Inductance device and electronic equipment

Abstract

The utility model belongs to the technical field of inductors, and discloses an inductance device and electronic equipment, the inductance device comprises a magnet and a heat dissipation assembly, the magnet is provided with a heat absorption end, a heat dissipation end and a first through hole penetrating through the heat absorption end and the heat dissipation end; and the heat dissipation assembly comprises a heat dissipation plate arranged on the outer surface of the magnet and a heat conduction piece arranged in the first through hole in a penetrating mode, and the heat dissipation plate is connected with the heat conduction piece. The inductance device and the electronic equipment provided by the utility model can have a shorter heat dissipation path, and the heat dissipation efficiency and the heat dissipation effect are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of inductance, especially inductance device and electronic equipment. BACKGROUND

[0002] Inductance is the element that can convert electrical energy into magnetic energy and store it, and is one of the key components in the power module. Inductance components are generally composed of a magnetic core, a winding (copper wire), a packaging material, etc. During the operation of the inductance, the magnetic core and the winding will convert part of the electrical energy into heat energy, resulting in energy loss. When the power module is running, the higher the switching frequency and the larger the current, the more heat the inductance generates. If the generated heat energy accumulates near the inductance and cannot be smoothly discharged to the outside, the temperature of the inductance will rise rapidly, affecting its normal and stable operation, and even causing the machine to burn out.

[0003] One application of inductance is in power modules. Specifically, in the mainboard of the server / communication field, the power module contains a large number of DC / DC circuits, and a large amount of heat is generated when the transistors in the DC / DC circuit are working, thereby increasing the temperature rise of the power module.

[0004] In the prior art, the inductance applied in the power module generally includes a magnet, a terminal arranged on the magnet, and a heat dissipation copper plate, wherein the heat dissipation channel is arranged on the outer periphery of the magnet. Moreover, the heat absorbing surface and the heat dissipation surface of the heat dissipation copper plate are usually opposite sides of the magnet, resulting in a long heat dissipation path for the heat transferred from the heat absorbing surface to the heat dissipation surface, thereby affecting the heat dissipation efficiency. SUMMARY

[0005] The purpose of the utility model is to provide an inductance device and electronic equipment to solve the technical problems of long heat dissipation path and low heat dissipation efficiency in the prior art.

[0006] According to the above idea, the technical scheme adopted by the utility model is as follows:

[0007] The inductance device comprises:

[0008] a magnet, the magnet having a heat absorbing end, a heat dissipation end, and a first through hole penetrating through the heat absorbing end and the heat dissipation end;

[0009] a heat dissipation assembly comprising a heat dissipation plate arranged on the outer surface of the magnet and a heat conducting member penetrating through the first through hole, the heat dissipation plate being connected with the heat conducting member.

[0010] As a preferred embodiment, the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate being in contact with the heat dissipation end, the second heat dissipation plate being in contact with the heat absorbing end, and the heat conducting member being connected between the first heat dissipation plate and the second heat dissipation plate.

[0011] Preferably, the heat-conducting component includes a first heat-conducting body and a second heat-conducting body connected together, wherein the first heat-conducting body is integrally formed with the first heat sink plate, and the second heat-conducting body is integrally formed with the second heat sink plate.

[0012] Preferably, the heat-conducting component further includes a heat-conducting connector disposed between the first heat-conducting body and the second heat-conducting body, wherein the thermal conductivity of the heat-conducting connector is greater than or equal to the thermal conductivity of the first heat sink, and the thermal conductivity of the first heat sink is greater than or equal to the thermal conductivity of the second heat sink.

[0013] Preferably, the inductor further includes a connection terminal wound around a magnet, the magnet having a first side and a second side opposite to the first side, and the magnet having a second through hole penetrating the first side and the second side, the second through hole being independent of the first through hole;

[0014] The end of the connecting terminal extends beyond the heat dissipation end, the connecting terminal is in the shape of an inverted U, and the middle part of the connecting terminal passes through the second through hole.

[0015] Preferably, the heat-conducting element has a rectangular cross-sectional shape, and the long side of the cross-section of the heat-conducting element is in the same direction as the extension direction of the second through hole.

[0016] Preferably, the heat-conducting component is connected to the geometric center of the first heat sink and the geometric center of the second heat sink;

[0017] The projection of the heat-conducting component onto the first heat sink is located within the first heat sink, and the projection of the heat-conducting component onto the second heat sink is located within the second heat sink.

