Detachable chip feeding carrier

Abstract

The utility model relates to the field of chip carriers, in particular to a detachable chip feeding carrier which comprises a bottom plate, a cover plate, an abutting block, a dismounting assembly and a power assembly. When the cover plate is placed, the cover plate is firstly placed on the placing surface along the side wall of the abutting block, and then gradually slides to the bottom plate along the inclined part along with the sliding of the dismounting block. And when the cover plate is detached, the cover plate slides to the placing surface from the bottom plate along the inclined part. Due to the fact that the abutting block and the side wall of the bottom plate are aligned in the vertical direction, and the two placing faces are located on the same horizontal line, the cover plate is in the state of being aligned with the bottom plate in the vertical direction before being placed on the bottom plate. And the cover plate and the bottom plate are kept in an aligned state to be disassembled and assembled through sliding of the disassembling and assembling blocks which are arranged in pairs. Therefore, the cover plate can be disassembled and assembled in the direction perpendicular to the bottom plate, and the situation that the chip is damaged due to the fact that the cover plate deviates in the disassembling and assembling process is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the chip carrier field, concretely relates to a chip loading carrier of dismountable. BACKGROUND

[0002] Chip refers to the etching, wiring, made on semiconductor sheet, can realize certain function's semiconductor device, in the chip loading, the loading carrier of chip usually includes a square setting bottom plate and a square setting cover plate, when moving the chip, usually the top end of the chip is covered by the cover plate after the plurality of chips is placed on the bottom plate, in order to reduce the influence of external environment to the chip. Although the existing cover plate is generally the same as the bottom plate in shape and size, in order to reduce the processing difficulty, the cover plate does not set the corresponding clamping structure with the bottom plate, and the cover plate is usually disassembled by artificial. Figure 1 When disassembling the cover plate 20, the position of the cover plate 20 is easy to offset relative to the bottom plate 10 in the vertical direction, and is not disassembled along the direction perpendicular to the bottom plate 10, thereby causing the chip to be damaged by scratching the chip on the bottom plate 10. SUMMARY

[0003] The utility model provides a chip loading carrier of dismountable, including:

[0004] The bottom plate is used for placing the chip, and a pair of clamping grooves are arranged on the bottom plate.

[0005] The cover plate is matched with the bottom plate.

[0006] The side wall of the abutting block is aligned with the peripheral side wall of the bottom plate in the vertical direction, and the cover plate is put into and taken out along the side wall of the abutting block.

[0007] The dismounting assembly includes two dismounting blocks corresponding to the clamping grooves, the two dismounting blocks are oppositely arranged, the dismounting blocks are slidably arranged relative to the bottom plate, the dismounting blocks are provided with placing surfaces, the two placing surfaces are located on the same horizontal line, one end of the placing surface close to the bottom plate is provided with an inclined portion, the top surface of the inclined portion is inclined, the height of one end of the inclined portion close to the bottom plate is lower than the height of the other end of the inclined portion away from the bottom plate, and the inclined portion can be clamped into the clamping groove.

[0008] The power assembly is used for driving the dismounting blocks to slide.

[0009] Further, the power assembly comprises a first connecting rod, a second connecting rod and a third connecting rod, and a limiting shell, the third connecting rod is connected with the dismounting block, the first connecting rod is rotatably arranged in the limiting shell, the second connecting rod is rotatably connected with the first connecting rod and the third connecting rod at two ends respectively, and the limiting shell is used for limiting the movement of the third connecting rod, so that the connecting rod moves linearly.

[0010] Further, the limiting shell is provided with a sliding groove for the sliding of the connecting rod, and the sliding groove is arranged along a linear direction.

[0011] Further, the power assembly further comprises a sliding rail and a connecting block, the sliding rail is arranged along a direction corresponding to the arrangement direction of the sliding groove, a load plate for bearing the dismounting block is slidably arranged on the sliding rail, the load plate is fixedly connected with the connecting block, and the connecting block is fixedly connected with the third connecting rod.

[0012] Further, the bottom plate is provided with a plurality of positioning grooves for positioning the chips.

[0013] Further, the bottom plate is provided with a first magnetic block, the cover plate is provided with a second magnetic block, and the first magnetic block and the second magnetic block are attracted to each other.

[0014] Further, the detachable chip loading carrier further comprises a rack and a positioning block arranged on the rack, the bottom plate is provided with a groove, and the positioning block is matched with the groove.

[0015] Further, the rack is provided with a supporting block, the supporting block is located on the inner side of the abutting block, and the supporting block is used for supporting the bottom plate.

