Special tin sheet forming tool for reflow soldering of special device of high-density module power supply
By designing a high-density modular power supply-specific solder sheet forming tool, the problem of high cost of forming solder sheets was solved, resulting in cost reduction and improved welding quality.
Patent Information
- Application Number
- CN202423197478.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-20
AI Technical Summary
Existing molded solder sheets are expensive, leading to increased costs for soldering power pins in high-density modules.
A high-density modular power supply-specific solder sheet forming tooling was designed, including feeding, pressing, conveying and shearing mechanisms, which can process solder sheets of different diameters and thicknesses to meet the PIN pin soldering requirements.
It reduces production costs, improves soldering quality and production efficiency, and avoids the problem of uncontrollable soldering quality caused by manually adding solder paste.
Smart Images
Figure CN223544411U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of processing and manufacturing technology, and in particular to a special solder sheet forming tool for reflow soldering of special components in high-density modular power supplies. Background Technology
[0002] In high-power, high-density multilayer thick copper plate power modules, pins are required. As a key component of the connector, the pin is responsible for conducting electrical signals within the power module. Through the pin, electrical connections between the power module and other circuits or components are established, ensuring smooth current transmission and enabling the entire power system to function properly. Therefore, the design and installation quality of the pins directly affect the performance and stability of the power module.
[0003] Currently, PIN pins are typically installed on circuit boards using reflow soldering. However, the high density of other surface-mount components on the circuit board results in limited space around the PIN pins. The amount of solder paste printed on the stencil is insufficient for PIN pin installation, necessitating manual soldering to ensure proper pin placement. However, due to the limited space, this process can easily damage or malfunction other components. Furthermore, the amount of solder paste applied is uncontrollable and inconsistent, affecting soldering quality. Therefore, to improve soldering quality, manufacturers purchase standard-sized pre-formed solder sheets for PIN pin soldering. However, these pre-formed solder sheets are expensive and in high demand, increasing manufacturing costs.
[0004] In the process of realizing this utility model, the inventors discovered that the prior art has at least the following problems:
[0005] The existing molded solder sheets used in the installation and soldering of PIN pins are expensive, which increases manufacturing costs. Utility Model Content
[0006] The purpose of this invention is to provide a special solder sheet forming tool for reflow soldering of high-density modular power supply components, thereby solving the technical problem in the prior art where the cost of the formed solder sheet used for installing and soldering PIN pins is high, increasing manufacturing costs. The various technical effects of the preferred technical solutions provided by this invention are detailed below.
[0007] To achieve the above objectives, the present invention provides the following technical solution:
[0008] This utility model provides a special solder sheet forming tool for reflow soldering of special components of high-density modular power supply, including a control table, and a feeding mechanism, a pressing mechanism, a conveying mechanism and a shearing mechanism arranged sequentially on the control table.
[0009] The feeding mechanism is used to place the solder wire reel and convey the solder wire to the pressing mechanism;
[0010] The pressing mechanism includes an active pressing component, a passive pressing component, and an adjusting component. The active pressing component and the passive pressing component are arranged parallel to each other in the longitudinal direction. The solder wire is pressed into a solder sheet by the active pressing component and the passive pressing component and then output in the same direction. The adjusting component is connected to the passive pressing component and is used to adjust the gap between the passive pressing component and the active pressing component to adjust the pressing thickness of the solder sheet.
[0011] The conveying mechanism is used to convey the tin sheet to the cutting mechanism;
[0012] The shearing mechanism is used to cut the tin sheet to obtain a shaped tin sheet.
[0013] Optionally, the active pressing assembly includes an active pressing roller, a drive motor, and a drive belt. The active pressing roller is connected to the drive motor via the drive belt. The active pressing roller is driven by the drive motor and the drive belt to cooperate with the passive pressing assembly to press the solder wire into the solder sheet.
[0014] Optionally, the adjustment assembly includes an adjustment spring, an adjustment plate, and an adjustment cylinder. The passive pressing assembly is mounted above the active pressing assembly via the adjustment spring. The adjustment plate is positioned above the passive pressing assembly, and the adjustment cylinder is positioned on top of the adjustment plate. The gap between the passive pressing assembly and the active pressing assembly is adjusted by the combined action of the adjustment spring, the adjustment plate, and the adjustment cylinder.
