Polishing device for semiconductor processing

Abstract

The utility model discloses a polishing device for semiconductor processing. The polishing device comprises a machine base, a rotary multi-station bearing assembly and a polishing assembly. The rotary multi-station bearing assembly comprises a workbench, a rotary workbench is rotationally assembled in the workbench, a plurality of evenly-distributed polishing tables are rotationally assembled above the rotary workbench, and polishing containing grooves are formed in the multiple polishing tables. The polishing assembly comprises an assembling limiting frame, an assembling block is slidably assembled on one side of the assembling limiting frame, a limiting cover is fixedly assembled below the assembling block and corresponds to the polishing table, and a polishing pad is fixedly assembled in the limiting cover and corresponds to the polishing containing groove. According to the polishing device for semiconductor processing, the rotary multi-station bearing assembly is arranged, so that the polishing part can continuously operate, the polishing period of the polishing device for semiconductor processing is shortened, and the polishing efficiency of the polishing device for semiconductor processing is improved.

Description

Technical Field

[0001] This utility model belongs to the field of polishing technology in semiconductor processing, and specifically relates to a polishing device for semiconductor processing. Background Technology

[0002] Semiconductor polishing equipment is a device that uses chemical mechanical polishing technology to polish the surface of wafers. It removes excess material from the wafer surface through the combined action of chemical components in the polishing slurry and mechanical friction, thereby achieving the purpose of polishing. It is widely used in wafer material manufacturing, semiconductor processing, and packaging and testing.

[0003] The traditional semiconductor processing polishing equipment mainly consists of several steps: feeding, polishing, cleaning, and unloading. This means that the polishing components are in a stopped state and do not operate continuously during the feeding, cleaning, and unloading processes of the product to be polished. As a result, the semiconductor processing polishing equipment suffers from problems such as long polishing cycles and low polishing efficiency.

[0004] Therefore, in view of the above-mentioned technical problems, it is necessary to provide a polishing apparatus for semiconductor processing.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a polishing device for semiconductor processing, which can shorten the polishing cycle and improve polishing efficiency.

[0007] To achieve the above objectives, a specific embodiment of this utility model provides a polishing apparatus for semiconductor processing, comprising: a base, a rotary multi-station support assembly, and a polishing assembly.

[0008] The rotary multi-station support assembly is mounted on top of the machine base. The rotary multi-station support assembly includes a worktable, which is fixedly mounted on top of the machine base. A rotary worktable is rotatably mounted inside the worktable. Multiple evenly distributed polishing tables are rotatably mounted above the rotary worktable, and each of the multiple polishing tables has a polishing placement groove.

[0009] The polishing assembly is fixedly mounted above the worktable. The polishing assembly includes an assembly limiting frame, which is fixedly mounted above the worktable. An assembly block is slidably mounted on one side of the assembly limiting frame. A limiting cover is fixedly mounted below the assembly block. The limiting cover is correspondingly arranged with the polishing table. A polishing pad is fixedly mounted inside the limiting cover. The polishing pad is correspondingly arranged with the polishing placement groove.

[0010] In one or more embodiments of this utility model, a protective cover is fixedly mounted above the worktable. The protective cover provides safety protection during the polishing process of the polishing pad. A rotary shaft is fixedly connected inside the rotary worktable, and the rotary shaft rotates with the worktable, passing through the worktable. The rotary shaft serves to assemble and fix the worktable and drive its rotation.

[0011] In one or more embodiments of this utility model, a partition is fixedly mounted inside the base. The partition serves to mount and fix the drive motor. A drive motor is fixedly mounted on one side of the partition, and the output shaft of the drive motor is connected to the rotary shaft via a transmission connection. The drive motor provides power, and the rotation of the rotary shaft is driven by controlling the operation of the drive motor.

[0012] In one or more embodiments of this utility model, a transmission shaft is fixedly connected to the lower part of each of the plurality of polishing tables, and the plurality of transmission shafts are rotatably connected to the worktable. The polishing tables are rotated by rotating the transmission shafts.

[0013] In one or more embodiments of this utility model, a plurality of polishing motors are fixedly connected below the rotary worktable. The plurality of polishing motors are correspondingly arranged with respect to the polishing table, and the output shafts of the plurality of polishing motors are connected to a transmission shaft. The polishing motors provide power, and by controlling the operation of the polishing motors, the transmission shaft is rotated, thereby facilitating the rotation of the polishing table.

