Vacuum motor casing with efficient heat dissipation

Abstract

The utility model discloses a vacuum motor casing with efficient heat dissipation, which relates to the technical field of motor assembly and comprises a base, an outer casing is fixedly mounted above the base, an inner casing is arranged on the inner side of the outer casing, the heat conductivity of the outer casing is lower than that of the inner casing, and a clamping block is fixedly mounted on the outer side of the inner casing. A clamping groove is formed in the inner side of the outer machine shell, a heat dissipation pipe and a clamping block are arranged in the clamping groove respectively, the inner machine shell and the outer machine shell are detachably connected, a heat dissipation base is fixedly installed at the bottom of the outer machine shell, a condensing agent is filled in the heat dissipation base, and the heat dissipation pipe is communicated with the heat dissipation base. The temperature of the outer shell is not too high, the larger the working load of the motor is, the higher the heat dissipation efficiency is, and the purpose of efficient heat dissipation is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of motor assembly, and specifically relates to a vacuum motor housing with high-efficiency heat dissipation. Background Technology

[0002] As the name suggests, a vacuum motor is a motor that can be used in a vacuum environment. A vacuum environment is usually a thin air environment (there is generally no absolute vacuum environment). In this environment, there is no heat convection, only heat conduction and radiation.

[0003] Therefore, existing vacuum motors have low heat dissipation efficiency. They are usually made of metal materials with high thermal conductivity to make the outer shell. As a result, the outer shell of the vacuum motor gets very hot during use. This can damage other components and cause burns if the user touches it accidentally.

[0004] Therefore, a vacuum motor housing with high heat dissipation efficiency is needed. Utility Model Content

[0005] This invention provides a vacuum motor housing with high-efficiency heat dissipation to solve the technical problems mentioned in the background.

[0006] To solve the above-mentioned technical problems, this utility model provides a high-efficiency heat dissipation vacuum motor housing, including a base, an outer housing fixedly installed on the top of the base, an inner housing provided inside the outer housing, the thermal conductivity of the outer housing being lower than that of the inner housing, a locking block fixedly installed on the outer side of the inner housing, a locking groove opened on the inner side of the outer housing, a heat dissipation pipe and a locking block respectively provided in the locking groove, the inner housing and the outer housing being detachably connected, a heat dissipation seat fixedly installed at the bottom of the outer housing, the heat dissipation seat being filled with condensate, and the heat dissipation pipe communicating with the heat dissipation seat.

[0007] Preferably, there are multiple heat dissipation pipes arranged in an array, and each heat dissipation pipe is connected to a heat sink.

[0008] Preferably, there are multiple card slots arranged in an array, and multiple card blocks are provided. The sum of the number of heat dissipation pipes and card blocks is the same as the number of card slots, and the heat dissipation pipes and card blocks are arranged alternately.

[0009] Preferably, the card block engages with the card slot, that is, the card block and the card slot are in a transitional fit.

[0010] Preferably, the heat dissipation component includes a cooling semiconductor. The top of the heat sink has an annular groove, in which the cooling semiconductor is fixedly installed. The cooling semiconductor is electrically connected to an external power supply, and the cooling end of the cooling semiconductor is connected to the interior of the heat sink. The top of the annular groove has a square groove, in which a fan is fixedly installed. The fan is electrically connected to an external power supply, and the fan corresponds to the heating end of the cooling semiconductor.

[0011] Preferably, the heat sink is provided with a rotating shaft that passes through the heat sink. A bearing is fixedly installed at the bottom of the inner casing, and the rotating shaft is fixedly connected to the inner wall of the bearing. A spiral blade is fixedly installed at the top of the rotating shaft. Multiple spiral blades are provided and arranged in an array.

[0012] This invention has the following advantages over the prior art:

[0013] This utility model discloses a high-efficiency heat dissipation vacuum motor housing. By setting an embedded structure of an outer housing and an inner housing, and with the thermal conductivity of the outer housing being lower than that of the inner housing, the temperature of the outer housing will not be too high during operation, while the inner housing dissipates heat.

