Vacuum system and semiconductor production device

Abstract

The utility model provides a vacuum system and a semiconductor production device, the vacuum system comprises a first vacuum mechanism and a second vacuum mechanism, when the first vacuum mechanism and the second vacuum mechanism are started at the same time, a target vacuum cavity is vacuumized at the same time, or when any one of the first vacuum mechanism and the second vacuum mechanism goes down, the target vacuum cavity is vacuumized at the same time. And the other one can continuously vacuumize the target vacuum cavity, so that the vacuum degree in the target vacuum cavity is ensured.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing technology, and more specifically, relates to a vacuum system and a semiconductor manufacturing apparatus. Background Technology

[0002] In the semiconductor manufacturing process, the TF (Transfer Chamber), ET (Etch Chamber), and DF (Degas Chamber) of the semiconductor manufacturing equipment are all integrated into the vacuum system of the semiconductor equipment. By maintaining a low-pressure or ultra-low-pressure environment in the vacuum system, particulate matter generated during the operation of the semiconductor manufacturing equipment is prevented from contaminating the wafer.

[0003] Currently, most existing semiconductor manufacturing equipment vacuum systems use a single vacuum generator to evacuate the system. However, this approach has several drawbacks. Particulate matter generated during the operation of the semiconductor manufacturing equipment can easily clog the vacuum generator, leading to instability in its operation. In severe cases, the particulate matter can even cause the vacuum generator to shut down, resulting in insufficient or unpredictable evacuation of the system. This can negatively impact the reaction process and reduce yield. Summary of the Invention

[0004] The purpose of this application is to provide a vacuum system to solve the technical problem in the prior art where the vacuum mechanism cannot effectively extract vacuum from the vacuum system in semiconductor equipment due to particulate matter blockage.

[0005] To achieve the above objectives, a first aspect of this application provides a vacuum system comprising:

[0006] The tube body is connected to the target vacuum cavity;

[0007] The first vacuum mechanism is connected to the tube body at the first connection point through the first gas flow channel;

[0008] The second vacuum mechanism is connected to the tube body at the second connection point through the second gas flow channel. The distance from the first connection point to the target vacuum cavity is less than or equal to the distance from the second connection point to the target vacuum cavity.

[0009] A dust collection mechanism is connected to the pipe body and is located directly below the bottom end of the pipe body;

[0010] The second connection is located above the dust collection mechanism, and the pipe body is arranged along the direction of gravity at least in part of the connection path between the first connection and the dust collection mechanism.

[0011] Using the above technical solution, the first vacuum mechanism and the second vacuum mechanism are connected to the target vacuum cavity through the tube body.

[0012] When the first vacuum mechanism and the second vacuum mechanism work simultaneously, the first vacuum mechanism and the second vacuum mechanism simultaneously draw a vacuum from the target vacuum cavity, thereby maintaining the target vacuum cavity at a preset vacuum level.

[0013] When the first vacuum mechanism stops working due to a malfunction, the second vacuum mechanism continues to work, or when the second vacuum mechanism stops working due to a malfunction, the first vacuum mechanism continues to work, to ensure that the vacuum chamber is continuously evacuated, thereby enabling the other vacuum mechanism to continuously evacuate the target vacuum chamber even when either the first or the second vacuum mechanism stops working.

[0014] Meanwhile, by setting the dust collection mechanism directly below the bottom of the tube, when the remaining impurity gases are drawn away in advance by the first and second vacuum mechanisms, the particles fall into the dust collection mechanism under the action of gravity, so as to facilitate the collection of solid particles.

[0015] Optionally, it also includes:

[0016] A first electric valve is disposed in the first gas flow channel and electrically connected to the first vacuum mechanism, and is used to close the first gas flow channel when the first vacuum mechanism stops.

[0017] A second electric valve is disposed in the second gas flow channel and electrically connected to the second vacuum mechanism, for closing the second gas flow channel when the second vacuum mechanism stops.

[0018] In the above technical solution, the first electric valve, the second electric valve, the first vacuum mechanism, and the second vacuum mechanism are all electrically connected to the controller.