[0014] In one or more embodiments of this utility model, a lifting and lowering groove is provided within the assembly limiting frame. This groove provides assembly sliding space for the threaded slider. The threaded slider is slidably assembled within the lifting and lowering groove and is fixedly connected to the assembly block. The threaded slider serves to assemble and fix the assembly block, and the lifting and lowering movement of the assembly block is controlled by adjusting the lifting and lowering sliding motion of the threaded slider.

[0015] In one or more embodiments of this utility model, an assembly connecting rod is fixedly connected between the assembly block and the limiting cover. The assembly connecting rod serves to connect the assembly block and the limiting cover, facilitating the synchronous raising and lowering of the limiting cover with the raising and lowering of the assembly block under the action of the assembly connecting rod.

[0016] In one or more embodiments of this utility model, a lifting threaded rod is rotatably mounted within the lifting clearance groove. The lifting threaded rod passes through the threaded slider and is threadedly connected to the threaded slider. The lifting threaded rod supports, limits, and allows the threaded slider to move vertically.

[0017] In one or more embodiments of this utility model, a lifting motor is fixedly mounted above the assembly limiting frame, and the output shaft of the lifting motor is connected to the lifting threaded rod. The lifting motor provides power, and by controlling the operation of the lifting motor, the lifting threaded rod is rotated, thereby facilitating the lifting and lowering movement control of the threaded slider.

[0018] Compared with the prior art, the polishing apparatus for semiconductor processing disclosed in this utility model, by setting a rotary multi-station support component, enables the polishing components to operate continuously, shortens the polishing cycle of the polishing apparatus for semiconductor processing, and improves the polishing efficiency of the polishing apparatus for semiconductor processing. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a perspective view of a semiconductor processing polishing apparatus according to an embodiment of the present invention;

[0021] Figure 2 This is another perspective view of a semiconductor processing polishing apparatus according to an embodiment of the present invention;

[0022] Figure 3 for Figure 2 Schematic diagram of the structure at point A in the middle;

[0023] Figure 4 This is a partial structural schematic diagram of a polishing apparatus for semiconductor processing according to one embodiment of the present invention;

[0024] Figure 5 This is a side sectional view of a polishing apparatus for semiconductor processing according to an embodiment of the present invention;

[0025] Figure 6 for Figure 5 Schematic diagram of the structure at point B.

[0026] Explanation of key figure labels:

[0027] 1-Base, 2-Rotary multi-station support assembly, 201-Worktable, 202-Rotary worktable, 203-Polishing table, 204-Protective cover, 205-Rotary shaft, 206-Partition plate, 207-Drive motor, 208-Transmission shaft, 209-Polishing motor, 3-Polishing assembly, 301-Assembly limit frame, 302-Assembly block, 303-Limit cover, 304-Polishing pad, 305-Lifting clearance groove, 306-Threaded slider, 307-Assembly connecting rod, 308-Lifting threaded rod, 309-Lifting motor. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0029] like Figures 1 to 6 As shown, a semiconductor processing polishing device according to one embodiment of the present invention includes: a base 1, a rotary multi-station support assembly 2, and a polishing assembly 3.

[0030] like Figures 1 to 2 As shown, the rotary multi-station support assembly 2 is mounted on top of the machine base 1. The rotary multi-station support assembly 2 includes a worktable 201, which is fixedly mounted on top of the machine base 1. The worktable 201 is used to limit the assembly and positioning of the rotary worktable 202 and multiple polishing tables 203.

[0031] like Figures 1 to 2 As shown, a protective cover 204 is fixedly mounted above the worktable 201. The protective cover 204 provides safety protection during the polishing process of the polishing pad 304.

[0032] like Figures 1 to 3 As shown, a rotary worktable 202 is rotatably mounted inside the worktable 201. The rotary worktable 202 serves to limit the assembly and control the rotation of the multiple polishing tables 203.

[0033] like Figures 4 to 6 As shown, a rotary shaft 205 is fixedly connected inside the rotary worktable 202. The rotary shaft 205 is rotatably engaged with the worktable 201 and passes through the worktable 201. The rotary shaft 205 serves to assemble and fix the worktable 201 and drive its rotation.

