Wafer appearance detection device

Abstract

The utility model discloses a wafer appearance detection device which comprises a bottom plate, a positioning plate, a height adjusting plate, a height adjusting platform, a clamp and a lens. Wherein the positioning plate is vertically arranged on the bottom plate, and the height adjusting plate is arranged on the side, opposite to the bottom plate, of the positioning plate. The height adjusting platform comprises a control module, a fixing seat and a sliding part, the fixing seat is attached and fixed to the side, back to the positioning plate, of the height adjusting plate, a sliding rail extending in the height direction protrudes out of the side, back to the height adjusting plate, of the fixing seat, and the sliding part is installed on the sliding rail. A clamp is fixed on the side, back to the fixing base, of the sliding piece and clamps and fixes the lens. The control module is located on one side of the fixing base and the sliding piece and used for controlling sliding of the sliding piece. According to the wafer appearance detection device, the wafer in the process equipment can be directly detected, the wafer does not need to be taken out from the process equipment, the tedious operation of taking out the wafer is reduced, and meanwhile the possibility that the wafer is damaged due to improper operation when the wafer is taken out is reduced.

Description

TECHNICAL FIELD

[0001] The present technology relates to the field of semiconductor detection, in particular to a wafer appearance detection device. BACKGROUND

[0002] The detection method of wafer appearance is generally taken out from each process equipment to a specific detection platform by the staff for detection. However, the detection from each process equipment will interrupt the detection sequence of the equipment, and when put into the process equipment again, secondary positioning is needed, so that the wafer is easily damaged when taken out from the process equipment, and the operation of taking out the wafer from the process equipment is relatively complicated and the time cost is high. CONTENT OF THE UTILITY MODEL

[0003] The present application aims to provide a wafer appearance detection device, which can detect the wafer without taking it out from the process equipment.

[0004] In order to achieve the above-mentioned purpose, the present application provides a wafer appearance detection device, which comprises a bottom plate, a positioning plate, a height adjusting plate, a height adjusting platform, a clamp and a lens; the positioning plate is vertically arranged on the bottom plate, and the height adjusting plate is arranged on the side of the positioning plate away from the bottom plate; the height adjusting platform comprises a control module, a fixed seat and a sliding piece, the fixed seat is fixedly attached to the side of the height adjusting plate away from the positioning plate, the side of the fixed seat away from the height adjusting plate protrudes a slide rail extending in the height direction, and the sliding piece is installed on the slide rail; the clamp is fixed to the side of the sliding piece away from the fixed seat, and the clamp clamps and fixes the lens; and the control module is located on one side of the fixed seat and the sliding piece, and is used for controlling the sliding of the sliding piece.

[0005] Optionally, the control module comprises a telescopic rod, a push block and a mounting bracket, the mounting bracket comprises a mounting block fixed to one side of the fixed seat, a protruding block is protruded from the side of the mounting block away from the positioning plate, an installation hole is formed in the protruding block along the sliding direction of the sliding piece, the installation hole is used for sleeving and fixing the telescopic rod, the push block is fixed to one side of the sliding piece, the output end of the telescopic rod faces the push block to push the push block, and the telescopic rod is in different telescopic lengths, so that the push block and the sliding piece are in different heights.

[0006] Optionally, a fastening hole is formed in the side wall of the installation hole and penetrates the protruding block and the mounting block outwardly, and the fastening hole is used for inserting a fastener from the side of the mounting block away from the protruding block into the installation hole to fasten the telescopic rod.

[0007] Optionally, the height adjusting platform further comprises a base plate and a positioning screw, the positioning screw passes through the base plate and is inserted into one side of the fixed seat and the sliding member, and the base plate, the fixed seat and the sliding member are fixedly attached.

[0008] Optionally, the height adjusting plate is provided with a plurality of long holes in the length direction of the height direction, the height adjusting plate is attached to the positioning plate and fixed on the positioning plate by using fasteners passing through the long holes.

[0009] Optionally, the clamp comprises an adapter block and a locking block, the adapter block comprises a mounting plate mounted on the side of the sliding member away from the fixed seat, the mounting plate extends out an extension on the side away from the sliding member, and the end of the extension is provided with a first clamping groove, the locking block is provided with a second clamping groove, and when the locking block and the adapter block are fixed together, the lens is clamped in the second clamping groove and the first clamping groove.

[0010] Optionally, the wafer appearance detection device further comprises an illumination device, and the illumination device is arranged at the bottom end of the lens.

[0011] Optionally, the illumination device comprises a ring-shaped light source and a light source fixing block, the light source fixing block is fixedly attached to the lower end of the lens, and the ring-shaped light source is coaxially and fixedly attached to the light source fixing block.

