Fixing device for chip on board (COB) module driving surface punching

Abstract

The utility model provides a fixing device for COB module driving surface punching, and relates to the technical field of COB module production equipment, a COB module comprises a PCB, the fixing device for COB module driving surface punching comprises a base and a pressing mechanism which are both arranged on a working table of reflow soldering equipment, the base is provided with an avoiding groove, opposite edges of the avoiding groove are used for supporting the PCB, the pressing mechanism is used for pressing the PCB, and the PCB is provided with a plurality of grooves. The pressing mechanism is provided with a flat pressing part, the flat pressing part abuts against the edge area of the face, away from the workbench face, of the PCB, and the edge area at least can cover the area, making contact with the edge of the receding groove, of the PCB. According to the utility model, the warping of the PCB is corrected through the hold-down mechanism in the process of driving surface punching, the warping degree of the PCB is corrected to a certain extent, and the probability that a driving circuit element flies out in the process of punching is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to COB module production equipment technical field, especially in kind with fixing device for COB module drive surface piece. BACKGROUND

[0002] COB (Chip on Board) module is a kind of packaging technology that LED chip is directly welded on printed circuit board (PCB), and in the production process of COB module, drive surface piece is a key step, since it involves the paste mounting of drive circuit element to PCB, therefore, the step is crucial to ensure the electrical connection and overall performance of module.

[0003] At present, there are two kinds of manufacturing process routes in COB module industry, which are "first drive then lamp" process and "first lamp then drive" process. Among them, "first drive then lamp" process refers to first drive surface piece, then lamp surface LED chip transfer, relative to "first drive then lamp" process, "first lamp then drive" process is to package LED chip on PCB first, then drive surface piece.

[0004] However, in the process of "first lamp then drive" process, when drive surface piece is carried out after lamp sealing, drive circuit element needs to be accurately pasted on the specified position of PCB using chip mounter first, and solder paste is printed on the pad that needs to be welded on drive surface to ensure good contact between drive circuit element and pad, then PCB with pasted drive circuit element is sent into reflow soldering furnace, and through heating, solder paste is melted to make drive circuit element and PCB welded together. Since the high temperature of reflow soldering treatment is high, PCB is prone to warping, at this time, drive circuit element is prone to fly out in the process of piece, resulting in abnormal drive surface piece process, product failure and material loss, and high repair rate, and since the melting point of solder paste on drive surface is high, pad is also prone to fall off in actual repair process, resulting in COB module scrap. UTILITY MODEL CONTENTS

[0005] Therefore, the utility model aims at providing a kind of COB module drive surface piece fixing device, which can correct the warping of PCB in the process of drive surface piece, correct the warping degree of PCB to a certain extent, and reduce the probability of drive circuit element flying out in the process of piece.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a kind of COB module driving surface piece with fixing device, the COB module includes PCB board, the COB module driving surface piece with fixing device includes base, pressing mechanism, base is movably arranged on the worktop of reflow soldering equipment, the base is equipped with a avoiding groove, the opposite edge of the avoiding groove is used to support the PCB board, pressing mechanism is arranged on the worktop of reflow soldering equipment, the pressing mechanism is equipped with a flat pressing portion, and the flat pressing portion is pressed on the edge area of the one side of the PCB board away from the worktop, and the edge area can at least partially cover the area of the PCB board and the edge of the avoiding groove contact.

[0008] The utility model has at least the following beneficial effects: first, the PCB board is placed flat on the base, and an avoiding groove is provided on the base to prevent the lamp beads protruding from the surface of the PCB board 100 from being crushed or physically contacted and broken, then the flat pressing portion of the pressing mechanism is pressed on the edge portion of the one side of the PCB board adhering to the driving circuit element, so that the upper and lower clamping flat forces are formed between the two side edges of the avoiding groove and the flat pressing portion, and the warping degree of the PCB board is corrected to a certain extent during reflow soldering.

[0009] In addition, the COB module driving surface piece with fixing device according to the utility model has the following additional technical features.

