Chip changing device for crystal oscillator probe

Abstract

The utility model relates to the field of semiconductor evaporation coating equipment, and discloses a crystal oscillator probe chip changing device which comprises an air guide piece and a conveying piece, an air outlet hole is formed in the air guide piece, the conveying piece comprises a conveying pipe used for conveying crystal oscillator chips, and a chip outlet hole is formed in one end, facing the air guide piece, of the conveying pipe. The gas guide part and the conveying part are detachably connected, a crystal oscillator probe is detachably connected between the gas guide part and the conveying part, a through hole used for containing a crystal oscillator piece is formed in the crystal oscillator probe, and the through hole, the piece outlet hole and the gas outlet hole are communicated through gas paths and correspond in position, so that gas guided out by the gas guide part penetrates through the through hole to act on the crystal oscillator piece in the conveying pipe. And the crystal oscillator is controlled to slide into the through hole through airflow change. The crystal oscillator probe chip changing device is high in chip changing efficiency and can realize lossless chip changing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor evaporation coating equipment, and in particular to a crystal oscillator probe changing device. Background Technology

[0002] In semiconductor evaporation coating equipment, crystal oscillators need to be replaced after reaching the end of their service life. The replacement process involves removing the crystal probe from the equipment, taking out the old crystal oscillator from the probe, and inserting a new one. Traditional methods for transferring crystal oscillators include using tweezers to pick up the side edge of the new crystal oscillator and placing it into the probe, or using an anti-static pick-up pen to extract the crystal oscillator and place it into the probe. However, using tweezers can cause stress damage or scratches to the gold plating layer on the crystal oscillator surface, and there is also a risk of the crystal oscillator falling out during replacement. When using an anti-static pick-up pen, the crystal oscillator is easily contaminated by the pen material, affecting signal transmission and frequency accuracy. Utility Model Content

[0003] To address the aforementioned technical problems of crystal oscillators being easily damaged, falling off, or contaminated during the replacement process, this invention provides a crystal oscillator probe replacement device that uses airflow to transport the crystal oscillator. Throughout the replacement process, the crystal oscillator does not come into contact with external objects, thus preventing damage and contamination, and eliminating the risk of the crystal oscillator falling off.

[0004] The specific technical solution of this utility model is as follows: a crystal oscillator probe changing device, including a gas guide and a conveying component. The gas guide is provided with a gas outlet, and the conveying component includes a conveying pipe for conveying the crystal oscillator. The end of the conveying pipe facing the gas guide is provided with a chip outlet. The gas guide and the conveying component are detachably connected, and a crystal oscillator probe is detachably connected between them. The crystal oscillator probe is provided with a through hole for accommodating the crystal oscillator. The through hole, the chip outlet, and the gas outlet are connected and positioned correspondingly, so that the gas discharged by the gas guide passes through the through hole and acts on the crystal oscillator in the conveying pipe, and the crystal oscillator slides into the through hole by the change of airflow.

[0005] This device transfers crystal oscillators by controlling the flow rate of gas exiting the vent. When the gas acts on the crystal oscillator, it generates a stable and uniform thrust, stabilizing the crystal oscillator in the delivery pipe. The gas flow rate is then slowly reduced to decrease the thrust. When the thrust is less than the weight of the crystal oscillator, it begins to fall. During this process, by controlling the rate at which the gas flow rate decreases, the crystal oscillator falls slowly and smoothly through the exit hole into the through hole. Throughout the entire crystal replacement process, the crystal oscillator does not come into contact with external objects, preventing damage and contamination, avoiding cost waste, and ensuring the quality of the crystal oscillator. The device has a closed structure, and the crystal oscillator moves along the path of the delivery pipe, eliminating the risk of the crystal oscillator falling and improving replacement efficiency.

[0006] Preferably, the air guide includes a first connecting part with an air outlet and a first groove in the first connecting part, and the conveying part includes a second connecting part communicating with the conveying pipe and a second groove in the second connecting part. The air guide and the conveying part are connected through the first connecting part and the second connecting part, and the first groove and the second groove form a receiving cavity for accommodating and fixing the crystal oscillator probe.

