Sample table and semiconductor production equipment

Abstract

The utility model provides a sample table and semiconductor production equipment. The sample table comprises a base, a table body and an adjusting mechanism, the adjusting mechanism comprises a first rotating shaft, a second rotating shaft, a locking piece and a driving piece; the first rotating shaft is connected with the base, and the second rotating shaft is perpendicularly connected with the first rotating shaft and connected with the table body. The driving piece is connected with the first rotating shaft and the second rotating shaft; the driving piece can partially move to drive the first rotating shaft to rotate and drive the table body to rotate around the axis of the first rotating shaft when the locking piece does not lock the first rotating shaft and the base but locks the second rotating shaft and the first rotating shaft; when the locking piece does not lock the second rotating shaft and the first rotating shaft, the locking piece can partially move to drive the second rotating shaft to rotate and drive the table body to rotate around the axis of the second rotating shaft; the driving piece is provided with an indication mark for indicating the motion amount of the driving piece; when the first rotating shaft and the second rotating shaft are horizontally arranged, the adjusting mechanism drives the table body to move quantitatively, and the table body is rapidly adjusted.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a sample stage and semiconductor manufacturing equipment. Background Technology

[0002] The levelness of the sample stage within the process chamber of the deposition equipment directly affects the quality of the deposited film. Currently, sample stage leveling is performed during preventative maintenance of the deposition equipment, and the specific procedure is roughly as follows:

[0003] Open the process chamber and remove all process kits;

[0004] The calibrated level assembly is placed in the process chamber, with two of the four levels on the assembly arranged along the extension direction of the first axis of rotation of the sample stage and the other two arranged along the extension direction of the second axis of rotation of the sample stage; the second axis of rotation is perpendicular to the first axis of rotation.

[0005] Raise the sample stage to the process position and check the readings of the four levels;

[0006] Release the lock on the sample stage's rotating shaft and manually bend the sample stage so that it swings around the axes of the first and second rotating shafts respectively. During this process, check the readings of the four levels until the deviation of the readings of each level is within 0.02.

[0007] Lock the rotating shaft of the sample stage to complete the leveling operation of the sample stage.

[0008] In the above process, the swing amplitude of the sample stage cannot be quantified when manually moving it. It can only rely on the level reading and the operator's feel. This results in inexperienced operators taking a long time to perform the above operations, which in turn leads to a longer time for preventive maintenance, reduces the uptime of the deposition equipment, and reduces the yield. Utility Model Content

[0009] The purpose of this invention is to provide a sample stage and semiconductor manufacturing equipment, which aims to quantify the adjustment amount when performing leveling operations on the sample stage, so as to speed up the leveling process and shorten the leveling time.

[0010] To achieve the above objectives, this utility model provides a sample stage, comprising:

[0011] Base;

[0012] Platform;

[0013] The adjustment mechanism includes a first rotating shaft, a second rotating shaft, a locking element, and a driving element; the first rotating shaft is connected to the base, the second rotating shaft is perpendicular to and connected to the first rotating shaft, and the second rotating shaft is also connected to the platform; the locking element selectively locks the first rotating shaft to the base and selectively locks the second rotating shaft to the first rotating shaft; the driving element is connected to both the first rotating shaft and the second rotating shaft.

[0014] The drive component is configured to: partially move under the drive of an external force when the first rotating shaft is not locked to the base and the second rotating shaft is locked to the first rotating shaft, thereby driving the first rotating shaft to rotate relative to the base and causing the platform to rotate around the axis of the first rotating shaft; and partially move under the drive of an external force when the second rotating shaft is not locked to the first rotating shaft, thereby driving the second rotating shaft to rotate relative to the first rotating shaft and causing the platform to rotate around the axis of the second rotating shaft.

[0015] The drive component is provided with indicator marks for indicating the amount of movement of the drive component and the amount of rotation of the platform.

[0016] Optionally, the indicator mark includes a first indicator mark and a second indicator mark;

[0017] The driving component includes a first driving component and a second driving component;

[0018] The first drive member is connected to the first rotating shaft and is configured to move under the drive of an external force when the first rotating shaft is not locked to the base and the second rotating shaft is locked to the first rotating shaft, thereby driving the first rotating shaft to rotate relative to the base and causing the platform to rotate around the axis of the first rotating shaft; the first drive member is provided with the first indicator mark to indicate the amount of movement of the first drive member and the amount of rotation of the platform when it rotates around the axis of the first rotating shaft;

[0019] The second drive member is connected to the second rotating shaft and is configured to move under the drive of an external force when the second rotating shaft and the first rotating shaft are in an unlocked state, thereby driving the second rotating shaft to rotate relative to the first rotating shaft and causing the platform to rotate around the axis of the second rotating shaft; the second drive member is provided with a second indicator mark to indicate the amount of movement of the second drive member and the amount of rotation of the platform when it rotates around the axis of the second rotating shaft.

