Printed circuit board, printed circuit board packaging structure and electronic equipment
By placing a pad on the surface of the printed circuit board substrate, the problem of ink layer rubbing during the stacking and packaging of printed circuit boards is solved, thereby reducing the scrap rate and increasing the production yield, while also improving heat dissipation performance.
Patent Information
- Application Number
- CN202422647844.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-10-31
AI Technical Summary
During the packaging and transportation of printed circuit boards, the heat dissipation ink layer is easily scratched, resulting in a high scrap rate.
Multiple pads are disposed on the substrate surface of the printed circuit board. The pads are spaced apart circumferentially along the ink layer and are higher than the ink layer to support another substrate and prevent the ink layer from contacting the horizontal support surface.
It effectively prevents the ink layer surface from being scratched, reduces the scrap rate of printed circuit boards, improves production yield, and enhances heat dissipation performance through the heat dissipation ink layer.
Smart Images
Figure CN223534071U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of printed circuit board technology, and in particular to a printed circuit board, a printed circuit board packaging structure, and an electronic device. Background Technology
[0002] Printed Circuit Boards (PCBs) are important electronic components, serving as the support for electronic components and the carrier for their electrical connections. With the booming development of the electronics industry, PCBs are increasingly used in high-power applications, which necessitates that PCBs have excellent heat dissipation performance to ensure that the performance of each electronic component is not affected by high heat.
[0003] Printing thermal ink on PCBs is one of the effective ways to improve the heat dissipation performance of PCBs. However, when packaging and transporting the PCBs by stacking them on top of each other, the surface of the thermal ink layer is easily scratched, which leads to a high scrap rate of the PCBs. Utility Model Content
[0004] Therefore, it is necessary to provide a printed circuit board, printed circuit board packaging structure, and electronic device that can effectively prevent ink layer smudging in order to address the above problems.
[0005] The technical solution is as follows:
[0006] In a first aspect, this application provides a printed circuit board, comprising:
[0007] The substrate includes a first surface, the first surface having an ink layer and a plurality of pads, the plurality of pads being spaced apart circumferentially along the ink layer, the height of each pad being greater than the thickness of the ink layer, the plurality of pads being used to jointly support another printed circuit board or to jointly support the substrate.
[0008] In the aforementioned printed circuit board, since the ink layer and multiple spacers are all disposed on the first surface, with the spacers spaced circumferentially along the ink layer and each spacer higher than the ink layer, when the printed circuit board is placed on a horizontal support plane with the first surface as its bottom, the multiple spacers can support the substrate on the same horizontal plane and ensure a certain distance between the surface of the ink layer and the horizontal support plane, thus preventing the ink layer from contacting the horizontal support plane and avoiding scratches on the ink layer surface. This helps reduce the scrap rate of the printed circuit board and improves the production yield. Therefore, when using a stacked configuration to package and transport printed circuit boards, the multiple spacers between two adjacent substrates can jointly support their corresponding substrates or the substrate of another printed circuit board, preventing the surface of the ink layer from contacting the substrate of another printed circuit board. This helps prevent scratches on the ink layer, effectively reducing the scrap rate of the printed circuit board and improving the production yield.
[0009] The technical solution will be further explained below:
[0010] In one embodiment, the difference between the height of each pad and the thickness of the ink layer is a first predetermined value.
[0011] In one embodiment, the first predetermined value is between 30 μm and 100 μm.
[0012] In one embodiment, the first predetermined value is 50 μm.
[0013] In one embodiment, the ink layer is a heat-dissipating ink layer;
[0014] And / or, the pad is a heat-dissipating ink pad.
[0015] In one embodiment, each of the gaskets is a columnar body, and the cross-section of the gasket is a rectangular structure.
[0016] In one embodiment, the gasket has a rounded rectangular cross-section;
[0017] And / or, the dimension of the end of the gasket facing away from the substrate is 5mm × 5mm.
[0018] In one embodiment, the edge of the gasket opposite to the substrate is provided with rounded corners.
[0019] Secondly, this application provides a printed circuit board packaging structure, including the printed circuit board described in any of the above claims, wherein a plurality of the printed circuit boards are stacked sequentially along the thickness direction of the printed circuit boards, and the first surface of all the printed circuit boards faces the same side.
