Scrubbing device

Abstract

The utility model belongs to the field of semiconductor production and processing, and particularly relates to a scrubbing device which comprises a driving unit, a sweeping unit and a cleaning unit. The sweeping unit and the cleaning unit are installed on the driving unit, and the driving unit drives the sweeping unit and the cleaning unit to do circumferential rotation in the horizontal direction above a chip product to be cleaned. The cleaning unit is used for spraying two-fluid water to the chip product so as to wash the upper surface of the chip product, and the sweeping unit is used for sweeping the upper surface of the chip product; the sweeping unit comprises a sweeping part and a height adjusting assembly; and the height adjusting assembly is connected with the cleaning part, and the height adjusting assembly is used for adjusting the height of the cleaning part relative to the upper surface of the chip product. By the adoption of the scrubbing device, tiny dust adhering to the surface of the chip product in a high-temperature environment can be removed.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of semiconductor production and processing, and particularly relates to a scrubbing device. BACKGROUND

[0002] Modern integrated circuit manufacturing technology usually includes a CMOS manufacturing process. CMOS in the CMOS manufacturing process is an abbreviation of Complementary Metal Oxide Semiconductor. The CMOS manufacturing process specifically includes: cutting a large-size wafer into single chips; adhering the cut chips to a PCB (printed circuit board); electrically connecting the chips to the PCB by using gold wires and performing communication testing; sealing the exposed gold wires by using glue; solidifying the glue by heating or ultraviolet irradiation; and performing performance testing on the encapsulated chips.

[0003] After the CMOS manufacturing process is completed, the chips (hereinafter referred to as chip products) that have passed the performance testing need to be surface cleaned for the next film plating process. Usually, a carrier plate is used to hold the chip products, and then the carrier plate is placed on a turntable of a cleaning device (for example, an ASM ISCM868S device), and the chip product surfaces are cleaned by using two-fluid water (including high-pressure nitrogen gas fluid and deionized water) and centrifugal force.

[0004] Since the CMOS manufacturing process involves the steps of "electrically connecting the chips to the PCB by using gold wires", "sealing the exposed gold wires by using glue", and "solidifying the glue by heating or ultraviolet irradiation", which involve a high-temperature environment, after dust adheres to the chip product surfaces in the high-temperature environment, it is difficult to remove the dust by using two-fluid water (including high-pressure nitrogen gas fluid and deionized water) and centrifugal force. CONTENT OF THE INVENTION

[0005] One of the purposes of the present application is to provide a scrubbing device that can remove dust adhering to chip product surfaces in a high-temperature environment.

[0006] To achieve the above-mentioned purposes and other related purposes, the present application provides a scrubbing device, which comprises a driving unit, a cleaning unit, and a washing unit.

[0007] The cleaning unit and the washing unit are installed on the driving unit, and the driving unit drives the cleaning unit and the washing unit to rotate circumferentially in a horizontal direction above the chip products to be cleaned. The washing unit is used to spray two-fluid water on the chip products to flush the upper surfaces of the chip products, and the cleaning unit is used to clean the upper surfaces of the chip products.

[0008] The cleaning unit comprises a cleaning part and a height adjusting assembly; the height adjusting assembly is connected with the cleaning part, and is used for adjusting the height of the cleaning part relative to the upper surface of the chip product.

[0009] The application has at least the following beneficial effects:

[0010] The cleaning device of the application uses the cleaning unit and the cleaning unit to clean the chip product, and the height adjusting assembly can adjust the distance of the cleaning unit relative to the chip product, so as to improve the cleaning effect and not damage the surface of the chip product. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0012] Figure 1 It is a structural schematic diagram of the cleaning unit according to the embodiment of the application;

[0013] Figure 2 It is a vertical sectional view of the cleaning part according to the embodiment of the application;

[0014] Figure 3 It is a horizontal sectional view of the fixed plate according to the embodiment of the application;

[0015] Figure 4 It is a horizontal sectional view of the limiting plate according to the embodiment of the application;

