High-thermal-conductivity thick copper circuit board

Abstract

The utility model discloses a thick copper circuit board with high thermal conductivity, which relates to the technical field of circuit boards and comprises a copper plate, an outer edge plate is arranged on the periphery of the edge of the copper plate, a first heat dissipation mechanism is arranged in the outer edge plate, a second heat dissipation mechanism is arranged on the surface of the outer edge plate, and a plurality of heat conduction pipes are arranged in the copper plate. The upper circuit layer and the lower circuit layer are arranged on the upper surface and the lower surface of the copper plate respectively, the heat dissipation substrates are arranged on the surfaces of the upper circuit layer and the lower circuit layer, heat on the copper plate can be discharged into air through the heat conduction pipes, and heat dissipation of the copper plate is achieved. The heat dissipation substrate can transfer heat generated by the upper circuit layer and the lower circuit layer to the heat dissipation teeth of the outer edge plate for heat dissipation, the first heat dissipation mechanism can enable air circulation in the outer edge plate for heat dissipation, and heat generated by the circuit board can be dissipated through the second heat dissipation mechanism. Therefore, the heat dissipation performance and the service life of the circuit board are further greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, concretely is thick copper circuit board of high heat conductivity. BACKGROUND

[0002] Printed circuit board is the provider of electrical connection of electronic components, before the appearance of printed circuit board, the interconnection between electronic components is all relied on the direct connection of electric wire and is connected to form complete circuit, printed circuit board develops from single layer to double -sided board, multilayer board and flexible board, and constantly develops to high precision, high density and high reliability, and thick copper circuit board is one of the most widely used printed circuit boards.

[0003] The structure of the conventional thick copper circuit board is relatively simple, and the heat generated in the long time work cannot be smoothly dissipated to the outside, is easily accumulated to the surface of the circuit board, causes the circuit board to be overheated, influences the service life of the circuit board, and finally causes the circuit layer to be burned.

[0004] Based on this, the thick copper circuit board of high heat conductivity is provided, which can eliminate the disadvantages of the existing device. CONTENT OF THE UTILITY MODEL

[0005] The utility model discloses a thick copper circuit board of high heat conductivity to solve the problem that the structure of the conventional thick copper circuit board is relatively simple, and the heat generated in the long time work cannot be smoothly dissipated to the outside, is easily accumulated to the surface of the circuit board, causes the circuit board to be overheated, influences the service life of the circuit board, and finally causes the circuit layer to be burned.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] Thick copper circuit board of high heat conductivity, including copper board, the copper board edge four around is provided with the outer edge board, the first heat dissipation mechanism is provided in the outer edge board, the second heat dissipation mechanism is provided on the outer edge board surface.

[0008] On the basis of the above technical scheme, the utility model still provides the following optional technical scheme:

[0009] In an optional scheme, the first heat dissipation mechanism includes first through -hole and second through -hole, and the first through -hole and the second through -hole are located in the cross -passing arrangement of the outer edge board.

[0010] In an optional scheme, the second heat dissipation mechanism includes heat dissipation tooth, and the heat dissipation tooth is evenly distributed on the outer edge board.

[0011] In an optional scheme, the copper board is provided with a plurality of heat conduction pipes.

[0012] In an alternative, the upper surface and the lower surface of the copper plate are respectively provided with an upper circuit layer and a lower circuit layer.

[0013] In an alternative, the upper surface and the lower surface of the copper plate are respectively provided with an upper circuit layer and a lower circuit layer.

[0014] In an alternative, the upper surface and the lower surface of the copper plate are respectively provided with an upper circuit layer and a lower circuit layer.

[0015] Compared with the prior art, the utility model has the advantages of the following:

[0016] The utility model discloses a copper plate edge four -around is provided with the outer edge board, the first heat dissipation mechanism is arranged in the outer edge board inside, the outer edge board surface is provided with the second heat dissipation mechanism, and the first heat dissipation mechanism and the second heat dissipation mechanism can greatly improve the heat dissipation performance of circuit board to improve the service life of circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the whole structure schematic diagram of the utility model.

[0018] Figure 2 It is the outer edge board internal structure schematic diagram of the utility model.

[0019] Figure 3 It is the copper plate surface structure schematic diagram of the utility model.

[0020] Figure 4 It is the copper plate internal structure schematic diagram of the utility model.

[0021] Mark annotation: 1, copper plate;2, outer edge board;3, first through -hole;4, second through -hole;5, heat dissipation tooth;6, heat pipe;7, upper circuit layer;8, lower circuit layer;9, double -sided adhesive layer;10, heat dissipation base plate. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the following is combined with the drawings and example, and the utility model is further detailed.

