Low-temperature-rise inductor

Abstract

The utility model discloses a low-temperature-rise inductor, which belongs to the technical field of inductors and comprises a magnetic core, a wire body and a shell, the inductor is novel in design and ingenious in device, heat can be conducted and dissipated more effectively by introducing high-heat-conductivity materials into the magnetic core and the wire body, the magnetic core and the wire body are made of high-heat-conductivity copper alloy materials, the temperature rise of the inductor is reduced, the wire body adopts the flat winding or Litz wire winding design, the surface area of the winding is increased, the heat dissipation efficiency of the winding is improved, and the service life of the inductor is prolonged. The flat winding and the Litz wire can reduce the skin effect and the proximity effect and reduce alternating current resistance, so that heating is reduced, a special heat dissipation channel is designed in the inductor, it is ensured that heat can be rapidly conducted to the outside, the heat dissipation channel can effectively guide heat to flow, heat is prevented from being accumulated in the inductor, and therefore the heat dissipation effect of the inductor is improved. By improving materials and structural design, the low-temperature-rise inductor can effectively reduce temperature rise under the high-current condition, and the overall performance and reliability are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inductors, and particularly relates to a low-temperature-rise inductor. BACKGROUND

[0002] An inductor is a component capable of converting electrical energy into magnetic energy and storing the magnetic energy, and the structure of the inductor is similar to that of a transformer, but only has one winding. The inductor has a certain inductance, and only hinders the change of current. If the inductor is in a state without current passing through, when the circuit is turned on, the inductor will try to hinder the current from flowing through it; if the inductor is in a state with current passing through, when the circuit is turned off, the inductor will try to maintain the current unchanged. The inductor is also called a choke, a reactor or a dynamic reactor.

[0003] The heat dissipation of the traditional inductor is limited by the limited thermal conductivity of the ferrite material and the winding material (such as copper wire), so that the heat is difficult to effectively dissipate under high current conditions, the temperature rise of the inductor is high, and the high temperature rise will affect the performance and service life of the inductor, and even may cause equipment failure. Therefore, the structure design of the traditional inductor does not fully consider the heat dissipation requirement, the winding is dense and the packaging is not conducive to heat dissipation, and the heat is concentrated in the winding and the magnetic core, further aggravating the temperature rise problem.

[0004] The prior art adopts a multi-layer winding or a segmented winding, and improves heat dissipation by increasing the gap between the windings. Although the heat dissipation can be improved to a certain extent, it is still limited by the thermal conductivity of the material and the overall structure design. The following methods are generally used in the prior art to achieve heat dissipation effect: one is to add heat dissipation fins or design heat dissipation holes in the packaging of the inductor to help heat dissipation. This method increases the volume and cost of the inductor, and the heat dissipation effect is limited. The second is to use a packaging material with good thermal conductivity, such as thermal conductive silicone or thermal conductive resin. Although the thermal conductivity of the packaging material is improved, the overall heat dissipation effect is still limited by the internal structure design, so it is not conducive to better heat dissipation of the inductor.

[0005] Therefore, the present application provides a low-temperature-rise inductor. Content of the utility model

[0006] The low-temperature rise inductor provided in the application solves the problems in the background art; by introducing high-thermal-conductivity materials into the magnetic core and the wire body, the magnetic core and the wire body are made of high-thermal-conductivity copper alloy materials, which can more effectively conduct and dissipate heat, reduce the temperature rise of the inductor, the wire body is designed in a flat winding or Litz wire winding to increase the surface area and heat dissipation efficiency of the winding, the flat winding and the Litz wire can reduce the skin effect and proximity effect, reduce the AC resistance, thereby reducing heat generation, a special heat dissipation channel is designed inside the inductor to ensure that heat can be quickly conducted to the outside, the heat dissipation channel can effectively guide the flow of heat and avoid heat accumulation inside the inductor, therefore, by improving the material and structure design, the low-temperature rise inductor can effectively reduce the temperature rise under high current conditions and improve the overall performance and reliability.

