Soldering tin paste stirring structure

Abstract

The utility model discloses a soldering tin paste stirring structure, which comprises a base, a placing seat, a lifting mechanism and a stirring mechanism, and is characterized in that the placing seat is arranged on the base and is used for fixing a tin paste bottle; the lifting mechanism is arranged in the base and drives the containing base to ascend and descend in the vertical direction. The stirring mechanism is arranged on the base and located above the containing base so that the lifting mechanism can drive the solder paste bottle to ascend and force the stirring mechanism to stretch into the solder paste bottle to conduct stirring. According to the tin soldering machine, the tin paste bottle can be fixed on the placing seat, and then the placing seat is driven by the lifting mechanism to ascend, so that the stirring mechanism can extend into the tin paste bottle for stirring, the manual intervention steps are fewer, the automation degree is high, and the tin soldering efficiency and the production capacity are improved.

Description

Technical Field

[0001] This utility model relates to the field of solder paste technology, specifically to a solder paste mixing structure. Background Technology

[0002] Solder paste is a new type of soldering material that emerged with the advent of SMT (Surface Mount Technology). It is a paste-like mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used in the SMT industry for soldering electronic components such as resistors, capacitors, and ICs on PCB surfaces. In related technologies, solder paste typically requires stirring during production; however, existing solder paste stirring equipment lacks automation in practical use, resulting in low soldering efficiency and difficulty in increasing production capacity. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this utility model is to provide a solder paste mixing structure, comprising:

[0004] Base;

[0005] A placement base, which is disposed on the base, is used to fix the solder paste bottle;

[0006] A lifting mechanism is provided inside the base and drives the placement seat to move up and down in the vertical direction;

[0007] A stirring mechanism is provided on the base and above the placement seat, so that the lifting mechanism drives the solder paste bottle to rise and forces the stirring mechanism to extend into the solder paste bottle for stirring.

[0008] Preferably, the placement base has a receiving groove adapted to the solder paste bottle for placing the solder paste bottle.

[0009] Preferably, the inner circumferential surface of the receiving groove is provided with an adsorption element, and the placement seat has an airflow channel that communicates with the adsorption element.

[0010] Preferably, the adsorption element is configured as a ring structure for fitting against the outer peripheral surface of the solder paste bottle.

[0011] Preferably, the adsorption element is provided with a plurality of vacuum holes, and the plurality of vacuum holes are connected to the airflow channel.

[0012] Preferably, the lifting mechanism includes:

[0013] A cylinder, wherein the cylinder is disposed within the base;

[0014] A connecting seat is slidably disposed within the base and connected to the cylinder, and the placement seat is mounted on the connecting seat.

[0015] Preferably, the placement seat is provided with a sliding cavity, and the connecting seat is slidably disposed in the sliding cavity.

[0016] Preferably, the stirring mechanism includes:

[0017] A support frame, which is mounted on the base;

[0018] An electric motor, which is mounted on the support frame;

[0019] A stirring blade, which is connected to the motor and extends toward the placement base.

[0020] The above-described solution of this utility model has at least the following beneficial effects:

[0021] The solder paste mixing structure provided by this utility model can fix the solder paste bottle on the placement base, and then drive the placement base to rise through the lifting mechanism, so that the mixing mechanism can extend into the solder paste bottle for mixing. This reduces the number of manual intervention steps, increases the degree of automation, and improves soldering efficiency and production capacity.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the solder paste stirring structure provided in the embodiment of this utility model;

[0025] Figure 2 This is a cross-sectional view of the solder paste mixing structure provided in the embodiment of this utility model;

[0026] Figure 3 This is a schematic diagram of the placement seat and lifting mechanism provided in the embodiments of this utility model;

[0027] Explanation of icon numbers:

[0028] 10. Base; 20. Placement seat; 201. Airflow channel; 21. Receiving tank; 22. Adsorption component; 221. Vacuum hole; 30. Lifting mechanism; 31. Cylinder; 32. Connecting seat; 40. Stirring mechanism; 41. Support frame; 42. Motor; 43. Stirring blade.

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] The solder paste mixing structure of this utility model embodiment is described in detail below with reference to the accompanying drawings.

[0036] Reference Figures 1 to 3 As shown, the solder paste stirring structure provided in this embodiment of the present invention includes: a base 10, a placement seat 20, a lifting mechanism 30, and a stirring mechanism 40. The placement seat 20 is disposed on the base 10 and is used to fix the solder paste bottle. The lifting mechanism 30 is disposed inside the base 10 and drives the placement seat 20 to rise and fall in the vertical direction. The stirring mechanism 40 is disposed on the base 10 and located above the placement seat 20, so that the lifting mechanism 30 drives the solder paste bottle to rise and forces the stirring mechanism 40 to extend into the solder paste bottle for stirring.

[0037] The solder paste mixing structure provided by this utility model can fix the solder paste bottle on the placement seat 20, and then drive the placement seat 20 to rise through the lifting mechanism 30, so that the mixing mechanism 40 can extend into the solder paste bottle for mixing. This reduces the number of manual intervention steps, increases the degree of automation, and improves soldering efficiency and production capacity.