[0019] When the first vacuum mechanism stops due to a malfunction, the first vacuum mechanism generates a first power failure signal and transmits the first power failure signal to the controller. After receiving the first power failure signal, the controller generates a first control signal based on the first power failure signal and transmits the first control signal to the first electric valve. After receiving the first control signal, the first electric valve closes the first gas flow channel to prevent gas from entering the tube body through the first gas flow channel, thereby causing pressure backflow.

[0020] When the second vacuum mechanism stops due to a malfunction, the second vacuum mechanism generates a second power failure signal and transmits the second power failure signal to the controller. After receiving the second power failure signal, the controller generates a second control signal based on the second power failure signal and transmits the second control signal to the second electric valve. After receiving the second control signal, the second electric valve closes the second gas flow channel to prevent gas from entering the tube body through the second gas flow channel, thereby causing pressure backflow.

[0021] Optionally, the first vacuum mechanism and the second vacuum mechanism are symmetrically arranged about the tube body.

[0022] Optionally, the first vacuum mechanism includes:

[0023] A first connecting pipe is connected to the pipe body and forms the first gas flow channel;

[0024] A first vacuum pump is connected to the end of the first connecting pipe away from the pipe body, and the first vacuum pump is electrically connected to the first electric valve.

[0025] Using the above technical solution, the first vacuum pump is connected to the tube body through the first connecting pipe. When the first vacuum pump is working, the first vacuum pump is connected to the inside of the tube body through the first gas flow channel formed in the first connecting pipe, and then connected to the target vacuum chamber.

[0026] Specifically, when the first vacuum pump stops, the first power-off signal is generated and transmitted to the controller.

[0027] Optionally, the second vacuum mechanism includes:

[0028] The second connecting pipe is connected to the pipe body and forms the second gas flow channel;

[0029] A second vacuum pump is connected to the end of the second connecting pipe away from the pipe body, and the second vacuum pump is electrically connected to the second electric valve.

[0030] Using the above technical solution, the second vacuum pump is connected to the tube body through the second connecting pipe. When the second vacuum pump is working, the second vacuum pump is connected to the inside of the tube body through the second gas flow channel formed in the second connecting pipe, and then connected to the target vacuum chamber.

[0031] Specifically, when the second vacuum pump stops, a second power-off signal is generated and transmitted to the controller.

[0032] Optionally, the dust collection mechanism is detachably connected to the pipe body.

[0033] By adopting the above technical solution, the dust collection mechanism is detachably connected to the pipe body, so as to facilitate the removal of the dust collection mechanism from the pipe body and the cleaning of the particles collected in the dust collection mechanism.

[0034] Optionally, the dust collection mechanism includes:

[0035] The dust collection tank is detachably connected to the pipe body;

[0036] The first filter element is detachably connected to the inlet end of the first gas flow channel and is used to filter particulate matter entering the first gas flow channel.

[0037] The second filter element is detachably connected to the inlet end of the second gas flow channel and is used to filter particulate matter entering the second gas flow channel.

[0038] At least a portion of the tube extends vertically, and the dust collection tank is located below the first filter element and the second filter element.

[0039] By employing the above technical solution, a detachable first filter element is provided in the first gas flow channel. When the first vacuum mechanism is working, the particulate matter extracted from the target vacuum chamber by the first vacuum mechanism is filtered by the first filter element, and the filtered particulate matter is collected by the dust collection tank. Simultaneously, the first filter element is detachably connected to the first gas flow channel, facilitating its removal from the first gas flow channel for cleaning.

[0040] By incorporating a detachable second filter element in the second gas flow channel, particulate matter extracted from the target vacuum chamber by the second vacuum mechanism is filtered by the second filter element during operation, and the filtered particulate matter is collected by the dust collection tank. Simultaneously, the second filter element is detachably connected to the second gas flow channel, facilitating its removal for cleaning.