[0016] The detachable chip loading carrier has the advantages that: the cover plate is placed on the placing surface along the side wall of the abutting block first, and then gradually slides along the inclined part to the bottom plate along with the sliding of the dismounting block. When dismounting the cover plate, the cover plate is slid along the inclined part to the placing surface from the bottom plate. Since the side walls of the abutting block and the bottom plate are aligned along the vertical direction, and the two placing surfaces are located on the same horizontal line, the cover plate is aligned with the bottom plate in the vertical direction before being placed on the bottom plate. Then, the cover plate is dismounted while being kept aligned with the bottom plate by the sliding of the paired dismounting blocks. Therefore, the cover plate can be dismounted along the direction perpendicular to the bottom plate, so that the damage to the chips caused by the deviation of the cover plate during the dismounting process is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] The detachable chip loading carrier will be further described below in combination with the drawings and embodiments.

[0018] In the drawings:Figure 1 This is a schematic diagram showing the relative positions of the cover plate and the bottom plate in the prior art described in the background section;

[0019] Figure 2 An overall structural diagram of a detachable chip loading carrier provided by this utility model;

[0020] Figure 3 for Figure 1 Exploded view;

[0021] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0022] Figure 5 for Figure 1 An exploded view from another perspective;

[0023] Figure 6 for Figure 1 A top view of the partial structure shown;

[0024] Figure 7 for Figure 6 Sectional view along axis AA;

[0025] Figure 8 for Figure 6 The diagram shows a three-dimensional structural representation of the part shown.

[0026] Explanation of reference numerals in the attached drawings: 100, Demountable chip loading carrier; 10, Base plate; 11, Slot; 12, Positioning slot; 13, First magnetic block; 14, Groove; 20, Cover plate; 21, Second magnetic block; 30, Support block; 40, Demountable assembly; 41, Demountable block; 411, Placement surface; 412, Inclined portion; 50, Power assembly; 51, First connecting rod; 52, Second connecting rod; 53, Third connecting rod; 54, Limiting shell; 541, Mounting hole; 542, Sliding groove; 55, Slide rail; 551, Carrier plate; 56, Connecting block; 60, Frame; 70, Positioning block; 80, Support block. Detailed Implementation

[0027] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] Please refer to Figures 2-8The utility model provides a detachable chip loading carrier 100, including bottom plate 10, cover plate 20, hold block 30, dismounting assembly 40 and power assembly 50 and the rack 60 for bearing each device, specifically, in the embodiment, dismounting assembly 40 and power assembly 50 are equipped with two groups, two groups of dismounting assembly are sequentially arranged along the length direction of bottom plate 10, and two groups of power assembly 50 are arranged on the both sides of the width direction of bottom plate 10.

[0029] The thickness direction of the bottom plate 10 shown in the figure is the vertical direction, and the top surface of the bottom plate 10 is the horizontal plane.

[0030] The bottom plate 10 is used for placing chips, and the bottom plate 10 is provided with a pair of clamping grooves 11. Specifically, the clamping grooves 11 are arranged on both sides of the width direction of the bottom plate 10. The cover plate 20 and the bottom plate 10 are compatible, and both the cover plate 20 and the bottom plate 10 are square plates. It can be understood that when the cover plate 20 and the bottom plate 10 overlap, the boundaries of the cover plate 20 and the bottom plate 10 can be aligned with each other.

[0031] The bottom plate 10 is provided with a plurality of positioning grooves 12 for positioning chips. The bottom plate 10 is provided with a first magnetic block 13, and the cover plate 20 is provided with a second magnetic block 21. The first magnetic block 13 and the second magnetic block 21 attract each other. Further, the first magnetic block 13 is provided along the length direction of the bottom plate 10, and the second magnetic block 21 is provided along the length direction of the cover plate 20, and the first magnetic block 13 and the second magnetic block 21 correspond to each other. The arrangement of the first magnetic block 13 and the second magnetic block 21 can facilitate the alignment of the cover plate 20 with the bottom plate 10 when placed.

[0032] The side wall of the hold block 30 and the peripheral side wall of the bottom plate 10 are aligned in the vertical direction, and the cover plate 20 is put into and taken out along the side wall of the hold block 30. Specifically, the hold block 30 is provided with four L-shaped blocks, and the four hold blocks 30 are respectively arranged at the four corners of the bottom plate 10 and abut against the side walls at the four corners of the bottom plate 10.

[0033] The dismounting assembly 40 includes two dismounting blocks 41 corresponding to the clamping grooves 11. The two dismounting blocks 41 are oppositely arranged, and the two dismounting blocks 41 are respectively slidably arranged on both sides of the width direction of the bottom plate 10, and the two dismounting blocks 41 are respectively provided with a placing surface 411. The two placing surfaces 411 are located on the same horizontal line.

[0034] The end of the placement surface 411 close to one end of the bottom plate 10 is provided with an inclined portion 412, the top surface of the inclined portion 412 is inclined, the height of the end of the inclined portion 412 close to one end of the bottom plate 10 is lower than the height of the end of the inclined portion 412 away from one end of the bottom plate 10, and the end of the inclined portion 412 close to one end of the bottom plate 10 can be clamped into the clamping groove 11. Specifically, the height of the end of the inclined portion 412 close to one end of the bottom plate 10 is slightly lower than the height of the top end of the bottom plate 10, so that when the cover plate 20 is disassembled, the top surface of the inclined portion 412 can abut against the side wall of the cover plate 20 during clamping into the clamping groove 11.