[0014] This invention relates to a high-efficiency heat dissipation vacuum motor housing. By setting up a heat dissipation component and activating a cooling semiconductor, the cooling semiconductor can exchange heat with the condenser, thereby achieving heat dissipation of the inner housing.

[0015] This utility model discloses a high-efficiency heat dissipation vacuum motor housing. By setting a rotating shaft, which is fixedly connected to the motor rotor, the motor operation will drive the rotating shaft to rotate, and the rotating shaft will drive the spiral blade to rotate. The spiral blade accelerates the interaction of refrigerant between the heat dissipation pipe and the heat dissipation base. Therefore, the greater the working load of the motor, the higher its heat dissipation efficiency, thus achieving the purpose of high-efficiency heat dissipation. Attached Figure Description

[0016] Figure 1 This is a structural diagram of a vacuum motor housing with high-efficiency heat dissipation according to the present invention;

[0017] Figure 2 This is an assembly structure diagram of a vacuum motor housing with high-efficiency heat dissipation according to the present invention;

[0018] Figure 3 This is a structural diagram of a heat sink in the housing of a vacuum motor with high-efficiency heat dissipation according to the present invention;

[0019] Figure 4 This is a diagram showing the internal structure of a heat sink in the housing of a high-efficiency heat dissipation vacuum motor according to the present invention.

[0020] The following are the labels in the diagram: 1. Base; 2. Outer casing; 3. Heat sink; 4. Inner casing; 5. Slot; 6. Heat pipe; 7. Block; 8. Bearing; 9. Heat dissipation assembly; 10. Annular groove; 11. Fan; 12. Square groove; 13. Refrigeration semiconductor; 14. Shaft; 15. Spiral blade. Detailed Implementation

[0021] Please see Figure 1-4 This utility model provides a technical solution: a high-efficiency heat dissipation vacuum motor housing, including a base 1, an outer housing 2 fixedly installed on the top of the base 1, an inner housing 4 provided inside the outer housing 2, the thermal conductivity of the outer housing 2 being lower than that of the inner housing 4, a locking block 7 fixedly installed on the outside of the inner housing 4, a slot 5 opened on the inside of the outer housing 2, a heat dissipation pipe 6 and the locking block 7 respectively provided in the slot 5, the inner housing 4 and the outer housing 2 being detachably connected, a heat dissipation seat 3 fixedly installed at the bottom of the outer housing 2, the heat dissipation seat 3 being filled with condensate, and the heat dissipation pipe 6 communicating with the heat dissipation seat 3.

[0022] Furthermore, there are multiple heat dissipation pipes 6 arranged in an array, and all heat dissipation pipes 6 are connected to the heat dissipation base 3.

[0023] Furthermore, there are multiple card slots 5 arranged in an array, and multiple card blocks 7 are provided. The sum of the number of heat dissipation pipes 6 and card blocks 7 is the same as the number of card slots 5, and the heat dissipation pipes 6 and card blocks 7 are arranged alternately.

[0024] Furthermore, the card block 7 engages with the card slot 5, that is, the card block 7 and the card slot 5 are in transitional fit.

[0025] Furthermore, the heat dissipation component 9 includes a cooling semiconductor 13. An annular groove 10 is formed on the top of the heat sink 3. The cooling semiconductor 13 is fixedly installed in the annular groove 10. The cooling semiconductor 13 is electrically connected to an external power supply. The cooling end of the cooling semiconductor 13 is connected to the interior of the heat sink 3. A square groove 12 is formed on the top of the annular groove 10. A fan 11 is fixedly installed in the square groove 12. The fan 11 is electrically connected to an external power supply, and the fan 11 corresponds to the heating end of the cooling semiconductor 13.

[0026] Furthermore, a rotating shaft 14 is provided inside the heat sink 3, the rotating shaft 14 passes through the heat sink 3, a bearing 8 is fixedly installed at the bottom of the inner casing 4, and the rotating shaft 14 is fixedly connected to the inner wall of the bearing 8. A spiral blade 15 is fixedly installed at the top of the rotating shaft 14, and multiple spiral blades 15 are provided, and multiple spiral blades 15 are arranged in an array.

