Electroplating box floating object filtering device

Abstract

The utility model discloses an electroplating box floater filtering device, which relates to the field of electroplating production technology, and comprises an electroplating box, one side of the upper end part of the electroplating box along the length direction is communicated with a liquid discharge pipe, and one end of the liquid discharge pipe in the electroplating box extends downwards to the lower end part of the electroplating box. The lower end of the filtering device communicates with a water pump, the side, away from the liquid discharging pipe, of the electroplating box communicates with a liquid inlet pipe, the end, away from the electroplating box, of the liquid inlet pipe communicates with the water pump, a baffle is fixedly arranged on the side, close to the liquid discharging pipe, in the electroplating box, and the baffle is vertically arranged and attached to the inner wall of the electroplating box. The electroplating device has the effect of improving the electroplating efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of electroplating production technology especially to an electroplating tank floating object filtering device. BACKGROUND

[0002] At present, the electroplating tank is the most basic equipment in the electroplating equipment, and the main function is to device solution, and the electroplating tank has PP material, PVC material, PVDF material, glass fiber reinforced plastic tank material, stainless steel tank material and the like, and in the electroplating process, the electroplating dregs will be generated in the liquid, and the dregs will affect the electroplating products, which is not conducive to electroplating.

[0003] The related technology can refer to the Chinese patent application with the announcement number CN211142228U, which discloses an electroplating tank filtering device with movable filter screen, which comprises an electroplating tank body, two side turning base piles are arranged on the left and right sides of the upper end of the electroplating tank body, the side turning base piles are fixedly connected with the inner wall of the electroplating tank body, a coaxial rotating rod is rotatably connected in the middle of the side turning base pile, movable handles and first folding rods are fixedly connected to the front and rear ends of the coaxial rotating rod, respectively, four groups of movable handles and first folding rods are arranged on the side turning base pile in a longitudinal axis symmetry of the electroplating tank body, the second folding rod is rotatably connected to the lower end of the first folding rod, the rotation of the movable handle drives the rotation and folding of the first folding rod and the second folding rod, and further drives the upward movement of the filter screen frame, the middle rotating screw rod is rotated, and the translation slide plate and the edge brushing are attached to the filter screen frame to slide, so that the surface of the filter screen frame in the electroplating tank body is cleaned, the impurities remaining on the filter screen frame are removed, the filtering efficiency of the filter screen frame is improved, and the secondary pollution in the electroplating tank body is reduced.

[0004] For the related technology in the above, the filter screen frame of the device is located at the lower end of the electroplating tank, which is used for collecting impurities in the electroplating liquid, the device can only collect the impurities at the bottom of the electroplating liquid, bubbles will be generated in the electroplating process, and foam will be formed on the surface of the electroplating liquid, part of the residues will be left in the foam and cannot be recycled, and the part of the residues will participate in the electroplating process, resulting in low electroplating efficiency. INVENTION CONTENTS

[0005] In order to improve the electroplating efficiency, the present application provides an electroplating tank floating object filtering device.

[0006] The present application provides an electroplating tank floating object filtering device, which adopts the following technical scheme:

[0007] The utility model provides an electroplating tank floating object filtering device, including electroplating tank, the upper end of electroplating tank is communicated with the liquid discharge pipe along the length direction one side, and the one end of liquid discharge pipe is extended to the lower end of electroplating tank in the electroplating tank, and the one end of liquid discharge pipe is communicated with filtering device away from electroplating tank, and the lower end of filtering device is communicated with water pump, and the one side of electroplating tank is communicated with liquid inlet pipe away from liquid discharge pipe, and the one end of liquid inlet pipe is communicated with water pump away from electroplating tank, and the one side of electroplating tank is fixed with baffle near liquid discharge pipe, and baffle is arranged along the vertical direction and is attached to the inner wall of electroplating tank.