[0018] Preferably, the shape of the first through hole is the same as the cross-sectional shape of the heat-conducting component, and the outer peripheral wall of the heat-conducting component is in contact with the hole wall of the first through hole.

[0019] The first heat sink completely covers the heat dissipation end, and / or the second heat sink completely covers the heat absorption end.

[0020] Electronic devices, including inductive devices as described above.

[0021] Preferably, the electronic device further includes a heating element and a circuit board. The circuit board is disposed near the heat-absorbing end and electrically connected to the connection terminal of the inductor. The heating element is disposed between the heat sink at the heat-absorbing end and the circuit board.

[0022] The beneficial effects of this utility model are:

[0023] The inductor device and the electronic equipment provided by the utility model, the magnet is provided with a first through hole, the heat dissipation assembly comprises a heat dissipation plate, the heat at the heat absorbing end of the magnet can be transmitted through the heat dissipation plate and the heat conducting piece, since the heat conducting piece is arranged through the magnet, the length of the heat conducting piece can be smaller, and then the heat transmission path between the heat absorbing end and the heat dissipation end can be shorter, so that the heat at the heat absorbing end can be quickly transmitted to the heat dissipation end, and then the heat dissipation path of the inductor device can be shorter, and then the heat dissipation efficiency of the inductor device can be improved, so that the inductor device has better heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the utility model embodiment, the drawings needed to be used in the utility model embodiment will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the contents of the utility model embodiment and the drawings by those skilled in the art without any creative effort.

[0025] Figure 1 It is the structural schematic diagram of the inductor device provided by the utility model embodiment;

[0026] Figure 2 It is the exploded view of the inductor device provided by the utility model embodiment;

[0027] Figure 3 It is the sectional view of the inductor device provided by the utility model embodiment;

[0028] Figure 4 It is the exploded view of the heat dissipation assembly provided by the utility model embodiment;

[0029] Figure 5 It is the structural schematic diagram of part inductor device provided by the utility model embodiment Figure 1 ;

[0030] Figure 6 It is the structural schematic diagram of part inductor device provided by the utility model embodiment Figure 2 ;

[0031] Figure 7 It is the structural schematic diagram of the electronic equipment provided by the utility model embodiment;

[0032] Figure 8 It is the sectional view of the electronic equipment provided by the utility model embodiment.

[0033] In the drawings:

[0034] 100, magnet; 110, heat dissipation end; 120, heat absorption end; 130, first through hole; 140, first side surface; 150, second side surface; 160, second through hole; 200, heat dissipation assembly; 210, first heat dissipation plate; 220, second heat dissipation plate; 230, heat conduction member; 231, first heat conduction member; 232, second heat conduction member; 233, heat conduction connecting member; 300, connecting terminal;

[0035] 10, circuit board; 20, heat generating member. DETAILED DESCRIPTION

[0036] To make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the present application will be further described below in conjunction with the accompanying drawings and through specific embodiments. It can be understood that the specific embodiments described herein are merely used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, but not all.

[0037] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, thus, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0038] In the description of the present application, unless explicitly defined and limited otherwise, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] In the present application, unless explicitly defined and limited otherwise, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature. In the description of the present embodiment, if not specially stated, "a plurality of" specifically refers to two or more than two.

[0040] In the description of the present embodiment, the terms "upper", "lower", "right", and the like, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.

[0041] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be a middle element.

[0042] The technical solutions of the present utility model will be further described below in conjunction with the drawings and through specific embodiments.

[0043] In a first aspect, the present embodiment provides an inductive device that can have a shorter heat transfer path, thereby improving heat dissipation efficiency and heat dissipation effect.

[0044] Exemplarily, the inductive device in the present embodiment can be an inductor, a transformer, etc., and the present embodiment does not limit this.

[0045] As shown in Figures 1 to 6 , the inductive device includes a magnet 100 and a heat dissipation assembly 200 disposed on the magnet 100. The magnet 100 is made of a magnetic conductive material and is used for magnetic conduction. The heat dissipation assembly 200 is used for heat dissipation. The shape of the magnet 100 in the present embodiment can be set according to actual needs. Exemplarily, Figure 1 the magnet 100 in the present embodiment is in the shape of a cuboid. The magnet 100 can also be in the shape of a square, an irregular shape, etc., and the present embodiment does not limit this.