[0007] In order to achieve the above-mentioned purpose, the application adopts the following technical scheme:

[0008] The low-temperature rise inductor comprises a magnetic core, a wire body and a shell, the magnetic core is installed inside the shell, the wire body is wound and connected outside the magnetic core and inside the shell, a first heat dissipation channel is arranged between the magnetic core and the wire body, and graphene is arranged inside the first heat dissipation channel.

[0009] As a preferred embodiment, a heat conduction channel is arranged inside the shell and outside the wire body;

[0010] By opening the heat conduction channel and arranging nanocrystalline magnetic materials in the heat conduction channel, heat can be more effectively conducted and dissipated, the temperature rise of the inductor is reduced, and the practicability of the device is improved.

[0011] As a preferred embodiment, a second heat dissipation channel is arranged inside the shell and outside the nanocrystalline magnetic material;

[0012] By introducing a ceramic substrate into the second heat dissipation channel during packaging, the heat dissipation performance of the inductor is further improved, and the practicability of the device is improved.

[0013] As a preferred embodiment, nanocrystalline magnetic materials are arranged inside the heat conduction channel, and a ceramic substrate is arranged inside the second heat dissipation channel;

[0014] By arranging nanocrystalline magnetic materials in the heat conduction channel, heat can be more effectively conducted and dissipated, the temperature rise of the inductor is reduced, and a ceramic substrate is introduced into the second heat dissipation channel during packaging, the heat dissipation performance of the inductor is further improved, and the practicability of the device is improved.

[0015] As a preferred embodiment, an upper cover is arranged at the top end of the shell, and a lower cover is arranged at the bottom end of the shell;

[0016] By setting the upper cover and the lower cover, the sealing and waterproof performance of the inductor are improved, and the device has certain protection function, so that the practicability of the device is improved.

[0017] As a preferred embodiment, the upper end and the lower end of the shell are provided with adhesive layers at the connection positions of the upper cover and the lower cover.

[0018] By setting the adhesive layers at the connection positions of the upper cover and the lower cover, the openings are sealed, so that the practicability of the device is improved.

[0019] As a preferred embodiment, high-thermal-conductivity adhesive is arranged in the adhesive layers of the upper cover and the lower cover.

[0020] By packaging the upper cover and the lower cover with the shell through the high-thermal-conductivity adhesive, the tightness and the thermal conductivity of the packaging are ensured, so that the practicability of the device is improved.

[0021] As a preferred embodiment, the upper cover and the lower cover are connected with the shell through the high-thermal-conductivity adhesive.

[0022] By setting the high-thermal-conductivity adhesive, the upper cover and the lower cover are connected with the shell through the high-thermal-conductivity adhesive, so that the practicability of the device is improved.

[0023] The beneficial effects of the present application are as follows:

[0024] 1. The low-temperature-rise inductor, the magnetic core and the wire body are made of high-thermal-conductivity copper alloy material, which can effectively conduct and dissipate heat, reduce the temperature rise of the inductor, introduce high-thermal-conductivity material into the magnetic core and the wire body, optimize the material ratio and the manufacturing process, ensure the thermal conductivity and electromagnetic performance of the material, and adopt flat winding or Litz wire winding design for the wire body to increase the surface area and the heat dissipation efficiency of the winding, so that the skin effect and the proximity effect are reduced, the alternating current resistance is reduced, the heat is reduced, a special heat dissipation channel is designed in the inductor to ensure that the heat can be quickly conducted to the outside, the heat dissipation channel can effectively guide the heat flow, and the heat accumulation in the inductor is avoided, so that the practicability of the device is greatly improved.