[0008] Through adopting the above technical scheme, the water pump extracts the electroplating solution in the electroplating tank from the liquid discharge pipe, the filtering device is used to filter the impurities in the electroplating solution, and then the electroplating solution is transported into the electroplating tank from the liquid inlet pipe; the baffle cooperates with the liquid discharge pipe to extract the impurities on the surface of the electroplating solution through the liquid discharge pipe, which is conducive to reducing the probability of impurities participating in the electroplating reaction and improving the electroplating efficiency.

[0009] Optionally, the one end of the liquid inlet pipe extending into the electroplating tank is vertically extended to the lower end of the electroplating tank, and the one end of the liquid inlet pipe extending into the electroplating tank is communicated with a liquid inlet branch pipe, and the liquid inlet branch pipe is horizontally arranged.

[0010] Through adopting the above technical scheme, the liquid inlet pipe located at the lower end of the electroplating tank is conducive to reducing the probability of surface fluctuation of the electroplating solution, and the horizontal arrangement of the liquid inlet branch pipe is conducive to reducing the probability of impurities being lifted up at the bottom of the electroplating tank, thereby improving the stability of electroplating.

[0011] Optionally, a through opening is formed in the side of the electroplating tank away from the liquid discharge pipe, the through opening is horizontally arranged along the width direction of the electroplating tank, the through opening is located above the liquid level of the electroplating solution, and a plurality of fans are arranged in the through opening.

[0012] Through adopting the above technical scheme, the fans in the through opening are used to blow the floating scum on the surface of the electroplating solution to the side of the electroplating tank close to the liquid discharge pipe, thereby improving the convenience of cleaning the floating scum.

[0013] Optionally, an overflow opening is formed in the side of the electroplating tank close to the liquid discharge pipe, the overflow opening is horizontally arranged along the width direction of the electroplating tank, the overflow opening is located above the liquid discharge pipe, an overflow tank is fixedly arranged outside the electroplating tank, and the overflow tank is opposite to the overflow opening.

[0014] Through adopting the above technical scheme, the floating scum is flowed into the overflow tank through the overflow opening under the action of the fan, thereby further improving the convenience of cleaning the floating scum.

[0015] Optionally, a plurality of exhaust openings are formed in the side of the electroplating tank close to the liquid discharge pipe, the plurality of exhaust openings are located above the overflow opening, the exhaust openings are communicated with an exhaust pipe, and an air extractor is fixedly arranged at the end of the exhaust pipe close to the electroplating tank, so as to extract the gas in the electroplating tank.

[0016] Through the above technical scheme, the air extractor is used to extract the gas in the electroplating tank, and the gas is extracted from the exhaust pipe through the exhaust port, thereby improving the production environment of the production workshop.

[0017] Optionally, the motor is fixed on the side of the electroplating tank away from the liquid discharge pipe, and the motor is located above the through port and is horizontally arranged. The output shaft of the motor penetrates the electroplating tank and is coaxially fixed with a gear. The gear is engaged with a rack. The rack is slidingly connected with the electroplating tank along the vertical direction. The lower end of the rack is fixed with a vertical plate. The vertical plate is used to block the through port.

[0018] Through the above technical scheme, when the object to be electroplated is lowered into the electroplating tank, the vertical plate is used to block the through port. When the object to be electroplated is stable in the electroplating solution, the motor drives the gear to rotate, and the rack moves vertically to lift the vertical plate, thereby improving the stability of electroplating.

[0019] Optionally, the filter screen is fixed at one end of the liquid discharge pipe in the electroplating tank, and is used to filter the charged object.

[0020] Through the above technical scheme, the filter screen is used to block the object to be electroplated, which is conducive to reducing the probability of damage to the filtering device and improving the stability of electroplating.

[0021] Optionally, the electroplating tank is communicated with a replenishment pipe on the side away from the liquid discharge pipe.

[0022] Through the above technical scheme, the high-concentration electroplating solution flows into the electroplating tank from the replenishment pipe, thereby improving the concentration of the electroplating solution and improving the electroplating efficiency.

[0023] In summary, the present application has at least one of the following beneficial technical effects:

[0024] 1. The baffle cooperates with the liquid discharge pipe to extract impurities on the surface of the electroplating solution through the liquid discharge pipe, which is conducive to reducing the probability of impurities participating in the electroplating reaction and improving the electroplating efficiency.

