Conductive silver paste consolidation behavior monitoring device

Abstract

The utility model relates to the technical field of conductive silver paste monitoring, and discloses a conductive silver paste consolidation behavior monitoring device, which comprises a monitoring box, a monitoring structure is arranged in the monitoring box, and the monitoring structure comprises a movable plate arranged in the monitoring box. Through the arrangement of the monitoring structure, the electric push rod stretches out to push the two lifting plates to ascend, the lifting plates ascend to drive the base plate to ascend to the probe position of the universal meter, the two probes of the universal meter enter the two detection grooves respectively, and the conductive electrode electrifies conductive silver paste; a worker monitors the resistance change of the conductive silver paste through the universal meter, so that the worker can more accurately know the solidification process of the conductive silver paste, the worker does not need to use a probe to monitor the solidification process of the conductive silver paste, and the solidification monitoring precision of the conductive silver paste is improved; and a worker can conveniently and comprehensively capture the change of the conductive silver paste in the solidification process.

Description

TECHNICAL FIELD

[0001] The utility model relates to conductive silver paste monitoring technical field especially relates to a kind of conductive silver paste consolidation behavior monitoring devices. BACKGROUND

[0002] Conductive silver paste is a kind of key material widely used in electronic components, solar cells, printed circuit board and other fields, and the consolidation behavior of conductive silver paste is crucial to its final electrical and mechanical properties. If consolidation is poor, it may lead to a decrease in electrical conductivity, insufficient adhesion, and even failure during subsequent use. Therefore, real-time monitoring of the consolidation process of conductive silver paste is of great significance to ensure its application in high-precision and high-reliability electronic devices.

[0003] In the prior art, silver paste consolidation behavior is usually monitored by calculating its curing time after manual coating or monitoring its resistance change using a multimeter. However, the existing monitoring method still has problems such as low precision, real-time performance and automation level, and it is difficult to fully capture the changes of conductive silver paste during the consolidation process. Therefore, we propose the present utility model. UTILITY MODEL CONTENT

[0004] The utility model aims to solve the problems existing in the prior art and proposes a conductive silver paste consolidation behavior monitoring device.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0006] A conductive silver paste consolidation behavior monitoring device includes a monitoring box, a monitoring structure is arranged inside the monitoring box, the monitoring structure includes a movable plate arranged inside the monitoring box, a substrate is attached to the top surface of the movable plate, a multimeter is fixed to the top surface of the monitoring box, two probes of the multimeter penetrate through one side of the monitoring box and are located inside the monitoring box, two detection grooves are formed in the top surface of the substrate, the shape of the detection grooves corresponds to the shape of the probes of the multimeter, and two conductive electrodes are fixed to the top surface of the substrate.

[0007] As a further scheme of the utility model, an internal bottom surface of the monitoring box is fixed with a placement table, two fixed grooves are formed in the top surface of the placement table, two electric push rods are fixed inside the two fixed grooves, the extension ends of the two electric push rods are fixed with lifting plates, the two lifting plates are L-shaped, the sides of the two lifting plates close to each other are attached to the two sides of the movable plate, and the movable plate is slidingly arranged on the top surface of the placement table.

[0008] As a further scheme of the utility model, a positioning strip is fixed to the top surface of the movable plate, a positioning groove is formed in the bottom surface of the substrate, and the positioning strip and the positioning groove are slidably inserted.

[0009] As a further scheme of the utility model, the top surface of the placing table is provided with a T-shaped groove, and the bottom surface of the movable plate is fixed with a T-shaped block, which is slidably arranged in the T-shaped groove.

[0010] As a further scheme of the utility model, the inner top surface of the monitoring box is fixed with a fixed frame, and the fixed frame is internally fixed with a plurality of heating rods.

[0011] As a further scheme of the utility model, the inner wall of the monitoring box is fixed with a temperature sensor, and the monitoring box is rotatably provided with a mounting door through a hinge.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] The monitoring device, through the arrangement of the monitoring structure, the electric push rod extends to push two lifting plates to rise, the lifting plates rise to drive the base plate to rise to the probe position of the multimeter, two probes of the multimeter enter two detection grooves respectively, the conductive electrode electrifies the conductive silver paste, when the conductive silver paste gradually consolidates, the staff monitors the resistance change of the conductive silver paste through the multimeter, and along with the gradual contact and adhesion of silver particles, the resistance gradually reduces.