[0016] ILLUSTRATIVE:

[0017] 10 cleaning part; 20 lifting rod; 30 vertical sleeve; 40 vertical sleeve; 50 fixed plate; 60 limiting plate DETAILED DESCRIPTION

[0018] The embodiments of the application will be described below through specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the application from the disclosure of the specification. The application can also be implemented or applied by different specific embodiments, and various modifications or changes can be made to the details based on different views and applications without departing from the spirit of the application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0019] In the description of the present application, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0020] Referring to Figures 1 to 4 The present application provides a scrubbing device, comprising a driving unit, a cleaning unit and a washing unit. The cleaning unit and the washing unit are mounted on the driving unit, and the driving unit drives the cleaning unit and the washing unit to rotate circumferentially in the horizontal direction above the chip product to be cleaned. The washing unit is used to spray two-fluid water on the chip product to flush the upper surface of the chip product, and the cleaning unit is used to clean the upper surface of the chip product.

[0021] The driving unit comprises a mechanical arm, and the mechanical arm is provided with a mechanical hand towards one side of the upper surface of the chip product. The cleaning unit and the washing unit are mounted on the mechanical hand. During the circumferential rotation of the mechanical hand in the horizontal direction, the mechanical arm rotates at a predetermined angle with the vertical direction to adjust the amplitude of the circumferential rotation of the mechanical hand in the horizontal direction. The predetermined angle can be between 4 degrees and 9 degrees. The frequency of circumferential rotation can be set according to the scrubbing effect, for example, the mechanical hand rotates one circle in the horizontal direction per minute.

[0022] The cleaning unit comprises a cleaning part 10 and a height adjusting assembly.

[0023] Referring to Figure 2 The cleaning part 10 is a sleeve in which a cleaning sponge is mounted. Specifically, the sleeve is provided with an opening and a receiving cavity, and the opening faces downward and communicates with the receiving cavity. One part of the cleaning sponge is accommodated in the receiving cavity, and the other part of the cleaning sponge extends out of the receiving cavity from the opening.

[0024] In some embodiments of the present application, the sleeve comprises a fastener, which can be a bolt, and the sleeve has a hole, and the bolt penetrates into the hole in the horizontal direction to fix the cleaning sponge accommodated in the receiving cavity.

[0025] In some embodiments of the present application, the cleaning sponge can be a PVA (polyvinyl alcohol) sponge strip.

[0026] The height adjusting assembly is connected with the cleaning part 10 and is used to adjust the height of the cleaning sponge of the cleaning part 10 relative to the upper surface of the chip product, so as to improve the cleaning effect and not damage the upper surface of the chip product.

[0027] Referring to Figure 1 The height adjusting assembly comprises a lifting rod 20, a vertical sleeve 30 and a vertical sleeve 40.

[0028] The lifting rod 20 is connected with the cleaning part 10, specifically, the lifting rod 20 is connected with the sleeve top of the cleaning part 10, and the sleeve of the cleaning part 10 is driven by the lifting rod 20 to move up and down, thereby controlling the height of the cleaning sponge relative to the upper surface of the chip product, so as to improve the cleaning effect and not damage the surface of the chip product.

[0029] In some embodiments of the present application, the lifting rod 20 and the cleaning part 10 are detachably connected, so as to facilitate replacement of the cleaning part 10 and the cleaning sponge. Specifically, the sleeve top is provided with a through hole, and the lifting rod 20 is arranged in the through hole of the sleeve top. The sleeve further comprises a fastener, and the fastener is used to fix the lifting rod 20 in the through hole of the sleeve. For example, the fastener is a bolt, which passes through the peripheral wall of the sleeve in the horizontal direction and extends into the through hole of the sleeve top to abut against the lifting rod 20 in the through hole of the sleeve top.

[0030] The vertical sleeve 30 is sleeved on the lifting rod 20, and the vertical sleeve 30 is connected with the lifting rod 20 through threads. The lower end of the lifting rod 20 extends from the lower part of the vertical sleeve 30, and the lower end of the lifting rod 20 is connected with the sleeve top of the cleaning part 10.

