Anti-offset chip tin drawing device

Abstract

The utility model relates to the technical field of chip processing, and discloses an anti-offset chip tin drawing device which comprises a table top, a tin drawing plate and a chip groove, a tin drawing head is suspended on the chip groove, a correction part and a positioning part are arranged on the tin drawing plate, the correction part comprises an alignment hole, the positioning part comprises a positioning plate located at one corner of the chip groove, an electric cylinder is connected to the positioning plate, and the chip groove is provided with a groove. The electric cylinder comprises an output rod, the output rod of the electric cylinder can push the positioning plate to move from one corner of the chip groove to the opposite corner, and a through tin hole is formed in the axis of the tin drawing head. The position of the tin drawing head is corrected through the correction part before tin drawing is conducted every time, original point alignment of the device is achieved, the situation that due to accumulated errors caused by long-time operation of the tin drawing head, tin drawing deviation of the tin drawing head on a chip is caused is prevented, the chip can be clamped and positioned through the positioning part, the situation that the chip is placed incorrectly, molten tin can flow out of a tin hole, and the tin drawing quality is improved is avoided. The tin drawing head can heat tin, and blockage caused by tin solidification in the tin hole is prevented.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a chip soldering device for preventing misalignment. Background Technology

[0002] The main reason for applying solder to chips is to ensure a good connection and heat dissipation between the chip and the PCB board. The solder layer on the back of the chip, i.e. the pads, is the key to connecting the chip and the PCB board, ensuring that the chip can be stably fixed on the PCB board and that electrical connections are achieved through tiny solder joints, ensuring normal data transmission. Applying solder can fill the gap between the chip and the substrate, and by ensuring uniform heating of the solder joints and enhancing adhesion, it helps to reduce chip displacement or tilting caused by factors such as uneven temperature, vibration, or uneven reflow airflow during the soldering process.

[0003] According to the patent application published on the Internet, a dual-head soldering device based on XZ axis linear motor handling (authorization announcement number: CN216435869U) is described as follows: "The bottom of the fixed shell is provided with through holes corresponding to the lifting cylinder and the mounting plate. A soldering machine is fixedly installed at the bottom of the left mounting plate to perform soldering work on the chip on the heating guide rail. A soldering machine is fixedly installed at the bottom of the mounting plate to perform soldering work on the chip on the heating guide rail. A soldering press is fixedly installed at the bottom of the right mounting plate to perform soldering work on the chip on the heating guide rail."

[0004] Regarding the above description, the applicant believes the following issues exist:

[0005] In the process of using this utility model, since a soldering machine is fixedly installed at the bottom of the left mounting plate to perform soldering work on the chip on the heating guide rail, the soldering machine fixed at the bottom of the mounting plate in the prior art has poor stability during the soldering process and is prone to displacement, resulting in incorrect soldering position. Therefore, it is necessary to improve the chip soldering device to prevent displacement and solve the above problems. Utility Model Content

[0006] In order to overcome the problem that the existing technology of bottom-fixed soldering machines for mounting boards has poor stability during the soldering process, and is prone to displacement, resulting in incorrect soldering positions.

[0007] The technical solution of this utility model is as follows: a chip soldering device for preventing offset, including a desktop and a soldering plate slidably mounted above the desktop. The soldering plate includes a chip slot, which is a rectangular slot. A soldering head is suspended on the chip slot. The soldering plate is provided with a correction part and a positioning part. The correction part includes an alignment hole into which the soldering head can be inserted. The positioning part includes a positioning plate located at one corner of the chip slot. The positioning plate is a right-angled plate. An electric cylinder is connected to the positioning plate. The electric cylinder includes an output rod. The output rod of the electric cylinder can push the positioning plate to move from one corner of the chip slot to the opposite corner. A through solder hole is provided at the axis of the soldering head, and the soldering head can heat the solder in the solder hole.

[0008] Preferably, the bottom of the tin-drawing plate is provided with a sliding block, the top of the tabletop is provided with a sliding rail, the sliding block moves above the sliding rail, there are fixed ends on both sides of the sliding rail along its length, a precision lead screw is rotatably provided between the two fixed ends, a servo motor is installed on the side of one of the fixed ends away from the precision lead screw, the output shaft of the servo motor is fixedly connected to the precision lead screw, and the bottom of the tin-drawing plate is provided with a lead screw seat corresponding to the precision lead screw.