[0007] In the above technical solution, the gas guide and conveying components cover the crystal oscillator probe, protecting it from physical damage or contamination, and making it easy to directly reinstall the crystal oscillator probe into the semiconductor evaporation coating equipment. At the same time, the embedded structure makes the device layout more compact, reduces the device size, and facilitates operation.

[0008] Preferably, the air guide and the conveying component are threaded together; or, the air guide and the conveying component are connected by snap-fit.

[0009] In the above technical solution, the threaded connection has good airtightness, which allows the airflow to remain stable and balanced during the crystal oscillator transfer process, flowing along the set path, which is conducive to the stable transfer of the crystal oscillator; the snap-fit ​​connection is easy to operate, realizing the quick assembly and disassembly of the air guide and the conveying component.

[0010] Preferably, the crystal oscillator probe is threadedly connected to the air guide or conveyor; or, the air guide and conveyor clamp and fix the crystal oscillator probe; or, the crystal oscillator probe is connected to the air guide or conveyor via a snap-fit ​​connection.

[0011] In the above technical solution, the threaded connection utilizes the threaded structure of the crystal oscillator probe itself to achieve a stable connection with the air guide or conveying component, resulting in high connection strength. Simultaneously, it improves the airtightness of the device and stabilizes the airflow transmission path. The clamping and fixing mechanism allows the crystal oscillator probe to be easily removed from between the air guide and conveying component after the crystal oscillator is replaced. This simple operation process minimizes wear on the crystal oscillator probe. Furthermore, it eliminates the need for additional connecting components on the crystal oscillator probe, reducing costs and facilitating its reinstallation in the semiconductor evaporation coating equipment. The snap-fit ​​connection allows for quick connection and separation of the crystal oscillator probe from the air guide or conveying component.

[0012] Preferably, the diameter of the vent hole is smaller than the diameter of the through hole.

[0013] In the above technical solution, because the diameter of the vent hole is smaller, the gas is more concentrated when it is ejected. Under the same flow rate, the airflow from the small hole can exert a greater thrust on the crystal oscillator compared to the airflow from the large hole, thus saving energy.

[0014] Preferably, the diameter of the output hole is less than or equal to the diameter of the through hole, and the diameter of the output hole is greater than the diameter of the crystal oscillator.

[0015] In the above technical solution, when the crystal oscillator transitions from the exit hole to the through hole, the through hole has a larger space than the exit hole, so that even if there is a certain positional deviation or angular offset during the falling process, the crystal oscillator can still fall smoothly into the through hole, thus improving the chip replacement efficiency.

[0016] Preferably, the conveying component includes a second connecting part that communicates with the conveying pipe. The second connecting part has a second groove, and the output hole is located at the bottom of the second groove. The diameter of the output hole is equal to the diameter of the through hole. The crystal oscillator probe includes a second disk, and the through hole penetrates the second disk. The second disk is embedded in the second groove and abuts against the bottom surface of the second groove. The through hole and the output hole are aligned.

[0017] In the above technical solution, the delivery pipe and the through hole form a continuous delivery channel, which allows the crystal oscillator to slide smoothly and accurately from the delivery pipe into the through hole, thus improving the efficiency of crystal replacement.

[0018] Preferably, there is one air outlet, and the central axes of the air outlet, through hole, and sheet outlet are collinear.

[0019] In the above technical solution, the central axes of the air outlet, through hole, and chip outlet are collinear, so that the airflow transmission path and the crystal oscillator conveying path overlap axially. The thrust generated by the airflow can act precisely on the center of gravity of the crystal oscillator, improving the stability of the crystal oscillator slippage and improving the chip replacement efficiency. The dynamic pressure of the airflow is converted into thrust to the maximum extent, thus improving the efficiency of airflow action.

[0020] Preferably, there are several vent holes, which are evenly distributed around the center of the through hole, and the air blown out from each vent hole can act on the crystal oscillator through the through hole.