[0010] Further, the top of the edge of the avoiding groove is a flat surface to support the PCB board.

[0011] Further, the top of the edge of the avoiding groove is a flat surface and is provided with a protrusion, the protrusion is away from the avoiding groove, the height of the protrusion matches the thickness of the PCB board, and the flat area between the protrusion and the avoiding groove is used to support the PCB board.

[0012] Further, the pressing mechanism includes a pressing plate, the pressing plate is located above the PCB board, and the side of the pressing plate close to the PCB board is a flat surface to form the flat pressing portion.

[0013] Further, the area of the side of the pressing plate close to the PCB board is greater than the area of the top of the edge of the avoiding groove.

[0014] Further, the pressing mechanism further includes a lifting assembly, the lifting assembly is connected with the pressing plate to drive the vertical movement of the pressing plate relative to the surface of the PCB board.

[0015] Further, the lifting assembly includes a lifting cylinder and a fixed seat, the telescopic rod of the lifting cylinder is connected with the pressing plate, the fixed seat is arranged on the reflow soldering equipment, and the cylinder body of the lifting cylinder is connected with the fixed seat.

[0016] Further, the base is provided with a sliding block matched with a sliding rail provided on a workbench of a reflow soldering device. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view of an embodiment of the present application;

[0018] Figure 2 is a side view of an embodiment of the present application;

[0019] Figure 3 is a side view of another embodiment of the present application;

[0020] Explanation of Main Elements:

[0021] PCB board 100, sliding block 120, base 200, avoiding groove 210, protrusion 211, pressing mechanism 300, pressing plate 310, flat pressing part 311, lifting assembly 320, lifting cylinder 321, fixing seat 322, sliding rail 400;

[0022] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the related drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixedly attached" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. As used herein the terms "vertical", "horizontal", "left", "right", and the like are merely used for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] In the process of the "lamp first and drive second" process, after the lamp is sealed, the driving surface is punched, the driving circuit element is accurately pasted on the specified position of the PCB board by using the chip mounter, the solder paste is printed on the pad which needs to be welded on the driving surface, so that the good contact of the driving circuit element and the pad is guaranteed, then the PCB board with the pasted driving circuit element is sent into the reflow soldering furnace, the solder paste is melted by heating, the driving circuit element and the PCB board are welded together. Because the high temperature of the reflow soldering treatment is high, the PCB board is prone to warping, at this time, because the PCB board is warped, the driving circuit element is prone to fly out in the punching process, which causes the abnormality of the driving surface punching process, causes the product defect and material loss, the maintenance rate is high, and because the solder paste of the driving surface has a high melting point, the pad is also prone to falling off in the actual repair process, which causes the COB module to be scrapped. In view of this, the utility model provides a kind of COB module driving surface punching fixed device, the edge portion of the double face of PCB board is fixed during reflow soldering treatment, the warping degree of PCB board is corrected to a certain extent, and the probability of driving circuit element flying out in the punching process is reduced.

[0027] Specifically, please refer to Figures 1 to 3 A kind of COB module driving surface punching fixed device is provided, the COB module includes PCB board 100, LED lamp bead is encapsulated on the corresponding area on one surface of PCB board 100, driving circuit element is adhered on the other surface opposite to PCB board 100.The COB module driving surface punching fixed device includes base 200, compression mechanism 300, base 200 is movably arranged on the workbench of reflow soldering equipment (not shown in the drawings), so that base 200 can be moved to the specified station on the workbench, base 200 is provided with avoiding slot 210, avoiding slot 210 both sides edge supports PCB board 100 when using, one side of PCB board 100 encapsulating LED lamp bead faces avoiding slot 210, so that the lamp bead protruding from the surface of PCB board 100 can be prevented from being broken by extrusion or physical contact when PCB board 100 is placed on base 200.Compression mechanism 300 is arranged on the workbench of reflow soldering equipment, compression mechanism 300 is provided with a flat pressing part 311, and the edge portion of the side of PCB board 100 adhering driving circuit element is pressed by the flat pressing part during work, it should be noted that the edge portion of the side of PCB board 100 adhering driving circuit element is not adhered to the driving circuit element pressed by compression mechanism 300.