[0009] Preferably, the positioning plate is fixed to the output rod of the electric cylinder by screws, and the surface of the positioning plate is coated with Teflon.

[0010] Preferably, the top of the desktop is provided with a stand that is mounted on both sides of the drawing board. The top of the stand has two fixed ends on both sides, and a precision lead screw is rotatably connected between the two fixed ends. A platform is mounted on the precision lead screw. A servo motor is installed on the side of one of the fixed ends away from the platform. The platform includes a threaded hole that corresponds to the precision lead screw. A groove is provided on the side of the platform away from the threaded hole. The top of the stand has an upper slider that corresponds to the groove. The precision lead screw is perpendicular to the precision lead screw.

[0011] Preferably, the bottom of the stage is provided with hole two, and the top of the stage is provided with hole one. The diameter of hole one is larger than that of hole two. Hole one and hole two are coaxially arranged. The top of the soldering head is integrally formed with a movable rod. The soldering head can be inserted into hole two, and the movable rod can be inserted into hole one. The movable rod is provided with two anti-rotation plates, and hole one is provided with a slot corresponding to the anti-rotation plate.

[0012] Preferably, a spring is fitted onto the soldering head, and the spring can be placed inside the hole.

[0013] Preferably, a push plate is provided on one side of the movable rod, and support plates are provided on both sides of the top of the platform located on the push plate. A rotating shaft is rotatably connected between the two support plates, and a cam is fixed on the rotating shaft. The cam contacts the push plate, and a servo motor is installed on one of the support plates on the side away from the cam.

[0014] The beneficial effects of this utility model are as follows: Compared with the soldering machine fixed at the bottom of the mounting plate, the position of the soldering head is corrected by the calibration part before each soldering operation, so as to realize the origin of the device and prevent the soldering head from accumulating errors during long-term operation and causing the soldering head to deviate on the chip. The positioning part can clamp and position the chip to prevent the chip from being placed incorrectly. The molten solder can flow out from the solder hole. The soldering head can heat the solder to prevent the solder in the solder hole from solidifying and causing blockage. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the movable rod structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the alignment hole structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the spring structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the cam structure of this utility model.

[0020] Explanation of reference numerals in the attached diagram: 1. Desktop; 2. Solder plate; 21. Alignment hole; 22. Chip slot; 23. Positioning plate; 24. Electric cylinder; 25. Fixed end one; 26. Precision lead screw one; 27. Servo motor one; 28. Lower slide rail; 31. Solder head; 32. Movable rod; 321. Anti-rotation plate; 322. Push plate; 33. Platform; 331. Threaded hole; 332. Slide groove; 333. Hole one; 3331. Hole two; 334. Solder hole; 34. Fixed end two; 35. Servo motor two; 36. Upper slider; 37. Precision lead screw two; 38. Spring; 39. Stand; 41. Lower slider; 51. Cam; 52. Rotating shaft; 521. Support plate; 53. Servo motor three. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please see Figure 1 - Figure 5This utility model provides an embodiment of a chip soldering device for preventing misalignment, including a desktop 1 and a soldering plate 2 slidably mounted above the desktop 1. The soldering plate 2 includes a chip slot 22, which is a rectangular slot. A soldering head 31 is suspended on the chip slot 22. The soldering plate 2 has a correction part and a positioning part. The correction part includes an alignment hole 21 into which the soldering head 31 can be inserted. The positioning part includes a positioning plate 23 located at one corner of the chip slot 22. The positioning plate 23 is a right-angled plate. An electric cylinder 24 is connected to the positioning plate 23. The electric cylinder 24 includes an output rod, which can push the positioning plate. 23 moves from one corner of the chip slot 22 to the opposite corner. The soldering head 31 has a through solder hole 334 at its axis. The soldering head 31 can heat the solder in the solder hole 334. Before each soldering operation, the position of the soldering head 31 is corrected by the calibration unit to achieve the origin alignment of the device and prevent the soldering head 31 from accumulating errors during long-term operation, causing the soldering head 31 to deviate on the chip. The positioning unit can clamp and position the chip to prevent the chip from being placed incorrectly. The molten solder can flow out from the solder hole 334. The soldering head 31 can heat the solder to prevent the solder in the solder hole 334 from solidifying and causing blockage.

