Circuit board edge grinding device

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a circuit board edge grinding device which comprises a machine box, a material carrying assembly arranged in the machine box and an edge grinding assembly suspended on the material carrying assembly and used for processing a circuit board, and the material carrying assembly comprises a first driving assembly used for driving the circuit board to rotate. Dust collection assemblies are further arranged on the portions, located on the two sides of the material carrying assembly, in the machine box, and the first driving assembly with the driving end connected to the material carrying assembly is arranged, so that the circuit board can be driven to rotate through the first driving assembly so as to be matched with synchronous grinding of multiple edge faces of the circuit board; and the dust collection assemblies are arranged on the two sides of the material carrying assembly, so that dust generated by edge grinding of the circuit board can be collected through the dust collection assemblies, the circuit board grinding efficiency is improved, and the dust is prevented from polluting the production environment.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board edge grinding device. Background Technology

[0002] With the advancement of science and technology, various new electronic products have been rapidly applied to daily life and industrial production. The use of these electronic products is inseparable from the control circuit boards embedded within them. After the manufacturing process, circuit boards typically have burrs left on their outer periphery due to machining marks. If these burrs are not removed, it can easily lead to instability in equipment operation. Therefore, a deburring process is unavoidable during circuit board production. Currently, most circuit board deburring is done manually. However, this manual processing method requires repeatedly grinding the outer periphery of the circuit board with abrasives, resulting in poor edge grinding effects and low efficiency. Furthermore, the dust and waste generated during manual edge grinding are difficult to collect. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a circuit board edge grinding device, including a chassis, a material carrier assembly disposed within the chassis, and an edge grinding assembly suspended from the material carrier assembly for processing the circuit board. The material carrier assembly includes a first drive assembly for driving the circuit board to rotate, which cooperates with the edge grinding assembly to complete the deburring process on the circuit board. Dust collection assemblies are also disposed on both sides of the material carrier assembly within the chassis to improve the efficiency of the circuit board grinding and avoid dust pollution of the production environment.

[0004] Preferably, the material loading assembly further includes a rotating block disposed inside the chassis, and a suction cup assembly for limiting and fixing the circuit board is disposed on the end face of the rotating block. The driving end of the first driving assembly is connected to the rotating block to realize simultaneous grinding of multiple sides of the circuit board, thereby effectively improving grinding efficiency.

[0005] Preferably, the suction cup assembly includes a plurality of mounting blocks fixedly arranged along the circumferential surface of the rotating block, and a vacuum suction cup is provided at the end of the mounting block to limit and fix the circuit board.

[0006] Preferably, the edge grinding assembly includes a slide table suspended on the material carrier assembly and a sliding block slidably disposed on the slide table. A second driving assembly is also provided at the end of the slide table. The driving end of the second driving assembly is connected to the sliding block. A grinding disc is fixedly disposed on the side of the sliding block facing the material carrier assembly, so as to drive the grinding disc to grind the burrs on the circuit board.

[0007] Preferably, the edge grinding assembly further includes a lifting drive assembly disposed at the top of the chassis, the drive end of the lifting drive assembly being connected to the slide table, and guide columns connected to the chassis being disposed on both sides of the slide table to drive the grinding disc closer to or further away from the circuit board.

[0008] Preferably, the dust collection component includes a dust cover disposed inside the chassis on both sides of the material carrier component, a dust collection block disposed inside the dust cover, a dust collection pipe connected to the dust collection block inside the dust cover in the chassis, and an air extraction device connected to the other end of the dust collection pipe connected to the dust collection block, so as to collect the dust generated by edge grinding and avoid dust spreading and polluting the working environment.

[0009] As can be seen from the above, the following beneficial effects can be obtained by applying the method provided in this application: This application uses a chassis, a material carrier assembly disposed in the chassis, and a grinding assembly suspended on the material carrier assembly for processing circuit boards. The material carrier assembly includes a first drive assembly for driving the circuit board to rotate, which cooperates with the grinding assembly to complete the deburring process on the circuit board. Dust collection assemblies are also disposed on both sides of the material carrier assembly in the chassis. By suspending the grinding assembly at the top of the material carrier assembly, the grinding assembly can perform edge grinding on the circuit board fixed on the material carrier assembly. Furthermore, by providing the first drive assembly with a drive end connected to the material carrier assembly, the first drive assembly can drive the circuit board to rotate, thereby cooperating to simultaneously grind multiple edges of the circuit board. Finally, by providing dust collection assemblies on both sides of the material carrier assembly, the dust generated by the edge grinding of the circuit board can be collected by the dust collection assemblies, thereby improving the grinding efficiency of the circuit board and avoiding dust pollution of the production environment. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the circuit board edge grinding device according to an embodiment of this application;

[0012] Figure 2 This is a front view of the circuit board edge grinding device according to an embodiment of this application.