[0028] In order to be able to fix the PCB 100 during the reflow soldering process to correct the warping of the PCB to some extent, the pressing mechanism 300 is pressed against the edge of the side of the PCB 100 on which the driving circuit elements are attached to cover at least the area of the side of the PCB 100 on which the LED lamp beads are packaged and which is in contact with the edge of the avoiding groove 210. For example, the edge of the side of the PCB 100 on which the driving circuit elements are attached is completely covered by the pressing mechanism 300. For another example, the edge of the side of the PCB 100 on which the driving circuit elements are attached is partially covered by the pressing mechanism 300, and the edge of the side of the PCB 100 on which the driving circuit elements are attached (excluding the area corresponding to the area of the side of the PCB 100 on which the LED lamp beads are packaged and which is in contact with the edge of the avoiding groove 210) is also covered by the pressing mechanism 300.

[0029] In some optional embodiments, as shown in Figure 2 In order to better support the PCB 100, the top of the edge of the avoiding groove 210 is flat, and the edge of the side of the PCB 100 on which the LED lamp beads are packaged is placed flat on the top of the edge of the avoiding groove 210. It should be noted that the edge of the side of the PCB 100 on which the LED lamp beads are packaged is the area on which the LED lamp beads are not packaged.

[0030] In some optional embodiments, as shown in Figure 3 In order to better support the PCB 100 and facilitate the placement of the PCB 100 on the base 200, the top of the edge of the avoiding groove 210 is flat, and a protrusion 211 is arranged on the top of the edge of the avoiding groove 210. The protrusion 211 is away from the avoiding groove 210, so that the planar area between the protrusion 211 and the avoiding groove 210 can support the PCB 100, and the protrusion 211 can also limit the PCB 100 to prevent the PCB 100 from sliding along the width direction of the avoiding groove 210 and affecting the precision of the driving surface assembly. In order to better press the flat pressing part against the surface of the PCB 100, the height of the protrusion 211 is equal to the thickness of the PCB 100. At this time, the area of the flat pressing part is larger than the top surface of the protrusion 211, and part of the area of the flat pressing part can stably press against the PCB 100, and another part of the area of the flat pressing part can stably press against the top surface of the protrusion 211. It can be understood that the part of the flat pressing part that can press against the top surface of the protrusion 211 can also be the part that completely covers the top surface of the protrusion 211.

[0031] In some optional embodiments, as shown in Figure 1As shown, the pressing mechanism 300 comprises a pressing plate 310, which is located above the PCB board 100, and the side of the pressing plate 310 close to the PCB board 100 is a plane to form a flat pressing part 311. In use, the flat pressing part 311 is flatly pressed on the PCB board 100, so that the warping degree of the PCB board can be corrected to a certain extent during the reflow soldering process through the upper and lower clamping of the two side edges of the avoiding groove 210 and the flat pressing part 311.

[0032] In some optional embodiments, as shown in Figure 1 As shown, the area of the side of the pressing plate 310 close to the PCB board 100 is greater than the area of the top of the edge of the avoiding groove 210, so that the part of the edge area of the PCB board 100 can be better clamped through the upper and lower clamping of the two side edges of the avoiding groove 210 and the flat pressing part 311.

[0033] In some optional embodiments, as shown in Figure 1 As shown, the pressing mechanism 300 further comprises a lifting assembly 320 connected with the pressing plate 310, through which the pressing plate 310 can be automatically lifted and lowered to facilitate the placement and pressing of the PCB board 100, and the pressing force of the pressing plate 310 on the PCB board 100 can also be adjusted through the lifting assembly 320, so as to avoid damaging the PCB board 100 due to excessive pressing force, and to avoid reducing the correction effect due to insufficient pressing force, and to avoid affecting the precision of the driving surface part due to the position deviation of the PCB board 100 on the base 200.