[0041] The dust collection tank is detachably connected to the pipe body to facilitate the cleaning of the particles collected in the dust collection tank;

[0042] Meanwhile, by drawing a vacuum into the target vacuum chamber through the first vacuum mechanism and the second vacuum mechanism, compared with the technical solution with only a single vacuum mechanism, when the first vacuum mechanism and the second vacuum mechanism are working, the particulate matter in the target vacuum chamber is filtered by the first filter element and the second filter element respectively. The particulate matter is filtered by the first filter element and the second filter element respectively, which reduces the risk of particulate matter clogging the first vacuum mechanism or the second vacuum mechanism, thereby extending the life of the first vacuum mechanism or the second vacuum mechanism.

[0043] Optionally, the first filter element and the second filter element are arranged at an angle to the axial direction of the tube body.

[0044] By adopting the above technical solution, the first filter element and the second filter element are set at an angle to the axial direction of the tube body, so that the particulate matter filtered by the first filter element and the second filter element respectively fall off from the first filter element and the second filter element and enter the dust collection tank.

[0045] Optionally, it also includes:

[0046] An isolation valve is installed in the pipe body, and its distance from the vacuum chamber is less than the distance between the first connection point and the vacuum chamber. It is used to close or open the gas flow channel in the pipe body.

[0047] By employing the above technical solution, when the first vacuum mechanism and the second vacuum mechanism are shut down, the isolation valve closes the gas flow channel within the tube, thereby disconnecting both the first vacuum mechanism and the second vacuum mechanism from the target vacuum chamber. When both the first vacuum mechanism and the second vacuum mechanism are shut down, or when cleaning the particles collected in the dust collection tank, the isolation valve disconnects the gas flow channel within the tube to ensure the vacuum level of the target vacuum chamber.

[0048] The beneficial effects of the vacuum system provided in this application are as follows: Compared with the prior art, the vacuum system provided in this application includes a first vacuum mechanism and a second vacuum mechanism. When the first vacuum mechanism and the second vacuum mechanism are turned on at the same time, the target vacuum cavity is simultaneously evacuated. Alternatively, when either the first vacuum mechanism or the second vacuum mechanism fails, the other can continuously evacuate the target vacuum cavity, thereby ensuring the vacuum level in the target vacuum cavity.

[0049] Secondly, this application provides a semiconductor manufacturing apparatus, comprising:

[0050] Vacuum cavity;

[0051] A vacuum system, connected to the vacuum chamber, is used to evacuate the vacuum chamber, and the vacuum system is any one of the vacuum systems described above.

[0052] The beneficial effects of the vacuum system provided in this application are as follows: Compared with the prior art, the semiconductor manufacturing apparatus provided in this application includes a vacuum chamber and a vacuum system. The vacuum system is connected to the vacuum chamber, and the vacuum system includes a first vacuum mechanism and a second vacuum mechanism. When the first vacuum mechanism and the second vacuum mechanism are turned on at the same time, the vacuum chamber is evacuated simultaneously. Alternatively, when either the first vacuum mechanism or the second vacuum mechanism fails, the other can continuously evacuate the vacuum chamber, thereby ensuring the vacuum level in the vacuum chamber. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of the structure of the vacuum system provided in the embodiments of this application;

[0055] Figure 2 This is a schematic diagram of the structure of a vacuum system provided in another embodiment of this application;

[0056] Figure 3 A schematic diagram of the mechanism of the first filter element provided in an embodiment of this application;

[0057] Figure 4 A schematic diagram of the mechanism of the first filter element provided in another embodiment of this application.

[0058] The following are the labeling elements in the figure:

[0059] 10. Tube body; 20. First vacuum mechanism; 21. First connecting pipe; 211. First gas flow channel; 22. First vacuum pump; 30. Second vacuum mechanism; 31. Second connecting pipe; 311. Second gas flow channel; 32. Second vacuum pump; 40. First electric valve; 50. Second electric valve; 60. Dust collection mechanism; 61. Dust collection tank; 62. First filter element; 621. Fixing ring; 622. Filter screen; 70. Isolation valve; 80. Target vacuum chamber. Detailed Implementation

[0060] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0061] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0062] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0064] Please refer to the following: Figures 1 to 4 The vacuum system and semiconductor manufacturing equipment provided in the embodiments of this application will now be described.

