Silicon carbide wafer cutting equipment
By combining a dual adsorption component and a laser cutting mechanism, the problems of low fixation efficiency, low precision, and chip scattering in silicon carbide wafer cutting equipment are solved, achieving high-precision, low-stress cutting results, which are suitable for a variety of brittle materials.
Patent Information
- Application Number
- CN202422819409.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-11-19
AI Technical Summary
Existing silicon carbide wafer dicing equipment suffers from low efficiency, impurity contamination, low cutting accuracy due to stress, and chip scattering during the fixing and dicing processes.
A dual adsorption component is used to fix the silicon carbide wafer. Combined with a laser cutting mechanism and a horizontal moving mechanism, non-contact cutting is achieved by using the first and second adsorption components to adsorb the wafer together. A motor drives the rotating seat and stage to rotate to achieve precise cutting.
It improves cutting accuracy, prevents wafer displacement and debris scattering during cutting, reduces the risk of breakage, enhances the flexibility and adaptability of the equipment, and is suitable for cutting a variety of brittle materials.
Smart Images
Figure CN223531643U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a silicon carbide wafer dicing device. Background Technology
[0002] In existing technologies, to ensure processing accuracy, semiconductor wafers are typically positioned before being cut using laser equipment. Using jigs for fixing the wafer requires significant time for operators to fix and remove it, which is not only inefficient but also easily leaves impurities on the wafer surface, negatively impacting cutting accuracy. Furthermore, this method cannot prevent the shedding of cutting debris. While adsorption-based fixing can generate stress on the wafer surface due to adsorption or electrostatic forces, this stress may be released during the cutting process, leading to wafer breakage or cracks.
[0003] Therefore, it is necessary to design a silicon carbide wafer dicing device to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a silicon carbide wafer cutting device that prevents the generation of cutting debris and has high cutting precision.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon carbide wafer dicing device, comprising a laser dicing mechanism, a stage mechanism disposed below the laser dicing mechanism, and a horizontal moving mechanism that drives the stage mechanism to move below the laser dicing mechanism. The stage mechanism includes a motor, a rotating base, a stage, a first adsorption component, and a second adsorption component. The motor, rotating base, and stage are arranged sequentially from bottom to top. The motor drives the rotating base and the stage to rotate horizontally. The first adsorption component is disposed on the rotating base and located on the outer periphery of the stage. The second adsorption component is disposed on the stage. The adsorption plane of the first adsorption component and the adsorption plane of the second adsorption component are located on the same plane. The first adsorption component and the second adsorption component are used to jointly adsorb and fix the wafer.
[0006] As a further improvement of the present invention, the first adsorption component includes a plurality of suction cup seats and a vacuum suction cup disposed on the outer periphery of the rotating seat.
[0007] As a further improvement of this utility model, the suction cup seat is provided with a first ventilation pipe, the rotating seat is provided with a second ventilation pipe that communicates with the first ventilation pipe, the hollow shaft of the motor is provided with a rotating quick connector that rotates synchronously with the rotating seat, and the second ventilation pipe is connected to the rotating quick connector.
[0008] As a further improvement of the present invention, the rotating seat includes an annular portion and a connecting plate disposed in the middle of the annular portion. The edge of the connecting plate partially overlaps with the annular portion. The second ventilation pipe includes a first horizontal section opened inside the annular portion, a second horizontal section opened on the connecting plate, and a vertical section connecting the first horizontal section and the second horizontal section.
[0009] As a further improvement of this utility model, a third vent pipe is provided on the connecting plate. The third vent pipe is connected to the second horizontal section. The opening of the third vent pipe is located on the lower surface of the connecting plate and is connected to the rotating quick connector.
[0010] As a further improvement of the present invention, each of the vacuum suction cups corresponds to a first horizontal section and a vertical section, and the second horizontal section connects multiple suction cups to the rotating quick connector through multiple sets of first horizontal sections and vertical sections.
[0011] As a further improvement of the present invention, the second adsorption component includes a plurality of connectors fixed to the outside of the platform. The platform has through holes corresponding to the connectors one by one. The two ends of the through holes are respectively located on the outer side and the upper surface of the platform. The connectors are connected to the through holes to provide a vacuum.
[0012] As a further improvement of this utility model, the openings of the plurality of through holes on the upper surface of the platform are evenly distributed along the edge of the platform.
[0013] As a further improvement of this utility model, the adsorption position of the first adsorption component and the adsorption position of the second adsorption component are located on both sides of the dicing line of the wafer.