[0025] 2. The fan blows the floating matter on the surface of the electroplating solution to the overflow port, and the floating matter is discharged from the overflow tank, thereby improving the convenience of floating matter cleaning.

[0026] 3. The liquid inlet pipe is located at the lower end of the electroplating tank, which is conducive to reducing the probability of surface fluctuation of the electroplating solution. The horizontal arrangement of the liquid inlet branch pipe is conducive to reducing the probability of impurities being lifted up at the bottom of the electroplating tank, thereby improving the stability of electroplating. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a whole structure schematic diagram of the electroplating tank floating object filtering device.

[0028] Figure 2 It is a schematic diagram aiming to highlight the connection relationship between the baffle and the electroplating tank.

[0029] Figure 3 is a schematic view aiming to highlight the connection relationship between the vertical plate and the rack.

[0030] Figure 4 is a schematic view aiming to highlight the connection relationship between the fan and the electroplating tank.

[0031] Figure 5 is Figure 3 an enlarged schematic view of part A in FIG. 1.

[0032] Reference signs: 1, electroplating tank; 11, liquid discharge pipe; 111, filter screen; 12, filtering device; 13, water pump; 14, liquid inlet pipe; 141, liquid inlet branch pipe; 15, baffle; 16, through opening; 161, fan; 17, overflow opening; 171, overflow groove; 18, exhaust opening; 181, exhaust pipe; 182, air extractor; 19, motor; 191, gear; 192, rack; 193, vertical plate; 2, replenishment pipe. DETAILED DESCRIPTION

[0033] The present application will be further described in detail below with reference to all the accompanying drawings.

[0034] The present application discloses an electroplating tank floating object filtering device. EMBODIMENT

[0035] Referring to Figure 1 and Figure 2 , an electroplating tank floating object filtering device comprises an electroplating tank 1 and a cover plate, the cover plate blocks the opening of the electroplating tank 1, the electroplating tank 1 is communicated with a liquid discharge pipe 11 at one side along the length direction, the liquid discharge pipe 11 is used for extracting the electroplating liquid, the end of the liquid discharge pipe 11 located in the electroplating tank 1 extends downward to the lower end of the electroplating tank 1, the end of the liquid discharge pipe 11 away from the electroplating tank 1 is communicated with a filtering device 12, the lower end of the filtering device 12 is communicated with a water pump 13, the end of the liquid discharge pipe 11 located in the electroplating tank 1 is fixedly provided with a filter screen 111, which can reduce the probability of the object to be electroplated entering the liquid discharge pipe 11 and improve the stability of the filtering device 12.

[0036] Referring to Figure 1 and Figure 2The baffle 15 is arranged in the vertical direction and is attached to the inside of the electroplating tank 1, the upper end of the baffle 15 is below the surface of the electroplating solution, the baffle 15 cooperates with the drain pipe 11 to draw out the impurities on the surface of the electroplating solution through the drain pipe 11, the electroplating tank 1 is connected with the liquid inlet pipe 14 at the side close to the liquid inlet pipe 14, the liquid inlet pipe 14 is connected with the water pump 13 at the side away from the electroplating tank 1, the electroplating tank 1 is connected with the material supplement pipe 2 at the side close to the liquid inlet pipe 14, which is used to supplement the high-concentration electroplating solution into the electroplating tank 1, the water pump 13 draws out the electroplating solution in the electroplating tank 1 through the drain pipe 11, the filter device 12 is used to filter the impurities in the electroplating solution, and then the electroplating solution is transported into the electroplating tank 1 through the liquid inlet pipe 14, the baffle 15 cooperates with the drain pipe 11 to draw out the impurities on the surface of the electroplating solution through the drain pipe 11, which is beneficial to reduce the probability of impurities participating in the electroplating reaction and improve the electroplating efficiency.