[0047] As shown in Figure 2 , the magnet 100 has a heat dissipation end 110 and a heat absorption end 120, which can be oppositely disposed or adjacently disposed, and the present embodiment does not limit this. The heat absorption end 120 can refer to one end of the magnet 100 close to a heat source, and the heat dissipation end 110 can refer to one end of the magnet 100 close to a heat dissipation system.

[0048] Exemplarily, the present embodiment shows the case where the heat dissipation end 110 and the heat absorption end 120 are oppositely disposed. Alternatively, as shown in Figure 2As shown, the heat dissipation end 110 and the heat absorption end 120 can be oppositely arranged in the height direction of the magnet 100. The magnet 100 also has a first through hole 130. The first through hole 130 extends from the heat dissipation end 110 to the heat absorption end 120, that is, one end of the first through hole 130 is located at the heat dissipation end 110, and the other end is located at the heat absorption end 120. In this embodiment, the first through hole 130 can be linear, diagonal, broken line, arc, etc., which is not limited in this embodiment.

[0049] The heat dissipation assembly 200 includes a heat dissipation plate arranged on the outer surface of the magnet 100 and a heat conduction piece 230 penetrating the first through hole 130, and the heat dissipation plate is connected with the heat conduction piece 230. Among them, the magnet 100 is provided with a heat dissipation plate at least one of the end face of the heat dissipation end 110 and the end face of the heat absorption end 120, and the other surface of the magnet 100 can be provided with a heat dissipation plate, or can not be provided with a heat dissipation plate, and part of the surface can be provided with a heat dissipation plate, and part of the surface can not be provided with a heat dissipation plate.

[0050] When the magnet 100 is provided with a heat dissipation plate at the end face of the heat dissipation end 110 and the end face of the heat absorption end 120, one end of the heat conduction piece 230 is connected with the heat dissipation plate at the heat absorption end 120, specifically in thermal conduction connection, and the other end of the heat conduction piece 230 is connected with the heat dissipation plate at the heat dissipation end 110, also in thermal conduction connection, so that the heat on the heat dissipation plate at the heat absorption end 120 can be transmitted to the heat dissipation plate at the heat dissipation end 110 through the heat conduction piece 230, thereby achieving heat dissipation.

[0051] The inductor provided in this embodiment is provided with a first through hole 130 in the magnet 100, and the heat dissipation assembly includes a heat dissipation plate. The heat at the heat absorption end 120 of the magnet 100 can be transmitted through the heat dissipation plate and the heat conduction piece 230. Since the heat conduction piece 230 penetrates the magnet, the length of the heat conduction piece 230 can be relatively small, thereby enabling the heat at the heat absorption end 120 to be quickly transmitted to the heat dissipation end 110, and thereby enabling the heat dissipation path of the inductor to be relatively short, thereby improving the heat dissipation efficiency of the inductor and enabling the inductor to have a better heat dissipation effect.

[0052] Exemplarily, please refer to Figure 2 and Figure 3 The plurality of heat dissipation plates include a first heat dissipation plate 210 and a second heat dissipation plate 220, and the heat conduction piece 230 is connected between the first heat dissipation plate 210 and the second heat dissipation plate 220. The first heat dissipation plate 210, the second heat dissipation plate 220 and the heat conduction piece 230 can all conduct heat, so that the heat can be transmitted between the first heat dissipation plate 210 and the second heat dissipation plate 220 through the heat conduction piece 230.

[0053] The first heat dissipation plate 210 is in contact with the heat dissipation end 110 and is used to release heat. For example, the first heat dissipation plate 210 is arranged towards the heat dissipation system, so that the heat dissipation system can take away the heat on the first heat dissipation plate 210. The second heat dissipation plate 220 is in contact with the heat absorption end 120 and is used to absorb heat near the heat absorption end 120. For example, the second heat dissipation plate 220 is arranged towards the heat source, so that the second heat dissipation plate 220 can absorb the heat of the heat source. The heat on the second heat dissipation plate 220 is transferred to the first heat dissipation plate 210 through the heat conduction member 230 to achieve heat dissipation. Optionally, the first heat dissipation plate 210 can be attached to the heat dissipation end 110, and the second heat dissipation plate 220 can be attached to the heat absorption end 120, so that the first heat dissipation plate 210 and the second heat dissipation plate 220 can be limited by the magnet 100, and thus the first heat dissipation plate 210 and the second heat dissipation plate 220 can be more stable.

