thermal conductivity can be selected to replace the metal substrate circuit board, and the overall cost of the entire ADB module can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0023] The specific embodiments of the utility model will be further described in detail below with reference to the drawings, in which:

[0024] Figure 1 It is a whole structure schematic view of the ADB module of the utility model;

[0025] Figure 2 It is another whole structure schematic view of the ADB module of the utility model;

[0026] Figure 3 It is a structure schematic view of the integrated LED chip of the utility model;

[0027] Figure 4 This is an equivalent circuit diagram of the integrated LED chip described in this utility model;

[0028] Figure 6 This is a process diagram illustrating the manufacturing of the integrated LED chip described in this utility model;

[0029] Figure 7 The process of manufacturing the ADB module described in this utility model Figure 1 ;

[0030] Figure 8 The process of manufacturing the ADB module described in this utility model Figure 2 .

[0031] Explanation of reference numerals in the attached figures: 1. Integrated LED chip; 11. Light-emitting unit; 111. Passivation layer; 112. Transparent conductive layer; 113. Positive emitting layer; 114. Multiple quantum well layer; 12. Adhesive layer; 13. Phosphor sheet; 14. Positive pad; 15. Negative pad; 16. Substrate; 17. Negative emitting layer; 2. Circuit board; 21. Window; 22. Positive pad; 23. Negative pad; 3. Heat sink; 4. First thermally conductive connection layer; 5. Second thermally conductive connection layer; 6. Lead wire; 7. Lead wire protection layer; 8. Light blocking layer. Detailed Implementation

[0032] The preferred embodiment of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiment described herein is for illustration and explanation only and is not intended to limit the present invention.

[0033] This utility model provides an ADB module, such as Figure 1 and Figure 2 As shown, it includes: an integrated LED chip 1, a circuit board 2, and a heat sink 3; the integrated LED chip 1 and the circuit board 2 are both connected to the heat sink 3; the circuit board 2 is provided with a window 21, and the integrated LED chip 1 is disposed in the window 21 and connected to the circuit board 2.

[0034] The substrate of circuit board 2 is FR4, and the heat sink 3 has heat dissipation fins made of aluminum, copper or other high thermal conductivity metals.

[0035] Furthermore, the integrated LED chip 1 is connected to the heat sink 3 through the first thermally conductive connection layer 4, and the first adhesive layer 12 is a high thermally conductive silicone.

[0036] Furthermore, the circuit board 2 is connected to the heat sink 3 through the second thermally conductive connection layer 5. The second adhesive layer 12 is made of high thermal conductivity silicone. The circuit board 2 is provided with positioning holes, and the heat sink 3 is provided with positioning posts. The positioning holes and positioning posts are positioned in a corresponding manner to facilitate positioning and installation.

[0037] As Figure 3 shown, the integrated LED chip 1 includes a plurality of light emitting units 11 arranged in an array; the surface of the light emitting unit 11 is fixed with a fluorescent sheet 13 through an adhesive layer 12, and the adhesive layer 12 is transparent silica gel. The fluorescent sheet 13 is one or several of white, red, green, and transparent fluorescent sheet 13. The base material of the fluorescent sheet 13 is glass or ceramic, and the height of the upper surface of the circuit board 2 is greater than the height of the upper surface of the fluorescent sheet 13.

[0038] Specifically, the adhesive layer 12 is coated on the surface of each light emitting unit 11, and then the fluorescent sheet 13 is aligned and attached to the surface of the light emitting unit 11. The integrated LED chip 1 has, from bottom to top, a substrate 16, a negative electrode emitting layer 17, a negative electrode pad 2315, and the light emitting unit 11 located on the negative electrode emitting layer 17. The light emitting unit 11 has, from top to bottom, the fluorescent sheet 13, the adhesive layer 12, a passivation layer 111, a transparent conductive layer 112, a positive electrode emitting layer 113, and a multiple quantum well layer 114.

[0039] Preferably, the integrated LED chip 1 of the utility model includes 12 light emitting units 11, which are arranged in two rows, each of which has 6 light emitting units 11, and each IC controls 6 light emitting units 11 in a row. Each output pin of the IC is connected to a positive electrode of a light emitting unit 11. The integrated LED chip 1 has a common cathode. Each light emitting unit 11 of the integrated LED chip 1 can be independently controlled, as Figure 4 shown.

[0040] As Figure 5 shown, the size of the fluorescent sheet 13 is smaller than that of the light emitting unit 11, so that the positive electrode pad 14 of the light emitting unit 11 is exposed to the fluorescent sheet 13, facilitating the subsequent bonding of the lead 6; the integrated LED chip 1 is provided with a negative electrode pad 15 on both sides.

