Circuit board of PV boost circuit

Abstract

The utility model discloses a circuit board of a PV boost circuit, a base plate of the circuit board comprises a first area and a second area, the first area is used for placing a boost IGBT, the second area is used for placing a fan, and the distance between the second area and the first area is smaller than a preset distance. And an air outlet of the fan in the second area faces the boost IGBT in the first area. According to the utility model, the first area and the second area which are close to each other are arranged on the circuit board base plate of the PV boost circuit, the boost IGBT and the fan are respectively arranged in the two areas, and the air outlet of the fan faces the boost IGBT, so that the fan can blow air to the boost IGBT at a short distance, the temperature of the boost IGBT can be reduced, the temperature rise problem of the boost IGBT can be obviously improved, and the service life of the boost IGBT is prolonged. And the heat problem of the circuit board is correspondingly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of energy storage inverter, more particularly to a kind of circuit board of PV boost circuit. BACKGROUND

[0002] Household energy storage inverter is mainly composed of PV (photovoltaic) boost circuit, battery boost circuit and inverter circuit. Among them, boost IGBT (Insulate-Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) is included in PV boost circuit, and the loss of boost IGBT includes switching loss and conduction loss. Because its loss is larger, its temperature rise is higher. Its temperature rise problem becomes the problem that the present technical personnel in the field urgently need to solve. SUMMARY

[0003] Therefore, the utility model aims to provide a kind of circuit board of PV boost circuit, can make the temperature rise problem of boost IGBT be obviously improved, and circuit board heat problem is also improved accordingly.

[0004] In order to achieve the above purpose, the utility model provides the following technical scheme:

[0005] A kind of circuit board of PV boost circuit, the bottom plate of the circuit board includes first area and second area, the first area is used to place boost IGBT, the second area is used to place fan, the distance between the second area and the first area is less than preset distance, the air outlet of fan in the second area is towards boost IGBT in the first area.

[0006] In one embodiment, it further includes third area, the third area is used to place boost diode, and is located at the side of the first area away from the second area, so that the first area is located between the second area and the third area.

[0007] In one embodiment, the distance between the third area and the first area is not less than the preset distance.

[0008] In one embodiment, the first area and / or the third area is further provided with radiator, and the radiator is arranged below the boost IGBT and / or the boost diode.

[0009] In one embodiment, the number of boost IGBT is 4, and the two sides of each boost IGBT are respectively towards the second area and the third area.

[0010] In one embodiment, the number of fans is 2, and the air outlet area of the fan air outlet covers the side of the boost IGBT facing the second region.

[0011] In one embodiment, the bottom plate is a printed circuit board, and a metal conductive layer with a thickness of 3-6 ounces is laid on the printed circuit board.

[0012] In one embodiment, the boost IGBT is connected to the bottom plate by welding.

[0013] The utility model provides a kind of circuit board of PV boost circuit, the bottom plate of the circuit board includes first area and second area, the first area is used to place boost IGBT, the second area is used to place fan, the distance between the second area and the first area is less than preset distance, the air outlet of fan in the second area faces boost IGBT in the first area.The utility model is provided with first area and second area close to each other on the circuit board bottom plate of PV boost circuit, two regions are placed with boost IGBT and fan respectively, and the air outlet of fan faces boost IGBT, whereby fan can close range to boost IGBT and blow, it helps to reduce the temperature of boost IGBT, so the utility model can make that boost IGBT temperature rise problem is obviously improved, and circuit board heat problem is also improved accordingly. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced below, and obviously, the drawings in the following description are only part of the embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative labor.

[0015] Figure 1 The utility model provides the structure diagram of circuit board of PV boost circuit for the embodiment. DETAILED DESCRIPTION

[0016] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0017] Figure 1The utility model provides a structure schematic drawing of the circuit board of PV boost circuit, and the following is based on Figure 1 A PV boost circuit is specifically described.

[0018] The utility model provides a kind of circuit board of PV boost circuit, the bottom plate of circuit board includes first area and second area, first area is used to place boost IGBT, second area is used to place fan, the distance between second area and first area is less than preset distance, the air outlet of fan in second area is towards boost IGBT in first area.

[0019] It needs to be explained that, preset distance can be set according to actual needs, if the distance between two regions is less than preset distance, it is close, otherwise, it is far apart.The circuit board in the utility model embodiment can be PCB board, the bottom plate of PCB board includes first area and second area, first area places boost IGBT, second area places fan, the distance between two regions is less than preset distance, indicating that two regions are close, and the device between two regions is also close;Therefore, fan can be close to boost IGBT and blow, help the cooling of boost IGBT.