[0065] The first aspect of this application provides a vacuum system, including a tube body 10, a first vacuum mechanism 20, a second vacuum mechanism 30, and a dust collection mechanism 60.

[0066] Please see Figure 1 and Figure 2 The tube body 10 is connected to the target vacuum chamber 80. The first vacuum mechanism 20 is connected to the tube body 10 at the first connection point through the first gas flow channel 211. The second vacuum mechanism 30 is connected to the tube body 10 at the second connection point through the second gas flow channel 311, and the distance from the first connection point to the target vacuum chamber 80 is less than or equal to the distance from the second connection point to the target vacuum chamber 80.

[0067] The dust collection mechanism 60 is connected to the pipe body 10 and is located directly below the bottom end of the pipe body 10. The second connection point is located above the dust collection mechanism 60, and at least part of the connection path between the pipe body 10 and the dust collection mechanism 60 is arranged along the direction of gravity so that solid particles can fall into the dust collection mechanism 60 under the action of gravity and be collected by the dust collection mechanism 60.

[0068] The second vacuum mechanism 30 is used to simultaneously evacuate the target vacuum chamber 80 with the first vacuum mechanism 20.

[0069] Alternatively, when either the first vacuum mechanism 20 or the second vacuum mechanism 30 stops, the other of the first vacuum mechanism 20 and the second vacuum mechanism 30 evacuates the target vacuum chamber 80.

[0070] Using the above technical solution, the first vacuum mechanism 20 and the second vacuum mechanism 30 are connected to the target vacuum cavity 80 through the tube body 10.

[0071] When the first vacuum mechanism 20 and the second vacuum mechanism 30 work simultaneously, the first vacuum mechanism 20 and the second vacuum mechanism 30 simultaneously draw vacuum from the target vacuum chamber 80, thereby keeping the target vacuum chamber 80 at a preset vacuum level.

[0072] When the first vacuum mechanism 20 stops working due to a malfunction, the second vacuum mechanism 30 continues to work, or when the second vacuum mechanism 30 stops working due to a malfunction, the first vacuum mechanism 20 continues to work, to ensure that the vacuum chamber 80 is continuously evacuated, so that when either the first vacuum mechanism 20 or the second vacuum mechanism 30 stops working, the other can continue to evacuate the target vacuum chamber 80.

[0073] By setting the dust collection mechanism 60 directly below the bottom of the tube body 10, when the remaining impurity gas is extracted in advance by the first vacuum mechanism 20 and the second vacuum mechanism, the particles fall into the dust collection mechanism 60 under the action of gravity, so as to facilitate the collection of solid particles.

[0074] Compared with the prior art, the vacuum system provided in this application includes a first vacuum mechanism 20 and a second vacuum mechanism 30. When the first vacuum mechanism 20 and the second vacuum mechanism 30 are turned on at the same time, the target vacuum cavity 80 is simultaneously evacuated. Alternatively, when any one of the first vacuum mechanism 20 and the second vacuum mechanism 30 fails, the other can continuously evacuate the target vacuum cavity 80, thereby ensuring the vacuum level in the target vacuum cavity 80.

[0075] Please see Figure 1 In one embodiment of this application, the vacuum system further includes a first electric valve 40 and a second electric valve 50.

[0076] A first electric valve 40 is disposed in the first gas flow channel 211 and electrically connected to the first vacuum mechanism 20, and is used to close the first gas flow channel 211 when the first vacuum mechanism 20 stops. A second electric valve 50 is disposed in the second gas flow channel 311 and electrically connected to the second vacuum mechanism 30, and is used to close the second gas flow channel 311 when the second vacuum mechanism 30 stops.

[0077] Using the above technical solution, the first electric valve 40, the second electric valve 50, the first vacuum mechanism 20, and the second vacuum mechanism 30 are all electrically connected to the controller.