[0021] In the above technical solution, the gas blown out from each vent can act on the crystal oscillator through the through hole, making the gas thrust on the crystal oscillator more uniform in all directions. At the same time, the circumferential distribution allows the gas to converge smoothly when it approaches the crystal oscillator, creating a stable gas environment that is conducive to precise control of the crystal oscillator. In addition, the simultaneous gas output from multiple vents greatly increases the gas flow rate. When facing a large crystal oscillator, the sufficient gas flow rate can provide enough thrust to ensure that it can be smoothly levitated and transported, thereby effectively enhancing the device's adaptability to different crystal oscillators.

[0022] Preferably, the end of the conveying pipe away from the air guide is provided with an exhaust hole or exhaust groove to connect the internal space of the conveying pipe with the atmosphere.

[0023] In the above technical solution, the delivery pipe is equipped with an exhaust channel for exhaust, which maintains the dynamic balance of gas in the delivery pipe. This can effectively prevent the gas from being unable to escape due to the sealing of the delivery pipe port and the crystal oscillator packaging box, thereby improving the adaptability of the device to different packaging box structures and ensuring that the entire crystal oscillator probe changing device can operate continuously, stably and efficiently.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] (1) Achieve non-destructive chip replacement: This device transfers the crystal oscillator by controlling the flow rate of the gas flowing out of the vent. During the entire chip replacement process, the crystal oscillator does not come into contact with external objects, so it will not cause damage or contamination. The device is a closed structure and the crystal oscillator moves along the path of the delivery pipe, eliminating the risk of the crystal oscillator falling.

[0026] (2) High crystal replacement efficiency: The conveying pipe and the through hole form a continuous conveying channel and the central axis of the air outlet, through hole and crystal outlet hole are collinear. The thrust generated by the airflow can act precisely on the center of gravity of the crystal oscillator, so that the crystal oscillator can slide smoothly, smoothly and accurately from the conveying pipe into the through hole, thus improving the crystal replacement efficiency. Attached Figure Description

[0027] Figure 1 This is a cross-sectional view of the present invention;

[0028] Figure 2 This is the structural explosion of the present invention. Figure 1 ;

[0029] Figure 3 This is the structural explosion of the present invention. Figure 2 ;

[0030] Figure 4 This is a structural schematic diagram of the conveying component of this utility model.

[0031] The attached figures are labeled as follows: 1. Conveying component; 11. Conveying pipe; 12. Plate outlet; 13. Exhaust port; 14. Second connecting part; 15. Second groove; 16. Exhaust groove; 2. Crystal oscillator probe; 21. Through hole; 22. First disk; 23. Second disk; 24. Limiting stop; 3. Air guide component; 31. Air outlet; 32. Air guide pipe; 33. Connecting pipe; 34. Third groove; 35. First connecting part; 36. First groove; 4. Positioning block; 5. First sealing ring; 6. Second sealing ring; 7. Crystal oscillator plate. Detailed Implementation

[0032] The present invention will be further described below with reference to embodiments. Unless otherwise specified, all devices, connection structures, and methods involved in this invention are known in the art.

[0033] Example 1

[0034] Reference Figures 1 to 4 As shown, this utility model provides a crystal oscillator probe changing device, including a gas guide 3 and a conveying component 1. The gas guide 3 includes a gas guide tube 32 for introducing gas. The end of the gas guide tube 32 facing the conveying component 1 is provided with a gas outlet 31. The end of the gas guide tube 32 away from the conveying component 1 is connected to a connecting tube 33 for connecting with an elastic gas delivery tube. When the elastic gas delivery tube wraps around the connecting tube 33, the gas path between the gas guide tube 32, the connecting tube 33 and the elastic gas delivery tube is connected. The conveying component 1 includes a conveying tube 11 for conveying the crystal oscillator chip 7. The conveying tube 11 is directed towards the gas guide. One end of component 3 is provided with a chip outlet hole 12. The air guide component 3 and the conveying component 1 are detachably connected, and a crystal oscillator probe 2 is detachably connected between them. The crystal oscillator probe 2 is provided with a through hole 21 for accommodating the crystal oscillator 7. A limiting baffle 24 is provided in the through hole 21 to restrict the falling of the crystal oscillator 7. The air passages of the through hole 21, the chip outlet hole 12, and the air outlet hole 31 are connected and corresponding in position, so that the gas discharged by the air guide component 3 passes through the through hole 21 and acts on the crystal oscillator 7 in the conveying pipe 11. The airflow changes control the crystal oscillator 7 to slide into the through hole 21 and be placed horizontally. The diameter of the conveying pipe 11 is constant and its diameter is larger than the diameter of the crystal oscillator 7.