[0015] Optionally, the feeding mechanism includes a placement column, a traction component, and a feeding channel arranged sequentially;
[0016] The placement column is used to place the solder wire reel; the traction component is used to pull and transport the solder wire on the solder wire reel, so that the solder wire is transported through the feeding channel to the input end of the pressing mechanism.
[0017] Optionally, the conveying mechanism includes a conveying mounting frame disposed above the control panel, and a plurality of conveying rollers disposed on the conveying mounting frame, the conveying rollers being used to convey the tin sheet pressed by the pressing mechanism to the shearing mechanism.
[0018] Optionally, the conveying mechanism further includes an adjustment component disposed on the back of one of the conveying rollers and connected to the conveying mounting frame. The adjustment component is used to adjust the position of the conveying rollers so that the solder sheet maintains tension during conveying.
[0019] Optionally, the adjustment assembly includes a slide rail, a slider, a spring, and a sensor. The slide rail is longitudinally arranged on the conveyor mounting frame. One side of the slider is connected to the slide rail, and the other side is connected to a conveyor roller. One end of the spring is located on one side of the slider, and the other end is connected to the conveyor mounting frame. The transmitting end of the sensor is located on the other side of the slider, and the receiving end is correspondingly located on the conveyor mounting frame on the same side as the transmitting end.
[0020] Optionally, the shearing mechanism includes a conveying channel, a solder sheet conveying assembly, and a shearing assembly arranged in sequence. The solder sheet conveyed by the conveying mechanism is conveyed through the conveying channel and the solder sheet conveying assembly to the bottom of the shearing assembly, where it is sheared by the shearing assembly.
[0021] Optionally, the shearing assembly includes a cutter, a cutter bracket, and a drive cylinder. The cutter moves up and down on the cutter bracket under the action of the drive cylinder to cut the tin sheet.
[0022] Optionally, the forming fixture further includes a receiving mechanism located at the output end of the shearing mechanism, which is used to collect the formed tin sheet after being sheared by the shearing mechanism.
[0023] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:
[0024] The solder sheet forming fixture described in this embodiment can meet the processing requirements of solder wires of various sizes and specifications. It can process solder wires of different diameters and press them into forming solder sheets of different thicknesses and cut them into forming solder sheets of different lengths. Using the forming solder sheets obtained in this embodiment, there is no need for manual application of solder paste when soldering PIN pins. This solves the problem of uncontrollable soldering quality caused by manual soldering and manual application of solder paste, improves soldering quality, reduces production and labor costs, and increases production efficiency. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:
[0026] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;
[0027] Figure 2 This is a second-view schematic diagram of the feeding mechanism, pressing mechanism and conveying mechanism arranged on the pressing control table in this embodiment of the present invention;
[0028] Figure 3 This is a schematic diagram showing the overall structure of an embodiment of this utility model.
[0029] Figure 4 This is a first-view schematic diagram of the feeding mechanism, pressing mechanism and conveying mechanism arranged on the pressing control table in the embodiment of this utility model;
[0030] In the diagram: 1. Control panel; 11. Pressing control panel; 111. Feeding mounting frame; 112. Pressing mounting frame; 113. Conveying mounting frame; 114. Mounting slot; 12. Shearing control panel; 2. Feeding mechanism; 21. Placement column; 22. Traction assembly; 221. Traction mounting plate; 222. Traction roller; 223. Roller drive component; 23. Feeding channel; 3. Pressing mechanism; 31. Active pressing assembly; 311. Active pressing roller; 312. Drive motor; 313. 32. Drive belt; 33. Passive pressing assembly; 34. Adjustment assembly; 35. Adjustment spring; 36. Adjustment plate; 37. Adjustment cylinder; 48. Conveying mechanism; 49. Conveying roller; 40. Slide rail; 41. Sliding block; 42. Sensing element; 43. Spring element; 50. Shearing mechanism; 51. Conveying channel; 52. Solder sheet conveying assembly; 521. Active drive element; 522. Passive drive element; 53. Shearing assembly; 54. Cutter; 55. Cutter support; 6. Receiving mechanism. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.
[0032] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.