[0078] When the first vacuum mechanism 20 stops due to a malfunction, the first vacuum mechanism 20 generates a first power failure signal and transmits the first power failure signal to the controller. After receiving the first power failure signal, the controller generates a first control signal based on the first power failure signal and transmits the first control signal to the first electric valve 40. After receiving the first control signal, the first electric valve 40 closes the first gas flow channel 211 to prevent gas from entering the pipe body 10 through the first gas flow channel, thereby preventing pressure backflow.

[0079] When the second vacuum mechanism 30 stops due to a malfunction, the second vacuum mechanism 30 generates a second power-off signal and transmits the second power-off signal to the controller. After receiving the second power-off signal, the controller generates a second control signal based on the second power-off signal and transmits the second control signal to the second electric valve 50. After receiving the second control signal, the second electric valve 50 closes the second gas flow channel 311 to prevent gas from entering the pipe body 10 through the second gas flow channel, thereby preventing pressure backflow.

[0080] In this application, please refer to Figure 1 When the distance from the first connection point to the target vacuum chamber 80 is equal to the distance from the second connection point to the target vacuum chamber 80, the first vacuum mechanism 20 and the second vacuum mechanism 30 are symmetrically arranged about the tube body 10.

[0081] In another embodiment of this application, please refer to Figure 2 The distance from the first connection point to the target vacuum cavity 80 is less than the distance from the second connection point to the target vacuum cavity 80.

[0082] In one embodiment of this application, the first vacuum mechanism 20 and the second vacuum mechanism 30 are disposed on the same side of the tube body 10.

[0083] In one embodiment of this application, the first vacuum mechanism 20 and the second vacuum mechanism 30 are arranged at circumferential intervals along the tube body 10.

[0084] Please see Figure 1 In this application, the first vacuum mechanism 20 includes a first connecting pipe 21 and a first vacuum pump 22.

[0085] The first connecting pipe 21 is connected to the pipe body 10 and forms a first gas flow channel 211. The first vacuum pump 22 is connected to the end of the first connecting pipe 21 away from the pipe body 10, and the first vacuum pump 22 is electrically connected to the first electric valve 40.

[0086] The first vacuum pump 22 is connected to the tube body 10 through the first connecting pipe 21. When the first vacuum pump 22 is working, it is connected to the inside of the tube body 10 through the first gas flow channel 211 formed in the first connecting pipe 21, and then connected to the target vacuum chamber 80. When the first vacuum pump 22 stops, it generates a first power-off signal and transmits the first power-off signal to the controller.

[0087] Please see Figure 1 In this application, the second vacuum mechanism 30 includes a second connecting pipe 31 and a second vacuum pump 32.

[0088] The second connecting pipe 31 is connected to the pipe body 10 and forms a second gas flow channel 311. The second vacuum pump 32 is connected to the end of the second connecting pipe 31 away from the pipe body 10, and the second vacuum pump 32 is electrically connected to the second electric valve 50.

[0089] The second vacuum pump 32 is connected to the tube body 10 via the second connecting pipe 31. When the second vacuum pump 32 is working, it is connected to the inside of the tube body 10 via the second gas flow channel 311 formed in the second connecting pipe 31, and thus connected to the target vacuum chamber 80. When the second vacuum pump 32 stops, it generates a second power-off signal and transmits the second power-off signal to the controller.

[0090] In one embodiment of this application, the dust collection mechanism 60 is detachably connected to the pipe body 10 to facilitate the cleaning of the particulate matter collected by the dust collection mechanism 60.

[0091] When the first vacuum mechanism 20 and the second vacuum mechanism 30 simultaneously evacuate the target vacuum chamber 80, or when either the first vacuum mechanism 20 or the second vacuum mechanism 30 evacuates the target vacuum chamber 80, the particulate matter generated in the target vacuum chamber 80 is extracted from the target chamber under the operation of the first vacuum and the second vacuum machine. Since the connecting path of the tube body 10, at least from the first connecting point to the dust collection mechanism 60, is set along the direction of gravity, the particulate matter falls into the dust collection mechanism 60 under the action of gravity and is collected by the dust collection mechanism 60.

[0092] Please see Figures 1 to 3 In one embodiment of this application, the dust collection mechanism 60 includes a dust collection tank 61, a first filter element 62, and a second filter element (not shown in the figure).