[0020] In the above-described printed circuit board packaging structure, since the ink layer and multiple spacers are both disposed on the first surface, and the multiple spacers are spaced apart circumferentially along the ink layer, and each spacer is higher than the ink layer, when the printed circuit board is packaged and transported by stacking the upper and lower boards, the multiple spacers between two adjacent substrates can jointly support their corresponding substrates or the substrate of another printed circuit board, so as to avoid the surface of the ink layer from contacting the substrate of another printed circuit board, thereby helping to avoid scratching the ink layer, effectively reducing the scrap rate of the printed circuit board and improving the production yield of the printed circuit board.
[0021] Thirdly, this application provides an electronic device including the printed circuit board described in any of the above claims.
[0022] In the aforementioned electronic device, since the ink layer and multiple pads are both disposed on the first surface, and the multiple pads are spaced apart circumferentially along the ink layer, and each pad is higher than the ink layer, the multiple pads can jointly abut against objects close to the ink layer to prevent the surface of the ink layer from being scratched, thereby reducing the scrap rate of the printed circuit board and saving the production cost of the electronic device. Attached Figure Description
[0023] Figure 1 This is a top view of the printed circuit board in one embodiment.
[0024] Figure 2 This is a cross-sectional view of a printed circuit board in one embodiment.
[0025] Explanation of reference numerals in the attached figures:
[0026] 100. Printed circuit board packaging structure; 10. Printed circuit board; 1. Substrate; 11. First surface; 2. Gasket; 3. Ink layer; S1. Thickness direction. Detailed Implementation
[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0028] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0031] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0033] See Figures 1 to 2 , Figure 1 This is a top view of the printed circuit board 10 according to one embodiment of the present application. Figure 2 A cross-sectional view of a printed circuit board 10 in one embodiment is shown. A printed circuit board 10 provided in one embodiment of this application includes a substrate 1. The substrate 1 includes a first surface 11. The first surface 11 is provided with an ink layer 3 and a plurality of pads 2. The plurality of pads 2 are arranged at intervals along the circumference of the ink layer 3. The height of each pad 2 is greater than the thickness of the ink layer 3. The plurality of pads 2 are used to jointly support another printed circuit board 10 or to jointly support the substrate 1.
[0034] In the aforementioned printed circuit board 10, since the ink layer 3 and multiple spacers 2 are both disposed on the first surface 11, and the multiple spacers 2 are spaced apart circumferentially along the ink layer 3, and each spacer 2 is higher than the ink layer 3, when the printed circuit board 10 is placed on a horizontal support plane with the first surface 11 as its bottom surface, the multiple spacers 2 can support the substrate 1 on the same horizontal plane, and can ensure that there is a first gap between the surface of the ink layer 3 and the horizontal support plane, that is, to ensure that the ink layer 3 does not contact the horizontal support plane, thereby preventing the surface of the ink layer 3 from being scratched. This is beneficial to reducing the scrap rate of the printed circuit board 10 and improving the production yield of the printed circuit board 10. Therefore, when the printed circuit board 10 is packaged and transported by stacking boards, the multiple spacers 2 between two adjacent substrates 1 can jointly support their corresponding substrate 1 or the substrate 1 of another printed circuit board 10, so as to prevent the surface of the ink layer 3 from contacting the substrate 1 of another printed circuit board 10, thereby preventing the ink layer 3 from being scratched, effectively reducing the scrap rate of the printed circuit board 10 and improving the production yield of the printed circuit board 10.
[0035] Indicatively, the position, size, and shape of the ink layer 3 on the first surface 11 can be set as needed. For example, the projection of the ink layer 3 on the first surface 11 can be a polygon (such as a rectangle), a circle, or other irregular shapes.
[0036] Indicatively, the spacer 2 is spaced apart from the ink layer 3. In some embodiments, the spacer 2 may also be fitted to the edge of the ink layer 3.