[0034] Example:
[0035] like Figure 1 As shown, this utility model provides a special solder sheet forming fixture for reflow soldering of special components in high-density modular power supplies. It includes a control panel 1, and a feeding mechanism 2, a pressing mechanism 3, a conveying mechanism 4, and a shearing mechanism 5 sequentially arranged on the control panel 1. The feeding mechanism 2 is used to place the solder wire reel and convey the solder wire to the pressing mechanism 3. The pressing mechanism 3 includes an active pressing component 31, a passive pressing component 32, and an adjusting component 33. The active pressing component 31 and the passive pressing component 32 are arranged parallel in the longitudinal direction. After the solder wire is pressed into a solder sheet by the active pressing component 31 and the passive pressing component 32, it is output in the same direction. The adjusting component 33 is connected to the passive pressing component 32 and is used to adjust the gap between the passive pressing component 32 and the active pressing component 31 to adjust the pressing thickness of the solder sheet. The conveying mechanism 4 is used to convey the solder sheet to the shearing mechanism 5. The shearing mechanism 5 is used to shear the solder sheet to obtain a formed solder sheet.
[0036] Specifically, this embodiment can press tin wire into tin sheets, and then cut the tin sheets to obtain shaped tin sheets. The thickness and length of the tin sheets can be adjusted to form tin sheets of different thicknesses and lengths, which is convenient for subsequent use, can save costs, and improve the welding quality during subsequent soldering.
[0037] Below, we will combine Figure 1-4This document provides a detailed explanation of the specific structure and working principle of the special solder sheet forming tool for reflow soldering of high-density modular power supply components.
[0038] like Figure 1 As shown, the control panel 1 includes a pressing control panel 11 and a shearing control panel 12. The feeding mechanism 2, pressing mechanism 3, and conveying mechanism 4 are all mounted on the pressing control panel 11, and the shearing mechanism 5 is mounted on the shearing control panel 12. The feeding mechanism 2, pressing mechanism 3, conveying mechanism 4, and shearing mechanism 5 perform a series of steps on the control panel 1 to finally obtain the shaped tin sheet.
[0039] like Figure 2 As shown, the feeding mechanism 2 includes a placement column 21, a traction component 22, and a feeding channel 23 arranged in sequence; the placement column 21 is used to place the solder wire reel; the traction component 22 is used to pull and transport the solder wire on the solder wire reel, so that the solder wire is transported to the input end of the pressing mechanism 3 through the feeding channel 23.
[0040] Specifically, the placement column 21 and the traction assembly 22 are mounted on the pressing control table 11 via the feeding mounting frame 111. The placement column 21 is a vertically arranged column, and the solder wire is generally a solder wire spool, which can be placed on the placement column 21. The traction assembly 22 is mounted on the feeding mounting frame 111 via the traction mounting plate 221. The traction assembly 22 includes multiple traction rollers 222 and roller drive components 223 for driving the traction rollers 222 to perform traction. The traction assembly 22 can pull the solder wire on the solder wire spool placed on the placement column 21. It should be noted that the multiple traction rollers 222 can move on the traction mounting plate 221, which can ensure that the solder wire tension is maintained during the solder wire feeding process, ensuring that the solder wire is stably delivered to the pressing mechanism 3.
[0041] like Figure 2 As shown, the feeding channel 23 is located at the rear end of the traction assembly 22 and the front end of the pressing mechanism 3. Specifically, the feeding channel 23 can be mounted on the pressing mounting frame 112. After the solder wire is pulled by the traction assembly 22, it will pass through the feeding channel 23 and be fed into the pressing mechanism 3, where the pressing mechanism 3 will press the solder wire into a solder sheet. The feeding channel 23 is a horizontally arranged channel, and its conveying direction is consistent with the pressing direction of the pressing mechanism 3 to ensure correct feeding of the solder wire.
[0042] The pressing mechanism 3 is mounted above the pressing control panel 11 via the pressing mounting bracket 112. The pressing mechanism 3 includes an active pressing component 31, a passive pressing component 32, and an adjusting component 33. The active pressing component 31 and the passive pressing component 32 are arranged parallel in the longitudinal direction. After the solder wire is pressed into a solder sheet by the active pressing component 31 and the passive pressing component 32, it is output in the same direction. The adjusting component 33 is connected to the passive pressing component 32 and is used to adjust the gap between the passive pressing component 32 and the active pressing component 31 to adjust the pressing thickness of the solder sheet. Specifically, the pressing mechanism 3 requires the active pressing component 31 and the passive pressing component 32 to cooperate in pressing the solder wire into a solder sheet. The active pressing component 31 is located at the lower part of the pressing mounting bracket 112, while the passive pressing component 32 is located at the upper part of the pressing mounting bracket 112 via the adjusting component 33.