[0020] Optionally, the first driving component includes a first swing arm and a first lead screw and nut assembly; the first swing arm is connected at an angle to the first rotating shaft; the first lead screw and nut assembly includes a first lead screw and a first nut; the first lead screw is connected at an angle to the first swing arm, and the first lead screw is also out of plane with the first rotating shaft; the first nut is disposed on the base and is capable of rotating relative to the base under the drive of an external force when the first rotating shaft and the base are in an unlocked state;

[0021] The first indicator mark includes a scale that is disposed on the first lead screw and extends along the axial direction of the first lead screw.

[0022] Optionally, the base is provided with a first mounting hole, a first clearance groove and a second mounting hole that are connected in sequence;

[0023] The first rotating shaft passes through the first mounting hole, the first swing arm is disposed in the first clearance groove, and the first lead screw partially passes through the second mounting hole.

[0024] Optionally, the second driving component includes a second swing arm and a second lead screw and nut assembly; the second swing arm is connected at an angle to the second rotating shaft; the second lead screw and nut assembly includes a second lead screw and a second nut; the second lead screw is connected at an angle to the second swing arm, and the second lead screw is also out of plane with the second rotating shaft; the second nut is disposed on the base, and the second nut is also capable of rotating relative to the base under the drive of an external force when the second rotating shaft and the first rotating shaft are in an unlocked state;

[0025] The second indicator includes a scale that is disposed on the second lead screw and extends along the axial direction of the second lead screw.

[0026] Optionally, the base is further provided with a third mounting hole, a second clearance groove and a fourth mounting hole connected in sequence;

[0027] The second rotating shaft is partially inserted into the third mounting hole; the second swing arm is disposed in the second clearance groove; and the second lead screw is partially inserted into the fourth mounting hole.

[0028] Optionally, the locking element includes a first locking element and a second locking element; the first locking element selectively locks the first rotating shaft and the base; the second locking element selectively locks the second rotating shaft and the first rotating shaft.

[0029] To achieve the above objectives, the present invention also provides a semiconductor manufacturing apparatus, including a process chamber and a sample stage as described in any of the preceding claims; the stage body is at least partially located within the process chamber; the adjustment mechanism is located outside the process chamber, and both the first rotating shaft and the second rotating shaft are arranged horizontally.

[0030] Optionally, it also includes a position switching mechanism connected to the base and configured to drive the sample stage to move relative to the process cavity in a preset direction; the preset direction is perpendicular to the first rotating shaft and the second rotating shaft.

[0031] Optionally, the semiconductor manufacturing equipment includes a deposition apparatus.

[0032] Compared with the prior art, the sample stage and semiconductor manufacturing equipment of this utility model have the following advantages:

[0033] The aforementioned sample stage includes a base, a stage body, and an adjustment mechanism; the adjustment mechanism includes a first rotating shaft, a second rotating shaft, a locking member, and a driving member; the first rotating shaft is connected to the base, the second rotating shaft is perpendicular to and connected to the first rotating shaft, and the second rotating shaft is also connected to the stage body; the locking member selectively locks the first rotating shaft to the base, and the locking member also selectively locks the second rotating shaft to the first rotating shaft; the driving member is connected to the first rotating shaft and the second rotating shaft; the driving member is configured to: when the first rotating shaft and the base are in an unlocked state and the second rotating shaft and the first rotating shaft are in a locked state, be able to partially move under the drive of an external force, thereby driving the first rotating shaft to rotate relative to the base and causing the stage body to rotate around the axis of the first rotating shaft, and at the second rotating shaft and the first rotating shaft... In the unlocked state, it can partially move under the drive of external force, thereby driving the second rotating shaft to rotate relative to the first rotating shaft and causing the stage to rotate around the axis of the second rotating shaft; the driving member is also provided with an indicator mark for indicating the amount of movement of the driving member; when both the first rotating shaft and the second rotating shaft are arranged horizontally, the leveling operation of the stage can be realized by controlling the rotation of the stage around the first rotating shaft and / or the second rotating shaft, and during the leveling process, the amount of rotation of the stage when it rotates on the first rotating shaft and / or the amount of rotation of the stage when it rotates on the second rotating shaft is obtained by indicating the amount of movement of the driving member through the indicator mark, thereby quantifying the amount of movement of the stage and realizing the purpose of quantitatively adjusting the levelness of the sample stage, which is conducive to quickly completing the leveling operation of the sample stage.

[0034] The aforementioned semiconductor manufacturing equipment includes a process chamber and a sample stage, with the stage body at least partially located within the process chamber and the adjustment mechanism located outside the process chamber. This allows the leveling operation of the sample stage to be performed without opening the process chamber, enabling the leveling operation of the sample stage to be performed as needed without waiting for preventive maintenance of the semiconductor equipment, which is beneficial to improving the yield of products produced by the semiconductor manufacturing equipment. Attached Figure Description

[0035] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:

[0036] Figure 1 This is a schematic diagram of the structure of a semiconductor manufacturing equipment provided according to an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the sample stage provided according to an embodiment of the present invention;

[0038] Figure 3 This is a partial structural schematic diagram of the sample stage provided according to an embodiment of the present invention;

[0039] Figure 4 This is a partial structural schematic diagram of the sample stage provided according to one embodiment of the present invention;

[0040] Figure 5 This is a partial structural schematic diagram of the sample stage provided according to one embodiment of the present invention.