[0012] The wafer appearance detection device of the present application comprises a base plate, a positioning plate, a height adjusting plate, a height adjusting platform, a clamp and a lens; the positioning plate is vertically arranged on the base plate, and the height adjusting plate is arranged on the side of the positioning plate away from the base plate; the height adjusting platform comprises a control module, a fixed seat and a sliding member, the fixed seat is fixedly attached to the side of the height adjusting plate away from the positioning plate, the side of the fixed seat away from the height adjusting plate protrudes out a sliding rail extending in the height direction, and the sliding member is mounted on the sliding rail; the clamp is fixed to the side of the sliding member away from the fixed seat, and the clamp clamps and fixes the lens; and the control module is arranged on one side of the fixed seat and the sliding member and used for controlling the sliding of the sliding member. In use, the lens of the wafer appearance detection device is directed towards a wafer in a process equipment, the approximate position of the lens is adjusted by adjusting the height adjusting plate, the position of the lens is finely adjusted by adjusting the position of the sliding member by using the control module, and the position of the lens relative to the wafer is determined after repeatedly adjusting the position of the lens until the wafer observed by the lens becomes clear, so that the appearance of the wafer can be detected by using the device without taking out the wafer from the process equipment, the operation of taking out the wafer is reduced, and the possibility of damage to the wafer due to improper operation when taking out the wafer is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer appearance detection device of the embodiment of the present application.

[0014] Figure 2 It is a schematic diagram of exploded structure of wafer appearance detection device of the embodiment of the present application.

[0015] Figure 3 It is a schematic diagram of three-dimensional structure of height adjustment platform of the embodiment of the present application.

[0016] Figure 4 It is another schematic diagram of three-dimensional structure of height adjustment platform of the embodiment of the present application. DETAILED DESCRIPTION

[0017] In order to explain the technical content, structural features, achieved purposes and effects of the present application in detail, the following will be described in detail in combination with the embodiments and the accompanying drawings.

[0018] Please refer to Figures 1 to 4 The present application discloses a wafer appearance detection device, which comprises a bottom plate 1, a positioning plate 2, a height adjustment plate 3, a height adjustment platform 4, a clamp 5 and a lens 6. The positioning plate 2 is vertically arranged on the bottom plate 1, and the height adjustment plate 3 is arranged on the side of the positioning plate 2 away from the bottom plate 1. The height adjustment platform 4 comprises a control module 41, a fixed seat 42 and a sliding member 43. The fixed seat 42 is fixedly attached to the side of the height adjustment plate 3 away from the positioning plate 2. The side of the fixed seat 42 away from the height adjustment plate 3 protrudes a sliding rail 421 extending in the height direction. The sliding member 43 is installed on the sliding rail 421. The clamp 5 is fixed to the side of the sliding member 43 away from the fixed seat 42, and the lens 6 is clamped and fixed by the clamp 5. The control module 41 is located on the side of the fixed seat 42 and the sliding member 43, and is used to control the sliding of the sliding member 43.

[0019] In use, the lens 6 of the wafer appearance detection device of the present application is directed towards the wafer in the process equipment. The approximate position of the lens 6 is adjusted by adjusting the height adjustment plate 3. The position of the lens 6 is finely adjusted by adjusting the position of the sliding member 43 using the control module 41. After repeatedly adjusting the position of the lens 6 until the wafer observed by the lens 6 becomes clear, the relative position of the lens 6 and the wafer is determined. The appearance of the wafer can be detected using the device without taking the wafer out of the process equipment, which reduces the cumbersome operation of taking the wafer out and reduces the possibility of damage to the wafer due to improper operation when taking the wafer out.

[0020] Please refer to Figures 2 to 4In some embodiments, the control module 41 comprises a telescopic rod 411, a push block 412 and a mounting bracket 413, the mounting bracket 413 comprises a mounting block 4131 fixed on one side of the fixed seat 42, the mounting block 4131 protrudes a protrusion 4132 away from the side of the positioning plate 2, the protrusion 4132 is provided with a mounting hole 4133 along the sliding direction of the sliding member 43, the mounting hole 4133 is used for sleeving and fixing the telescopic rod 411, the push block 412 is fixed on one side of the sliding member 43, the output end of the telescopic rod 411 faces the push block 412 to push the push block 412, and the telescopic rod 411 is in different telescopic lengths, so that the push block 412 and the sliding member 43 are in different heights.

[0021] Specifically, the side wall of the mounting hole 4133 is provided with a fastening hole 4134 penetrating through the protrusion 4132 and the mounting block 4131 outwardly, the fastening hole 4134 is used for inserting a fastener from the side of the mounting block 4131 away from the protrusion 4132 into the mounting hole 4133 to fasten the telescopic rod 411. It can be understood that the fastening hole 4134 can also be arranged on the side of the mounting hole 4133 and connected to the outer side of the protrusion 4132.

[0022] Optionally, the push block 412 comprises a fixed plate 4121 fixed on one side of the sliding member 43, the fixed plate 4121 extends a push portion 4122 away from the sliding member 43, and the output end of the telescopic rod 411 faces the push portion 4122 to push the push portion 4122.

[0023] Please refer to Figure 4 In some embodiments, the height adjusting platform 44 further comprises a backing plate 44 and a positioning screw 45, the positioning screw 45 passes through the backing plate 44 and is inserted into one side of the fixed seat 42 and the sliding member 43, the backing plate 44, the fixed seat 42 and the sliding member 43 are fixedly attached, so that the control module 41 cannot be accidentally moved to change the position of the adjusted lens 6 and affect the appearance detection of the wafer.