[0054] The inductor provided in the embodiment has the first through hole 130 penetrating through the heat dissipation end 110 and the heat absorption end 120. The heat dissipation assembly 200 includes the first heat dissipation plate 210, the second heat dissipation plate 220, and the heat conduction member 230 connected between the first heat dissipation plate 210 and the second heat dissipation plate 220, so that the first heat dissipation plate 210 and the second heat dissipation plate 220 can transfer heat through the heat conduction member 230. Since the heat conduction member 230 is arranged through the magnet 100, compared with the arrangement along the outer circumferential surface of the magnet 100, the length of the heat conduction member 230 can be smaller, and thus the heat transfer path between the first heat dissipation plate 210 and the second heat dissipation plate 220 can be shorter, and thus the heat dissipation path of the inductor can be shorter. Heat can be quickly transferred between the first heat dissipation plate 210 and the second heat dissipation plate 220, and thus the heat dissipation efficiency of the inductor can be improved, and the inductor has better heat dissipation effect.

[0055] In some optional embodiments, as shown in Figure 4 The heat conduction member 230 includes the first heat conduction body 231 and the second heat conduction body 232 connected together. By arranging the first heat conduction body 231 and the second heat conduction body 232, the assembly of the inductor can be facilitated, and the preparation difficulty of the inductor can be reduced.

[0056] For example, the first heat conduction body 231 is integrally formed with the first heat dissipation plate 210, and the second heat conduction body 232 is integrally formed with the second heat dissipation plate 220. By arranging the first heat conduction body 231 and the first heat dissipation plate 210 in an integral manner, on the one hand, the heat dissipation effect of the heat dissipation assembly 200 can be further improved, and on the other hand, the first heat conduction body 231 and the first heat dissipation plate 210 do not need to be assembled, and can also have higher connection strength. Similarly, by arranging the second heat conduction body 232 and the second heat dissipation plate 220 in an integral manner, on the one hand, the heat dissipation effect of the heat dissipation assembly 200 can be further improved, and on the other hand, the second heat conduction body 232 and the second heat dissipation plate 220 do not need to be assembled, and can also have higher connection strength.

[0057] Of course, it can be understood that the heat conduction member 230 can also be an integral structure, and is an integral structure with the first heat dissipation plate 210 or the second heat dissipation plate 220, which can also reduce the preparation difficulty of the inductor device.

[0058] Optionally, please continue to refer to Figure 4 The heat conduction member 230 further includes a heat conduction connecting body 233 arranged between the first heat conduction body 231 and the second heat conduction body 232. Optionally, the first heat conduction body 231 and the second heat conduction body 232 are connected or not connected through the heat conduction connecting body 233, and the heat conduction connecting body 233 has the function of heat conduction, so that the arrangement of the heat conduction connecting body 233 will not affect the heat dissipation efficiency and effect of the inductor device. By arranging the heat conduction connecting body 233, the heat transfer efficiency at the connection between the first heat conduction body 231 and the second heat conduction body 232 can be improved. In some optional embodiments, the first heat conduction body 231 and the second heat conduction body 232 can be interference-fitted in the first through hole, so as to limit the position of the first heat dissipation plate 210 and the second heat dissipation plate 220 relative to the magnet 100.

[0059] In some optional embodiments, the heat conduction coefficient of the heat conduction connecting body 233 is greater than the heat conduction coefficient of the first heat dissipation plate 210, so that the arrangement of the heat conduction connecting body 233 can also increase the heat conduction efficiency, without reducing the overall heat dissipation efficiency of the heat dissipation assembly 200.

[0060] Of course, it can be understood that the heat conduction coefficient of the heat conduction connecting body 233 can also be equal to the heat conduction coefficient of the first heat dissipation plate 210, which is not limited in the present embodiment.

[0061] For example, the material of the first heat dissipation plate 210 and the second heat dissipation plate 220 can both be copper, that is, the heat conduction coefficient of the first heat dissipation plate 210 is equal to the heat conduction coefficient of the second heat dissipation plate 220, so as to avoid the heat conduction short board and ensure the efficient heat dissipation of the inductor device. Of course, it can be understood that the heat conduction coefficient of the first heat dissipation plate 210 can also be greater than the heat conduction coefficient of the second heat dissipation plate 220, which is not limited in the present embodiment.

[0062] The material of the heat conduction connecting body 233 can be heat-conducting silicone grease or other high-heat-conducting materials, which is not limited in the present embodiment. It should be noted that the heat conduction connecting body 233 is heat-conducting silicone grease, which has a certain softness and can be in close contact with the hard first heat conduction body 231 and the second heat conduction body 232, so as to ensure the heat transfer efficiency.