[0014] By measuring the resistance at different time points in the curing process, the staff can more accurately understand the consolidation process of the conductive silver paste, the staff need not use the probe to monitor the consolidation process of the conductive silver paste, the consolidation monitoring precision of the conductive silver paste is improved, and the staff can comprehensively capture the change of the conductive silver paste in the consolidation process. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The utility model provides a kind of conductive silver paste consolidation behavior monitoring device structure schematic diagram;

[0016] Figure 2 The utility model provides a kind of conductive silver paste consolidation behavior monitoring device split structure schematic diagram;

[0017] Figure 3 The utility model provides a kind of conductive silver paste consolidation behavior monitoring device monitoring box place split structure schematic diagram;

[0018] Figure 4 The utility model provides a kind of conductive silver paste consolidation behavior monitoring device placing table place split structure schematic diagram;

[0019] Figure 5 The utility model provides a kind of conductive silver paste consolidation behavior monitoring device movable plate place split structure schematic diagram.

[0020] In the figure: 1, monitoring box; 2, movable plate; 201, base plate; 202, multimeter; 203, detection groove; 204, placement table; 205, fixed groove; 206, electric push rod; 207, lifting plate; 208, conductive electrode; 3, positioning strip; 301, positioning groove; 4, T-shaped groove; 401, T-shaped block; 5, fixed frame; 501, heating rod; 6, temperature sensor; 601, installation door. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0022] In the description of the utility model, it should be pointed out that the directions or position relationships indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like are based on the directions or position relationships shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the utility model, it should be pointed out that unless otherwise specified and limited, the terms "installation", "provided with", "connection" and the like should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium; can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] As shown in Figures 1-5 A conductive silver paste consolidation behavior monitoring device, comprising a monitoring box 1, the inside of the monitoring box 1 is provided with a monitoring structure, the monitoring structure comprises a movable plate 2 arranged in the monitoring box 1, the top surface of the movable plate 2 is attached with a base plate 201, the top surface of the monitoring box 1 is fixed with a multimeter 202, two probes of the multimeter 202 penetrate through one side of the monitoring box 1 and are located in the inside of the monitoring box 1, the top surface of the base plate 201 is provided with two detection grooves 203, the shape of the detection groove 203 corresponds to the shape of the probe of the multimeter 202, and the top surface of the base plate 201 is fixed with two conductive electrodes 208.

[0025] In the embodiment, the inner bottom surface of the monitoring box 1 is fixed with a placement table 204, the top surface of the placement table 204 is provided with two fixed grooves 205, the inner part of each of the two fixed grooves 205 is fixed with an electric push rod 206, the telescopic end of each of the two electric push rods 206 is fixed with a lifting plate 207, each of the two lifting plates 207 is L-shaped, the side of each of the two lifting plates 207 close to each other is attached to the two sides of the movable plate 2, the movable plate 2 is slidingly arranged on the top surface of the placement table 204, through the arrangement of the monitoring structure, the worker applies conductive silver paste to the substrate 201 and the detection groove 203, so that the two ends of the conductive silver paste are in contact with the conductive electrode 208, then the worker places the substrate 201 on the movable plate 2, and then slides the movable plate 2 on the placement table 204 between the two lifting plates 207, at this time the lifting plate 207 is below the substrate 201, then the worker starts the electric push rod 206 to extend, the electric push rod 206 extends to push the two lifting plates 207 to rise, the lifting plate 207 rises to drive the substrate 201 to rise to the probe position of the multimeter 202, the two probes of the multimeter 202 enter the two detection grooves 203 respectively, and the conductive electrode 208 is started to conduct electricity to the conductive silver paste, when the conductive silver paste gradually solidifies, the worker monitors the resistance change of the conductive silver paste through the multimeter 202, as the silver particles gradually contact and adhere, the resistance gradually decreases, and by measuring the resistance at different time points during the solidification process, the worker can more accurately understand the solidification process of the conductive silver paste, without the worker using the probe to monitor the solidification process of the conductive silver paste, the solidification monitoring precision of the conductive silver paste is improved, and the worker can comprehensively capture the changes of the conductive silver paste during the solidification process.

[0026] In the embodiment, the top surface of the movable plate 2 is fixed with a positioning strip 3, the bottom surface of the substrate 201 is provided with a positioning groove 301, and the positioning strip 3 and the positioning groove 301 are slidingly arranged inside. When the worker places the substrate 201 on the movable plate 2, the cooperation of the positioning strip 3 and the positioning groove 301 can facilitate the worker to quickly place the substrate 201 on the movable plate 2 at the accurate position, preventing the substrate 201 from colliding with the lifting plate 207 when the movable plate 2 slides between the two lifting plates 207.

[0027] In the embodiment, the top surface of the placement table 204 is provided with a T-shaped groove 4, and the bottom surface of the movable plate 2 is fixed with a T-shaped block 401, and the T-shaped block 401 and the T-shaped groove 4 are slidingly arranged. When the worker slides the movable plate 2 on the placement table 204, the cooperation of the T-shaped block 401 and the T-shaped groove 4 can prevent the movable plate 2 from being deviated from the position on the placement table 204.