[0041] The circuit board 2 is provided with a corresponding circuit, and the circuit is provided with a positive electrode pad 22 and a negative electrode pad 23; the positive electrode pad 22 of the circuit board 2 is connected to the positive electrode pad 14 of the integrated LED chip 1 through the lead 6; the negative electrode pad 23 of the circuit board 2 is connected to the negative electrode pad 15 of the integrated LED chip 1 through the lead 6, and the lead 6 is made of gold wire or aluminum wire with a diameter of 0.9-5 mil.

[0042] The lead 6 is covered with a lead protection layer 6, and the material of the lead protection layer 6 is white or black silica gel.

[0043] The size of the window 21 is greater than that of the integrated LED chip 1, so that the integrated LED chip 1 is located in the window 21, and the connection between the window 21 and the integrated LED chip 1 (i.e., the gap between the window 21 and the integrated LED chip 1) is filled with a light blocking layer 8, and the light blocking layer 8 is also filled between adjacent light emitting units 11.

[0044] The height of the light blocking layer 8 is less than the height of the upper surface of the fluorescent sheet 13, and the material of the light blocking layer 8 is white or black silica gel.

[0045] Next, the ADB module is further explained in combination with the manufacturing method:

[0046] S1, the circuit board 2 is attached to the heat sink 3 through the first heat-conducting connecting layer 4, and the integrated LED chip 1 is attached to the heat sink 3 through the second heat-conducting connecting layer 5.

[0047] Before that, the integrated LED chip 1 and the circuit board 2 need to be processed first. Figure 6 The adhesive layer 12 is coated on the surface of each light emitting unit 11, and then the fluorescent sheet 13 is aligned and attached to the surface of the light emitting unit 11 to obtain Figure 3 ; as shown, the circuit board 2 is processed by windowing 21, and at the same time, the positive electrode pad 22 and the negative electrode pad 23 are made. Figure 5

[0048] S2, the positive electrode pad 22 of the circuit board 2 is connected with the positive electrode pad 14 of the integrated LED chip 1 through the lead wire 6, and the negative electrode pad 23 of the circuit board 2 is connected with the negative electrode pad 15 of the integrated LED chip 1, as shown. Figure 7

[0049] S3, the light blocking layer is filled between the windowing 21 and the connection of the integrated LED chip 1 and the adjacent light emitting unit 11, as shown. Figure 8

[0050] S4, the lead wire protection layer 6 is covered above the lead wire 6, and finally the ADB module is obtained. Figure 2

[0051] Other specific embodiments of the utility model, please see the utility model 1, hereinafter will not be elaborated one by one.

[0052] As described above, the utility model has the following beneficial effects:

[0053] 1. Each light emitting unit can realize the control of light emitting with super-small pixel spacing;

[0054] 2. The LED chip is directly attached to the heat sink, which greatly enhances the heat dissipation effect;

[0055] 3. The circuit does not need to bear the heat dissipation, and low-thermal-conductivity FR4 can be used instead of metal substrate circuit board, thereby reducing the overall cost of the module.

[0056] ​​​​The above is only the preferred embodiment of the present application, and is not intended to limit the present application in any form. Therefore, any modification, equivalent change and modification of the above embodiment, which does not deviate from the technical solution of the present application and is based on the technical essence of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. An ADB module, characterized by, The application relates to an integrated LED chip, a circuit board and a heat sink. The integrated LED chip and the circuit board are connected with the heat sink. The circuit board is provided with a window, and the integrated LED chip is arranged in the window and connected with the circuit board. The integrated LED chip is connected with the heat sink through a first heat-conducting connecting layer.

2. The ADB module of claim 1, wherein, The circuit board is connected with the heat sink through a second heat-conducting connecting layer.

3. The ADS module of claim 1, wherein, The integrated LED chip comprises a plurality of light-emitting units arranged in an array.

4. The ADS module of any one of claims 1 to 3, wherein, The surface of the light-emitting unit is fixed with a fluorescent sheet through an adhesive layer. The size of the fluorescent sheet is smaller than that of the light-emitting unit, so that the positive pad of the light-emitting unit is exposed to the fluorescent sheet.

5. The ADS module of claim 4, wherein, Two side edges of the integrated LED chip are provided with negative pads. The circuit board is provided with positive pads and negative pads.

6. The ADB module of claim 5, wherein, The positive pad of the circuit board is connected with the positive pad of the integrated LED chip through a lead wire. The negative pad of the circuit board is connected with the negative pad of the integrated LED chip through a lead wire. The lead wire is covered with a lead wire protection layer.

7. The ADB module of claim 6, wherein, The window is filled with a light-blocking layer at the connection with the integrated LED chip, and the light-blocking layer is filled between adjacent light-emitting units.

8. The ADB module of claim 4, wherein, The height of the light-blocking layer is smaller than that of the upper surface of the fluorescent sheet.

9. The ADB module of claim 8, wherein, The height of the upper surface of the circuit board is greater than that of the upper surface of the fluorescent sheet.

10. The ADB module of claim 4, wherein, ​

Images