[0013] Figure Labels

[0014] 10. Chassis; 20. Material loading assembly; 30. Edge grinding assembly; 40. Dust collection assembly; 21. First drive assembly; 22. Rotating block; 23. Suction cup assembly; 31. Slide table; 32. Sliding block; 33. Second drive assembly; 34. Grinding disc; 35. Lifting drive assembly; 36. Guide column; 41. Dust cover; 42. Dust collection block; 43. Dust collection pipe; 231. Mounting block; 232. Vacuum suction cup. Detailed Implementation

[0015] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0016] Example

[0017] To address the aforementioned technical problems, this embodiment provides a circuit board edge grinding device, such as... Figure 1 As shown, the system includes a chassis 10, a material carrier 20 disposed within the chassis 10, and a grinding assembly 30 suspended on the material carrier 20 for processing circuit boards. The material carrier 20 includes a first drive assembly 21 for driving the circuit board to rotate, which works in conjunction with the grinding assembly 30 to complete the deburring process on the circuit board. Dust collection assemblies 40 are also disposed on both sides of the material carrier 20 within the chassis 10. By suspending the grinding assembly 30 at the top of the material carrier 20, the grinding assembly 30 can perform edge grinding on the circuit board fixed on the material carrier 20. The first drive assembly 21, with its drive end connected to the material carrier 20, can drive the circuit board to rotate, thereby coordinating the simultaneous grinding of multiple edges of the circuit board. The dust collection assemblies 40 on both sides of the material carrier 20 can collect the dust generated during the edge grinding of the circuit board, thereby improving the efficiency of circuit board grinding and preventing dust pollution of the production environment.

[0018] Specifically, such as Figure 2As shown, the material loading assembly 20 also includes a rotating block 22 disposed inside the chassis 10. A suction cup assembly 23 for limiting and fixing the circuit board is disposed on the end face of the rotating block 22. The driving end of the first driving assembly 21 is connected to the rotating block 22. By disposing of the rotating block 22 at the driving end of the first driving assembly 21 and by disposing of the suction cup assembly 23 on the end face of the rotating block 22, when the circuit board is being limited and fixed by the suction cup assembly 23, the first driving assembly 21 can drive the rotating block 22 to rotate, thereby driving the suction cup assembly 23 disposed on the rotating block 22 to rotate. This allows the edge grinding assembly 30 to simultaneously grind multiple edges of the circuit board without disassembling the circuit board, thereby achieving simultaneous grinding of multiple edges of the circuit board and effectively improving grinding efficiency.

[0019] In the above scheme, the suction cup assembly 23 includes several mounting blocks 231 fixedly arranged along the circumferential surface of the rotating block 22. A vacuum suction cup 232 is provided at the end of the mounting block 231. In this embodiment, a vacuum channel is opened in the rotating block 22 along the inside of the mounting block 231 and connected to the vacuum suction cup 232. The vacuum channel is connected to the other end of the vacuum suction cup 232 and a vacuum pump is connected to it. The circuit board is fixed and limited by the vacuum suction cup 232. In other embodiments, the suction cup assembly 23 can be replaced by a clamping assembly. A clamping cylinder is provided, and a clamping claw is provided at the driving end of the clamping cylinder. The clamping claw clamps the two ends of the circuit board to be processed and limits and fixes them. Then, the unclamped end face is polished first, and the polished end face is fixed by disassembling the circuit board. The remaining end faces are polished to complete the process.

[0020] Furthermore, the edge grinding assembly 30 includes a slide table 31 suspended on the material carrier assembly 20 and a sliding block 32 slidably disposed on the slide table 31. A second drive assembly 33 is also disposed at the end of the slide table 31. The drive end of the second drive assembly 33 is connected to the sliding block 32. A grinding disc 34 is fixedly disposed on the side of the sliding block 32 facing the material carrier assembly 20. By slidably disposing of the sliding block 32 on the slide table 31, and by connecting the drive end of the second drive assembly 33 to the sliding block 32, and by disposing of the grinding disc 34 on the sliding block 32, the second drive assembly 33 can drive the sliding block 32 to slide along the slide table 31, thereby driving the grinding disc 34 to move along the end face of the circuit board that needs to be ground, thus completing the process of grinding burrs off the circuit board with the grinding disc.