[0023] Please see Figure 1 - Figure 4In this embodiment, the bottom of the tin-drawing plate 2 is provided with a sliding block 41, and the top of the tabletop 1 is provided with a sliding rail 28. The sliding block 41 moves above the sliding rail 28. The two sides of the sliding rail 28 in the length direction are provided with fixed ends 25. A precision lead screw 26 is rotatably provided between the two fixed ends 25. A servo motor 27 is installed on the side of one of the fixed ends 25 away from the precision lead screw 26. The output shaft of the servo motor 27 is fixedly connected to the precision lead screw 26. The bottom of the tin-drawing plate 2 is provided with a lead screw seat corresponding to the precision lead screw 26. The precision lead screw 26 enables the tin-drawing plate 2 to have a high movement. To ensure precision and prevent the soldering head 31 from shifting during soldering, the servo motor 27 has high motion precision, allowing the soldering head 31 to be accurately aligned. The positioning plate 23 is fixed to the output rod of the electric cylinder 24 by screws. The surface of the positioning plate 23 is coated with Teflon, which increases the smoothness of the movement of the positioning plate 23, reduces friction, and extends its service life. The top of the desktop 1 is equipped with a stand 39 that supports both sides of the soldering plate 2. The top of the stand 39 has two fixed ends 34 on both sides, and a precision lead screw 37 is rotatably connected between the two fixed ends 34. A platform 33 is provided, and a servo motor 35 is mounted on the side of one of the fixed ends 34 away from the platform 33. The platform 33 includes a threaded hole 331, which corresponds to a precision lead screw 37. A groove 332 is provided on the side of the platform 33 away from the threaded hole 331. The top of the stand 39 is provided with an upper slider 36 corresponding to the groove 332. The precision lead screw 37 is perpendicular to the precision lead screw 26. The perpendicularity between the precision lead screw 37 and the precision lead screw 26 allows the solder drawing head 31 to move in two relative directions. The precision lead screw 37 and the servo motor 35 can raise the solder drawing head. To ensure the alignment accuracy of 31 and prevent solder application from shifting, the base 33 has a second hole 3331 at the bottom and a first hole 333 at the top. The diameter of the first hole 333 is larger than that of the second hole 3331. The first hole 333 and the second hole 3331 are coaxially arranged. The top of the solder application head 31 has an integrally formed movable rod 32. The solder application head 31 can be inserted into the second hole 3331, and the movable rod 32 can be inserted into the first hole 333. The movable rod 32 has two anti-rotation plates 321. The first hole 333 has a slot corresponding to the anti-rotation plate 321. The anti-rotation plate 321 prevents the solder application head 31 from rotating in the first hole 333, thus preventing the solder application from shifting.

[0024] Please see Figure 2 - Figure 5In this embodiment, a spring 38 is fitted on the soldering head 31. The spring 38 can be placed in the hole 333. The spring 38 presses the movable rod 32, giving the movable rod 32 the ability to spring upward. When the spring 38 is pressed down, the soldering head 31 can be aligned with the alignment hole 21. A push plate 322 is provided on one side of the movable rod 32. Support plates 521 are provided on both sides of the push plate 322 at the top of the platform 33. A rotating shaft 52 is rotatably connected between the two support plates 521. A cam 51 is fixed on the rotating shaft 52. The cam 51 is in contact with the push plate 322. A servo motor 53 is installed on the side of one of the support plates 521 away from the cam 51. The cam 51 drives the cam 51 to rotate, thereby applying a downward pushing force to the push plate 322 to align the soldering head 31.

[0025] During operation, the chip is placed in the chip slot 22. The electric cylinder 24 pushes the positioning plate 23 to one side, pushing the chip to a corner of the chip slot 22. Precision lead screw 27 and precision lead screw 26 are driven by servo motor 25 and servo motor 27 respectively, transporting the soldering head 31 to the top of the alignment hole 21. The movable rod 32 is rotated by the cam 51 and presses down to compress the spring 38, so that the soldering head 31 is aligned with the alignment hole 21. The soldering head 31 heats the solder in the solder hole 334 to prevent the solder from clogging the solder hole 334. The heating principle of the soldering head 31 is similar to that of the soldering iron heating the soldering head. Its working principle will not be described in detail here. The anti-rotation plate 321 prevents the movable rod 32 from deflecting in the hole 333.