[0025] 2. The low temperature rise inductor, by precision machining technology, a first heat dissipation channel is reserved between the magnetic core and the wire body, and a thermally conductive filling material graphene is used to fill the gap, as a new type of thermally conductive material, graphene has excellent thermal conductivity due to its single-layer two-dimensional crystal structure, and its thermal conductivity is as high as 5000W / mK, several times that of copper, graphene powder can be used to prepare thermally conductive paste, thermally conductive glue and other materials, used for heat dissipation of electronic devices, thereby improving the heat dissipation effect, the shell adopts advanced packaging technology, metal packaging or ceramic packaging, to improve the overall heat dissipation capacity, metal and ceramic packaging have excellent thermal conductivity and mechanical strength, which can significantly improve the heat dissipation effect and reliability of the inductor, greatly improving the practicality of the device. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a cross-sectional schematic view of the device of the present application;

[0027] Figure 2 It is an internal top view schematic view of the device of the present application;

[0028] Figure 3 It is an enlarged view of A in the present application Figure 2

[0029] Reference numerals in the figure: 1, magnetic core; 2, wire body; 3, shell; 4, upper cover; 5, lower cover; 6, first heat dissipation channel; 7, graphene; 8, thermal conduction channel; 9, nanocrystalline magnetic material; 10, second heat dissipation channel; 11, ceramic substrate; 12, adhesive layer; 13, high thermal conductivity adhesive. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0031] Referring to Figures 1-3 A low temperature rise inductor, comprising a magnetic core 1, a wire body 2 and a shell 3, the magnetic core 1 is installed inside the shell 3, and the wire body 2 is wound and connected outside the magnetic core 1 and inside the shell 3.

[0032] A first heat dissipation channel 6 is provided between the magnetic core 1 and the wire body 2, and the first heat dissipation channel 6 is provided with graphene 7 inside; by precision machining technology, a first heat dissipation channel 6 is reserved between the magnetic core 1 and the wire body 2, and a thermally conductive filling material graphene 7 is used to fill the gap, as a new type of thermally conductive material, graphene 7 has excellent thermal conductivity due to its single-layer two-dimensional crystal structure, and its thermal conductivity is as high as 5000W / mK, several times that of copper, graphene 7 powder can be used to prepare thermally conductive paste, thermally conductive glue and other materials, used for heat dissipation of electronic devices, thereby improving the heat dissipation effect.

[0033] ​The inside of the shell 3 and outside of the wire body 2 is provided with a heat conduction channel 8, and the inside of the heat conduction channel 8 is provided with nanocrystalline magnetic material 9; by opening the heat conduction channel 8, the nanocrystalline magnetic material 9 is arranged in the heat conduction channel 8, which can more effectively conduct and dissipate heat, reduce the temperature rise of the inductor, and improve the practicability of the device.

[0034] The inside of the shell 3 and outside of the nanocrystalline magnetic material 9 is provided with a second heat dissipation channel 10, and the inside of the second heat dissipation channel 10 is provided with a ceramic substrate 11; by introducing the ceramic substrate 11 in the second heat dissipation channel 10 during packaging, the heat dissipation performance of the inductor is further improved, thereby improving the practicability of the device.

[0035] The top end of the shell 3 is provided with an upper cover 4, and the bottom end of the shell 3 is provided with a lower cover 5; by arranging the upper cover 4 and the lower cover 5, the sealing and waterproof properties of the inductor are improved, and the device has certain protection function, thereby improving the practicability of the device.

[0036] The upper and lower ends of the shell 3 and the connection of the upper cover 4 and the lower cover 5 are provided with adhesive layers 12, and the upper end of the shell 3 and the lower end of the shell 3 are provided with high-thermal-conductivity adhesive 13 in the adhesive layers 12, and the upper cover 4 and the lower cover 5 are connected with the shell 3 by the high-thermal-conductivity adhesive 13; the upper cover 4 and the lower cover 5 are packaged with the shell 3 by the high-thermal-conductivity adhesive 13, which ensures the tightness and thermal conductivity of the packaging, thereby improving the practicability of the device.