[0041] [The annotations in the attached figures are explained below]:

[0042] 1-Semiconductor manufacturing equipment, 10-Process chamber, 20-Sample stage, 100-Base, 101-First mounting hole, 102-Second mounting hole, 103-First locking threaded hole, 104-Allowing hole, 105-First clearance groove, 106-Second mounting hole, 107-Fourth mounting hole, 200-Stage body, 300-Adjusting mechanism, 310-First rotating shaft, 311-Connecting hole, 312-Second locking threaded hole, 320-Second rotating shaft, 3 30-Locking component, 331-First locking component, 332-Second locking component, 340-Drive component, 350-Indicator mark, 351-First indicator mark, 352-Second indicator mark, 341-First drive component, 3411-First swing arm, 3412-First lead screw, 3413-First nut, 342-Second drive component, 3421-Second swing arm, 3422-Second lead screw, 3423-Second nut, 30-Position switching mechanism. Detailed Implementation

[0043] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0044] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0045] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “link” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate relative importance or implicitly specify the number of indicated technical features. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] One of the objectives of this invention is to provide a sample stage that is used in semiconductor manufacturing equipment, such as deposition equipment. This sample stage can quantitatively perform leveling operations to improve the speed of leveling operations, thereby extending the working time of the semiconductor manufacturing equipment and increasing the yield.

[0047] The second objective of this invention is to provide a semiconductor device that utilizes the aforementioned sample stage.

[0048] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0049] Figure 1 This is a schematic diagram of the structure of a semiconductor manufacturing apparatus 1 provided in some embodiments of this utility model. For example... Figure 1 As shown, the semiconductor manufacturing equipment 1 includes a process chamber 10 and a sample stage 20. Part of the sample stage 20 is disposed inside the process chamber 10, and another part is disposed outside the process chamber 10.

[0050] Furthermore, the semiconductor manufacturing equipment 1 also includes a position switching mechanism 30, which is disposed outside the process cavity 10 and connected to the sample stage 20. The position switching mechanism 30 is configured to drive the sample stage 20 to move relative to the process cavity 10 in a preset direction, so that the sample stage 20 moves between a process position and a non-process position.

[0051] Figure 2 This is a schematic diagram of the sample stage 20. Figures 3 to 5 These are schematic diagrams showing different partial structures of the sample stage 20. Please refer to them. Figures 2 to 5 and combined Figure 1 The sample stage 20 includes a base 100, a stage body 200, and an adjustment mechanism 300. The stage body 200 is at least partially disposed inside the process cavity 10, while the base 100 and the adjustment mechanism 300 are disposed outside the process cavity 10, and the base 100 is connected to the position switching mechanism 30.

[0052] The adjustment mechanism 300 includes a first rotating shaft 310, a second rotating shaft 320, a locking member 330, and a driving member 340. The extension directions of the first rotating shaft 310, the second rotating shaft 320, and the preset direction are perpendicular to each other. The first rotating shaft 310 is connected to the base 100. The second rotating shaft 320 is connected to the first rotating shaft 310 and also to the platform 200. The locking member 330 selectively locks the first rotating shaft 310 to the base 100 and also selectively locks the second rotating shaft 320 to the first rotating shaft 310. The driving member 340 is connected to both the first rotating shaft 310 and the second rotating shaft 320.

[0053] When the locking member 330 locks the first rotating shaft 310 and the base 100, the first rotating shaft 310 and the base 100 are in a locked state and remain relatively stationary; and when the locking member 330 locks the second rotating shaft 320 and the first rotating shaft 310, the second rotating shaft 320 and the first rotating shaft 310 remain relatively stationary. When the locking member 330 releases the locking of the first rotating shaft 310 and the base 100, the first rotating shaft 310 and the base 100 are in an unlocked state, and the driving member 340 enables relative movement between the first rotating shaft 310 and the base 100; and when the locking member 330 releases the locking of the second rotating shaft 320 and the first rotating shaft 310, the second rotating shaft 320 and the first rotating shaft 310 are in an unlocked state, and the driving member 340 enables relative movement between the second rotating shaft 320 and the first rotating shaft 310. Specifically, when the first rotating shaft 310 is not locked to the base 100, the driving member 340 can move partially under the drive of an external force, thereby causing the first rotating shaft 310 to rotate relative to the base 100; when the second rotating shaft 320 is not locked to the first rotating shaft 310, the driving member 340 can move partially under the drive of an external force, thereby causing the second rotating shaft 320 to rotate relative to the first rotating shaft 310. It can be understood that during the rotation of the first rotating shaft 310, if the second rotating shaft 320 is locked to the first rotating shaft 310, then the second rotating shaft 320 and the platform 200 rotate around the axis of the first rotating shaft 310; during the rotation of the second rotating shaft 320, the platform 200 rotates around the axis of the second rotating shaft 320.

