Film coating equipment for semiconductor processing

Abstract

The utility model provides coating equipment for semiconductor processing, which relates to the technical field of semiconductor processing and comprises an operating table, an electric slide rail is arranged at the center of the surface of the operating table, the front surface of the operating table is connected with a coating box, the rear surface of the operating table is connected with a drying component, and the drying component comprises a drying box. The top of the drying box is connected with two hot air blowers, the surfaces of the two hot air blowers are connected with a frame, insertion openings are formed in the inner walls of the two sides of the frame, a filter screen is arranged in the frame, groove holes are formed in the two sides of the filter screen, springs are arranged in the groove holes, and one side of each spring is connected with a push plate. According to the utility model, after a semiconductor workpiece is coated, the workpiece can be dried, and dust can be prevented from being sucked into the drying box by the hot-air blower through the filter screen while the workpiece is dried, so that the binding force and the adhesive force between a coating layer and the workpiece are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, especially relates to a film plating equipment for semiconductor processing. BACKGROUND

[0002] Semiconductor processing refers to the process required for manufacturing electronic devices using semiconductor materials. These processes include wafer preparation, photolithography, etching, deposition, and other links, each of which requires high-precision machinery, optics, and electronic technology, as well as advanced automation and intelligent control systems.

[0003] As the publication number: CN221387082U, a kind of film plating equipment for semiconductor production, including processing box, film spraying equipment and sealing glass window, sealing glass window is rotatably installed in the side of processing box, further including working assembly;Working assembly includes moving frame, adjusting frame, mounting frame, drive member, lifting member and clamping member;Moving frame is slidably connected with processing box, adjusting frame is slidably connected with moving frame, mounting frame is connected with film spraying equipment, drive member is connected with processing box, lifting member is connected with mounting frame, clamping member is connected with processing box, realized the corresponding height and its position adjustment of the position of spray gun spray according to the actual semiconductor workpiece size by being provided with component, so that the plated film of semiconductor surface spraying is more uniform.

[0004] The existing patent adjusts the corresponding height and its position of the position of spray gun spray according to the actual semiconductor workpiece size by being provided with component, but the existing film plating equipment cannot dry the semiconductor after plating after plating, which will weaken the bonding force between the plating layer and the substrate, affect the adhesion and durability of plating, therefore, we propose a new type of film plating equipment for semiconductor processing. UTILITY MODEL CONTENT

[0005] The utility model mainly provides a kind of film plating equipment for improving the bonding force between plating layer and substrate.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of film plating equipment for semiconductor processing, including operation platform, the surface center position of the operation platform is provided with electric slide rail, the front surface of the operation platform is connected with film plating box, the rear surface of the operation platform is connected with drying assembly, the drying assembly includes drying box, the top of the drying box is connected with two groups of air heaters, the surface of two groups of air heaters is connected with frame, the both sides inner walls of the frame are all provided with socket, the inside of the frame is provided with filter screen, the both sides inside of the filter screen is all provided with slot hole, the inside of the slot hole is provided with spring, one side of the spring is connected with push plate, one side of the push plate is connected with plug block, the front surface of the push plate is connected with push block.

[0007] Compared with the prior art, the semiconductor processing plating equipment has the advantages and positive effects that

[0008] 1、The semiconductor processing plating equipment has the advantages and positive effects that after the semiconductor workpiece is plated, the workpiece can be dried, dust can be prevented from being sucked into the drying box by the air heater through the filter screen, and the bonding force and the adhesion between the plating layer and the workpiece are improved.

[0009] 2、The semiconductor processing plating equipment has the advantages and positive effects that the workpiece on the tray surface can be rotated by the motor during plating, and the uniformity and the plating quality of plating are significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 The semiconductor processing plating equipment has the advantages and positive effects that a three-dimensional structure schematic diagram of the semiconductor processing plating equipment is provided.

[0011] Figure 2 The semiconductor processing plating equipment has the advantages and positive effects that an explosion structure schematic diagram of the drying box of the semiconductor processing plating equipment is provided.

[0012] Figure 3 The semiconductor processing plating equipment has the advantages and positive effects that a filter screen partial section structure schematic diagram of the semiconductor processing plating equipment is provided.

[0013] Figure 4 The semiconductor processing plating equipment has the advantages and positive effects that an explosion structure schematic diagram of the moving frame of the semiconductor processing plating equipment is provided.

[0014] Figure 5 The semiconductor processing plating equipment has the advantages and positive effects that a moving frame section structure schematic diagram of the semiconductor processing plating equipment is provided.

[0015] Figure 6 The semiconductor processing plating equipment has the advantages and positive effects that a plating box section structure schematic diagram of the semiconductor processing plating equipment is provided.

[0016] Legend: 1, operation table; 2, electric sliding rail; 3, plating box; 4, drying assembly; 401, drying box; 402, air heater; 403, frame; 404, socket; 405, filter screen; 406, slot hole; 407, spring; 408, push plate; 409, push block; 410, plug block; 5, rotating assembly; 501, moving frame; 502, motor; 503, plane bearing; 504, tray; 505, clamp. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned purpose, features and advantages of the semiconductor processing plating equipment clearer, the semiconductor processing plating equipment will be further described below in combination with the drawings and embodiments.