[0038] Reference Figure 2 and Figure 3 As shown, the placement base 20 has a receiving groove 21, which is adapted to the solder paste bottle for placing the solder paste bottle; furthermore, the inner circumferential surface of the receiving groove 21 is provided with an adsorption element 22, and the placement base 20 has an airflow channel 201 that is connected to the adsorption element 22.

[0039] In this embodiment, the adsorption element 22 can be sealed and fixed with the placement seat 20, so that the airflow channel 201 can communicate with the adsorption element 22. After the solder paste bottle is placed in the receiving tank 21, the adsorption element 22 can be vacuumed by a vacuum device so that the adsorption element 22 can vacuum adsorb and fix the solder paste bottle. Then, the placement seat 20 is lifted by the lifting mechanism 30, and the stirring mechanism 40 is forced to extend into the solder paste bottle to complete the stirring work. The overall operation is simpler and reduces manual intervention.

[0040] Specifically, the adsorption element 22 is constructed as a ring structure to fit against the outer peripheral surface of the solder paste bottle; furthermore, the adsorption element 22 is provided with a plurality of vacuum holes 221, which are connected to the airflow channel 201.

[0041] In this embodiment, the adsorption element 22 can be provided with an air channel and communicate with the vacuum hole 221. When a vacuum is drawn by a vacuum device, the airflow channel 201 and the air channel can be evacuated, so that the vacuum hole 221 is kept under negative pressure, thereby adsorbing and fixing the solder paste bottle, thus ensuring that the solder paste bottle is more stable and reliable on the placement seat 20, and thus no manual intervention is required during the stirring process, resulting in better stability.

[0042] Specifically, the lifting mechanism 30 includes a cylinder 31 and a connecting seat 32. The cylinder 31 is located inside the base 10. The connecting seat 32 is slidably located inside the base 10 and connected to the cylinder 31. The placement seat 20 is mounted on the connecting seat 32. Furthermore, the placement seat 20 is provided with a sliding cavity, and the connecting seat 32 is slidably located inside the sliding cavity.

[0043] In this embodiment, the cylinder 31 can drive the connecting seat 32 to rise or fall within the sliding cavity, so that the connecting seat 32 can drive the placement seat 20 to rise or fall. When stirring the solder paste, the placement seat 20 can be driven to rise so that the stirring mechanism 40 can be inserted into the solder paste bottle to complete the stirring work. After the stirring work is completed, the placement seat 20 can be driven to fall so that the solder paste bottle can be separated from the stirring mechanism 40, thereby removing the solder paste bottle to complete the subsequent process, thereby reducing manual intervention and achieving a higher degree of automation.

[0044] Specifically, the stirring mechanism 40 includes a support frame 41, a motor 42, and a stirring blade 43. The support frame 41 is mounted on the base 10; the motor 42 is mounted on the support frame 41; and the stirring blade 43 is connected to the motor 42 and extends towards the placement seat 20. When the cylinder 31 drives the placement seat 20 to rise, the stirring blade 43 can extend into the solder paste container, and the motor 42 drives the stirring blade 43 to stir, resulting in more uniform stirring of the solder paste and higher stirring efficiency.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A solder paste mixing structure, characterized in that, include: Base; A placement base, which is disposed on the base, is used to fix the solder paste bottle; A lifting mechanism is provided inside the base and drives the placement seat to move up and down in the vertical direction; A stirring mechanism is provided on the base and above the placement seat, so that the lifting mechanism drives the solder paste bottle to rise and forces the stirring mechanism to extend into the solder paste bottle for stirring.

2. The solder paste stirring structure according to claim 1, characterized in that, The placement base has a receiving groove that is adapted to accommodate the solder paste bottle for placing the solder paste bottle.

3. The solder paste stirring structure according to claim 2, characterized in that, The inner circumferential surface of the receiving groove is provided with an adsorption element, and the placement seat has an airflow channel that communicates with the adsorption element.

4. The solder paste stirring structure according to claim 3, characterized in that, The adsorption element is constructed as a ring structure for adhering to the outer peripheral surface of the solder paste bottle.

5. The solder paste stirring structure according to claim 3, characterized in that, The adsorption element is provided with multiple vacuum holes, which are connected to the airflow channel.

6. The solder paste stirring structure according to claim 1, characterized in that, The lifting mechanism includes: A cylinder, wherein the cylinder is disposed within the base; A connecting seat is slidably disposed within the base and connected to the cylinder, and the placement seat is mounted on the connecting seat.

7. The solder paste stirring structure according to claim 6, characterized in that, The placement seat is provided with a sliding cavity, and the connecting seat is slidably disposed in the sliding cavity.

8. The solder paste stirring structure according to claim 1, characterized in that, The stirring mechanism includes: A support frame, which is mounted on the base; An electric motor, which is mounted on the support frame; A stirring blade, which is connected to the motor and extends toward the placement base.

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