[0054] In other words, the drive member 340 can partially move under the influence of an external force when the first rotating shaft 310 is not locked to the base 100 and the second rotating shaft 320 is locked to the first rotating shaft 310, thereby causing the first rotating shaft 310 to rotate relative to the base 100, and driving the second rotating shaft 320 and the platform 200 to rotate around the axis of the first rotating shaft 310. Furthermore, the drive member 340 can partially move under the influence of an external force when the second rotating shaft 320 is not locked to the first rotating shaft 310, thereby causing the second rotating shaft 320 to rotate relative to the first rotating shaft 310, and driving the platform 200 to rotate around the axis of the second rotating shaft 320. It is understood that when the driving component 330 drives the first rotating shaft 310 and the second rotating shaft 320 to rotate, the rotation amount of the first rotating shaft 310 and the movement amount of the driving component 340 have a first preset quantitative relationship, and the rotation amount of the second rotating shaft 320 and the movement amount of the driving component 340 have a second preset quantitative relationship. Furthermore, the rotation amount of the platform 200 when rotating around the axis of the first rotating shaft 310 is equal to the rotation amount of the first rotating shaft 310, and the rotation amount of the platform 200 when rotating around the axis of the second rotating shaft 320 is equal to the rotation amount of the second rotating shaft 320.

[0055] The drive member 340 is also provided with an indicator mark 350 for indicating the amount of movement of the drive member 340. Therefore, after obtaining the amount of movement of the drive member 340 according to the indicator mark 350, the rotational amount of the first rotating shaft 310 when it rotates on its own axis can be obtained, and thus the rotational amount of the platform 200 when it rotates around the axis of the first rotating shaft 310 can be obtained, as well as the rotational amount of the second rotating shaft 320 when it rotates on its own axis, and thus the rotational amount of the platform 200 when it rotates around the axis of the second rotating shaft 320 can be obtained. In other words, the indicator mark 350 indirectly indicates the rotational amount of the first rotating shaft 310, the rotational amount of the second rotating shaft 320, the rotational amount of the platform 200 when it rotates around the first rotating shaft 310, and the rotational amount of the platform 200 when it rotates around the second rotating shaft 320 by indicating the amount of movement of the drive member 340.

[0056] During normal operation of the semiconductor manufacturing equipment 1, the preset direction is vertical, and the extension directions of the first rotating shaft 310 and the second rotating shaft 320 are both horizontal. Thus, by rotating the stage 200 around the axis of the first rotating shaft 310 and / or around the axis of the second rotating shaft 320, a leveling operation can be performed on the stage 200. The drive member 340 drives the stage 200 to rotate around the axes of the first rotating shaft 310 and / or the second rotating shaft 320, and the indicator mark 350 obtains the amount of rotation of the stage 200. This allows for quantitative rotation of the stage 200 during leveling operations on the sample stage 20, reducing reliance on operator experience and feel, shortening leveling time, reducing downtime of the semiconductor manufacturing equipment 1, and increasing the productivity of the semiconductor manufacturing equipment 1.

[0057] As previously stated, the adjustment mechanism 300 is located outside the process cavity 10. That is, both the locking member 330 and the driving member 340 are located outside the process cavity 10. This allows the leveling operation of the sample stage 20 to be performed without opening the process cavity 10. In other words, the leveling operation of the sample stage 20 can be performed as needed, without waiting for preventative maintenance of the semiconductor equipment 1, which helps improve the yield of products produced by the semiconductor manufacturing equipment 1. The specific process of the leveling operation of the sample stage 20 will be detailed later.

[0058] Optionally, the base 100 is provided with a first mounting hole 101 and a third mounting hole 102, the third mounting hole 102 being perpendicular to and intersecting the first mounting hole 101. The first rotating shaft 310 passes through the first mounting hole 101, and the first rotating shaft 320 is provided with a connecting hole 311, located at the junction of the first mounting hole 101 and the third mounting hole 102, and the connecting hole 311 communicating with the third mounting hole 102. A portion of the second rotating shaft 320 passes through the third mounting hole 102, and another portion passes through the connecting hole 311, so that the second rotating shaft 320 and the first rotating shaft 310 are connected at the intersection of the third mounting hole 102 and the first mounting hole 101. It should be understood that the diameter of the third mounting hole 102 should be larger than the outer diameter of the second rotating shaft 320 to avoid interfering with the rotation of the second rotating shaft 320 around the first rotating shaft 310.

[0059] It is understandable that during the leveling operation, the adjustment amount of the platform 200 is small, so the rotation angles of the first rotating shaft 310 and the second rotating shaft 320 are both small.

[0060] In some examples, the locking member 330 includes a first locking member 331 and a second locking member 332. The first locking member 331 selectively locks the first rotating shaft 310 to the base 100, and the second locking member 332 selectively locks the second rotating shaft 320 to the first rotating shaft 310.