[0035] This crystal oscillator probe changing device transfers the crystal oscillator 7 by controlling the flow rate of gas exiting the vent 31. When the gas acts on the crystal oscillator 7, it generates a stable and uniform thrust, stabilizing the crystal oscillator 7 in the delivery pipe 11. The gas flow rate is then slowly reduced to decrease the thrust. When the thrust is less than the weight of the crystal oscillator 7, it begins to fall. During this process, by controlling the rate of gas flow reduction, the crystal oscillator 7 falls slowly and smoothly through the exit hole 12 into the through hole 21. Throughout the changing process, the crystal oscillator 7 does not come into contact with external objects, preventing damage and contamination, avoiding cost waste, and ensuring the quality of the crystal oscillator 7. The device has a closed structure, and the crystal oscillator 7 moves along the path of the delivery pipe 11, eliminating the risk of the crystal oscillator 7 falling and improving changing efficiency. This crystal oscillator probe changing device uses transparent quartz material and nitrogen gas. During the changing process, the sliding of the crystal oscillator 7 can be clearly and intuitively observed, allowing for flexible adjustment of the nitrogen gas flow rate to control the sliding speed of the crystal oscillator 7.

[0036] The crystal oscillator probe changing device is assembled as follows: first, connect the crystal oscillator probe 2 to the conveyor component 1, and then connect the air guide component 3 to the conveyor component 1 connected to the crystal oscillator probe 2; or, first, connect the crystal oscillator probe 2 to the air guide component 3, and then connect the conveyor component 1 to the air guide component 3 connected to the crystal oscillator probe 2. Regardless of the order, the crystal oscillator probe 2 is always in the middle of the entire connection structure.

[0037] The crystal oscillator replacement process of this crystal oscillator probe replacement device is as follows: First, remove the old crystal oscillator 7 from the crystal oscillator probe 2, and assemble it with the gas guide 3 and the conveying component 1 according to the above assembly method. Connect the end of the conveying pipe 11 away from the gas guide 3 to the hole in the crystal oscillator packaging box. Connect the elastic gas supply pipe to the connecting pipe 33 of the gas guide 3, and introduce nitrogen gas to make the crystal oscillator 7 suspend in the conveying pipe 11. Invert the device so that the conveying pipe 11 is above and the gas guide 32 is below, and slowly reduce the nitrogen gas level. As the flow rate decreases to zero, the crystal oscillator 7 will slowly fall into the through hole 21 of the crystal oscillator probe 2 under the action of gravity. During this process, the airflow passes through the side gap between the delivery pipe 11 and the crystal oscillator 7, and flows out from the gap between the inlet of the delivery pipe 11 and the crystal oscillator packaging box. After the crystal oscillator 7 successfully falls into the through hole 21 and is placed horizontally, the elastic gas delivery pipe is removed, and then the crystal oscillator probe replacement device is disassembled, the crystal oscillator probe 2 is taken out, and the crystal oscillator probe 2 is put back into the semiconductor evaporation coating equipment.

[0038] Example 2

[0039] Based on Example 1, such as Figures 1 to 4 As shown, this utility model provides a crystal oscillator probe changing device. The air guide 3 includes a first connecting portion 35 communicating with an air guide pipe 32. The first connecting portion 35 has a first groove 36, and an air outlet 31 is located at the bottom of the first groove 36. The conveying component 1 includes a second connecting portion 14 communicating with a conveying pipe 11. The second connecting portion 14 has a second groove 15, and a chip outlet 12 is located at the bottom of the second groove 15. The air guide 3 and the conveying component 1 are connected through the first connecting portion 35 and the second connecting portion 14. The first groove 36 and the second groove 15 form a receiving cavity for accommodating and fixing the crystal oscillator probe 2. The crystal oscillator probe 2 includes a first disk 22 and a second disk 23. The diameter of the first disk 22 is larger than that of the second disk 23, and a through hole 21 penetrates both the first disk 22 and the second disk 23. The diameter of the air outlet 31 is smaller than that of the through hole 21, and the diameter of the chip outlet 12 is less than or equal to that of the through hole 21, but larger than the diameter of the crystal oscillator plate 7.