[0031] The vertical sleeve 40 is sleeved on the upper segment of the vertical sleeve 30, and the vertical sleeve 40 can rotate relative to the vertical sleeve 30 and move in the vertical direction. The lower segment of the vertical sleeve 30 extends from below the vertical sleeve 40 and is located outside the vertical sleeve 40. The upper end of the lifting rod 20 is connected with the vertical sleeve 40 after passing through the upper segment of the vertical sleeve 30, and the lifting rod 20 can be driven to rotate by rotating the vertical sleeve 40. The vertical sleeve 30 and the lifting rod 20 are connected through threads, so that the lifting rod 20 moves in the vertical direction relative to the vertical sleeve 30 at the same time. The range of vertical direction movement can be determined according to the height of the cleaning sponge relative to the upper surface of the chip product and the thickness of the cleaning sponge. In an example, the range of vertical direction movement can be 20-30mm, preferably 25mm.

[0032] In some embodiments of the present application, the height adjusting assembly further comprises a boss, which is arranged on the peripheral wall of the vertical sleeve 40 in the circumferential direction, so as to facilitate rotation of the vertical sleeve 40 by a finger through the boss. The side of the boss away from the vertical sleeve 40 is provided with a stripe, so as to increase the friction between the finger and the boss.

[0033] The cleaning unit comprises a plurality of spray heads and water pipes connected to the spray heads. The water pipes provide the spray heads with cleaning liquid, and the spray heads clean the chip products by spraying the cleaning liquid onto the upper surfaces of the chip products. The cleaning liquid can be two-fluid water, which is suitable for removing tiny particles and contaminants, and the two-fluid water comprises a high-pressure nitrogen fluid and deionized water.

[0034] In some embodiments of the present application, different spray heads can be supplied with different cleaning liquids, so as to adjust the concentration or ratio of different cleaning liquids.

[0035] Referring to Figure 3 The driving unit comprises a plurality of fixing plates 50, which are used to mount the cleaning unit and the cleaning unit on the mechanical arm of the driving unit.

[0036] In some embodiments of the present application, the fixing plate 50 is internally provided with a mounting hole. The vertical sleeve 30 is arranged in the mounting hole of the fixing plate 50. The fixing plate 50 further comprises a fastener, which is used to fix the vertical sleeve 30 in the mounting hole of the fixing plate 50. The fastener can be a bolt, which passes through the inside of the fixing plate in the horizontal direction and extends into the mounting hole of the fixing plate 50 to abut against the vertical sleeve 30 arranged in the mounting hole of the fixing plate 50.

[0037] In some embodiments of the present application, the plurality of spray heads of the cleaning unit are arranged around the cleaning sponge of the cleaning unit. After the cleaning sponge sweeps away the dust on the chip products, the dust falls within the spraying range of the spray heads arranged around the cleaning sponge, and the two-fluid water is sprayed through the spray heads, so that the dust is washed away by the two-fluid water and moves away from the chip products.

[0038] Referring to Figure 4 The scrubbing device comprises a limiting plate 60, which is used to limit the sweeping range and the cleaning range of the cleaning unit and the cleaning unit in the horizontal direction along the circumference above the chip products to be cleaned, so as to reduce the cleaning and washing of the cleaning unit and the cleaning unit on the areas other than the chip products.

[0039] The limiting plate 60 is mounted on the turntable of the cleaning equipment (for example, the ASM ISCM868S equipment) and is placed around the carrier plate carrying the chip products.

[0040] In some embodiments of the present application, the side surface of the limiting plate 60 facing the carrier plate is provided with a wave-shaped or zigzag-shaped groove. After the cleaning sponge of the cleaning unit contacts the side surface of the limiting plate 60 facing the carrier plate, the cleaning sponge is bent along the shape of the groove, and then sweeps the chip products on the carrier plate. The groove can also be used to deflect the two-fluid water sprayed by the cleaning unit after the two-fluid water is sprayed onto the side surface of the limiting plate 60 facing the carrier plate, and then the two-fluid water is used to clean the chip products on the carrier plate.