[0061] In some examples, the base 100 is provided with a first locking threaded hole 103 and a clearance hole 104. The first locking threaded hole 103 communicates with the first mounting hole 101. The first rotating shaft 310 is provided with a second locking threaded hole 312, and the second threaded connection hole 312 communicates with the connection hole 311 and the clearance hole 104. The first locking member 331 and the second locking member 332 are, for example, screws. A portion of the first locking member 331 passes through the first locking threaded hole 103, and another portion extends into the first mounting hole 101. When the first locking member 331 is partially located within the first mounting hole 101 and presses against the first rotating shaft 310, the first locking member 331 locks the first rotating shaft 310 and the base 100. When the first locking member 331 moves away from the first rotating shaft 310 until it no longer presses against the first rotating shaft 310, the first locking member 331 releases the locking of the first rotating shaft 310 and the base 100. A portion of the second locking member 332 passes through the second threaded connection hole 312, and another portion extends into the connection hole 311. When the second locking member 332 is partially located within the connecting hole 311 and presses against the second rotating shaft 320, the second locking member 332 locks the second rotating shaft 320 and the first rotating shaft 310. When the second locking member 332 moves away from the second rotating shaft 320 until it no longer presses against the second rotating shaft 320, the second locking member 332 releases the locking of the second rotating shaft 320 and the first rotating shaft 310. It should be understood that the second locking member 332 may or may not pass through the clearance hole 104. When the second locking member 332 does not pass through the clearance hole 104, the size of the clearance hole 104 is such that the second locking member 332 can always be seen to the outside through the clearance hole 104. In this case, an internal hexagonal operating groove should be provided on the end face of the second locking member 332 away from the second rotating shaft 320 to facilitate the operator's control of the movement of the second locking member 332. When the second locking member 332 passes through the clearance hole 104, the size of the clearance hole 104 is such that it does not interfere with the rotation of the second rotating shaft 320 around the axis of the first rotating shaft 310.

[0062] In some examples, the drive member 340 includes a first drive member 341 and a second drive member 342. The first drive member 341 is connected to the first rotating shaft 310 and is configured to move under the drive of an external force when the first rotating shaft 310 is in a non-locked state with respect to the base 100 and the second rotating shaft 320 is in a locked state with respect to the first rotating shaft 310, thereby causing the first rotating shaft 310 to rotate relative to the base 100. The second drive member 342 is connected to the second rotating shaft 320 and is configured to move under the drive of an external force when the second rotating shaft 320 is in a non-locked state with respect to the first rotating shaft 310, thereby causing the second rotating shaft 320 to rotate relative to the first rotating shaft 310.

[0063] Accordingly, the indicator mark 350 includes a first indicator mark 351 and a second indicator mark 352. The first indicator mark 351 is disposed on the first drive member 341 and is used to indicate the amount of movement of the first drive member 341, thereby indicating the amount of rotation of the first rotating shaft 310. The second indicator mark 352 is disposed on the second drive member 342 and is used to indicate the amount of movement of the second drive member 342, thereby indicating the amount of rotation of the second rotating shaft 320.

[0064] Thus, the first preset quantitative relationship is the relationship between the rotation amount of the first rotating shaft 310 and the motion amount of the first driving member 341. The second preset quantitative relationship is the relationship between the rotation amount of the second rotating shaft 320 and the motion amount of the second driving member 342. That is, the rotation amount of the first rotating shaft 310 can be obtained through the motion amount of the first driving member 341 and the first preset quantitative relationship, thereby obtaining the rotation amount of the platform 200 rotating around the axis of the first rotating shaft 310. Similarly, the rotation amount of the second rotating shaft 320 can be obtained through the motion amount of the second driving member 342 and the second preset quantitative relationship, thereby obtaining the rotation amount of the platform 200 rotating around the axis of the second rotating shaft 320.

[0065] In some examples, the first drive member 341 includes a first swing arm 3411, a first lead screw 3412, and a first nut 3413. The first swing arm 3411 is connected at an angle to the first rotating shaft 310. The first lead screw 3412 is connected at an angle to the first swing arm 3411, and the first lead screw 3412 is arranged out of plane with the first rotating shaft 310. The first nut 3413 is sleeved on the first lead screw 3412, forming a first lead screw-nut pair with the first lead screw 3412, and the first nut 3413 is also connected to the base 100. Thus, when the first rotating shaft 310 and the base 200 are in an unlocked state, when the operator rotates the first nut 3413, the first lead screw 3412 and the first nut 3413 perform helical transmission, so that the first lead screw 3412 moves along its own axial direction, thereby driving the connection point between the first swing arm 3411 and the first lead screw 3412 to move along the axial direction of the first lead screw 3412, thereby driving the first rotating shaft 310 to rotate around its own axis.

[0066] Preferably, the axis of the first swing arm 3411 is perpendicular to and intersects the axis of the first rotating shaft 310, the axis of the first lead screw 3412 is perpendicular to and intersects the axis of the first swing arm 3411, and the axis of the first lead screw 3412 is perpendicular to the axis of the first rotating shaft 310.

[0067] The first indicator mark 351 includes a first scale, which is disposed on the first lead screw 3412 and extends along the axial direction of the first lead screw 3412. The scale on the first scale indicates the relative position of the first nut 3413 and the first lead screw 3412. Thus, by determining the scale corresponding to the rotation of the first nut 3413 before and after rotation, the distance the first lead screw 3412 moves along its own axial direction and the rotation angle of the first nut 3413 can be obtained. Therefore, the amount of movement of the first drive member 341 includes either the distance the first lead screw 3412 moves along its own axial direction or the rotation angle of the first nut 3413.