[0034] like Figures 4 to 6As shown, a partition 206 is fixedly installed inside the base 1. The partition 206 serves to assemble and fix the drive motor 207.

[0035] like Figures 4 to 6 As shown, a drive motor 207 is fixedly mounted on one side of the partition 206, and the output shaft of the drive motor 207 is connected to the rotary shaft 205. The drive motor 207 provides power, and the rotary shaft 205 is rotated by controlling the operation of the drive motor 207.

[0036] like Figures 2 to 3 As shown, multiple evenly distributed polishing tables 203 are mounted on top of the rotary worktable 202. The multiple polishing tables 203 support and limit the movement of the wafer to be polished.

[0037] Specifically, each of the multiple polishing stages 203 has a polishing placement groove. The polishing placement groove facilitates the support and positioning of the wafer, providing a basis for subsequent mechanical polishing of the wafer.

[0038] like Figures 5 to 6 As shown, each of the multiple polishing tables 203 has a drive shaft 208 fixedly connected to its lower surface, and each drive shaft 208 is rotatably connected to the worktable 201. The polishing tables 203 are rotated by rotating the drive shafts 208.

[0039] like Figures 4 to 6 As shown, multiple polishing motors 209 are fixedly connected to the bottom of the rotary worktable 202. These motors correspond to the polishing table 203, and their output shafts are connected to the transmission shaft 208. The polishing motors 209 provide power, and by controlling their operation, the transmission shaft 208 is rotated, thus facilitating the rotation of the polishing table 203.

[0040] like Figures 4 to 6 As shown, the polishing assembly 3 is fixedly mounted above the worktable 201. The polishing assembly 3 includes an assembly limit frame 301, which is fixedly mounted above the worktable 201. The assembly limit frame 301 serves to limit the assembly of the lifting and lowering clearance groove 305. At the same time, the assembly limit frame 301 provides assembly and lifting guidance for the threaded slider 306.

[0041] like Figures 4 to 6 As shown, an assembly block 302 is slidably mounted on one side of the assembly limit frame 301. The assembly block 302 serves to connect the assembly connecting rod 307 and the threaded slider 306. The polishing pad 304 can be adjusted by raising and lowering the assembly block 302.

[0042] like Figures 4 to 6As shown, a lifting and sliding groove 305 is provided inside the assembly limit frame 301. The lifting and sliding groove 305 provides assembly sliding space for the threaded slider 306.

[0043] like Figures 4 to 6 As shown, a threaded slider 306 is slidably mounted in the lifting and lowering groove 305, and the threaded slider 306 is fixedly connected to the assembly block 302. The threaded slider 306 serves to assemble and fix the assembly block 302, and the lifting and lowering movement of the assembly block 302 is controlled by lifting and lowering the threaded slider 306.

[0044] like Figures 4 to 6 As shown, a limiting cover 303 is fixedly mounted below the assembly block 302, and the limiting cover 303 is correspondingly set with the polishing table 203. The limiting cover 303 serves to fix the polishing pad 304 during assembly and to limit the polishing.

[0045] like Figures 5 to 6 As shown, an assembly connecting rod 307 is fixedly connected between the assembly block 302 and the limiting cover 303. The assembly connecting rod 307 serves to connect the assembly block 302 and the limiting cover 303, so that the limiting cover 303 can move up and down synchronously with the assembly block 302 under the action of the assembly connecting rod 307.

[0046] like Figures 5 to 6 As shown, a polishing pad 304 is fixedly installed inside the limiting cover 303, and the polishing pad 304 is correspondingly arranged with the polishing placement groove. The wafer placed on the polishing table 203 is polished by the relative movement between the polishing pad 304 and the wafer on the polishing table 203.

[0047] like Figures 5 to 6 As shown, a lifting threaded rod 308 is rotatably mounted within the lifting clearance groove 305. The lifting threaded rod 308 passes through the threaded slider 306 and is threadedly connected to the threaded slider 306. The lifting threaded rod 308 supports, limits, and allows the threaded slider 306 to move vertically.