[0041] In some embodiments of the present application, a plurality of carrier plates are arranged circumferentially on the turntable, and each of the carrier plates is provided with a limiting plate 60 on each side. Therefore, two limiting plates are arranged between two adjacent carrier plates, and the limiting plates are arranged at a preset angle with respect to each other. In order to facilitate disassembly, the two limiting plates 60 between the two adjacent carrier plates can be combined into one whole as shown in Figure 4 and are integrally formed.

[0042] The above description is only preferred embodiments of the present application, and it should be pointed out that, for those skilled in the art, without departing from the technical principles of the present application, a number of improvements and replacements can be made, and these improvements and replacements should also be considered as the protection scope of the present application.

Claims

1. A scrubbing device, characterized in that, include: Drive unit, sweeping unit, and cleaning unit; The cleaning unit and the washing unit are mounted on the drive unit. The drive unit drives the cleaning unit and the washing unit to rotate circumferentially in the horizontal direction above the chip product to be cleaned. The washing unit is used to spray two fluids of water onto the chip product to rinse the upper surface of the chip product, and the cleaning unit is used to clean the upper surface of the chip product. The cleaning unit includes a cleaning section and a height adjustment component; the height adjustment component is connected to the cleaning section and is used to adjust the height of the cleaning section relative to the upper surface of the chip product.

2. The scrubbing device according to claim 1, characterized in that, The height adjustment assembly includes a lifting rod, a vertical sleeve, and a vertical sleeve. The lifting rod is connected to the cleaning unit; The vertical sleeve is fitted onto the lifting rod, and the vertical sleeve is connected to the lifting rod by a thread; The vertical sleeve is fitted onto the upper section of the vertical sleeve, and the vertical sleeve is rotatable relative to the vertical sleeve and can move in the vertical direction; the lower section of the vertical sleeve extends from below the vertical sleeve; the upper end of the lifting rod passes through the upper section of the vertical sleeve and is connected to the vertical sleeve. The lifting rod can be driven to rotate by rotating the vertical sleeve, and at the same time the lifting rod moves in the vertical direction relative to the vertical sleeve.

3. The scrubbing device according to claim 2, characterized in that, The height adjustment assembly includes a boss, which is circumferentially disposed on the outer peripheral wall of the vertical sleeve.

4. The scrubbing device according to claim 1, characterized in that, The cleaning unit includes multiple nozzles and water pipes connected to the nozzles. The water pipes are used to supply cleaning fluid to the nozzles, and the nozzles are used to clean the chip product by spraying the cleaning fluid onto the upper surface of the chip product.

5. The scrubbing device according to claim 2, characterized in that, The drive unit includes multiple fixing plates, which are used to mount the sweeping unit and the cleaning unit on the drive unit.

6. The scrubbing device according to claim 5, characterized in that, The fixing plate has mounting holes inside, and the vertical sleeve passes through the mounting holes of the fixing plate.

7. The scrubbing device according to claim 1, characterized in that, The cleaning section is a sleeve fitted with a cleaning sponge.

8. The scrubbing device according to claim 1, characterized in that, The wiping device includes a limiting plate, which limits the wiping range and cleaning range of the cleaning unit and the cleaning unit as they rotate circumferentially in the horizontal direction above the chip product.

9. The scrubbing device according to claim 8, characterized in that, The limiting plate is installed on the turntable of the cleaning equipment and placed around the carrier plate that carries the chip product. The side of the limiting plate facing the carrier plate has a wavy or sawtooth groove.

10. The scrubbing device according to claim 9, characterized in that, The turntable has multiple carrier plates arranged around its circumference, and each carrier plate has a limiting plate on each side; the two limiting plates between two adjacent carrier plates form a whole, and the two limiting plates are integrally formed.

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