[0035] The power assembly 50 includes a first connecting rod 51, a second connecting rod 52, and a third connecting rod 53, and a limiting shell 54, the third connecting rod 53 is connected with the disassembly block 41, the first connecting rod 51 is rotationally arranged in the limiting shell 54, the two ends of the second connecting rod 52 are rotationally connected with the first connecting rod 51 and the third connecting rod 53 respectively, and the limiting shell 54 is used for limiting the movement of the third connecting rod 53, so that the connecting rod moves linearly. The limiting shell 54 is provided with a sliding groove 542 for sliding of the third connecting rod 53, and the sliding groove 542 is arranged in a straight line direction. Specifically, the sliding groove 542 is arranged along the width direction of the bottom plate 10.

[0036] Further, the limiting shell 54 is fixedly connected to the rack 60, and the limiting shell 54 is further provided with a mounting hole 541, and one end of the first connecting rod 51 away from the rotation center of itself is exposed outside the mounting hole 541. The second connecting rod 52 is located between the first connecting rod 51 and the third connecting rod 53, and the first connecting rod 51 is farther away from the bottom plate 10 than the third connecting rod 53.

[0037] More specifically, the power assembly 50 further includes a sliding rail 55 and a connecting block 56, the setting direction of the sliding rail 55 corresponds to the setting direction of the sliding groove 542, the sliding rail 55 is provided with a load plate 551 for carrying the disassembly block 41, the load plate 551 and the connecting block 56 are fixedly connected, and the connecting block 56 and the third connecting rod 53 are fixedly connected.

[0038] When placing the cover plate 20, first slide the four corners of the cover plate 20 along the side walls of the abutting blocks 30 downward until placed in the placement surface 411, and at this time the placement surface 411 and the bottom wall of the cover plate 20 abut, the cover plate 20 and the bottom plate 10 are aligned with each other in the vertical direction. Then rotate the first connecting rod 51, the first connecting rod 51 drives the third connecting rod 53 to slide away from the bottom plate 10, the third connecting rod 53 drives the disassembling block 41 away from the bottom plate 10, the two sides of the cover plate 20 are sequentially slid along the placement surface 411 and the inclined part 412, and finally placed on the bottom plate 10 in the state of alignment with the bottom plate 10. When disassembling the cover plate 20, rotate the first connecting rod 51 in the opposite direction, so that the third connecting rod 53 drives the disassembling block 41 to slide towards the cover plate 20 to abut with the corresponding clamping groove 11 on the bottom plate 10, and the two sides of the cover plate 20 slide along the inclined part 412 to the placement surface 411 as the disassembling block 41 moves, the height of the cover plate 20 gradually increases away from the bottom plate 10. Because the side walls of the abutting blocks 30 and the bottom plate 10 are aligned in the vertical direction, and the two opposite placement surfaces 411 are located on the same horizontal line, the cover plate 20 is aligned with the bottom plate 10 in the vertical direction before being placed on the bottom plate 10. And because the two placement surfaces 411 are arranged in pairs, and the top surfaces of the two inclined parts 412 are also arranged in pairs, the cover plate 20 moves in the direction aligned with the bottom plate 10 during disassembly. Therefore, the cover plate 20 can be disassembled in the direction perpendicular to the bottom plate 10, thereby reducing the damage to the chip caused by the offset during disassembly of the cover plate 20.

[0039] Optionally, in the embodiment, the disassembling chip loading carrier 100 further comprises a positioning block 70 and a supporting block 80 arranged on the rack 60, the bottom plate 10 and the cover plate 20 are both provided with a recess 14, and the positioning block 70 and the recess 14 are matched. The supporting block 80 is located inside the four abutting blocks 30, and the supporting block 80 is used to support the bottom plate 10. Further, in the embodiment, the recess 14 on the bottom plate 10 is provided with two, and the positioning block 70 is also provided with two correspondingly. The arrangement of the positioning block 70 further facilitates the mutual alignment of the cover plate 20 and the bottom plate 10.

Claims

1. A detachable on-chip material loading carrier, characterized by, The utility model relates to a chip loading carrier which can be disassembled and assembled, and belongs to the technical field of chip loading carriers. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled.

2. The detachable on-die load carrier of claim 1, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

3. The detachable on-die load carrier of claim 2, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

4. The detachable on-die load carrier of claim 3, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

5. The detachable on-die load carrier of claim 1, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

6. The detachable on-die load carrier of claim 1, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

7. The detachable on-die load carrier of claim 1, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled.

8. The detachable on-die load carrier of claim 7, wherein: The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. The utility model discloses a chip loading carrier which can be disassembled and assembled. 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