[0037] Indicatively, the number of gaskets 2 can be set according to actual needs, for example, there can be two, three, four or more. Optionally, the spacing between gaskets 2 can be set according to actual needs. For example, multiple gaskets 2 can be evenly spaced along the outer periphery of the ink layer 3; or the spacing between gaskets 2 can be unequal; or, some gaskets 2 can have equal spacing, while other gaskets 2 have unequal spacing.
[0038] In illustrative terms, to ensure that the placement of the spacer 2 does not affect the function of the printed circuit board 10, the spacer 2 can be placed in a non-functional area of the printed circuit board 10, such as a non-soldering position of the printed circuit board 10.
[0039] Schematic, the cross-section of gasket 2 can be circular, polygonal or irregular.
[0040] In one embodiment, such as Figure 2 As shown, the height difference between each pad 2 and the thickness difference between each ink layer 3 is a first predetermined value. Thus, the height of each pad is consistent, ensuring that when the printed circuit board 10 is packaged and transported using a stacked configuration, the multiple pads 2 between adjacent substrates 1 can maintain the horizontal alignment between the two substrates 1, effectively preventing the printed circuit board 10 from sliding due to tilting, and thus helping to avoid scratching of the ink layer 3 caused by sliding.
[0041] Furthermore, the first predetermined value is between 30μm and 100μm. In this way, it can be effectively ensured that when the printed circuit boards 10 are stacked, the multiple spacers 2 can effectively prevent the ink layer 3 from contacting the substrate 1 of the adjacent printed circuit board 10, thereby ensuring that the ink layer 3 will not be scratched.
[0042] Preferably, the first predetermined value is 50 μm.
[0043] In one embodiment, ink layer 3 is a heat-dissipating ink layer. Thus, ink layer 3 can be formed by screen printing heat-dissipating ink. Since heat-dissipating ink has excellent heat dissipation properties, the heat-dissipating ink layer can dissipate heat transferred from electronic components to the substrate 1, thereby improving the heat dissipation capacity and efficiency of the printed circuit board 10.
[0044] In other embodiments, ink layer 3 may also be a solder resist ink layer or a conductive ink layer.
[0045] Furthermore, the gasket 2 is a heat-dissipating ink gasket. Thus, the gasket 2 can be formed by screen printing heat-dissipating ink, allowing the heat-dissipating ink gasket to be formed in the same process as the heat-dissipating ink layer. This not only improves production efficiency but also saves production steps to reduce production costs. In addition, it can effectively ensure the height difference between the gasket 2 and the ink layer 3.
[0046] In one embodiment, such as Figure 1 and Figure 2 As shown, each pad 2 is a columnar body with a rectangular cross-section. Thus, the surface of the pad 2 facing away from the substrate 1 is flat. This results in a larger contact area between the pad 2 and the substrate 1 of the adjacent printed circuit board 10 when packaging or transporting the printed circuit board 10 using upper and lower pads. This allows two adjacent printed circuit boards 10 to remain stable under the support of multiple pads 2, thereby preventing scratches on the ink layer 3 caused by sliding surfaces.
[0047] Furthermore, such as Figure 1 As shown, the cross-section of the spacer 2 is a rounded rectangle. In this way, during the stacking of printed circuit boards 10, the spacer 2 will not scratch the ink layer 3 of other printed circuit boards 10 due to its sharp edges, which helps to reduce the scrap rate of printed circuit boards 10 and improve the production yield of printed circuit boards 10.
[0048] Optionally, the dimension of the end of the spacer 2 facing away from the substrate 1 is 5mm × 5mm. In this way, when multiple printed circuit boards 10 are stacked, the contact surface between the spacer 2 and the substrate 1 of the adjacent printed circuit board 10 is larger, so that the two adjacent printed circuit boards 10 can remain stable under the support of multiple spacers 2, thereby avoiding scratching of the ink layer 3 caused by the slide plate.
[0049] Furthermore, such as Figure 2 As shown, the edge of the spacer 2 facing away from the substrate 1 is rounded. In this way, during the stacking of printed circuit boards 10, the end face of the spacer 2 will not scratch the ink layer 3 of other printed circuit boards 10 due to its sharp edge, which helps to reduce the scrap rate of printed circuit boards 10 and improve the production yield of printed circuit boards 10.