[0043] like Figure 3 As shown, the active pressing assembly 31 includes an active pressing roller 311, a drive motor 312, and a drive belt 313. The active pressing roller 311 is connected to the drive motor 312 via the drive belt 313. Under the action of the drive motor 312 and the drive belt 313, the active pressing roller 311 cooperates with the passive pressing assembly 32 to press the solder wire into a solder sheet. The pressing speed of the active pressing roller 311 is adjusted by the rotation speed of the drive motor 312. Specifically, the drive motor 312 and the drive belt 313 are hidden inside the pressing control panel 11, while the active pressing roller 311 is mounted on the pressing control panel 11. The active pressing roller 311 rotates under the action of the drive motor 312 and the drive belt 313. The active pressing assembly 31 is an actively rotating assembly. While acting as a drive assembly to transport the solder wire, it also cooperates with the passive pressing assembly 32 to press the solder wire into a solder sheet.
[0044] like Figure 4As shown, the adjustment assembly includes an adjustment spring 331, an adjustment plate 332, and an adjustment cylinder 333. The passive pressing assembly 32 is mounted above the active pressing assembly 31 via the adjustment spring 331. The adjustment plate 332 is positioned above the passive pressing assembly 32, and the adjustment cylinder 333 is positioned on top of the adjustment plate 332. The gap between the passive pressing assembly 32 and the active pressing assembly 31 is adjusted by the combined action of the adjustment spring 331, the adjustment plate 332, and the adjustment cylinder 333. Specifically, the inner side of the pressing mounting bracket 112 has a platform for placing the adjusting spring 331. The passive pressing component 32 is mounted above the active pressing component 31 via the adjusting spring 331 and the adjusting plate 332. The adjusting cylinder 333 is located on top of the adjusting plate 332 and connected to it. The adjusting cylinder 333 can adjust the pressure it applies to the adjusting plate 332, compressing the adjusting spring 331, thereby adjusting the position of the passive pressing component 32 relative to the active pressing component 31. This adjusts the distance between the passive pressing component 32 and the active pressing component 31, ultimately adjusting the pressing thickness of the solder sheet. This design offers strong adaptability, practicality, and versatility. It should be noted that the passive pressing component 32 is actually a passive pressing roller.
[0045] As an optional implementation method, such as Figure 4 As shown, the conveying mechanism 4 includes a conveying mounting frame 113 disposed above the pressing control panel 11, and a plurality of conveying rollers 41 disposed on the conveying mounting frame 113. The conveying rollers 41 are used to convey the solder sheets pressed by the pressing mechanism 3 to the shearing mechanism 5. The conveying mechanism 4 is located at the output end of the pressing mechanism 3 and is used to convey the solder sheets pressed by the pressing mechanism 3.
[0046] The conveyor roller 41 is designed with an I-shaped structure. One end of the conveyor roller 41 is a snap-fit, while the other end can rotate to convey the solder sheet. The conveyor roller 41 is correspondingly installed in the mounting groove 114 on the conveyor mounting frame 113. The mounting groove 114 is arranged horizontally or vertically on the conveyor mounting frame 113, so that the position of the conveyor roller 41 can be adjusted within the mounting groove 114 according to the actual situation, ensuring tension during the solder sheet conveying process.
[0047] In addition, such as Figure 4As shown, the conveying mechanism 4 also includes an adjustment assembly. The adjustment assembly is disposed on the back of one of the conveying rollers 41 and connected to the conveying mounting frame 113. The adjustment assembly is used to adjust the position of the conveying roller 41 so that the solder sheet maintains tension during conveying. The adjustment assembly includes a slide rail 42, a slider 43, a spring 45, and a sensor 44. The slide rail 42 is longitudinally arranged on the conveying mounting frame 113. One side of the slider 43 is connected to the slide rail 42, and the other side is connected to one of the conveying rollers 41. One end of the spring 45 is disposed on one side of the slider 43, and the other end is connected to the conveying mounting frame 113. The transmitting end of the sensor 44 is disposed on the other side of the slider 43, and the receiving end is correspondingly disposed on the conveying mounting frame 113 on the same side as the transmitting end. Specifically, the adjustment component is located on the back of one of the conveying rollers 41. The position of this conveying roller 41 can be adaptively adjusted according to the tension during the solder sheet conveying process under the action of the spring 45 and the sensing element 44, so as to ensure the correct conveying of the solder sheet, further maintain the tension of the solder sheet during the conveying process, and facilitate the subsequent conveying and cutting of the solder sheet.