[0020] The utility model is provided with first area and second area that are close to each other on the bottom plate of the circuit board of PV boost circuit, two regions are placed with boost IGBT and fan respectively, and the air outlet of fan is towards boost IGBT, so fan can be close to boost IGBT and blow, help to reduce the temperature of boost IGBT, so the utility model can make that the temperature rise problem of boost IGBT is obviously improved, and circuit board heat problem is also improved accordingly.

[0021] The utility model embodiment provides a kind of circuit board of PV boost circuit, it can also include third area, third area is used to place boost diode, and it is located in the side of first area away from second area, so that first area is located between second area and third area.The distance between third area and first area is not less than preset distance.

[0022] It should be noted that the boost diode only has conduction loss, and the boost IGBT loss has switching loss + conduction loss, so the general IGBT loss is greater than the diode loss; because the thermal resistances of the two are the same, the IGBT temperature rise is greater than the diode. Based on this, the boost IGBT is placed close to the air outlet position in the embodiment of the utility model, the boost diode is placed in the third area, and the third area is located on the side of the first area away from the second area, and the first area is located between the second area and the third area.

[0023] In addition, in order to reduce the electromagnetic interference of the power circuit to other circuits, the distance between the third area and the first area can also be set to be not less than a preset distance, that is, the distance between the two is large, and the distance between the boost IGBT and the boost diode is large.

[0024] The circuit board of the PV boost circuit provided in the embodiment of the utility model further comprises a heat sink arranged below the boost IGBT and / or the boost diode in the first area and / or the third area.

[0025] It should be noted that, in order to further improve the temperature rise problem, the embodiment of the utility model can also be provided with a corresponding support on the upper part of the first area and / or the second area, and the boost IGBT or the boost diode is below the support, and the heat sink is above the support, and the boost IGBT and the boost diode are not attached to the heat sink.

[0026] The circuit board of the PV boost circuit provided in the embodiment of the utility model comprises four boost IGBTs, and the two sides of each boost IGBT are respectively directed to the second area and the third area. The number of fans is two, and the air outlet area of the fan air outlet covers the side of the boost IGBT directed to the second area. The bottom plate is a printed circuit board, and a metal conductive layer with a thickness of 3-6 ounces is laid on the printed circuit board. The boost IGBT is connected to the bottom plate by welding.

[0027] The number of boost IGBTs in the utility model can be four, the number of fans can be two, and each boost IGBT has two sides directed to the second area and the third area, so as to be parallel and arranged in the first area; the air outlet area of the fan air outlet covers the side of the boost IGBT directed to the second area, so that the boost IGBT can obtain air blowing and realize cooling. In addition, the bottom plate can be a printed circuit board, and a metal conductive layer with a thickness of 3-6 ounces is laid on the printed circuit board, and the boost IGBT is connected to the bottom plate by welding, so as to realize stable installation of the circuit board and improve its service life.

[0028] In addition, the part of the above technical solution of the embodiments of the present application which is consistent with the implementation principle of the corresponding technical solution in the prior art is not described in detail to avoid excessive repetition.

[0029] The above description of disclosed embodiments enables one skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board for a PV boost circuit, characterized in that, The circuit board base plate includes a first area and a second area. The first area is used to place the boost IGBT, and the second area is used to place the fan. The distance between the second area and the first area is less than a preset distance. The air outlet of the fan in the second area faces the boost IGBT in the first area.

2. The circuit board according to claim 1, characterized in that, It also includes a third region for placing the boost diode and located on the side of the first region away from the second region, such that the first region is located between the second region and the third region.

3. The circuit board according to claim 2, characterized in that, The distance between the third region and the first region is not less than the preset distance.

4. The circuit board according to claim 3, characterized in that, A heat sink is also provided in the first region and / or the third region, and the heat sink is located below the boost IGBT and / or the boost diode.

5. The circuit board according to claim 4, characterized in that, The number of boostIGBTs is 4, and the two sides of each boostIGBT face the second region and the third region respectively.

6. The circuit board according to claim 5, characterized in that, The number of fans is two, and the air outlet area of ​​the fans covers the side of the boostIGBT facing the second area.

7. The circuit board according to claim 6, characterized in that, The base plate is a printed circuit board, on which a 3-6 ounce thick conductive metal layer is laid.

8. The circuit board according to claim 7, characterized in that, The boostIGBT is welded to the base plate.

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