[0024] Please refer to Figure 2 In some embodiments, the height adjusting plate 3 is provided with a plurality of long holes 31 in the length direction as the height direction, the height adjusting plate 3 is attached to the positioning plate 2 and fixed on the positioning plate 2 by using fasteners passing through the long holes 31. In use, the height adjusting plate 3 is first adjusted in height, and then the height adjusting plate 3 is fixed on the positioning plate 2 by using the fasteners and the long holes 31.

[0025] Please refer to Figure 2In some embodiments, the clamp 5 comprises an adapter block 51 and a locking block 52. The adapter block 51 comprises a mounting plate 511 mounted on the side of the sliding member 43 opposite to the fixed seat 42. The mounting plate 511 extends out of an extension 512 on the side opposite to the sliding member 43. The end of the extension 512 is provided with a first clamping groove 513. The locking block 52 is provided with a second clamping groove 521. When the locking block 52 and the adapter block 51 are fixed together, the lens 6 is clamped between the second clamping groove 521 and the first clamping groove 513.

[0026] Optionally, the mounting plate 511 is provided with a plurality of waist holes 514 extending in the height direction. The mounting plate 511 is attached to the sliding member 43 and fixed to the sliding member 43 by fasteners passing through the waist holes 514. This can make the position adjustment of the lens 6 more flexible.

[0027] Please refer to Figure 1 and Figure 2 In some embodiments, the wafer appearance detection device of the present application is provided with an illuminating device 7 arranged at the bottom end of the lens 6 to facilitate the provision of light required for detecting the wafer appearance.

[0028] Specifically, the illuminating device 7 comprises a ring-shaped light source 71 and a light source fixing block 72. The light source fixing block 72 is fixedly connected to the lower end of the lens 6, and the ring-shaped light source 71 is coaxially attached to the light source fixing block 72.

[0029] In some embodiments, the lens 6 is also signal-connected to a display screen (not shown in the figure). The image captured by the lens 6 can be transmitted to the display screen for the staff to detect the wafer appearance.

[0030] The above disclosure is only the preferred embodiment of the present application and cannot be used to limit the scope of the rights of the present application. Therefore, any equivalent changes made in accordance with the claims of the present application are all within the scope covered by the present application.

Claims

1. A wafer appearance inspection device, characterized in that, The system includes a base plate, a positioning plate, a height adjustment plate, a height adjustment platform, a clamp, and a lens. The positioning plate is erected on the base plate, and the height adjustment plate is located on the side of the positioning plate facing away from the base plate. The height adjustment platform includes a control module, a fixed base, and a sliding member. The fixed base is fitted and fixed to the side of the height adjustment plate facing away from the positioning plate. A slide rail extending along the height direction protrudes from the side of the fixed base facing away from the height adjustment plate, and the sliding member is mounted on the slide rail. The clamp is fixed to the side of the sliding member facing away from the fixed base, and the clamp holds and fixes the lens. The control module is located on one side of the fixed base and the sliding member and is used to control the sliding of the sliding member.

2. The wafer appearance inspection device as described in claim 1, characterized in that, The control module includes a telescopic rod, a push block, and a mounting bracket. The mounting bracket includes a mounting block fixed to one side of the fixed base. A protrusion extends from the side of the mounting block facing away from the positioning plate. The protrusion has a mounting hole along the sliding direction of the sliding member. The mounting hole is used to fit and fix the telescopic rod. The push block is fixed to one side of the sliding member. The output end of the telescopic rod faces the push block to push the push block. When the telescopic rod is at different telescopic lengths, the push block and the sliding member are at different heights.

3. The wafer appearance inspection device as described in claim 2, characterized in that, The sidewall of the mounting hole has a fastening hole that extends outward through the protrusion and the mounting block. The fastening hole is used for fasteners to be inserted into the mounting hole from the side of the mounting block facing away from the protrusion to fasten the telescopic rod.

4. The wafer appearance inspection device as described in claim 1, characterized in that, The height adjustment plate has several elongated holes in the length direction of the height direction. The height adjustment plate is attached to the positioning plate and fasteners are used to pass through the elongated holes to fix the height adjustment plate to the positioning plate.

5. The wafer appearance inspection device as described in claim 1, characterized in that, The clamp includes an adapter block and a locking block. The adapter block includes a mounting plate installed on the side of the slider facing away from the fixed base. The mounting plate extends outward from the side of the slider. The end of the extension has a first clamping groove. The locking block has a second clamping groove. When the locking block and the adapter block are fixed together, the lens is clamped in the second clamping groove and the first clamping groove.

6. The wafer appearance inspection device as described in claim 1, characterized in that, It also includes an illumination device, which is located at the bottom of the lens.

7. The wafer appearance inspection device as described in claim 6, characterized in that, The lighting device includes a ring light source and a light source fixing block. The light source fixing block is locked and fixed to the lower end of the lens. The ring light source is coaxially fitted and fixed to the light source fixing block.

Images