[0021] In a preferred embodiment, the edge grinding assembly 30 further includes a lifting drive assembly 35 disposed at the top of the housing 10. The drive end of the lifting drive assembly 35 is connected to the slide table 31. Guide posts 36 connected to the housing 10 are also disposed on both sides of the slide table 31. By connecting the drive end of the lifting drive assembly 35 to the slide table 31, the lifting drive assembly 35 can drive the grinding disc 34 to move closer to or away from the circuit board fixedly disposed on the edge grinding assembly 30. Furthermore, by providing guide posts 36 on both sides of the slide table 31, the movement of the edge grinding assembly 30 is better guided.

[0022] Specifically, the dust collection component 40 includes a dust cover 41 located inside the housing 10 on both sides of the material loading component 20. A dust collection block 42 is installed inside the dust cover 41. A dust collection pipe 43 is provided in the housing 10 and connects to the dust collection block 42 inside the dust cover 41. An air extraction device is connected to the other end of the dust collection pipe 43 connected to the dust collection block 42. By installing the dust collection block 42 inside the dust cover 41, and having a dust collection pipe 43 connected to the outside of the housing 10, and an air extraction device connected to the other end of the dust collection pipe 43 connected to the dust collection block 42, the dust and debris generated when the edge grinding component 30 grinds the circuit board can be collected by the air extraction of the dust collection block 42, thus effectively preventing dust pollution of the construction environment.

[0023] In summary, in one or more embodiments of this application, this application provides a circuit board edge grinding device, including a chassis, a material carrier assembly disposed within the chassis, and an edge grinding assembly suspended from the material carrier assembly for processing the circuit board. The material carrier assembly includes a first drive assembly for driving the circuit board to rotate, which cooperates with the edge grinding assembly to complete the deburring process on the circuit board. Dust collection assemblies are also disposed on both sides of the material carrier assembly within the chassis. By suspending the edge grinding assembly at the top of the material carrier assembly, the edge grinding assembly can perform edge grinding processing on the circuit board fixedly disposed on the material carrier assembly. Furthermore, by providing a drive end connected to the material carrier assembly, the first drive assembly can drive the circuit board to rotate, thereby cooperating to simultaneously grind multiple edges of the circuit board. Finally, by providing dust collection assemblies on both sides of the material carrier assembly, the dust generated during circuit board edge grinding can be collected by the dust collection assemblies, thereby improving the efficiency of circuit board grinding and avoiding dust pollution of the production environment.

[0024] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.

Claims

1. A circuit board edge grinding device, characterized in that: The device includes a chassis (10), a material carrier assembly (20) disposed within the chassis (10), and an edge grinding assembly (30) suspended from the material carrier assembly (20) for processing circuit boards. The material carrier assembly (20) includes a first drive assembly (21) for driving the circuit board to rotate, which works in conjunction with the edge grinding assembly (30) to complete the deburring process on the circuit board. Dust collection assemblies (40) are also disposed on both sides of the material carrier assembly (20) within the chassis (10).

2. The circuit board edge grinding device according to claim 1, characterized in that: The material loading assembly (20) further includes a rotating block (22) disposed in the chassis (10), and a suction cup assembly (23) for limiting and fixing the circuit board is disposed on the end face of the rotating block (22), and the driving end of the first driving assembly (21) is connected to the rotating block (22).

3. The circuit board edge grinding device according to claim 2, characterized in that: The suction cup assembly (23) includes a plurality of mounting blocks (231) fixedly arranged along the circumferential surface of the rotating block (22), and a vacuum suction cup (232) is provided at the end of the mounting block (231).

4. The circuit board edge grinding device according to claim 1, characterized in that: The edge grinding assembly (30) includes a slide table (31) suspended on the material carrier assembly (20) and a sliding block (32) slidably disposed on the slide table (31). A second drive assembly (33) is also provided at the end of the slide table (31). The drive end of the second drive assembly (33) is connected to the sliding block (32). A grinding disc (34) is fixedly disposed on the side of the sliding block (32) facing the material carrier assembly (20).

5. The circuit board edge grinding device according to claim 4, characterized in that: The edge grinding assembly (30) also includes a lifting drive assembly (35) disposed at the top of the chassis (10). The drive end of the lifting drive assembly (35) is connected to the slide table (31). Guide columns (36) connected to the chassis (10) are also provided on both sides of the slide table (31).

6. The circuit board edge grinding device according to claim 1, characterized in that: The dust collection assembly (40) includes a dust cover (41) located on both sides of the material loading assembly (20) inside the housing (10). A dust collection block (42) is provided inside the dust cover (41). A dust collection pipe (43) is provided in the housing (10) and communicates with the dust collection block (42) inside the dust cover (41). An air extraction device is connected to the other end of the dust collection pipe (43) connected to the dust collection block (42).

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