[0037] With reference to Figure 3 and Figure 4 The end of the liquid inlet pipe 14 in the electroplating tank 1 extends to the lower end of the electroplating tank 1 in the vertical direction, which is beneficial to reduce the fluctuation of the surface of the electroplating solution, the end of the liquid inlet pipe 14 in the electroplating tank 1 is connected with the liquid inlet branch pipe 141, the liquid inlet branch pipe 141 is arranged horizontally, the liquid inlet pipe 14 is located at the lower end of the electroplating tank 1, when the liquid is filled, the electroplating solution flows from the lower end of the electroplating tank 1, which is beneficial to reduce the probability of the fluctuation of the surface of the electroplating solution, and the horizontal arrangement of the liquid inlet branch pipe 141 is beneficial to reduce the probability of the impurities at the bottom of the electroplating tank 1 being lifted up, thereby improving the stability of the electroplating.

[0038] With reference to Figure 2 and Figure 4 The side of the electroplating tank 1 away from the drain pipe 11 is provided with the through opening 16, the through opening 16 is arranged horizontally along the width direction of the electroplating tank 1, the through opening 16 is above the surface of the electroplating solution, a plurality of fans 161 are arranged in the through opening 16, the fans 161 blow the floating scum on the surface of the electroplating solution to the side of the electroplating tank 1 close to the drain pipe 11. The side of the electroplating tank 1 close to the drain pipe 11 is provided with the overflow opening 17, the overflow opening 17 is arranged horizontally along the width direction of the electroplating tank 1, the floating scum flows out through the overflow opening 17, the overflow opening 17 is above the drain pipe 11, the electroplating tank 1 is fixedly provided with the overflow tank 171 outside, the overflow tank 171 is opposite to the overflow opening 17, and the floating scum flows into the overflow tank 171 through the overflow opening 17 under the action of the fans 161.

[0039] With reference to Figure 1 and Figure 2The electroplating tank 1 is provided with a plurality of exhaust ports 18 on the side close to the liquid discharge pipe 11, the exhaust ports 18 are located above the overflow ports 17, the gas generated in the electroplating process is discharged from the exhaust ports 18, the exhaust ports 18 are communicated with exhaust pipes 181, one end of the exhaust pipes 181 close to the electroplating tank 1 is fixedly provided with an air extractor 182, the air extractor 182 is used for extracting the gas in the electroplating tank 1, the gas is extracted from the exhaust pipes 181 through the exhaust ports 18, which reduces the probability of the gas generated in the electroplating process diffusing from the electroplating tank 1 to the production workshop, and improves the production environment of the production workshop.

[0040] With reference to Figure 3 and Figure 5 The electroplating tank 1 is provided with a motor 19 on the side close to the liquid inlet pipe 14, the motor 19 is located above the through port 16 and is horizontally arranged, the output shaft of the motor 19 penetrates through the electroplating tank 1 and is coaxially fixedly provided with a gear 191, the motor 19 drives the gear 191 to rotate, the gear 191 is engaged with a rack 192, the rack 192 is provided with a sliding groove in the vertical direction on the side close to the electroplating tank 1, a limiting rod is fixedly arranged on the inner side of the electroplating tank 1, the limiting rod is inserted into the sliding groove and is attached to the sliding groove, the rack 192 is slidably connected to the electroplating tank 1 in the vertical direction, the gear 191 rotates to drive the rack 192 to move up and down in the vertical direction, the lower end of the rack 192 is fixedly provided with a vertical plate 193, which is used for blocking the through port 16 when the object to be electroplated is lowered into the electroplating tank 1, when the object to be electroplated is stable in the electroplating solution, the motor 19 drives the gear 191 to rotate, the rack 192 moves in the vertical direction to lift the vertical plate 193, when the object to be electroplated is immersed in the electroplating solution, the liquid level will fluctuate, the vertical plate 193 is used for blocking the through port 16, which reduces the probability of the electroplating solution entering the through port 16 and improves the stability of electroplating.