[0048] like Figures 5 to 6 As shown, a lifting motor 309 is fixedly mounted above the assembly limit frame 301, and the output shaft of the lifting motor 309 is connected to the lifting threaded rod 308. The lifting motor 309 provides power, and by controlling the operation of the lifting motor 309, the lifting threaded rod 308 is rotated, thereby facilitating the lifting and lowering movement control of the threaded slider 306.

[0049] In practical use, the wafer to be polished can be placed in the polishing placement slot on the polishing table 203, which supports and limits the wafer to be polished. Subsequently, the rotary shaft 205 can be rotated by controlling the drive motor 207, so that the rotary worktable 202 can move the wafer to be polished to the bottom of the limiting cover 303.

[0050] Subsequently, the lifting threaded rod 308 can be rotated by controlling the operation of the lifting motor 309. Under the action of the internal and external threads, the threaded slider 306 drives the assembly block 302, the assembly connecting rod 307, and the limiting cover 303 to descend, thereby causing the limiting cover 303 to engage above the polishing table 203. Then, the polishing table 203 can be rotated by controlling the operation of the polishing motor 209. The polishing pad 304 polishes the wafer by rotating relative to the wafer.

[0051] After polishing is complete, the limiting cover 303 can be raised by controlling the lifting motor 309 to rotate in the opposite direction. Simultaneously, the rotary worktable 202 can be rotated by controlling the drive motor 207, thereby moving the polished polishing table 203 to the material handling position. At the same time, the polishing table 203 supporting the wafer to be polished in the next station can move below the limiting cover 303 for polishing, thus ensuring the continuous operation of the polishing pad 304.

[0052] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A polishing apparatus for semiconductor processing, characterized in that, include: Base; A rotary multi-station support assembly is mounted on top of the machine base. The rotary multi-station support assembly includes a worktable, which is fixedly mounted on top of the machine base. A rotary worktable is rotatably mounted inside the worktable. Multiple evenly distributed polishing tables are rotatably mounted above the rotary worktable. Each of the multiple polishing tables has a polishing placement groove. A polishing assembly is fixedly mounted above the worktable. The polishing assembly includes an assembly limiting frame, which is fixedly mounted above the worktable. An assembly block is slidably mounted on one side of the assembly limiting frame. A limiting cover is fixedly mounted below the assembly block. The limiting cover is correspondingly arranged with the polishing table. A polishing pad is fixedly mounted inside the limiting cover. The polishing pad is correspondingly arranged with the polishing placement groove.

2. The polishing apparatus for semiconductor processing according to claim 1, characterized in that, A protective cover is fixedly installed above the workbench, and a rotary shaft is fixedly connected inside the rotary workbench. The rotary shaft rotates in coordination with the workbench and passes through the workbench.

3. The polishing apparatus for semiconductor processing according to claim 2, characterized in that, A partition is fixedly mounted inside the base, and a drive motor is fixedly mounted on one side of the partition. The output shaft of the drive motor is connected to the rotary shaft for transmission.

4. The polishing apparatus for semiconductor processing according to claim 1, characterized in that, Each of the multiple polishing tables is fixedly connected to a drive shaft below it, and each of the multiple drive shafts is rotatably connected to the worktable.

5. The polishing apparatus for semiconductor processing according to claim 4, characterized in that, Multiple polishing motors are fixedly connected to the bottom of the rotary worktable. The multiple polishing motors are arranged corresponding to the polishing table, and the output shafts of the multiple polishing motors are connected to the transmission shaft.

6. The polishing apparatus for semiconductor processing according to claim 1, characterized in that, The assembly limiting frame has a lifting and avoiding groove, and a threaded slider is slidably assembled in the lifting and avoiding groove. The threaded slider is fixedly connected to the assembly block.

7. The polishing apparatus for semiconductor processing according to claim 1, characterized in that, An assembly connecting rod is fixedly connected between the assembly block and the limiting cover.

8. The polishing apparatus for semiconductor processing according to claim 6, characterized in that, A lifting threaded rod is rotatably mounted inside the lifting and locating groove. The lifting threaded rod passes through the threaded slider and is threadedly connected to the threaded slider.

9. A polishing apparatus for semiconductor processing according to claim 8, characterized in that, A lifting motor is fixedly mounted on the top of the assembly limit frame, and the output shaft of the lifting motor is connected to the lifting threaded rod.

Images