[0040] In this crystal oscillator probe changing device, the air guide 3 and the conveying component 1 cover the crystal oscillator probe 2, protecting it from physical damage or contamination, and facilitating its direct reinstallation in the semiconductor evaporation coating equipment. Simultaneously, the embedded structure makes the device layout more compact, reducing its size and simplifying operation. Because the air outlet 31 has a smaller diameter, the gas ejection is more concentrated. Under the same flow rate, the airflow from the smaller outlet can exert a greater thrust on the crystal oscillator 7 compared to the airflow from the larger outlet, saving energy. When the crystal oscillator 7 transitions from the exit hole 12 to the through hole 21, the through hole 21 has more space than the exit hole 12, allowing the crystal oscillator 7 to fall smoothly into the through hole 21 even with some positional or angular deviation during its descent, thus improving changing efficiency.

[0041] In this embodiment, as Figure 2 and Figure 3 As shown, the inner wall of the first groove 36 in the first connecting part 35 is provided with an internal thread, and the outer wall of the second groove 15 in the second connecting part 14 is provided with a corresponding external thread. The air guide 3 and the conveying part 1 are connected by threads through the first connecting part 35 and the second connecting part 14. It can be understood that the method of having an external thread on the outer wall of the first groove 36 in the first connecting part 35 and a corresponding internal thread on the inner wall of the second groove 15 in the second connecting part 14 is also feasible. The threaded connection has good airtightness, which allows the airflow to remain stable and balanced during the transfer of the crystal oscillator 7, flowing along the set path, which is beneficial to the stable transfer of the crystal oscillator 7.

[0042] In another embodiment, the outer wall of the first connecting part 35 is provided with a protruding locking block, and the outer wall of the second connecting part 14 is provided with a locking groove adapted to the locking block; or, the outer wall of the second connecting part 14 is provided with a protruding locking block, and the outer wall of the first connecting part 35 is provided with a locking groove adapted to the locking block. The air guide 3 and the conveying part 1 are connected by a snap-fit ​​connection through the first connecting part 35 and the second connecting part 14. The snap-fit ​​connection is convenient and enables quick assembly and disassembly of the air guide 3 and the conveying part 1.

[0043] In this embodiment, as Figure 2 and Figure 3 As shown, the outer wall of the second disk 23 is provided with an external thread adapted to the semiconductor evaporation coating equipment, and the inner wall of the second groove 15 is provided with an internal thread adapted to the thread on the outer wall of the second disk 23. The crystal oscillator probe 2 is threadedly connected to the conveying component 1; or the outer wall of the first disk 22 is provided with an external thread adapted to the semiconductor evaporation coating equipment, and the inner wall of the first groove 36 is provided with an internal thread adapted to the thread on the outer wall of the first disk 22. The crystal oscillator probe 2 is threadedly connected to the gas guide component 3. The threaded connection utilizes the thread structure of the crystal oscillator probe 2 itself to achieve a stable connection with the gas guide component 3 or the conveying component 1. The connection strength is high, and there is no need to set additional connecting parts on the crystal oscillator probe 2, thereby adapting the semiconductor evaporation coating equipment. Alternatively, a detachable connecting part can be installed on the crystal oscillator probe 2. After the crystal oscillator chip 7 is loaded, the connecting part can be removed, which reduces costs and improves the convenience and efficiency of the chip replacement process. At the same time, it can improve the airtightness of the device and stabilize the airflow transmission path.