[0093] The dust collection tank 61 is detachably connected to the pipe body 10. The first filter element 62 is detachably connected to the inlet end of the first gas flow channel 211 and is used to filter particulate matter entering the first gas flow channel. The second filter element is detachably connected to the inlet end of the second gas flow channel 311 and is used to filter particulate matter entering the second gas flow channel.

[0094] At least a portion of the tube 10 extends vertically, and the dust collection tank 61 is located below the first filter element 62 and the second filter element.

[0095] By providing a detachable first filter element 62 in the first gas flow channel 211, when the first vacuum mechanism 20 is working, the particulate matter in the target vacuum chamber 80 extracted by the first vacuum mechanism 20 is filtered by the first filter element 62, and the filtered particulate matter is collected by the dust collection tank 61. At the same time, the first filter element 62 is detachably connected to the first gas flow channel 211, which facilitates the cleaning of the first filter element 62 after it is removed from the first gas flow channel 211.

[0096] By providing a detachable second filter element in the second gas flow channel 311, when the second vacuum mechanism 30 is working, the particulate matter in the target vacuum chamber 80 extracted by the second vacuum mechanism 30 is filtered by the second filter element, and the filtered particulate matter is collected by the dust collection tank 61. At the same time, the second filter element is detachably connected to the second gas flow channel 311, which facilitates the cleaning of the second filter element after it is removed from the second gas flow channel 311.

[0097] The dust collection tank 61 is detachably connected to the pipe body 10 to facilitate the cleaning of the particles collected in the dust collection tank 61.

[0098] Simultaneously, the target vacuum chamber 80 is evacuated by the first vacuum mechanism 20 and the second vacuum mechanism 30. Compared with the technical solution with only a single vacuum mechanism, when the first vacuum mechanism 20 and the second vacuum mechanism are working, the particulate matter in the target vacuum chamber 80 is filtered by the first filter element 62 and the second filter element respectively. The particulate matter is filtered by the first filter element 62 and the second filter element respectively, which reduces the risk of particulate matter clogging the first vacuum mechanism 20 or the second vacuum mechanism 30, thereby extending the life of the first vacuum mechanism 20 or the second vacuum mechanism 30.

[0099] Please see Figure 3 In one embodiment of this application, the first filter element 62 and the second filter element have the same structure, and both the first filter element 62 and the second filter element include a retaining ring 621 and a filter screen 622 connected to the retaining ring 621. The retaining ring 621 is used to sleeve the air inlet end of the first connecting pipe 21 and the second connecting pipe 31, so that the first filter element 62 and the second filter element can be detachably connected to the first connecting pipe 21 and the second connecting pipe 31, respectively.

[0100] Please see Figure 3 Both the first filter element 62 and the second filter element are set at an angle to the axial direction of the tube body 10.

[0101] By adopting the above technical solution, the first filter element 62 and the second filter element are both set at an angle to the axial direction of the tube body 10, so that the particles filtered by the first filter element 62 and the second filter element can fall off from the first filter element 62 and the second filter element respectively and enter the dust collection tank 61.

[0102] Please see Figure 4 In another embodiment of this application, the first filter element 62 and the second filter element are arranged parallel to the axial direction of the tube body 10.

[0103] Please see Figure 1 The vacuum system also includes an isolation valve 70. The isolation valve 70 is disposed in the tube 10, and the distance between the isolation valve 70 and the vacuum chamber is less than the distance between the first connection point and the vacuum chamber. It is used to close or open the gas flow channel in the tube 10.

[0104] When the first vacuum mechanism 20 and the second vacuum mechanism 30 are shut down, the isolation valve 70 closes the gas flow channel inside the tube 10, thereby disconnecting both the first vacuum mechanism 20 and the second vacuum mechanism 30 from the target vacuum chamber 80. When both the first vacuum mechanism 20 and the second vacuum mechanism 30 are shut down, or when cleaning the particles collected in the dust collection tank 61, the isolation valve 70 disconnects the gas flow channel inside the tube 10 to ensure the vacuum level of the target vacuum chamber.