[0023] In one embodiment, as shown in Figures 1-4 High thermal conductivity thick copper circuit board, including copper plate 1, copper plate 1 edge four -around is provided with outer edge board 2, and the first heat dissipation mechanism is arranged in the outer edge board 2 inside, and the outer edge board 2 surface is provided with the second heat dissipation mechanism, and the first heat dissipation mechanism can make the air circulation in the outer edge board 2 inside, and the heat generated by circuit board can be dissipated through the second heat dissipation mechanism, to further improve the heat dissipation performance and service life of circuit board greatly.

[0024] In one embodiment, as shown in Figure 1 andFigure 2 As shown, the first heat dissipation mechanism includes the first through hole 3 and the second through hole 4, which are arranged inside the outer edge plate 2 in a cross-through manner. Air flows through the first through hole 3 and the second through hole 4 to improve heat dissipation.

[0025] In one embodiment, as shown in the figure, the second heat dissipation mechanism includes the heat dissipation teeth 5, which are evenly distributed on the outer edge plate 2. The heat generated by the circuit board can be discharged into the air through the heat dissipation teeth 5, avoiding damage caused by high temperature of the circuit board. Figure 1

[0026] In one embodiment, as shown in the figure, the copper plate 1 is provided with a plurality of heat conduction pipes 6. The heat conduction pipes 6 can discharge the heat on the copper plate 1 into the air, achieving heat dissipation of the copper plate 1.

[0027] In one embodiment, as shown in the figure, the upper surface and the lower surface of the copper plate 1 are respectively provided with the upper circuit layer 7 and the lower circuit layer 8.

[0028] In one embodiment, as shown in the figure, the surfaces of the upper circuit layer 7 and the lower circuit layer 8 are respectively provided with the heat dissipation substrate 10. The heat dissipation substrate 10 can transfer the heat generated by the upper circuit layer 7 and the lower circuit layer 8 to the heat dissipation teeth 5 of the outer edge plate 2.

[0029] In one embodiment, as shown in the figure, the heat dissipation substrate 10 is fixedly connected with the upper circuit layer 7 and the lower circuit layer 8 through the double-sided adhesive layer 9.

[0030] The above embodiment discloses a thick copper circuit board with high thermal conductivity. When the upper circuit layer 7 and the lower circuit layer 8 of the circuit board work for a long time, a large amount of heat is accumulated on the copper plate 1 and the circuit layer. Since the heat conduction pipes 6 are arranged in the copper plate 1, the heat conduction pipes 6 discharge the heat on the copper plate 1 into the air, achieving heat dissipation of the copper plate 1. Since the copper plate 1 is effectively cooled, thermal deformation of the copper plate 1 caused by high temperature is avoided, prolonging the service life of the circuit board. The heat dissipation substrate 10 can transfer the heat generated by the upper circuit layer 7 and the lower circuit layer 8 to the heat dissipation teeth 5 of the outer edge plate 2. The heat is discharged into the air through the heat dissipation teeth 5, avoiding damage caused by high temperature of the circuit board. The first through hole 3 and the second through hole 4 inside the outer edge plate 2 flow air, improving the heat dissipation effect.

[0031] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.​

Claims

1. A thick copper circuit board having high thermal conductivity comprising a copper plate (1), characterized in that, The copper plate (1) is provided with an outer edge plate (2) around the edge, the inner part of the outer edge plate (2) is provided with a first heat dissipation mechanism, and the surface of the outer edge plate (2) is provided with a second heat dissipation mechanism.

2. The thick copper circuit board of claim 1, wherein, The first heat dissipation mechanism comprises first through holes (3) and second through holes (4), and the first through holes (3) and the second through holes (4) are arranged in the inner part of the outer edge plate (2) and cross through.

3. The thick copper circuit board of claim 1, wherein, The second heat dissipation mechanism comprises heat dissipation teeth (5), and the heat dissipation teeth (5) are evenly distributed on the outer edge plate (2).

4. The high heat conductivity thick copper circuit board according to claim 1, wherein The copper plate (1) is provided with a plurality of heat conduction pipes (6).

5. The high heat conductivity thick copper circuit board according to claim 1, wherein The upper surface and the lower surface of the copper plate (1) are respectively provided with an upper circuit layer (7) and a lower circuit layer (8).

6. The high heat conductivity thick copper circuit board according to claim 5, wherein The surfaces of the upper circuit layer (7) and the lower circuit layer (8) are respectively provided with heat dissipation substrates (10).

7. The high heat conductivity thick copper circuit board according to claim 6, wherein The heat dissipation substrates (10) are fixedly connected with the upper circuit layer (7) and the lower circuit layer (8) through double-sided adhesive layers (9).

Images