Non-refrigeration type infrared detector

Abstract

The utility model relates to a non-refrigeration type infrared detector, which comprises a heat dissipation shell, a circuit board and a detector chip, the circuit board is provided with a first surface and a second surface, the detector chip is electrically connected with the circuit board and is positioned on the first surface of the circuit board, the heat dissipation shell is positioned on the second surface of the circuit board, and the detector chip is electrically connected with the heat dissipation shell. A containing cavity is defined by the circuit board and the circuit board, and the containing cavity is filled with insulating cooling liquid. The non-refrigeration type infrared detector provided by the utility model solves the problems that a heat dissipation part of a conventional detector is relatively poor in adaptability to a device with an uneven surface and is non-uniform in heat dissipation.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared detection equipment technical field especially relates to a non refrigeration type infrared detector. BACKGROUND

[0002] Non refrigeration type infrared detector is the core component of infrared technology, and is the forerunner of infrared technology development. Non refrigeration type infrared detector has very extensive application in missile guidance, reconnaissance, vehicle auxiliary driving, unmanned plane reconnaissance, temperature measurement and other civil and military aspects. The detector realizes infrared signal acquisition through infrared detector sensitive resistance array, and is fine identification to temperature, therefore, when the detector works, device heat dissipation is particularly important, and if heat dissipation is not good, the precision of the detector will be directly affected.

[0003] In order to make the infrared detector work normally, the detector chip is packaged generally by using copper or aluminum and other metal heat dissipation, but the adaptability to the uneven surface device is poor, and the heat dissipation is uneven, and the heat dissipation efficiency is low. UTILITY MODEL CONTENT

[0004] The utility model discloses a non refrigeration type infrared detector, and aims at solving the problems of poor adaptability to uneven surface device and uneven heat dissipation of the heat dissipation component of the existing detector.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a non refrigeration type infrared detector, which comprises a heat dissipation shell, a circuit board and a detector chip, the circuit board has a first surface and a second surface, the detector chip is electrically connected with the circuit board and located on the first surface of the circuit board, the heat dissipation shell is located on the second surface of the circuit board and forms an accommodating cavity together with the circuit board, and the accommodating cavity is filled with insulating cooling liquid.

[0006] According to some embodiments of the utility model, the heat dissipation shell and the circuit board are connected through sealing glue.

[0007] According to some embodiments of the utility model, a liquid inlet is formed on the heat dissipation shell, and the liquid inlet is communicated with the accommodating cavity.

[0008] According to some embodiments of the utility model, the liquid inlet is arranged in a tapering manner towards the direction close to the accommodating cavity.

[0009] According to some embodiments of the utility model, a sealing cover is further included, the sealing cover covers the liquid inlet, and the sealing cover is detachably connected with the heat dissipation shell.

[0010] According to some embodiments of the utility model, the sealing cover is made of elastic material.

[0011] According to some embodiments of the utility model, the sealing cover body includes first sealing section and second sealing section who are connected with each other, the first sealing section is located inside the containing cavity and blocks the communication between the liquid inlet and the containing cavity, the second sealing section is filled in the liquid inlet.

[0012] According to some embodiments of the utility model, still include a plurality of electronic components, a plurality of electronic components are electrically connected to the second surface of the circuit board, and be in the containing cavity.

[0013] According to some embodiments of the utility model, the heat dissipation shell is metal material.

[0014] According to some embodiments of the utility model, still include protective shell, the protective shell is located at the first surface of the circuit board, so that the detector chip is placed in the protective shell, the protective shell is equipped with the light transmission port, and the light transmission port is on the detection light path of the detector chip.

[0015] The utility model has at least the following beneficial effects:

[0016] In the utility model, the second surface of the circuit board is immersed in the insulating coolant in the containing cavity, and the heat generated by the detector chip is transmitted to the insulating coolant through the circuit board. Compared with the existing detector heat dissipation component relying on metal contact heat dissipation, since the plasticity of metal is poor, it is difficult to completely cover the second surface of the circuit board with uneven surface. The utility model realizes heat dissipation of the detector chip by contacting the second surface of the circuit board with the insulating coolant with high plasticity, which is better in adaptability. At the same time, since the liquid has higher heat capacity than the solid, the flowability of the insulating coolant makes the heat dissipation more uniform, and the heat dissipation speed is improved, the thermal equilibrium can be reached faster, and the heat dissipation efficiency is improved. ACCURACY

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0018] Figure 1 A structure diagram of a non-refrigeration type infrared detector provided by the embodiments of the utility model is shown in the drawings.

[0019] Figure 2 A structure diagram of the liquid inlet and the sealing cover body in cooperation with the installation in Figure 1

[0020] ​Figure 3 Structure diagram of the sealed liquid inlet in another embodiment of the utility model.