[0014] As a further improvement of the present invention, the horizontal moving mechanism includes a Y-axis linear module and an X-axis linear module disposed on the Y-axis linear module, the platform mechanism is disposed on the X-axis linear module, and the horizontal moving mechanism drives the platform mechanism to move in the X-axis direction and the Y-axis direction.
[0015] As can be seen from the above technical solutions, the silicon carbide wafer dicing equipment of this utility model has the following effects:
[0016] 1. Through the combined action of the first adsorption component and the second adsorption component, wherein the first adsorption component is disposed on the rotating seat and located on the outer periphery of the stage, and is used to adsorb the part to be removed on the wafer, and the second adsorption component is disposed on the stage, and is used to adsorb the part to be retained after wafer cutting, the adsorption planes of the two are located on the same plane, forming a dual adsorption mechanism. On the one hand, it effectively prevents the wafer from shifting or vibrating during the cutting process, ensuring that the wafer remains stable throughout the entire cutting process. On the other hand, it can prevent the scattering of the cut material.
[0017] 2. By using a motor to drive the rotating base and stage to rotate horizontally, the wafer can be cut at different angles, enabling more precise cutting path planning and improving the flexibility and adaptability of the equipment.
[0018] 3. Due to the use of non-contact laser cutting and the optimized adsorption and fixation mechanism, stress concentration during wafer cutting is greatly reduced, thus lowering the risk of wafer breakage.
[0019] 4. This equipment is not only suitable for cutting silicon carbide wafers, but can also be widely used for precision cutting of other brittle materials, and has strong versatility and practicality. Attached Figure Description
[0020] Figure 1 This is a perspective view of a silicon carbide wafer dicing device according to an embodiment of the present invention.
[0021] Figure 2 for Figure 1 A three-dimensional view of the intermediate platform mechanism and the horizontal moving mechanism.
[0022] Figure 3 for Figure 2 Top view of the intermediate platform mechanism.
[0023] Figure 4 for Figure 3 Sectional view at position AA.
[0024] Figure 5 for Figure 2 Side view of the intermediate platform mechanism.
[0025] Figure 6 for Figure 5 Sectional view at the CC position.
[0026] Figure 7 for Figure 5 Sectional view of the DD position in the middle. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0028] Please refer to Figure 1 As shown, this utility model provides a silicon carbide wafer dicing device, which includes a base 10, a gantry 20 disposed on the base 10, a laser dicing mechanism 30 disposed on the gantry 20, a stage mechanism 50 disposed below the laser dicing mechanism 30, and a horizontal moving mechanism 40 that drives the stage mechanism 50 to move below the laser dicing mechanism 30.
[0029] The horizontal moving mechanism 40 includes a Y-axis linear module and an X-axis linear module disposed on the Y-axis linear module. The platform mechanism 50 is disposed on the X-axis linear module. The horizontal moving mechanism 40 drives the platform mechanism 50 to move in the X-axis direction and the Y-axis direction.
[0030] Please refer to Figure 2 As shown, the stage mechanism 50 includes a base 51, a motor 52, a rotating seat 53, a stage 55, a first adsorption component 56, and a second adsorption component 54. The motor 52, the rotating seat 53, and the stage 55 are arranged sequentially from bottom to top, and the motor 52 drives the rotating seat 53 and the stage 55 to rotate horizontally.
[0031] The first adsorption component 56 and the second adsorption component 54 are used to jointly adsorb and fix the wafer. The adsorption positions of the first adsorption component 56 and the second adsorption component 54 are located on both sides of the wafer's dicing line. The first adsorption component 56 is disposed on the rotary seat 53 and located on the outer periphery of the stage 55. The first adsorption component 56 includes a plurality of suction cup seats 562 and vacuum suction cups 561 disposed on the outer periphery of the rotary seat 53.
[0032] Please refer to Figure 3 and Figure 4 As shown, the suction cup base 562 has a first ventilation pipe 563, and the rotating base 53 has a second ventilation pipe 531 that communicates with the first ventilation pipe 563. The hollow shaft of the motor 52 has a quick-connect coupling 57 that rotates synchronously with the rotating base 53, and the second ventilation pipe 531 is connected to the quick-connect coupling 57. Specifically, the rotating base 53 includes an annular portion 532 and a connecting plate 533 located in the middle of the annular portion 532, with the edge of the connecting plate 533 partially overlapping the annular portion 532.
[0033] Please participate together Figures 5 to 7 As shown, the second vent pipe 531 includes a first horizontal section a inside the annular portion 532, a second horizontal section b on the connecting plate 533, and a vertical section c connecting the first horizontal section a and the second horizontal section b. A third vent pipe 534 is provided on the connecting plate 533, the third vent pipe 534 is connected to the second horizontal section b, and the opening of the third vent pipe 534 is located on the lower surface of the connecting plate 533, and the opening is connected to the rotating quick connector 57.