[0018] Please refer toFigures 1-3 The utility model provides a kind of technical scheme: a kind of plating equipment for semiconductor processing, including operation platform 1, the surface center position of operation platform 1 is provided with electric slide rail 2, the front surface of operation platform 1 is connected with plating box 3, the rear surface of operation platform 1 is connected with drying assembly 4, drying assembly 4 includes drying box 401, the top of drying box 401 is connected with two groups of air heaters 402, the surface of two groups of air heaters 402 is connected with frame 403, the two side inner walls of frame 403 are all provided with socket 404, the inside of frame 403 is provided with filter screen 405, the two side interiors of filter screen 405 are all provided with slot hole 406, the inside of slot hole 406 is provided with spring 407, one side of spring 407 is connected with push plate 408, one side of push plate 408 is connected with plug 410, the front surface of push plate 408 is connected with push block 409.

[0019] As shown in Figure 3 The position and size of socket 404 match those of plug 410, and plug 410 and socket 404 are connected by insertion, which can quickly fix filter screen 405.

[0020] As shown in Figure 2 And Figure 3 Plug 410 is provided with an inclined opening on its surface, and filter screen 405 and frame 403 are connected by sliding, which facilitates the installation of filter screen 405.

[0021] As shown in Figure 3 The two side inner walls of frame 403 are in close contact with the two side outer surfaces of filter screen 405, reducing the gap between frame 403 and filter screen 405.

[0022] As shown in Figure 5 Electric slide rail 2 is provided with rotating assembly 5 on its surface, and rotating assembly 5 includes moving frame 501, and motor 502 is arranged in moving frame 501, which can rotate the workpiece of semiconductor.

[0023] As shown in Figure 4 And Figure 5 Moving frame 501 is provided with plane bearing 503 on its surface, and tray 504 is connected to the top of plane bearing 503, and clamp 505 is connected to the surface of tray 504, which can improve the stability of tray 504 when rotating.

[0024] As shown in Figure 5 And Figure 6 Tray 504 and plane bearing 503 are connected by rotation, and the output end of motor 502 penetrates plane bearing 503 and is fixedly connected between the bottom of tray 504, and clamp 505 can clamp and fix the workpiece

[0025] The working principle and method of using the device: the workpiece of the semiconductor is conveyed to the coating box 3 through the electric sliding rail 2 for coating, and the workpiece after coating enters the drying box 401 again, and the hot air fan 402 is started to realize the drying of the workpiece surface coating, at the same time of drying, the external dust is filtered through the filter screen 405, when used for a long time, the dust adsorbed on the surface of the filter screen 405 is more, the two groups of push blocks 409 can be pushed to the inside at the same time, so that the push block 409 can drive the push plate 408 to extrude the spring 407, and drive the plug 410 to be pulled out from the socket 404, and the filter screen 405 can be taken out from the frame 403 for cleaning, after cleaning the filter screen 405, the filter screen 405 can be pushed into the frame 403, when the inclined position of the plug 410 is extruded, it will automatically shrink, when the filter screen 405 is completely pushed into the frame 403, the spring 407 will push the push plate 408 to drive the plug 410 to be inserted into the socket 404 for fixation, so as to complete the installation and fixation of the filter screen 405, so that the filter screen 405 can avoid the hot air fan 402 from sucking the dust into the drying box 401, improve the bonding force and adhesion between the coating layer and the workpiece, and the semiconductor workpiece can be clamped and fixed by using the clamp 505 after being placed on the tray 504, when coating in the coating box 3, the motor 502 can be started to drive the workpiece on the tray 504 to rotate, and the rotation during coating can significantly improve the uniformity and coating quality of the coating.

[0026] The above is only a preferred embodiment of the present application, and does not limit the present application in other forms, and any skilled person in the art can change or modify the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification of the above embodiments without departing from the technical scheme of the present application, according to the technical essence of the present application, still belongs to the protection scope of the technical scheme of the present application.

Claims

1. A coating apparatus for semiconductor processing, comprising an operating table (1), characterized in that: An electric slide rail (2) is provided at the center of the surface of the operating table (1), a coating box (3) is connected to the front surface of the operating table (1), and a drying assembly (4) is connected to the rear surface of the operating table (1). The drying assembly (4) includes a drying chamber (401), with two sets of hot air blowers (402) connected to the top of the drying chamber (401). A frame (403) is connected to the surface of the two sets of hot air blowers (402). An insertion port (404) is provided on both sides of the inner wall of the frame (403). A filter screen (405) is provided inside the frame (403). A slot (406) is provided on both sides of the filter screen (405). A spring (407) is provided inside the slot (406). A push plate (408) is connected to one side of the spring (407). An insertion block (410) is connected to one side of the push plate (408). A toggle block (409) is connected to the front surface of the push plate (408).

2. The semiconductor coating equipment according to claim 1, characterized in that: The position and size of the socket (404) match the position and size of the plug (410), and the plug (410) and the socket (404) form a mating connection.

3. The semiconductor coating equipment according to claim 2, characterized in that: The surface of the insert (410) is provided with a bevel, and the filter screen (405) and the frame (403) are connected in a sliding manner.

4. The semiconductor coating equipment according to claim 2, characterized in that: The inner walls on both sides of the frame (403) are in contact with the outer surfaces on both sides of the filter screen (405).

5. A coating apparatus for semiconductor processing according to claim 1, characterized in that: The surface of the electric slide rail (2) is provided with a rotating component (5), the rotating component (5) includes a moving frame (501), and a motor (502) is provided inside the moving frame (501).

6. A coating apparatus for semiconductor processing according to claim 5, characterized in that: The surface of the movable frame (501) is provided with a flat bearing (503), the top of the flat bearing (503) is connected to a tray (504), and the surface of the tray (504) is connected to a clamp (505).

7. A coating apparatus for semiconductor processing according to claim 6, characterized in that: The tray (504) and the plane bearing (503) are rotatably connected, and the output end of the motor (502) passes through the plane bearing (503) and is fixedly connected to the bottom of the tray (504).

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