[0021] Mark explanation:

[0022] 100-non refrigeration type infrared detector;1-heat dissipation shell;11-contains cavity;12-liquid inlet;2-circuit board;3-detector chip;4-sealing cover;41-first sealing section;42-second sealing section;5-electronic components;6-protection shell;61-translucent port. Specific implementation

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below, obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0024] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), if the specific posture changes, the directional indications also change accordingly.

[0025] In addition, if the embodiments of the utility model involve the description of "first", "second", etc., the description of "first", "second", etc. is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features with "first", "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously meet the scheme. In addition, the technical schemes of each embodiment can be combined with each other, but it must be based on the realization of the person skilled in the art, when the combination of technical schemes appears contradictory or unachievable, it should be considered that the combination of technical schemes does not exist, and is not within the protection scope required by the utility model.

[0026] The utility model provides a kind of non refrigeration type infrared detector, Figures 1 to 3 The utility model provides a kind of non refrigeration type infrared detector.

[0027] As Figure 1As shown, the utility model embodiment provides a kind of non-refrigeration type infrared detector 100, including heat dissipation shell 1, circuit board 2 and detector chip 3, the circuit board 2 has first face and second face, the detector chip 3 is electrically connected with the circuit board 2, and located the first face of the circuit board 2, the heat dissipation shell 1 is located the second face of the circuit board 2, with the circuit board 2 is enclosed to form with containing cavity 11, the containing cavity 11 is filled with insulating coolant.

[0028] In the utility model, the second face of the circuit board 2 is immersed in the insulating coolant in the containing cavity 11, and the heat generated by the detector chip 3 is transmitted to the insulating coolant via the circuit board 2. Compared with the existing detector heat dissipation component relying on metal contact heat dissipation, since the plasticity of metal is poor, it is difficult to completely cover the second face of the circuit board 2 which is not flat. The utility model realizes heat dissipation of the detector chip 3 by contacting the second face of the circuit board 2 with the highly plastic insulating coolant, which is better in adaptability. At the same time, since the liquid has higher heat capacity than the solid, the flowability of the insulating coolant makes the heat dissipation more uniform, and the heat dissipation speed is improved, the thermal equilibrium can be reached faster, and the heat dissipation efficiency is improved.

[0029] Specifically, the insulating coolant can be a liquid such as ultrapure water or a mixture of ethylene glycol and ultrapure water, or a solid-liquid coexistence body such as silica gel or hydrogel.

[0030] As shown, Figure 1 The non-refrigeration type infrared detector 100 further includes a plurality of electronic components 5, which are electrically connected to the second face of the circuit board 2 and located in the containing cavity 11. Specifically, the electronic components 5 are generally capacitors and resistors on the circuit board 2. The plurality of electronic components 5 are completely immersed in the insulating coolant in the containing cavity 11, and heat is transferred from the plurality of electronic components 5 to the insulating coolant by contacting the plurality of electronic components 5 with the insulating coolant, so that the heat generated by the electronic components 5 is directly transmitted to the insulating coolant, and heat dissipation of the plurality of electronic components 5 is realized.

[0031] It should be noted that, in some embodiments, the heat dissipation shell 1 is made of metal, so that the heat of the insulating coolant can be transmitted to the heat dissipation shell 1 and finally dissipated to the outside air, avoiding the accumulation of heat in the insulating coolant due to the inability to dissipate heat, which affects the heat dissipation effect after the detector works for a long time.

[0032] In order to avoid the leakage of the insulation cooling liquid from the gap between the heat dissipation shell 1 and the circuit board 2, in some embodiments, the heat dissipation shell 1 and the circuit board 2 are connected by the sealant. In this way, the gap between the heat dissipation shell 1 and the circuit board 2 is sealed by the sealant, avoiding the leakage of the insulation cooling liquid and affecting the heat dissipation effect.

[0033] Preferably, in some embodiments, as shown in the drawings, Figure 1 The heat dissipation shell 1 is provided with a liquid inlet 12 which communicates with the accommodating cavity 11. In this way, the heat dissipation shell 1 and the circuit board 2 are first bonded by the sealant, and then the insulation cooling liquid is injected into the accommodating cavity 11 through the liquid inlet 12. Compared with the method of injecting the insulation cooling liquid into the accommodating cavity 11 first and then sealing the opening of the heat dissipation shell 1 by the circuit board 2, the method can avoid the early entry of part of the insulation cooling liquid into the gap between the heat dissipation shell 1 and the circuit board 2, which affects the sealing effect of the sealant.

[0034] In order to facilitate the injection of the insulation cooling liquid, in some embodiments, as shown in the drawings, Figure 2 The liquid inlet 12 is tapered towards the accommodating cavity 11. Since the insulation cooling liquid is relatively viscous and the droplets are large, if the diameter of the liquid inlet 12 is too small, it will be difficult to inject. However, if the diameter of the liquid inlet 12 is too large, it will also increase the difficulty of subsequent sealing of the liquid inlet 12. Therefore, the liquid inlet 12 is funnel-shaped, which facilitates the injection of the insulation cooling liquid and does not affect the subsequent sealing of the liquid inlet 12.