[0044] In another embodiment, the crystal oscillator probe 2 is placed between the conveying device and the gas guiding device. The first disc 22 of the crystal oscillator probe 2 abuts against the first connecting portion 35 of the gas guiding component 3, and the second disc 23 abuts against the second connecting portion 14 of the conveying component 1. Alternatively, the first connecting portion 35 and the second connecting portion 14 abut against opposite sides of the first disc 22, respectively. The gas guiding component 3 and the conveying component 1 clamp and fix the crystal oscillator probe 2 through a snap-fit ​​assembly. This clamping and fixing allows the crystal oscillator probe 2 to be easily removed from between the gas guiding component 3 and the conveying component 1 after the crystal oscillator chip 7 has been replaced. The operation is simple and does not easily cause wear to the crystal oscillator probe 2. At the same time, this connection method does not require additional connecting parts on the crystal oscillator probe 2, reducing costs and facilitating the reinstallation of the crystal oscillator probe 2 back into the semiconductor evaporation coating equipment. In another embodiment, the crystal oscillator probe 2 is connected to the gas guiding component 3 or the conveying component 1 through a snap-fit ​​connection. This snap-fit ​​connection allows the crystal oscillator probe 2 to be quickly connected and separated from the gas guiding component 3 or the conveying component 1.

[0045] In this embodiment, as Figure 1 and Figure 2 As shown, there is one vent 31. The central axes of the vent 31, through hole 21, and chip outlet hole 12 are collinear, so that the airflow transmission path overlaps axially with the crystal oscillator 7 conveying path. The thrust generated by the airflow can act precisely on the center of gravity of the crystal oscillator 7, improving the stability of the crystal oscillator 7 during slippage and increasing the chip replacement efficiency. The dynamic pressure of the airflow is converted into thrust to the maximum extent, improving the efficiency of airflow action. It can be understood that in other embodiments, the positions of the vent 31, through hole 21, and chip outlet hole 12 are roughly matched, and there is a certain deviation between their central axes. Most of the airflow blown out of the vent 31 can pass through the through hole 21 and chip outlet hole 12 and act on the crystal oscillator 7 in the conveying pipe 11.

[0046] In another embodiment, such as Figure 3 As shown, there are several vent holes 31, which are evenly distributed circumferentially around the center of the through hole 21. The air blown out of each vent hole 31 can act on the crystal oscillator 7 through the through hole 21. The gas thrust on the crystal oscillator 7 is more uniform in all directions. At the same time, the circumferential distribution allows the gas to converge smoothly when it approaches the crystal oscillator 7, creating a stable gas environment, which is conducive to precise control of the crystal oscillator 7. In addition, the simultaneous air output of multiple vent holes 31 greatly increases the air flow rate. When facing a large crystal oscillator 7, the sufficient air flow rate can provide enough thrust to ensure that it can be smoothly levitated and transferred, thereby effectively enhancing the device's adaptability to different crystal oscillators 7.

[0047] In this preferred embodiment, the diameter of the output hole 12 is equal to the diameter of the through hole 21. The crystal oscillator probe 2 includes a second disk 23, through which the through hole 21 passes. The second disk 23 is embedded in the second groove 15 and abuts against the bottom surface of the second groove 15. The through hole 21 is aligned with the output hole 12. The conveying pipe 11 and the through hole 21 form a continuous conveying channel, allowing the crystal oscillator 7 to slide smoothly and accurately from the conveying pipe 11 into the through hole 21, thus improving the chip changing efficiency.

[0048] In this preferred embodiment, the end of the delivery pipe 11 furthest from the air guide 3 is provided with an exhaust port 13 or an exhaust groove 16 to connect the internal space of the delivery pipe 11 with the atmosphere. The delivery pipe 11 has an exhaust channel for venting, maintaining the dynamic balance of the gas inside the delivery pipe 11. This effectively prevents gas from being unable to escape due to the sealing of the delivery port of the delivery pipe 11 and the crystal oscillator packaging box, thereby improving the adaptability of the device to different packaging box structures and ensuring that the entire crystal oscillator probe changing device can operate continuously, stably, and efficiently.

[0049] In this preferred embodiment, the connecting pipe 33 is provided with a third groove 34 to prevent the elastic gas delivery pipe from detaching from the gas guide pipe 32. During the downward movement of the elastic gas delivery pipe, it will be embedded in the third groove 34 and will not be able to continue to move downward. The stable connection between the connecting pipe 33 and the elastic gas delivery pipe ensures the stability of the gas transmission path. The connecting pipe 33 is also provided with a positioning block 4, which is located between the third groove 34 and the gas guide pipe 32, limiting the connection length of the elastic gas delivery pipe and improving the connection efficiency.