[0028] In the embodiment, the inner top surface of the monitoring box 1 is fixed with a fixed frame 5, and a plurality of heating rods 501 are fixed in the fixed frame 5. The heating rods 501 can heat the inside of the monitoring box 1, which facilitates the worker to monitor the solidification change of the conductive silver paste in a high-temperature environment.

[0029] In the embodiment, the temperature sensor 6 is fixed on the inner wall of the monitoring box 1, and the mounting door 601 is rotatably arranged on one side of the monitoring box 1 through a hinge, so that the staff can seal the monitoring box 1 through the mounting door 601, reduce external interference in the monitoring process, and the temperature sensor 6 can facilitate the staff to monitor the temperature inside the monitoring box 1.

[0030] Working principle: in use, the staff coats the conductive silver paste on the substrate 201 and the detection groove 203, so that the two ends of the conductive silver paste are in contact with the conductive electrode 208, then the staff places the substrate 201 on the movable plate 2, and then slides the movable plate 2 on the placement table 204 to between the two lifting plates 207, at this time the lifting plates 207 are below the substrate 201, then the staff starts the electric push rod 206 to extend, the electric push rod 206 extends to push the two lifting plates 207 to rise, the lifting plates 207 rise to drive the substrate 201 to rise to the probe position of the multimeter 202, the two probes of the multimeter 202 enter the two detection grooves 203 respectively, and the conductive electrode 208 is started to electrify the conductive silver paste, when the conductive silver paste gradually solidifies, the staff monitors the resistance change of the conductive silver paste through the multimeter 202, and the resistance gradually decreases with the gradual contact and adhesion of silver particles. The resistance is measured at different time points in the solidification process, when the staff places the substrate 201 on the movable plate 2, the positioning strip 3 and the positioning groove 301 are cooperatively arranged to facilitate the staff to quickly place the substrate 201 on the accurate position of the movable plate 2, so that the substrate 201 does not collide with the lifting plate 207 when the movable plate 2 slides to between the lifting plates 207, when the staff slides the movable plate 2 on the placement table 204, the T-shaped block 401 and the T-shaped groove 4 are cooperatively arranged to prevent the movable plate 2 from deviating from the position on the placement table 204, the heating rod 501 can heat the inside of the monitoring box 1, so as to facilitate the staff to monitor the solidification change of the conductive silver paste in a high-temperature environment, the staff can seal the monitoring box 1 through the mounting door 601, reduce external interference in the monitoring process, and the temperature sensor 6 can facilitate the staff to monitor the temperature inside the monitoring box 1.

[0031] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model. These changes and improvements all fall within the scope of the utility model claimed.

Claims

1. An electrically conductive silver paste consolidation behavior monitoring device comprising a monitoring box (1), characterized in that: The inside of the monitoring box (1) is provided with a monitoring structure, which comprises a movable plate (2) arranged in the inside of the monitoring box (1), the top surface of the movable plate (2) is attached with a base plate (201), the top surface of the base plate (201) is provided with two detection grooves (203), the shape of the detection grooves (203) corresponds to the shape of the probes of the multimeter (202), the top surface of the base plate (201) is fixedly provided with two conductive electrodes (208), and the top surface of the monitoring box (1) is fixedly provided with a multimeter (202).

2. The solidification behavior monitoring device of claim 1, wherein, The inside bottom surface of the monitoring box (1) is fixedly provided with a placing table (204), the top surface of the placing table (204) is provided with two fixed grooves (205), the inside of each of the two fixed grooves (205) is fixedly provided with an electric push rod (206), the telescopic end of each of the two electric push rods (206) is fixedly provided with a lifting plate (207), the two lifting plates (207) are both L-shaped, the side of each of the two lifting plates (207) close to each other is attached with the two sides of the movable plate (2), and the movable plate (2) and the top surface of the placing table (204) are arranged in a sliding mode.

3. The solidification behavior monitoring device of claim 2, wherein, The top surface of the movable plate (2) is fixedly provided with a positioning strip (3), the bottom surface of the base plate (201) is provided with a positioning groove (301), and the positioning strip (3) and the inside of the positioning groove (301) are slidably inserted.

4. The solidification behavior monitoring device of claim 3, wherein, The top surface of the placing table (204) is provided with a T-shaped groove (4), the bottom surface of the movable plate (2) is fixedly provided with a T-shaped block (401), and the T-shaped block (401) and the inside of the T-shaped groove (4) are arranged in a sliding mode.

5. The solidification behavior monitoring apparatus of claim 4, wherein, The inside top surface of the monitoring box (1) is fixedly provided with a fixed frame (5), and the inside of the fixed frame (5) is fixedly provided with a plurality of heating rods (501).

6. The solidification behavior monitoring apparatus of claim 5, wherein, One side of the inner wall of the monitoring box (1) is fixedly provided with a temperature sensor (6), and one side of the monitoring box (1) is rotatably provided with a mounting door (601) through a hinge.

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