[0068] It is understood that if the movement of the first driving member 341 is the distance the first lead screw 3412 moves along its own axial direction, then the first preset quantitative relationship can be obtained based on the relative positions of the first rotating shaft 310, the first swing arm 3411, and the first lead screw 3412. If the movement of the first driving member 341 is the rotation angle of the first nut 3413, then the first preset quantitative relationship can be obtained based on the relative positions of the first rotating shaft 310, the first swing arm 3411, and the first lead screw 3412, as well as the thread parameters on the first lead screw 3412.

[0069] It should be understood that the first nut 3413 is located outside the base 100 to facilitate operator control of its rotation. Optionally, the first swing arm 3411 shown is located inside the base 100. Thus, the base 100 is further provided with a first clearance groove 105, which communicates with the first mounting hole 101 and is used to accommodate the first swing arm 3411. It can be understood that the first clearance groove 105 provides space for the movement of the first swing arm 3411; it can be a sector centered on the axis of the first mounting hole 101, although the center of the sector can also be offset from the axis of the first mounting hole 101. Furthermore, the base 100 is also provided with a second mounting hole 106, one end of the first lead screw 3412 is connected to the first swing arm 3411, and the other end, after passing through the second mounting hole 106, engages with the first nut 3413.

[0070] The structure of the second driving member 342 can be the same as that of the first driving member 341. That is, the second driving member 342 includes a second swing arm 3421, a second lead screw 3422, and a second nut 3423. The second swing arm 3421 is connected to the second rotating shaft 320 at an angle. The second lead screw 3422 is connected to the second swing arm 3421 at an angle, and the second lead screw 3422 is arranged in a non-planar manner with the second rotating shaft 320. The second nut 3423 is sleeved on the second lead screw 3422 and forms a second lead screw nut pair with the second lead screw 3422. The second nut 3423 is also connected to the base 100. Thus, when the second rotating shaft 320 and the first rotating shaft 310 are in an unlocked state, when the operator rotates the second nut 3423, the second lead screw 3422 and the second nut 3423 undergo helical transmission, causing the second lead screw 3422 to move along its own axial direction. This, in turn, causes the connection point between the second swing arm 351 and the second lead screw 3422 to move along the axial direction of the second lead screw 3422, thereby causing the second rotating shaft 320 to rotate around its own axis. The method for obtaining the second preset quantitative relationship can refer to the method for obtaining the first preset quantitative relationship.

[0071] Preferably, the axis of the second swing arm 3421 is perpendicular to and intersects the axis of the second rotating shaft 320, the axis of the second lead screw 3422 is perpendicular to and intersects the axis of the second swing arm 3421, and the axis of the second lead screw 3422 is perpendicular to the axis of the second rotating shaft 320.

[0072] The second nut 3423 is located outside the base 100 to facilitate operator control of its rotation. Optionally, the second swing arm 3421 shown is located inside the base 100, and the base 100 is also provided with a second clearance groove (not shown in the figure) and a fourth mounting hole 107. The second clearance groove and the fourth mounting hole 107 are both connected to the third mounting hole 102. The second clearance groove is used to accommodate the second swing arm 3421 and provide space for the movement of the second swing arm 3421. In practice, the second clearance groove can be a sector centered on the axis of the third mounting hole 102. Of course, the center of the sector can also be offset from the axis of the third mounting hole 102. One end of the second lead screw 3422 is connected to the second swing arm 3421, and the other end, after passing through the fourth mounting hole 107, engages with the second nut 3423.

[0073] The second indicator mark 352 includes a second scale, which is disposed on the second lead screw 3413 and extends along the axial direction of the second lead screw 3422.

[0074] In other examples, the first lead screw and nut assembly can be replaced by a first push-pull rod, and the second lead screw and nut assembly can be replaced by a second push-pull rod. The adjusting mechanism also includes a first clamping sleeve, a first clamping member, a second clamping sleeve, and a second clamping member. The first push-pull rod is angled to the first swing arm and partially passes through the first clamping sleeve, which is fixedly connected to the base. The first clamping member selectively applies a radially inward clamping force to the first clamping sleeve. When the first clamping member applies a clamping force to the first clamping sleeve, the first clamping sleeve holds the first push-pull rod so that the first push-pull rod and the first clamping sleeve remain relatively stationary. When the first clamping member stops applying the clamping force to the first clamping sleeve, the first clamping sleeve releases the first push-pull rod, allowing the operator to drive the first push-pull rod axially relative to the first clamping sleeve, thereby driving the first swing arm to move and causing the first rotating shaft to rotate. The second push-pull rod is connected at an angle to the second swing arm and also partially passes through the second clamp, which is fixedly connected to the base. The second clamping member selectively applies a radially inward clamping force to the second clamp. When the second clamping member applies a clamping force to the second clamp, the second clamp holds the second push-pull rod so that the second push-pull rod and the second clamp remain relatively stationary. When the second clamping member stops applying a clamping force to the second clamp, the second clamp releases the second push-pull rod, allowing the operator to drive the second push-pull rod to move axially relative to the second clamp, thereby driving the second swing arm to move and causing the second rotating shaft to rotate. In this case, the first scale is set on the first push-pull rod and extends axially along the first push-pull rod, and the second scale is set on the second push-pull rod and extends axially along the second push-pull rod (not shown in the figure).