[0048] As an optional implementation method, such as Figure 1 As shown, the shearing mechanism 5 is mounted on the shearing control panel 12. Figure 3 As shown, the shearing mechanism 5 includes a conveying channel 51, a solder sheet conveying assembly 52, and a shearing assembly 53 sequentially arranged on the shearing control table 12. The solder sheet conveyed by the conveying mechanism 4 is conveyed through the conveying channel 51 and the solder sheet conveying assembly 52 to the bottom of the shearing assembly 53, where it is sheared. Specifically, the shearing mechanism 5 is located at the output end of the conveying mechanism 4. The solder sheet output by the conveying mechanism 4 passes sequentially through the conveying channel 51, the solder sheet conveying assembly 52, and the shearing assembly 53. Finally, the shearing assembly 53 cuts the solder sheet to a preset length, resulting in a shaped solder sheet. The solder sheet conveying assembly 52 includes an active drive component 521 and a passive drive component 522. The active drive component 521 and the passive drive component 522 cooperate to pull and convey the solder sheet, ultimately conveying it to the bottom of the shearing assembly 53 for shearing to obtain a shaped solder sheet. Specifically, both the active drive component 521 and the passive drive component 522 are cylindrical rollers, and the active drive component 521 is driven by a motor.
[0049] like Figure 3As shown, the shearing assembly 53 includes a cutter 531, a cutter support 532, and a drive cylinder (not shown in the figure). The cutter 531 moves up and down on the cutter support 532 under the action of the drive cylinder to cut the solder sheet. Specifically, the cutter 531 is positioned at the far end of the conveying channel 51 via the cutter support 532. The solder sheet is conveyed to the bottom of the cutter 531 via the conveying channel 51 and the solder sheet conveying assembly 52. The cutter 531 is connected to the drive cylinder via a cylinder tube. Under the action of the drive cylinder, the cutter 531 moves up and down on the cutter support 532 and contacts the surface of the shearing control table 12 to cut the solder sheet to a preset length. It should be noted that the solder sheet conveying assembly 52 continuously conveys the solder sheet; therefore, the cutting length of the formed solder sheet is controlled by the duration of the drive cylinder's operation.
[0050] As an optional implementation method, such as Figure 1 As shown, the forming fixture also includes a receiving mechanism 6, which is located at the output end of the shearing mechanism 5 and is used to collect the formed tin sheets after being sheared by the shearing mechanism 5.
[0051] The working principle of this embodiment is as follows: the feeding mechanism 2 conveys the solder wire on the solder wire reel to the pressing mechanism 3, where the pressing mechanism 3 presses the solder wire into a solder sheet. Subsequently, the solder sheet is conveyed by the conveying mechanism 4 to the shearing structure for cutting. The pressing mechanism 3 can be adjusted to adjust the pressing thickness of the solder sheet, and the shearing mechanism 5 can also be adjusted to adjust the cutting length of the solder sheet. The solder sheet forming fixture described in this embodiment can meet the processing requirements of solder wires of various sizes, can process solder wires of different diameters, and can press the solder wire into shaped solder sheets of different thicknesses and cut them into shaped solder sheets of different lengths.
[0052] Using the molded tin sheet obtained in this embodiment, there is no need to manually add solder paste when soldering PIN pins. This solves the problem of uncontrollable soldering quality caused by manual soldering and manual addition of solder paste, improves soldering quality, reduces production and labor costs, and increases production efficiency.
[0053] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.
[0054] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.
Claims
1. A special solder sheet forming fixture for reflow soldering of special components in high-density modular power supplies, characterized in that, It includes a control panel, and a feeding mechanism (2), a pressing mechanism (3), a conveying mechanism (4) and a shearing mechanism (5) arranged sequentially on the control panel; The feeding mechanism (2) is used to place the tin wire spool and transport the tin wire to the pressing mechanism (3); The pressing mechanism (3) includes an active pressing component (31), a passive pressing component (32), and an adjusting component (33). The active pressing component (31) and the passive pressing component (32) are arranged parallel to each other in the longitudinal direction. The solder wire is pressed into a solder sheet by the active pressing component (31) and the passive pressing component (32) and then output in the same direction. The adjusting component (33) is connected to the passive pressing component (32) and is used to adjust the gap between the passive pressing component (32) and the active pressing component (31) to adjust the pressing thickness of the solder sheet. The conveying mechanism (4) is used to convey the tin sheet to the shearing mechanism (5); The shearing mechanism (5) is used to shear the tin sheet to obtain a shaped tin sheet.