[0063] It should be noted that when the heat conduction connecting body 233 has the function of connection, the heat-conducting silicone grease is in colloidal state under the preset condition and can be solidified outside the preset condition, so as to realize the connection between the first heat conduction body 231 and the second heat conduction body 232.

[0064] Optionally, the first heat sink 210 completely covers the heat absorbing end 120, so that the area of the first heat sink 210 can be larger, thereby having a larger heat absorbing area, further improving the heat dissipation efficiency and effect.

[0065] Optionally, the second heat sink 220 completely covers the heat absorbing end 120, so that the area of the second heat sink 220 can be larger, thereby having a larger heat absorbing area, further improving the heat dissipation efficiency and effect.

[0066] Exemplarily, please continue to refer to Figure 2 , the magnet 100 further has a first side surface 140 and a second side surface 150 opposite to the first side surface 140. For example, the first side surface 140 is different from the end surface of the heat absorbing end 120 and the end surface of the heat dissipation end 110, and the second side surface 150 is different from the end surface of the heat absorbing end 120 and the end surface of the heat dissipation end 110. In some optional embodiments, the first side surface 140 and the second side surface 150 are oppositely arranged in the width direction of the magnet 100. The magnet 100 is further provided with a second through hole 160 penetrating through the first side surface 140 and the second side surface 150, and the second through hole 160 is spaced apart from and independent of the first through hole 130, that is, the second through hole 160 is not communicated with the first through hole 130. The second through hole 160 extends along the width direction of the magnet 100.

[0067] Optionally, the inductive device further comprises a connecting terminal 300 arranged around the magnet 100, and the connecting terminal 300 is used for electrically connecting with the circuit board 10. As Figure 2 shown, the end portion of the connecting terminal 300 extends beyond the heat dissipation end 110, the connecting terminal 300 is in an inverted U shape, and both end portions of the connecting terminal 300 are used for connecting with the circuit board 10, and the middle portion of the connecting terminal 300 penetrates through the second through hole 160 to realize the connection between the connecting terminal 300 and the magnet 100. In the embodiment, the outer circumferential surface of the middle portion of the connecting terminal 300 is in contact with the hole wall of the second through hole 160, so that the connecting terminal 300 can be limited through the second through hole 160, and the end portion of the connecting terminal 300 is in contact with the side wall of the magnet 100, so that the magnet 100 can limit the connecting terminal 300 in the width direction thereof, thereby improving the stability of the connecting terminal 300.

[0068] Further optionally, the cross-sectional shape of the heat-conducting member 230 is rectangular, and the long side direction of the cross section of the heat-conducting member 230 is the same as the extension direction of the second through hole 160 (i.e. the width direction of the magnet 100), so that the size of the heat-conducting member 230 in the extension direction of the second through hole 160 can be longer, and is the same as the extension direction of the middle part of the connecting terminal 300, thereby being able to absorb as much heat generated by the middle part of the connecting terminal 300 as possible, improving the heat dissipation effect on the connecting terminal 300, to prevent the situation of excessively high local temperature of the connecting terminal 300. Moreover, the heat-conducting member 230 extends in the width direction of the magnet 100 by a certain size, so that the heat-conducting member 230 has a larger cross-sectional area, thereby being able to improve the efficiency of heat transfer between the first heat sink 210 and the second heat sink 220.

[0069] In some optional embodiments, the shape of the first through hole 130 is the same as the cross-sectional shape of the heat-conducting member 230, and the outer peripheral wall surface of the heat-conducting member 230 is in contact with the hole wall of the first through hole 130, so that the heat-conducting member 230 can be limited by the first through hole 130, to reduce the basis for shaking of the heat-conducting member 230 relative to the magnet 100, improving the structural stability of the inductor device.

[0070] In the present embodiment, two connecting terminals 300 are provided, and the two connecting terminals 300 are arranged at intervals in the length direction of the magnet 100, and the heat-conducting member 230 is located between the two connecting terminals 300 in the length direction of the magnet 100.