[0075] The leveling operation of the sample stage 20 used in the semiconductor manufacturing equipment 1 will be described next.

[0076] The first scenario involves leveling the sample stage 20 while the process chamber 10 is open. The specific process includes the following steps: S1, S2, S3, S4, and S5.

[0077] Step S1 includes: opening the process cavity 10 and removing the process kit.

[0078] Step S2 includes: placing the calibrated level assembly inside the process cavity 10, such that two of the four levels on the level assembly are arranged along the extension direction of the first rotating shaft 310, and the other two are arranged along the extension direction of the second rotating shaft 320.

[0079] Step S3 includes: using the position switching mechanism 30 to drive the sample stage 20 to move in the vertical direction, so as to raise the sample stage 20 to the process position.

[0080] Step S4 includes steps S41 and / or S42. Step S41 includes releasing the first locking member 331 from locking the first rotating shaft 310 and the base 100, and keeping the second locking member 332 locked to the second rotating shaft 320 and the first rotating shaft 310, and driving the first rotating shaft 310 to rotate via the first driving member 341. Step S42 includes releasing the second locking member 332 from locking the second rotating shaft 320 and the first rotating shaft 310, and driving the second rotating shaft 320 to rotate via the second driving member 342. Step S41 can be executed multiple times, and step S42 can be executed multiple times, and the number of times and the order of execution of steps S41 and S42 can be determined as needed. Furthermore, during step S41, the operator determines the amount of movement of the first drive member 341 based on the readings of each of the levels. During step S42, the operator determines the amount of movement of the second drive member 342 based on the readings of each of the levels, until the deviation of the readings of each level is within 0.02. Additionally, during step S42, it is preferable to keep the first locking member 331 locked to the first rotating shaft 310 and the base 100 to prevent the first rotating shaft 310 from moving under frictional force.

[0081] If the first rotating shaft 310 and the base 100 are locked together after step S4 is completed, then step S5 includes locking the second rotating shaft 320 and the first rotating shaft 320 together using the second locking member 332; if the second rotating shaft 320 and the first rotating shaft 310 are locked together after step S4 is completed, then step S5 includes locking the first rotating shaft 310 and the base 100 together using the first locking member 331. That is, after step S5 is completed, the first rotating shaft 310 and the base 100, and the second rotating shaft 320 and the first rotating shaft 310 are respectively locked together.

[0082] The second scenario: Leveling the sample stage 20 without opening the process chamber 10. The specific process may include the following steps: S10, S20, S30, S40, and S50.

[0083] Step S10 includes obtaining the required rotation direction of the first rotating shaft 310 as the first target direction and the required rotation angle as the first target value based on the product data, and obtaining the required rotation direction of the second rotating shaft 320 as the second target direction and the required rotation angle as the second target value.

[0084] Step S20 includes using the position switching mechanism 30 to drive the sample stage 20 to move vertically, so as to raise the sample stage 20 to the process position.

[0085] Step S30 includes steps S310 and / or S320. Step S310 includes releasing the first locking member 331 from locking the first rotating shaft 310 and the base 100, while keeping the second locking member 332 locked to the second rotating shaft 320 and the first rotating shaft 310. The first driving member 341 then drives the first rotating shaft 310 to rotate along the first target direction until the rotation angle of the first rotating shaft 310 is the first target value. Step S320 includes releasing the second locking member 332 from locking the second rotating shaft 320 and the first rotating shaft 310, and the second driving member 342 then drives the second rotating shaft 320 to rotate along the second target direction until the rotation angle of the second rotating shaft 320 is the second target value. The execution order of steps S310 and S320 is determined as needed. In addition, when performing step S320, it is preferable to keep the first locking member 331 locked to the first rotating shaft 310 and the base 100 to prevent the first rotating shaft 310 from rotating under the action of friction.

[0086] If the first rotating shaft 310 and the base 100 are locked together when step S30 is completed, then step S40 includes locking the second rotating shaft 320 and the first rotating shaft 310 together with the second locking member 332. If the second rotating shaft 320 and the first rotating shaft 310 are locked together when step S30 is completed, then step S40 includes locking the first rotating shaft 310 and the base 100 together with the first locking member 331.

[0087] Step S50 includes using the semiconductor manufacturing equipment 1 to carry out production and determining whether the sample stage 20 is leveled according to the product parameters.

[0088] When the semiconductor manufacturing equipment 1 is a deposition equipment, the portion of the stage 200 located within the process cavity 10 is used to support the substrate, allowing the substrate to form a thin film within the process cavity through deposition. The product parameter refers to the thickness of the thin film formed on the substrate. That is, in step S10, the tilt degree of the stage 200 can be determined based on the thickness of the thin film at different locations, thereby obtaining the required adjustment direction and adjustment amount for the stage 200, and thus obtaining the first target direction, the first target value, the second target direction, and the second target value. In step S50, if the thickness of the thin film at different locations is comparable, it indicates that the leveling effect of the sample stage 20 is good; if the thickness difference at different locations is still large, it indicates that readjustment is required. The substrate is, for example, a wafer. Step S20 is not a mandatory operation and can be omitted.