[0050] In this preferred embodiment, a first sealing ring 5 is provided on the connecting surface of the air guide 3 and the conveying component 1, and a second sealing ring 6 is provided on the connecting surface of the second disc 23 and the second groove 15, so as to improve the sealing performance inside the device, improve the airflow stability, and make it flow strictly according to the set path, so as to achieve the stable sliding of the crystal oscillator 7.

[0051] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the present utility model. Any simple modifications, alterations, or equivalent structural transformations made to the above embodiments based on the technical essence of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A crystal oscillator probe changing device, characterized in that, The device includes a gas guide (3) and a conveyor (1). The gas guide (3) is provided with an air outlet (31). The conveyor (1) includes a conveying pipe (11) for conveying the crystal oscillator (7). The end of the conveying pipe (11) facing the gas guide (3) is provided with a chip outlet (12). The gas guide (3) and the conveyor (1) are detachably connected and a crystal oscillator probe (2) is detachably connected between them. The crystal oscillator probe (2) is provided with a through hole (21) for accommodating the crystal oscillator (7). The through hole (21), the chip outlet (12) and the air outlet (31) are connected in the air path and are in corresponding positions, so that the gas discharged by the gas guide (3) passes through the through hole (21) and acts on the crystal oscillator (7) in the conveying pipe (11), and the crystal oscillator (7) slides into the through hole (21) by the change of airflow.

2. The crystal oscillator probe changing device according to claim 1, characterized in that, The air guide (3) includes a first connecting part (35) with an air outlet (31) and a first groove (36) in the first connecting part (35). The conveying part (1) includes a second connecting part (14) communicating with the conveying pipe (11) and a second groove (15) in the second connecting part (14). The air guide (3) and the conveying part (1) are connected through the first connecting part (35) and the second connecting part (14). The first groove (36) and the second groove (15) form a receiving cavity for accommodating and fixing the crystal oscillator probe (2).

3. The crystal oscillator probe changing device according to claim 1, characterized in that, The air guide (3) and the conveyor (1) are threaded together; or the air guide (3) and the conveyor (1) are connected by a snap-fit.

4. The crystal oscillator probe changing device according to claim 1, characterized in that, The crystal oscillator probe (2) is threadedly connected to the air guide (3) or the conveyor (1); or, the air guide (3) and the conveyor (1) clamp and fix the crystal oscillator probe (2); or, the crystal oscillator probe (2) is connected to the air guide (3) or the conveyor (1) by a snap-fit.

5. A crystal oscillator probe changing device according to claim 1, characterized in that, The diameter of the vent (31) is smaller than the diameter of the through hole (21).

6. The crystal oscillator probe changing device according to claim 1, characterized in that, The diameter of the output hole (12) is less than or equal to the diameter of the through hole (21), and the diameter of the output hole (12) is greater than the diameter of the crystal oscillator (7).

7. A crystal oscillator probe changing device according to claim 6, characterized in that, The conveying component (1) includes a second connecting part (14) communicating with the conveying pipe (11). The second connecting part (14) is provided with a second groove (15). The output hole (12) is located at the bottom of the second groove (15). The diameter of the output hole (12) is equal to the diameter of the through hole (21). The crystal oscillator probe (2) includes a second disk (23). The through hole (21) passes through the second disk (23). The second disk (23) is embedded in the second groove (15) and abuts against the bottom surface of the second groove (15). The through hole (21) is aligned with the output hole (12).

8. A crystal oscillator probe changing device according to claim 1, characterized in that, There is one air outlet (31), and the central axes of the air outlet (31), through hole (21) and plate outlet (12) are collinear.

9. A crystal oscillator probe changing device according to claim 1, characterized in that, There are several vent holes (31), and the vent holes (31) are evenly distributed around the center of the through hole (21), and the air blown out by each vent hole (31) can act on the crystal oscillator (7) through the through hole (21).

10. A crystal oscillator probe changing device according to any one of claims 1 to 8, characterized in that, The end of the conveying pipe (11) away from the air guide (3) is provided with an exhaust hole (13) or an exhaust groove (16) to connect the internal space of the conveying pipe (11) with the atmosphere.

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