[0034] Each vacuum suction cup 561 corresponds to a first horizontal section a and a vertical section c. The second horizontal section b connects multiple vacuum suction cups 561 to the rotating quick connector 57 through multiple sets of first horizontal sections a and vertical sections c. Therefore, by connecting to an external vacuum device through a third vent pipe 534, a vacuum can be provided to multiple vacuum suction cups 561 simultaneously.
[0035] The second adsorption component 54 is disposed on the stage 55. The second adsorption component 54 includes multiple connectors 541 fixed to the outside of the stage 55. The stage 55 has through holes 551 corresponding to the connectors 541 one by one. The two ends of the through holes 551 are respectively located on the outer side and the upper surface of the stage 55. The connectors 541 are connected to the through holes 551 to provide a vacuum. The openings of the multiple through holes 551 on the upper surface of the stage 55 are evenly distributed along the edge of the stage 55. The adsorption plane of the first adsorption component 56 (i.e., the surface of the suction cup 561) and the adsorption plane of the second adsorption component 54 (i.e., the upper surface of the stage 55) are located on the same plane.
[0036] The terms used herein, such as "upper" and "lower," indicating spatial relative position, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.
[0037] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.
Claims
1. A silicon carbide wafer dicing device, characterized in that: The device includes a laser cutting mechanism, a stage mechanism located below the laser cutting mechanism, and a horizontal moving mechanism that drives the stage mechanism to move below the laser cutting mechanism. The stage mechanism includes a motor, a rotating base, a stage, a first adsorption component, and a second adsorption component. The motor, rotating base, and stage are arranged sequentially from bottom to top. The motor drives the rotating base and stage to rotate horizontally. The first adsorption component is located on the rotating base and on the outer periphery of the stage. The second adsorption component is located on the stage. The adsorption planes of the first adsorption component and the second adsorption component are located on the same plane. The first adsorption component and the second adsorption component are used to jointly adsorb and fix the wafer.
2. The silicon carbide wafer dicing equipment as described in claim 1, characterized in that: The first adsorption assembly includes a plurality of suction cup seats and a vacuum suction cup disposed on the outer periphery of the rotating seat.
3. The silicon carbide wafer dicing equipment as described in claim 2, characterized in that: The suction cup base has a first ventilation pipe, and the rotating base has a second ventilation pipe that communicates with the first ventilation pipe. The hollow shaft of the motor has a rotating quick connector that rotates synchronously with the rotating base. The second ventilation pipe is connected to the rotating quick connector.
4. The silicon carbide wafer dicing equipment as described in claim 3, characterized in that: The rotating seat includes an annular portion and a connecting plate disposed in the middle of the annular portion. The edge of the connecting plate partially overlaps with the annular portion. The second ventilation pipe includes a first horizontal section opened inside the annular portion, a second horizontal section opened on the connecting plate, and a vertical section connecting the first horizontal section and the second horizontal section.
5. The silicon carbide wafer dicing equipment as described in claim 4, characterized in that: A third vent pipe is provided on the connecting plate. The third vent pipe is connected to the second horizontal section. The opening of the third vent pipe is located on the lower surface of the connecting plate and is connected to the rotating quick connector.
6. The silicon carbide wafer dicing equipment as described in claim 5, characterized in that: Each of the vacuum suction cups corresponds to a first horizontal section and a vertical section, and the second horizontal section connects multiple suction cups to the rotating quick connector through multiple sets of first horizontal sections and vertical sections.
7. The silicon carbide wafer dicing equipment as described in claim 1, characterized in that: The second adsorption component includes multiple connectors fixed to the outside of the stage. The stage has through holes that correspond one-to-one with the connectors. The two ends of the through holes are respectively located on the outer side and the upper surface of the stage. The connectors are connected to the through holes to provide a vacuum.
8. The silicon carbide wafer dicing equipment as described in claim 7, characterized in that: The openings of the plurality of through holes located on the upper surface of the platform are evenly distributed along the edge of the platform.
9. The silicon carbide wafer dicing equipment as described in claim 1, characterized in that: The adsorption positions of the first adsorption component and the second adsorption component are located on opposite sides of the dicing line of the wafer.
10. The silicon carbide wafer dicing equipment as described in claim 1, characterized in that: The horizontal moving mechanism includes a Y-axis linear module and an X-axis linear module disposed on the Y-axis linear module. The platform mechanism is disposed on the X-axis linear module. The horizontal moving mechanism drives the platform mechanism to move in the X-axis direction and the Y-axis direction.