[0089] Although the above description uses the application of the sample stage 20 to a deposition equipment as an example, in practice, the sample stage 20 can also be applied to other equipment.

[0090] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A sample stage, characterized in that, include: Base; Platform; The adjustment mechanism includes a first rotating shaft, a second rotating shaft, a locking element, and a driving element; the first rotating shaft is connected to the base, the second rotating shaft is perpendicular to and connected to the first rotating shaft, and the second rotating shaft is also connected to the platform; the locking element selectively locks the first rotating shaft to the base and selectively locks the second rotating shaft to the first rotating shaft; the driving element is connected to both the first rotating shaft and the second rotating shaft. The drive component is configured to: partially move under the drive of an external force when the first rotating shaft is not locked to the base and the second rotating shaft is locked to the first rotating shaft, thereby driving the first rotating shaft to rotate relative to the base and causing the platform to rotate around the axis of the first rotating shaft; and partially move under the drive of an external force when the second rotating shaft is not locked to the first rotating shaft, thereby driving the second rotating shaft to rotate relative to the first rotating shaft and causing the platform to rotate around the axis of the second rotating shaft. The drive component is provided with indicator marks for indicating the amount of movement of the drive component and the amount of rotation of the platform.

2. The sample stage according to claim 1, characterized in that, The indicator mark includes a first indicator mark and a second indicator mark; The driving component includes a first driving component and a second driving component; The first drive member is connected to the first rotating shaft and is configured to move under the drive of an external force when the first rotating shaft is not locked to the base and the second rotating shaft is locked to the first rotating shaft, thereby driving the first rotating shaft to rotate relative to the base and causing the platform to rotate around the axis of the first rotating shaft; the first drive member is provided with the first indicator mark to indicate the amount of movement of the first drive member and the amount of rotation of the platform when it rotates around the axis of the first rotating shaft; The second drive member is connected to the second rotating shaft and is configured to move under the drive of an external force when the second rotating shaft and the first rotating shaft are in an unlocked state, thereby driving the second rotating shaft to rotate relative to the first rotating shaft and causing the platform to rotate around the axis of the second rotating shaft; the second drive member is provided with a second indicator mark to indicate the amount of movement of the second drive member and the amount of rotation of the platform when it rotates around the axis of the second rotating shaft.

3. The sample stage according to claim 2, characterized in that, The first driving component includes a first swing arm and a first lead screw and nut assembly; the first swing arm is connected at an angle to the first rotating shaft; the first lead screw and nut assembly includes a first lead screw and a first nut; the first lead screw is connected at an angle to the first swing arm, and the first lead screw is also out of plane with the first rotating shaft; the first nut is disposed on the base and is capable of rotating relative to the base under the drive of an external force when the first rotating shaft and the base are in an unlocked state; The first indicator mark includes a scale that is disposed on the first lead screw and extends along the axial direction of the first lead screw.

4. The sample stage according to claim 3, characterized in that, The base is provided with a first mounting hole, a first clearance groove and a second mounting hole connected in sequence. The first rotating shaft passes through the first mounting hole, the first swing arm is disposed in the first clearance groove, and the first lead screw partially passes through the second mounting hole.

5. The sample stage according to claim 3, characterized in that, The second driving component includes a second swing arm and a second lead screw and nut assembly; the second swing arm is connected to the second rotating shaft at an angle; the second lead screw and nut assembly includes a second lead screw and a second nut; the second lead screw is connected to the second swing arm at an angle, and the second lead screw is also out of plane with the second rotating shaft; the second nut is disposed on the base, and the second nut can also rotate relative to the base under the drive of an external force when the second rotating shaft and the first rotating shaft are in an unlocked state; The second indicator includes a scale that is disposed on the second lead screw and extends along the axial direction of the second lead screw.

6. The sample stage according to claim 5, characterized in that, The base is also provided with a third mounting hole, a second clearance groove and a fourth mounting hole connected in sequence; The second rotating shaft is partially inserted into the third mounting hole; the second swing arm is disposed in the second clearance groove; and the second lead screw is partially inserted into the fourth mounting hole.

7. The sample stage according to claim 1, characterized in that, The locking mechanism includes a first locking mechanism and a second locking mechanism; the first locking mechanism selectively locks the first rotating shaft to the base; the second locking mechanism selectively locks the second rotating shaft to the first rotating shaft.

8. A semiconductor manufacturing apparatus, characterized in that, It includes a process chamber and a sample stage as described in any one of claims 1-7; the stage body is at least partially located within the process chamber; the adjustment mechanism is located outside the process chamber, and both the first rotating shaft and the second rotating shaft are arranged horizontally.

9. The semiconductor manufacturing equipment according to claim 8, characterized in that, It also includes a position switching mechanism connected to the base and configured to drive the sample stage to move relative to the process cavity in a preset direction; the preset direction is perpendicular to the first rotating shaft and the second rotating shaft.

10. The semiconductor manufacturing equipment according to claim 8 or 9, characterized in that, The semiconductor manufacturing equipment includes deposition equipment.

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