[0027] Working principle:

[0028] By setting an embedded structure for the outer casing 2 and the inner casing 4, and with the outer casing 2 having a lower thermal conductivity than the inner casing 4, the temperature of the outer casing 2 will not be too high during operation while the inner casing 4 dissipates heat. By setting a heat dissipation component 9, the cooling semiconductor 13 is activated, and the cooling end of the cooling semiconductor 13 can exchange heat with the refrigerant. The fan 11 is activated, and the fan 11 dissipates heat from the heating end of the cooling semiconductor 13, thereby achieving heat dissipation of the inner casing 4. By setting a rotating shaft 14, which is fixedly connected to the motor rotor, the operation of the motor will drive the rotating shaft 14 to rotate, and the rotating shaft 14 will drive the spiral blade 15 to rotate. The spiral blade 15 accelerates the refrigerant interaction between the heat dissipation pipe 6 and the heat dissipation base 3. Therefore, the greater the motor's workload, the higher its heat dissipation efficiency, achieving the purpose of high-efficiency heat dissipation.

Claims

1. A vacuum motor housing with high-efficiency heat dissipation, comprising a base (1), characterized in that: The outer casing (2) is fixedly installed on the base (1). The inner casing (4) is provided inside the outer casing (2). The thermal conductivity of the outer casing (2) is lower than that of the inner casing (4). The outer casing (4) is fixedly installed with a clip (7). The inner casing (2) is provided with a slot (5). The slot (5) is provided with a heat dissipation pipe (6) and a clip (7). The inner casing (4) and the outer casing (2) are detachably connected. The bottom of the outer casing (2) is fixedly installed with a heat dissipation seat (3). The heat dissipation seat (3) is filled with a condenser. The heat dissipation pipe (6) is connected to the heat dissipation seat (3).

2. The high-efficiency heat dissipation vacuum motor housing according to claim 1, characterized in that, The heat dissipation pipe (6) is provided in multiple ways, and the multiple heat dissipation pipes (6) are arranged in an array, and the heat dissipation pipes (6) are all connected to the heat dissipation base (3).

3. The high-efficiency heat dissipation vacuum motor housing according to claim 1, characterized in that, The card slots (5) are provided in multiple arrays, and the card blocks (7) are provided in multiple arrays. The sum of the number of heat dissipation pipes (6) and card blocks (7) is the same as the number of card slots (5). The heat dissipation pipes (6) and card blocks (7) are arranged alternately.

4. The high-efficiency heat dissipation vacuum motor housing according to claim 1, characterized in that, The card block (7) engages with the card slot (5), that is, the card block (7) and the card slot (5) are in transitional fit.

5. The high-efficiency heat dissipation vacuum motor housing according to claim 1, characterized in that, The heat dissipation assembly (9) includes a cooling semiconductor (13). The top of the heat sink (3) is provided with an annular groove (10). The cooling semiconductor (13) is fixedly installed in the annular groove (10). The cooling semiconductor (13) is electrically connected to an external power supply. The cooling end of the cooling semiconductor (13) is connected to the interior of the heat sink (3). The top of the annular groove (10) is provided with a square groove (12). The fan (11) is fixedly installed in the square groove (12). The fan (11) is electrically connected to an external power supply, and the fan (11) corresponds to the heating end of the cooling semiconductor (13).

6. The high-efficiency heat dissipation vacuum motor housing according to claim 1, characterized in that, The heat sink (3) is provided with a rotating shaft (14), which passes through the heat sink (3). The bottom of the inner casing (4) is fixedly installed with a bearing (8), and the rotating shaft (14) is fixedly connected to the inner wall of the bearing (8). The top of the rotating shaft (14) is fixedly installed with a spiral blade (15). There are multiple spiral blades (15), and multiple spiral blades (15) are arranged in an array.

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