[0026] Through the above steps, the position of the soldering head 31 is corrected by the calibration unit before each soldering operation, thus achieving the original alignment of the device. This prevents the soldering head 31 from accumulating errors during long-term operation and causing it to deviate from its intended position on the chip. The positioning unit can clamp and position the chip to prevent incorrect chip placement. Molten solder can flow out from the solder hole 334. The soldering head 31 can heat the solder to prevent the solder in the solder hole 334 from solidifying and causing blockage. This solves the problem of poor stability and easy deviation in the soldering process of the existing bottom-fixed soldering machine for mounting boards, which results in incorrect soldering position.

Claims

1. A chip soldering device for preventing misalignment, comprising a desktop (1), characterized in that: It also includes a soldering plate (2) that slides above the desktop (1). The soldering plate (2) includes a chip slot (22), which is a rectangular slot. A soldering head (31) is suspended on the chip slot (22). The soldering plate (2) is provided with a correction part and a positioning part. The correction part includes an alignment hole (21), in which the soldering head (31) can be inserted. The positioning part includes a positioning plate (23) located at one corner of the chip slot (22). The positioning plate (23) is a right-angled plate. An electric cylinder (24) is connected to the positioning plate (23). The electric cylinder (24) includes an output rod. The output rod of the electric cylinder (24) can push the positioning plate (23) to move from one corner of the chip slot (22) to the opposite corner. A through solder hole (334) is provided at the axis of the soldering head (31), and the soldering head (31) can heat the solder in the solder hole (334).

2. The anti-offset chip soldering device according to claim 1, characterized in that: The bottom of the tin plate (2) is provided with a sliding block (41), and the top of the tabletop (1) is provided with a sliding rail (28). The sliding block (41) moves above the sliding rail (28). The two sides of the sliding rail (28) along its length are provided with fixed ends (25). A precision lead screw (26) is rotatably provided between the two fixed ends (25). A servo motor (27) is installed on the side of one of the fixed ends (25) away from the precision lead screw (26). The output shaft of the servo motor (27) is fixedly connected to the precision lead screw (26). The bottom of the tin plate (2) is provided with a lead screw seat corresponding to the precision lead screw (26).

3. The anti-offset chip soldering device according to claim 2, characterized in that: The positioning plate (23) is fixed to the output rod of the electric cylinder (24) by screws, and the surface of the positioning plate (23) is coated with Teflon.

4. The anti-offset chip soldering device according to claim 3, characterized in that: The top of the desktop (1) is provided with a stand (39) mounted on both sides of the tinplate (2). The top of the stand (39) is provided with two fixed ends (34) on both sides. A precision lead screw (37) is rotatably connected between the two fixed ends (34). A platform (33) is mounted on the precision lead screw (37). A servo motor (35) is installed on the side of one of the fixed ends (34) away from the platform (33). The platform (33) includes a threaded hole (331) corresponding to the precision lead screw (37). A slide groove (332) is provided on the side of the platform (33) away from the threaded hole (331). The top of the stand (39) is provided with an upper slider (36) corresponding to the slide groove (332). The precision lead screw (37) is perpendicular to the precision lead screw (26).

5. The anti-offset chip soldering device according to claim 3, characterized in that: The bottom of the platform (33) is provided with hole 2 (3331), and the top of the platform (33) is provided with hole 1 (333). The diameter of hole 1 (333) is larger than that of hole 2 (3331). Hole 1 (333) and hole 2 (3331) are coaxially arranged. The top of the soldering head (31) is integrally formed with a movable rod (32). The soldering head (31) can be inserted into hole 2 (3331), and the movable rod (32) can be inserted into hole 1 (333). The movable rod (32) is provided with two anti-rotation plates (321). Hole 1 (333) is provided with a slot corresponding to the anti-rotation plate (321).

6. The anti-offset chip soldering device according to claim 5, characterized in that: A spring (38) is fitted on the soldering head (31), and the spring (38) can be placed in the hole (333).

7. The anti-offset chip soldering device according to claim 6, characterized in that: A push plate (322) is provided on one side of the movable rod (32), and a support plate (521) is provided on both sides of the push plate (322) at the top of the platform (33). A rotating shaft (52) is rotatably connected between the two support plates (521), and a cam (51) is fixed on the rotating shaft (52). The cam (51) is in contact with the push plate (322), and a servo motor (53) is installed on the side of one of the support plates (521) away from the cam (51).

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