[0071] Optionally, the heat-conducting member 230 is connected to the geometric centers of the first heat sink 210 and the second heat sink 220, that is, the first heat-conducting body 231 is arranged at the geometric center of the first heat sink 210, and the second heat-conducting body 232 is arranged at the geometric center of the second heat sink 220. In this way, the heat-conducting member 230 can transfer heat to the geometric center of the first heat sink 210, and the heat at the geometric center can be dissipated to the surrounding, thereby improving the uniformity of the overall heat dissipation of the inductor device, fully utilizing the heat dissipation area of the first heat sink 210, and improving the heat dissipation effect.

[0072] Optionally, the projection of the heat-conducting member 230 on the first heat sink 210 is located in the first heat sink 210, and the projection of the heat-conducting member 230 on the second heat sink 220 is located in the second heat sink 220. That is, the first heat sink 210 and the second heat sink 220 have a larger area to increase the heat dissipation efficiency.

[0073] In the preparation of the inductor device provided in the embodiment, first, the magnet 100 is pressed by a mold, at this time, the magnet 100 has already had the connecting terminal 300 and the first through hole 130, and the shape of the first through hole 130 is not limited to a rectangle or a circle, etc. Next, the magnet 100 and the connecting terminal 300 are sprayed, laser marked, electroplated, etc. Finally, the heat dissipation assembly 200 is assembled, the first heat conductor 231 is inserted into the first through hole 130 by the heat dissipation end 110, and the second heat conductor 232 is inserted into the first through hole 130 by the heat absorption end 120, until the first heat dissipation plate 210 is attached to the heat dissipation end 110, and the second heat dissipation plate 220 is attached to the heat absorption end 120, at this time, the heat conduction connecting body 233 between the first heat conductor 231 and the second heat conductor 232 connects the two, to obtain the inductor device. The attachment connection mode of the first heat dissipation plate 210 and the heat dissipation end 110, and the attachment connection mode of the second heat dissipation plate 220 and the heat dissipation end 110 are not specifically limited here, as long as they can facilitate the structural stability of the inductor device and facilitate heat dissipation.

[0074] The heat dissipation plate of the conventional inductor device is a plate wrapped on the outer surface of the magnet 100 and bent to form on the end face of the heat dissipation end 110 and / or the end face of the heat absorption end 120, so that when assembled, the end of the heat dissipation plate bent to form on the end face of the heat dissipation end 110 and the end face of the heat absorption end 120 is easy to be warped, and the flatness is difficult to guarantee. In the embodiment, the first heat dissipation plate 210 and the second heat dissipation plate 220 are both a whole plate, therefore, the flatness of the first heat dissipation plate 210 and the second heat dissipation plate 220 is increased, so that the second heat dissipation plate 220 can be more attached to the heating device (such as a transistor), and the heat conduction efficiency is better. Moreover, the inductor device provided in the embodiment increases the heat dissipation efficiency without increasing the volume of the magnet 100, and increases the flatness of the first heat dissipation plate 210 and the second heat dissipation plate 220 of the heat dissipation assembly 200.

[0075] In a second aspect, the embodiment also provides an electronic device, as shown in Figure 7 and Figure 8 The electronic device includes the inductor device as described in the first aspect. The electronic device has a higher heat dissipation efficiency, so as to be able to be applied to a high-power application scenario.

[0076] Exemplarily, the electronic device can be a power supply module. Since the space of the power supply module is limited, it is difficult to add a large amount of heat dissipation structure, the inductor device provided in the embodiment, as shown in Figure 8 by setting the heat conduction member 230, the heat on the heat dissipation plate at the heat absorption end 120 can be quickly transferred to the heat dissipation plate at the heat dissipation end 110 through the heat conduction member 230, and dissipated, which can shorten the heat dissipation path, and further improve the heat dissipation efficiency and heat dissipation effect. Among them, Figure 8 the dashed line with an arrow in the middle represents the heat transfer direction.

[0077] Optionally, as shown in Figure 7 The electronic device further comprises a heating element 20 and a circuit board 10. The circuit board 10 is arranged on the side of the heat absorbing end 120 opposite to the heat dissipating end 110, that is, the circuit board 10 is arranged close to the heat absorbing end 120. The circuit board 10 is electrically connected with the connecting terminal 300 of the inductive element. Specifically, both ends of the connecting terminal 300 are electrically connected with the circuit board 10. Since the end of the connecting terminal 300 extends beyond the heat dissipating end 110, the heating element 20 is arranged between the circuit board 10 and the heat dissipating plate arranged at the heat absorbing end 120, that is, the heating element 20 is arranged between the second heat dissipating plate 220 and the circuit board 10, and is located in the space enclosed by the circuit board 10, the connecting terminal 300 and the heat dissipating end 110. The second heat dissipating plate 220 can absorb the heat generated by the heating element 20, thereby cooling the heating element 20. For example, the heating element 20 can be a transistor, and the present embodiment is not limited thereto.