[0041] The implementation principle of the electroplating tank floating object filtering device is that the water pump 13 extracts the electroplating solution in the electroplating tank 1 from the liquid discharge pipe 11, the filtering device 12 is used for filtering the impurities in the electroplating solution, and then the electroplating solution is delivered into the electroplating tank 1 from the liquid inlet pipe 14, the baffle 15 cooperates with the liquid discharge pipe 11 to extract the impurities on the surface of the electroplating solution through the liquid discharge pipe 11, the air blower 161 blows the floating scum on the surface of the electroplating solution to move towards the overflow port 17, and the floating scum is discharged from the overflow groove 171 at the overflow port 17, and the gas generated in the electroplating process is extracted from the exhaust pipe 181 by the air extractor 182, which reduces the probability of the impurities in the electroplating solution participating in the electroplating reaction and is conducive to improving the electroplating efficiency.

[0042] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A floating matter filtering device for an electroplating tank, comprising an electroplating tank (1), characterized in that: The upper end of the electroplating tank (1) is connected to a drain pipe (11) along its length. One end of the drain pipe (11) inside the electroplating tank (1) extends downward to the lower end of the electroplating tank (1). The end of the drain pipe (11) away from the electroplating tank (1) is connected to a filter device (12). The lower end of the filter device (12) is connected to a water pump (13). The side of the electroplating tank (1) away from the drain pipe (11) is connected to an inlet pipe (14). The end of the inlet pipe (14) away from the electroplating tank (1) is connected to the water pump (13). A baffle (15) is fixed inside the electroplating tank (1) on the side near the drain pipe (11). The baffle (15) is set vertically and fits against the inner wall of the electroplating tank (1).

2. The electroplating tank floating matter filtering device according to claim 1, characterized in that: The liquid inlet pipe (14) extends vertically to the lower end of the electroplating tank (1) at one end inside the electroplating tank (1), and the liquid inlet pipe (141) at one end inside the electroplating tank (1) is connected to a liquid inlet branch pipe (141), which is horizontally arranged.

3. The electroplating tank floating matter filtering device according to claim 1, characterized in that: The electroplating tank (1) has an opening (16) on the side away from the drain pipe (11). The opening (16) is horizontally arranged along the width direction of the electroplating tank (1) and is located above the surface of the electroplating liquid. Several fans (161) are installed in the opening (16).

4. The electroplating tank floating matter filtering device according to claim 3, characterized in that: An overflow port (17) is opened on the side of the electroplating tank (1) near the drain pipe (11). The overflow port (17) is horizontally arranged along the width direction of the electroplating tank (1) and is located above the drain pipe (11). An overflow groove (171) is fixed on the outside of the electroplating tank (1) and the overflow groove (171) is directly opposite the overflow port (17).

5. The electroplating tank floating matter filtering device according to claim 3, characterized in that: The electroplating tank (1) has several exhaust ports (18) on the side near the drain pipe (11). The exhaust ports (18) are located above the overflow port (17). The exhaust ports (18) are connected to exhaust pipes (181). An air extractor (182) is fixed at one end of the exhaust pipe (181) near the electroplating tank (1) for extracting the gas in the electroplating tank (1).

6. The electroplating tank floating matter filtering device according to claim 3, characterized in that: A motor (19) is fixedly installed on the side of the electroplating tank (1) away from the drain pipe (11). The motor (19) is located above the inlet (16) and is set horizontally. The output shaft of the motor (19) passes through the electroplating tank (1) and is coaxially fixedly provided with a gear (191). The gear (191) meshes with a rack (192). The rack (192) is slidably connected to the electroplating tank (1) in the vertical direction. A vertical plate (193) is fixedly provided at the lower end of the rack (192). The vertical plate (193) is used to block the inlet (16).

7. The electroplating tank floating matter filtering device according to claim 1, characterized in that: The drain pipe (11) is fixed with a filter screen (111) at one end inside the electroplating tank (1) for filtering the object to be electroplated.

8. The electroplating tank floating matter filtering device according to claim 1, characterized in that: The electroplating tank (1) is connected to a replenishment pipe (2) on the side away from the drain pipe (11).

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