[0035] The sealing method of the liquid inlet 12 is various, as shown in the drawings, Figure 3 For the heat dissipation shell 1 made of metal, the liquid inlet 12 can be sealed by laser welding. For the heat dissipation shell 1 made of non-metal, the liquid inlet 12 can be sealed by the sealant.

[0036] It should be noted that the heat dissipation shell 1 made of metal can also be sealed by the sealant.

[0037] When the liquid inlet 12 is sealed by the above sealing method, the insulation cooling liquid cannot be replaced, so preferably, in some embodiments, as shown in the drawings, Figure 2As shown, the non-cooled infrared detector 100 further comprises a sealing cover 4, which covers the liquid inlet 12 and is detachably connected with the heat dissipation shell 1. In this way, when the detector works for a long time, the insulation cooling liquid accumulates a large amount of heat, resulting in a decline in heat dissipation effect. The sealing cover 4 can be removed, and the insulation cooling liquid in the heat dissipation shell 1 can be replaced to ensure good heat dissipation effect.

[0038] Further, in some embodiments, the sealing cover 4 is made of elastic material. Since the sealing cover 4 made of elastic material can produce large deformation, by using a sealing cover 4 with large size, the sealing cover 4 and the liquid inlet 12 are interference-fitted to realize sealing, avoiding leakage of insulation cooling liquid from the gap between the sealing cover 4 and the liquid inlet 12.

[0039] In some embodiments, as shown in Figure 2 The sealing cover 4 comprises a first sealing segment 41 and a second sealing segment 42 connected with each other. The first sealing segment 41 is located inside the containing cavity 11 and blocks the communication between the liquid inlet 12 and the containing cavity 11. The second sealing segment 42 is filled in the liquid inlet 12. In this way, by blocking the communication through the first sealing segment 41 and blocking the liquid inlet 12 through the second sealing segment 42, complete sealing of the liquid inlet 12 is realized to avoid leakage of insulation cooling liquid from the liquid inlet 12.

[0040] Specifically, in some embodiments, as shown in Figure 1 The liquid inlet 12 is arranged at the end of the heat dissipation shell 1 away from the circuit board 2. Since the detection surface of the detector chip 3 is arranged downward during daily work of the non-cooled infrared detector 100, the circuit board 2 is arranged at the bottom of the heat dissipation shell 1. The liquid inlet 12 is arranged at the top of the heat dissipation shell 1, which can reduce the pressure of the insulation cooling liquid on the liquid inlet 12, thereby avoiding sealing failure of the liquid inlet 12.

[0041] In order to protect the detector chip 3, in some embodiments, as shown in Figure 1 The non-cooled infrared detector 100 further comprises a protective shell 6 arranged on the first surface of the circuit board 2. The detector chip 3 is arranged in the protective shell 6. The protective shell 6 is provided with a light transmission opening 61 on the light path of the detector chip 3. In this way, the detector chip 3 is arranged in the protective shell 6, which can avoid damage to the detector chip 3.

[0042] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An uncooled infrared detector, characterized in that, The device includes a heat sink housing, a circuit board, and a detector chip. The circuit board has a first side and a second side. The detector chip is electrically connected to the circuit board and is located on the first side of the circuit board. The heat sink housing is located on the second side of the circuit board and forms a receiving cavity with the circuit board. The receiving cavity is filled with insulating coolant.

2. The uncooled infrared detector as described in claim 1, characterized in that, The heat sink housing and the circuit board are connected by sealant.

3. The uncooled infrared detector as described in claim 2, characterized in that, The heat dissipation housing has a liquid inlet, which is connected to the receiving cavity.

4. The uncooled infrared detector as described in claim 3, characterized in that, The liquid inlet is tapered toward the receiving cavity.

5. The uncooled infrared detector as described in claim 3, characterized in that, It also includes a sealing cover that covers the liquid inlet and is detachably connected to the heat dissipation housing.

6. The uncooled infrared detector as described in claim 5, characterized in that, The sealing cover is made of elastic material.

7. The uncooled infrared detector as described in claim 6, characterized in that, The sealing cover includes a first sealing section and a second sealing section connected to each other. The first sealing section is located inside the receiving cavity and blocks the connection between the liquid inlet and the receiving cavity. The liquid inlet is filled with the second sealing section.

8. The uncooled infrared detector as described in claim 1, characterized in that, It also includes multiple electronic components, which are electrically connected to the second side of the circuit board and are located within the receiving cavity.

9. The uncooled infrared detector as described in claim 1, characterized in that, The heat dissipation housing is made of metal.

10. The uncooled infrared detector as described in claim 1, characterized in that, It also includes a protective housing, which is disposed on the first side of the circuit board so that the detector chip can be placed inside the protective housing. The protective housing has a light-transmitting opening, which is located in the detection light path of the detector chip.

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