[0078] In some optional embodiments, the heating element 20 can be attached to the second heat dissipating plate 220 to improve the efficiency of heat conduction.

[0079] It should be noted that the above are only preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. An inductive device, characterized by The application relates to an inductor device. The inductor device comprises a magnet (100) having a heat absorbing end (120), a heat radiating end (110) and a first through hole (130) penetrating through the heat absorbing end (120) and the heat radiating end (110); a heat radiating assembly (200) comprising a heat radiating plate arranged on the outer surface of the magnet (100) and a heat conducting member (230) penetrating through the first through hole (130), wherein the heat radiating plate is connected with the heat conducting member (230). The heat radiating plate comprises a first heat radiating plate (210) and a second heat radiating plate (220), wherein the first heat radiating plate (210) is in contact with the heat radiating end (110), the second heat radiating plate (220) is in contact with the heat absorbing end (120), and the heat conducting member (230) is connected between the first heat radiating plate (210) and the second heat radiating plate (220).

2. The inductive device of claim 1, wherein, The heat conducting member (230) comprises a first heat conducting body (231) and a second heat conducting body (232) connected with each other, wherein the first heat conducting body (231) is integrally formed with the first heat radiating plate (210), and the second heat conducting body (232) is integrally formed with the second heat radiating plate (220).

3. The inductive device of claim 2, wherein, The heat conducting member (230) further comprises a heat conducting connecting body (233) arranged between the first heat conducting body (231) and the second heat conducting body (232), wherein the heat conducting coefficient of the heat conducting connecting body (233) is greater than or equal to the heat conducting coefficient of the first heat radiating plate (210), and the heat conducting coefficient of the first heat radiating plate (210) is greater than or equal to the heat conducting coefficient of the second heat radiating plate (220).

4. The inductive device of claim 3, wherein, The inductor device further comprises a connecting terminal (300) arranged around the magnet (100), wherein the magnet (100) further comprises a first side surface (140) and a second side surface (150) arranged opposite to the first side surface (140), and the magnet (100) further comprises a second through hole (160) penetrating through the first side surface (140) and the second side surface (150), wherein the second through hole (160) is independent of the first through hole (130).

5. The inductive device according to any of claims 1-4, characterized in that, The end of the connecting terminal (300) extends beyond the heat radiating end (110), the connecting terminal (300) is in an inverted U shape, and the middle part of the connecting terminal (300) penetrates through the second through hole (160). The cross section of the heat conducting member (230) is in a rectangular shape, and the long side direction of the cross section of the heat conducting member (230) is the same as the extending direction of the second through hole (160).

6. The inductive device of claim 5, wherein, The heat conducting member (230) is connected with the geometric center of the first heat radiating plate (210) and the geometric center of the second heat radiating plate (220).

7. The inductive device according to any of claims 2-4, characterized by The projection of the heat conducting member (230) on the first heat radiating plate (210) is located in the first heat radiating plate (210), and the projection of the heat conducting member (230) on the second heat radiating plate (220) is located in the second heat radiating plate (220). The shape of the first through hole (130) is the same as the cross section shape of the heat conducting member (230), and the outer peripheral wall surface of the heat conducting member (230) is in contact with the hole wall of the first through hole (130).

8. The inductive device of any of claims 2-4, wherein, ​ The first heat dissipation plate (210) completely covers the heat dissipation end (110), and / or the second heat dissipation plate (220) completely covers the heat absorption end (120).

9. An electronic device, characterized by The electronic device further comprises a heating element (20) and a circuit board (10), the circuit board (10) is arranged on the side of the heat absorption end (120) away from the heat dissipation end (110) and is electrically connected with the connecting terminal (300) of the inductor, and the heating element (20) is arranged between the heat dissipation plate at the heat absorption end (120) and the circuit board (10).

10. The electronic device of claim 9, wherein, The electronic device further comprises a heating element (20) and a circuit board (10), the circuit board (10) is arranged on the side of the heat absorption end (120) away from the heat dissipation end (110) and is electrically connected with the connecting terminal (300) of the inductor, and the heating element (20) is arranged between the heat dissipation plate at the heat absorption end (120) and the circuit board (10).

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