2. The high-density modular power supply special device reflow soldering special solder sheet forming tooling according to claim 1, characterized in that, The active pressing assembly (31) includes an active pressing roller (311), a drive motor (312), and a drive belt (313). The active pressing roller (311) is connected to the drive motor (312) through the drive belt (313). The active pressing roller (311) is driven by the drive motor (312) and the drive belt (313) to cooperate with the passive pressing assembly (32) to press the solder wire into the solder sheet.
3. The high-density modular power supply special device reflow soldering special solder sheet forming tooling according to claim 1, characterized in that, The adjustment assembly (33) includes an adjustment spring (331), an adjustment plate (332), and an adjustment cylinder (333). The passive pressing assembly (32) is mounted above the active pressing assembly (31) via the adjustment spring (331). The adjustment plate (332) is positioned above the passive pressing assembly (32), and the adjustment cylinder (333) is positioned on top of the adjustment plate (332). The gap between the passive pressing assembly (32) and the active pressing assembly (31) is adjusted by the combined action of the adjustment spring (331), the adjustment plate (332), and the adjustment cylinder (333).
4. The high-density modular power supply special device reflow soldering special solder sheet forming tooling according to claim 1, characterized in that, The feeding mechanism (2) includes a placement column (21), a traction component (22), and a feeding channel (23) arranged in sequence; The placement column (21) is used to place the tin wire reel; the traction assembly (22) is used to pull and transport the tin wire on the tin wire reel, so that the tin wire is transported through the feeding channel (23) to the input end of the pressing mechanism (3).
5. The high-density modular power supply special device reflow soldering solder sheet forming fixture according to claim 1, characterized in that, The conveying mechanism (4) includes a conveying mounting frame (113) disposed above the control panel, and a plurality of conveying rollers (41) disposed on the conveying mounting frame (113). The conveying rollers (41) are used to convey the tin sheet pressed by the pressing mechanism (3) to the shearing mechanism (5).
6. The high-density modular power supply special device reflow soldering special solder sheet forming fixture according to claim 5, characterized in that, The conveying mechanism (4) further includes an adjustment component, which is disposed on the back of one of the conveying rollers (41) and connected to the conveying mounting frame (113). The adjustment component is used to adjust the position of the conveying roller (41) so that the tin sheet maintains tension during the conveying process.
7. The high-density modular power supply special device reflow soldering solder sheet forming fixture according to claim 6, characterized in that, The adjustment assembly includes a slide rail (42), a slider (43), a spring (45), and a sensor (44). The slide rail (42) is longitudinally arranged on the conveyor mounting frame (113). One side of the slider (43) is connected to the slide rail (42), and the other side is connected to a conveyor roller (41). One end of the spring (45) is located on one side of the slider (43), and the other end is connected to the conveyor mounting frame (113). The transmitting end of the sensor (44) is located on the other side of the slider (43), and the receiving end is correspondingly located on the conveyor mounting frame (113) on the same side as the transmitting end.
8. The high-density modular power supply special device reflow soldering special solder sheet forming tooling according to claim 1, characterized in that, The shearing mechanism (5) includes a conveying channel (51), a solder sheet conveying assembly (52), and a shearing assembly (53) arranged in sequence. The solder sheet conveyed by the conveying mechanism (4) is conveyed to the bottom of the shearing assembly (53) via the conveying channel (51) and the solder sheet conveying assembly (52), and is sheared by the shearing assembly (53).
9. The high-density modular power supply special device reflow soldering special solder sheet forming fixture according to claim 8, characterized in that, The shearing assembly (53) includes a cutter (531), a cutter support (532), and a drive cylinder. The cutter (531) moves up and down on the cutter support (532) under the action of the drive cylinder to cut the tin sheet.
10. The high-density modular power supply special device reflow soldering special solder sheet forming tooling according to claim 1, characterized in that, The forming fixture also includes a receiving mechanism (6), which is located at the output end of the shearing mechanism (5) and is used to collect the formed tin sheet after being sheared by the shearing mechanism (5).