[0037] Working principle: the magnetic core 1 and the wire body 2 are made of high-thermal-conductivity copper alloy material, which can more effectively conduct and dissipate heat, reduce the temperature rise of the inductor, and by introducing high-thermal-conductivity material in the magnetic core 1 and the wire body 2, the material ratio and manufacturing process are optimized to ensure the thermal conductivity and electromagnetic performance of the material.

[0038] The wire body 2 adopts flat winding or Litz wire winding design to increase the surface area and heat dissipation efficiency of the winding, and the flat winding and Litz wire can reduce the skin effect and proximity effect, thereby reducing the alternating current resistance and heat generation.

[0039] By designing a special heat dissipation channel inside the inductor, it is ensured that the heat can be quickly conducted to the outside, and the heat dissipation channel can effectively guide the flow of heat to avoid the accumulation of heat inside the inductor.

[0040] The first heat dissipation channel 6 is reserved between the magnetic core 1 and the wire body 2 by precision machining technology, and the gap is filled with graphene 7 as a new type of thermal conductive material, which has excellent thermal conductivity due to its single-layer two-dimensional crystal structure, and its thermal conductivity is as high as 5000W / mK, which is several times that of copper. Graphene 7 powder can be used to prepare thermal conductive paste, thermal conductive adhesive and other materials, which are used for heat dissipation of electronic devices, thereby improving the heat dissipation effect.

[0041] The shell 3 adopts advanced packaging technology, metal packaging or ceramic packaging, to improve the overall heat dissipation capacity. The metal and ceramic packaging have excellent heat conduction performance and mechanical strength, which can significantly improve the heat dissipation effect and reliability of the inductor.

[0042] By setting the second heat dissipation channel 10 in the packaging process to introduce the ceramic substrate 11, the heat dissipation performance of the inductor is further improved.

[0043] The upper cover 4 and the lower cover 5 are packaged by high-thermal-conductivity adhesive 13, to ensure the tightness and thermal conductivity of the packaging.

[0044] Through the improvement of material and structure design, the low-temperature-rise inductor can effectively reduce the temperature rise under high current conditions, improve the overall performance and reliability.

[0045] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art, according to the technical scheme and the utility model concept of the present application, within the technical range disclosed by the present application, makes equivalent replacement or change, should be covered in the protection scope of the present application.

Claims

1. A low temperature rise inductor comprising a magnetic core (1), a wire body (2) and a housing (3), characterized in that, The magnetic core (1) is installed inside the shell (3), the wire body (2) is wound and connected outside the magnetic core (1) and inside the shell (3), a first heat dissipation channel (6) is arranged between the magnetic core (1) and the wire body (2), and the first heat dissipation channel (6) is internally provided with graphene (7).

2. A low-temperature-rise inductor according to claim 1, wherein A heat conduction channel (8) is arranged inside the shell (3) and outside the wire body (2).

3. A low-temperature-rise inductor according to claim 2, wherein A second heat dissipation channel (10) is arranged inside the shell (3) and outside the nanocrystalline magnetic material (9).

4. A low-temperature-rise inductor according to claim 3, wherein The heat conduction channel (8) is internally provided with the nanocrystalline magnetic material (9), and the second heat dissipation channel (10) is internally provided with a ceramic substrate (11).

5. A low-temperature-rise inductor according to claim 1, wherein The top end of the shell (3) is provided with an upper cover (4), and the bottom end of the shell (3) is provided with a lower cover (5).

6. A low-temperature-rise inductor according to claim 5, wherein The upper and lower ends of the shell (3) are provided with adhesive layers (12) at the connection positions of the upper cover (4) and the lower cover (5).

7. A low-temperature-rise inductor according to claim 5, wherein The upper end of the shell (3) and the lower end of the shell (3) are both provided with high-thermal-conductivity adhesive (13) in the adhesive layers (12).

8. A low-temperature-rise inductor according to claim 5, wherein The upper cover (4) and the lower cover (5) are adhesively connected with the shell (3) through the high-thermal-conductivity adhesive (13).

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