[0050] In one embodiment, illustratively, the substrate 1 further includes a second surface opposite to the first surface. The second surface is provided with a second ink layer and a plurality of second pads. The plurality of second pads are spaced apart circumferentially along the second ink layer. The height of each second pad is greater than the thickness of the second ink layer, and the difference between the height of the second pad and the thickness of the second ink layer is a second predetermined value. Thus, when the substrate 1 has a double-sided ink printing structure, the pads 2 can protect the ink layer 3 on the first surface 11 to prevent scratches, and the second pads can protect the second ink layer on the second surface to prevent scratches. Optionally, the second pads are heat-dissipating ink pads, and the second ink layer is a heat-dissipating ink layer. The second predetermined value is between 30 μm and 100 μm. Preferably, the second predetermined value is 50 μm.
[0051] Please see Figure 1 and Figure 2An embodiment of this application also provides a printed circuit board packaging structure 100, including a plurality of printed circuit boards 10 of any of the above embodiments. The plurality of printed circuit boards 10 are stacked sequentially along the thickness direction S1 of the printed circuit boards 10, and the first surface 11 of all printed circuit boards 10 faces the same side.
[0052] In the aforementioned printed circuit board packaging structure 100, since the ink layer 3 and multiple spacers 2 are both disposed on the first surface 11, and the multiple spacers 2 are spaced apart circumferentially along the ink layer 3, and each spacer 2 is higher than the ink layer 3, when the printed circuit board 10 is packaged and transported by stacking the upper and lower boards, the multiple spacers 2 between two adjacent substrates 1 can jointly support their corresponding substrate 1 or the substrate 1 of another printed circuit board 10, so as to avoid the surface of the ink layer 3 from contacting the substrate 1 of another printed circuit board 10, thereby helping to avoid scratching the ink layer 3, effectively reducing the scrap rate of the printed circuit board 10 and improving the production yield of the printed circuit board 10.
[0053] An embodiment of this application also provides an electronic device, including the printed circuit board 10 of any of the above embodiments.
[0054] In the aforementioned electronic device, since the ink layer 3 and multiple pads 2 are both disposed on the first surface 11, and the multiple pads 2 are spaced apart along the circumference of the ink layer 3, and each pad 2 is higher than the ink layer 3, the multiple pads 2 can jointly abut against objects close to the ink layer to avoid scratching the surface of the ink layer, thereby reducing the scrap rate of the printed circuit board 10 and saving the production cost of the electronic device.
[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0056] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A printed circuit board, characterized in that, include: The substrate includes a first surface, the first surface having an ink layer and a plurality of pads, the plurality of pads being spaced apart circumferentially along the ink layer, the height of each pad being greater than the thickness of the ink layer, the plurality of pads being used to jointly support another printed circuit board or to jointly support the substrate.
2. The printed circuit board according to claim 1, characterized in that, The difference between the height of each pad and the thickness of the ink layer is a first predetermined value.
3. The printed circuit board according to claim 2, characterized in that, The first predetermined value is between 30 μm and 100 μm.
4. The printed circuit board according to claim 3, characterized in that, The first predetermined value is 50 μm.
5. The printed circuit board according to claim 4, characterized in that, The ink layer is a heat-dissipating ink layer; And / or, the pad is a heat-dissipating ink pad.
6. The printed circuit board according to claim 1, characterized in that, Each of the gaskets is a columnar body, and the cross-section of the gasket is a rectangular structure.
7. The printed circuit board according to claim 6, characterized in that, The gasket has a rounded rectangular cross-section; And / or, the dimension of the end of the gasket facing away from the substrate is 5mm × 5mm.
8. The printed circuit board according to claim 6, characterized in that, The edge of the gasket opposite to the substrate has rounded corners.
9. A printed circuit board packaging structure, characterized in that, The invention includes a plurality of printed circuit boards as described in any one of claims 1 to 8, wherein the plurality of printed circuit boards are stacked sequentially along the thickness direction of the printed circuit boards, and the first surfaces of all the printed circuit boards face the same side.
10. An electronic device, characterized in that, Including the printed circuit board as described in any one of claims 1 to 8.