[0105] Secondly, this application provides a semiconductor manufacturing apparatus, including a vacuum chamber 80 and a vacuum system.

[0106] Please see Figure 1 The vacuum system is connected to the vacuum chamber 80. The vacuum system is used to maintain the vacuum level in the vacuum chamber 80 within a preset vacuum level. The vacuum system is the vacuum system provided in any of the above embodiments.

[0107] Compared with the prior art, the semiconductor manufacturing apparatus provided in this application includes a vacuum chamber 80 and a vacuum system. The vacuum system is connected to the vacuum chamber 80 and includes a first vacuum mechanism 20 and a second vacuum mechanism 30. When the first vacuum mechanism 20 and the second vacuum mechanism 30 are simultaneously turned on, the vacuum chamber 80 is simultaneously evacuated. Alternatively, when either the first vacuum mechanism 20 or the second vacuum mechanism 30 fails, the other can continuously evacuate the vacuum chamber 80, thereby ensuring the vacuum level in the vacuum chamber 80.

[0108] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A vacuum system for evacuating a target vacuum chamber, characterized in that, include: The tube body is connected to the target vacuum cavity; The first vacuum mechanism is connected to the tube body at the first connection point through the first gas flow channel; The second vacuum mechanism is connected to the tube body at the second connection point through the second gas flow channel. The distance from the first connection point to the target vacuum cavity is less than or equal to the distance from the second connection point to the target vacuum cavity. A dust collection mechanism is connected to the pipe body and is located directly below the bottom end of the pipe body; The second connection is located above the dust collection mechanism, and the pipe body is arranged along the direction of gravity at least in part of the connection path between the first connection and the dust collection mechanism.

2. The vacuum system as described in claim 1, characterized in that, Also includes: A first electric valve is disposed in the first gas flow channel and electrically connected to the first vacuum mechanism, and is used to close the first gas flow channel when the first vacuum mechanism stops. A second electric valve is disposed in the second gas flow channel and electrically connected to the second vacuum mechanism, for closing the second gas flow channel when the second vacuum mechanism stops.

3. The vacuum system as described in claim 2, characterized in that, The first vacuum mechanism and the second vacuum mechanism are symmetrically arranged about the tube body.

4. The vacuum system as described in claim 3, characterized in that, The first vacuum mechanism includes: A first connecting pipe is connected to the pipe body and forms the first gas flow channel; A first vacuum pump is connected to the end of the first connecting pipe away from the pipe body, and the first vacuum pump is electrically connected to the first electric valve.

5. The vacuum system as described in claim 4, characterized in that, The second vacuum mechanism includes: The second connecting pipe is connected to the pipe body and forms the second gas flow channel; A second vacuum pump is connected to the end of the second connecting pipe away from the pipe body, and the second vacuum pump is electrically connected to the second electric valve.

6. The vacuum system as described in claim 1 or 5, characterized in that: The dust collection mechanism is detachably connected to the pipe body.

7. The vacuum system as described in claim 6, characterized in that, The dust collection mechanism includes: The dust collection tank is detachably connected to the pipe body; The first filter element is detachably connected to the inlet end of the first gas flow channel and is used to filter particulate matter entering the first gas flow channel. The second filter element is detachably connected to the inlet end of the second gas flow channel and is used to filter particulate matter entering the second gas flow channel. At least a portion of the tube extends vertically, and the dust collection tank is located below the first filter element and the second filter element.

8. The vacuum system as described in claim 7, characterized in that, Both the first filter element and the second filter element are arranged at an angle to the axial direction of the tube body.

9. The vacuum system as claimed in claim 1, characterized in that, Also includes: An isolation valve is installed in the pipe body, and its distance from the vacuum chamber is less than the distance between the first connection point and the vacuum chamber. It is used to close or open the gas flow channel in the pipe body.

10. A semiconductor manufacturing apparatus, comprising: Vacuum cavity; A vacuum system, connected to the vacuum chamber, is used to maintain a preset vacuum level within the vacuum chamber, and the vacuum system is the vacuum system according to any one of claims 1-9.

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