[0034] In some optional embodiments, as shown in Figure 1 As shown, the lifting assembly 320 comprises a lifting cylinder 321 and a fixed seat 322, the telescopic rod of the lifting cylinder 321 is connected with the pressing plate 310, the fixed seat 322 is fixedly installed on the reflow soldering equipment, the position of the fixed seat 322 corresponds to the working area, and the cylinder body of the lifting cylinder 321 is connected with the fixed seat 322. In use, when the base 200 moves to the corresponding working position on the workbench surface of the reflow soldering equipment, the base 200 stops moving, the lifting cylinder 321 on the fixed seat 322 acts and drives the pressing plate 310 to move downward, so that the pressing plate 310 is pressed on the PCB board 100 accurately placed on the base 200 with appropriate pressure.

[0035] In some optional embodiments, as shown in Figure 1 As shown, the base 200 is provided with a sliding block 120 matched with a sliding rail 400 provided on the workbench surface of the reflow soldering equipment. In order to ensure the working precision, high-precision sliding rail 400 and sliding block 120 can be selected, and the sliding rail 400 is fixed on the workbench surface of the reflow soldering equipment, and the PCB board 100 is accurately moved to the working area of the corresponding working position on the workbench surface through the precise sliding of the sliding block 120 on the sliding rail 400, so as to ensure the precision of the driving surface part.

[0036] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the protection scope of the utility model. It should be pointed out that for ordinary skilled in the art, on the premise of not departing from the utility model concept, a number of modifications and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model should be subject to the appended claims.

Claims

1. A fixing device for mounting parts on the drive surface of a COB module, wherein the COB module includes a PCB board, characterized in that... The fixing device for the COB module drive surface assembly includes: The base is movably mounted on the worktable of the reflow soldering equipment. The base is provided with a clearance groove, and the opposite edge of the clearance groove is used to support the PCB board. A clamping mechanism is provided on the worktable of the reflow soldering equipment. The clamping mechanism is provided with a flat pressing part, and the flat pressing part presses against the edge area of ​​the PCB board away from the worktable surface. The edge area can at least partially cover the area where the PCB board contacts the edge of the clearance groove.

2. The fixing device for fixing parts for driving surface of COB module according to claim 1, characterized in that, The top edge of the clearance groove is a flat surface to support the PCB board.

3. The fixing device for fixing parts for driving the COB module according to claim 1, characterized in that, The top of the edge of the clearance groove is a flat surface with a protrusion. The protrusion is away from the clearance groove, and the height of the protrusion matches the thickness of the PCB board. The flat area between the protrusion and the clearance groove is used to support the PCB board.

4. The fixing device for fixing parts for driving the COB module according to any one of claims 1 to 3, characterized in that, The pressing mechanism includes a pressure plate located above the PCB board, and the side of the pressure plate closest to the PCB board is a flat surface to form the flat pressing part.

5. The fixing device for fixing parts for driving the COB module according to claim 4, characterized in that, The area of ​​the pressure plate on the side closest to the PCB board is larger than the area of ​​the top edge of the clearance groove.

6. The fixing device for fixing parts for driving the COB module according to claim 4, characterized in that, The clamping mechanism also includes a lifting assembly, which is connected to the pressure plate to drive the pressure plate to move vertically relative to the surface of the PCB board.

7. The fixing device for fixing parts for driving surface of COB module according to claim 6, characterized in that, The lifting assembly includes: A lifting cylinder, wherein the extension rod of the lifting cylinder is connected to the pressure plate; A fixed base is provided on the reflow soldering equipment, and the cylinder body of the lifting cylinder is connected to the fixed base.

8. The fixing device for fixing parts for driving surface of COB module according to claim 4, characterized in that, The base is equipped with a slider that matches the slide rail on the worktable of the reflow soldering equipment.

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