Packaging type laser diode

Abstract

The utility model discloses a packaging type laser diode which comprises a base, conductive supports are fixedly installed on the two sides of the upper surface of the base, the conductive supports are designed to be of an inverted-L-shaped structure, an inner substrate is fixedly installed between the two conductive supports, an upper light-emitting chip is fixedly installed on the upper surface of the inner substrate, and a lower light-emitting chip is fixedly installed on the lower surface of the inner substrate. An upper light-emitting chip is fixedly installed on the upper surface of the inner substrate, a lower light-emitting chip is fixedly installed on the lower surface of the inner substrate, conductive connecting pieces are electrically connected to the two sides of the upper light-emitting chip and the two sides of the lower light-emitting chip, the conductive connecting pieces are electrically connected with the conductive support, and a reflection cup is fixedly installed on the upper surface of the base. The light beam of the lower light-emitting chip can be reflected upwards through the reflection cup, and through the cooperation with the use of the upper light-emitting chip, the LED lamp has the actual use characteristic of double-chip light emitting, the illumination brightness of the LED lamp can be effectively improved, the illumination effect is improved, and the practicability is high.

Description

Technical Field

[0001] This utility model relates to the field of laser diode technology, specifically a packaged laser diode. Background Technology

[0002] A laser diode is an electronic device that converts electric current into light energy and generates laser light using a semiconductor pn junction. Its basic principle is that light generated by the recombination of electrons and holes, when injected with a sufficiently large current, causes population inversion, thus producing laser light. Laser diodes have excellent directivity and linearity, and as a light source with easily controllable energy, they are widely used in optical communication, medical applications, sensing, data storage, and entertainment.

[0003] Laser diodes can be classified into single heterojunction, double heterojunction, and quantum well laser diodes according to their structure. Most traditional laser diodes adopt a single-chip light-emitting design, which limits the brightness during use and may result in poor lighting effect. Therefore, this utility model proposes a dual-chip packaged laser diode structure. Utility Model Content

[0004] The purpose of this invention is to provide a packaged laser diode to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a packaged laser diode, including a base, conductive brackets fixedly mounted on both sides of the upper surface of the base, the conductive brackets adopting an inverted "L" shaped structure design, an inner substrate fixedly mounted between the two conductive brackets, an upper light-emitting chip fixedly mounted on the upper surface of the inner substrate, a lower light-emitting chip fixedly mounted on the lower surface of the inner substrate, conductive connecting pieces electrically connected to both sides of the upper and lower light-emitting chips, the conductive connecting pieces being electrically connected to the conductive brackets, and a reflective cup fixedly mounted on the upper surface of the base.

[0006] Preferably, the reflector cup adopts a conical structure design, and the outer wall of the inner ring of the reflector cup is coated with highly reflective white oil.

[0007] Preferably, the outer packaging cover of the base is provided with a packaging cover, and the top of the packaging cover adopts a convex lens spherical structure design for focusing light.

[0008] Preferably, the space between the outer casing and the base is filled with epoxy resin.

[0009] Preferably, power-connecting pins are fixedly installed on both sides of the lower surface of the base, and the two power-connecting pins are electrically connected to two conductive supports respectively.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] The laser diode of this invention has an upper light-emitting chip and a lower light-emitting chip respectively disposed on the upper and lower outer surfaces of the inner substrate. The upper light-emitting chip can perform upper-end light emission processing, while the lower light-emitting chip can perform lower-end light emission processing. This invention has a reflector cup disposed below the lower light-emitting chip. The light beam emitted by the lower light-emitting chip can be reflected by the reflector cup, thereby reflecting the light beam of the lower light-emitting chip upward. By using it in conjunction with the upper light-emitting chip, this invention can have the practical application characteristics of dual-chip light emission, which can effectively improve the lighting brightness and lighting effect, and has strong practicality.

[0012] Furthermore, the convex spherical encapsulation cover of this invention can effectively improve the focusing illumination effect of the laser diode and increase the brightness of the focused illumination. At the same time, the epoxy resin filling between the encapsulation cover and the base can tightly bond the chip with the conductive support and the inner substrate to form a reliable connection, and can effectively prevent current leakage and ensure the stable operation of the circuit. In addition, epoxy resin also has good mechanical strength and thermal stability, and can maintain stable performance within a certain temperature range, thus facilitating the encapsulation and use of laser diodes and improving the overall performance. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the external three-dimensional structure of the laser diode according to an embodiment of the present invention;

[0014] Figure 2 This is a bottom-view schematic diagram of the laser diode structure according to an embodiment of the present invention;

[0015] Figure 3 This is a schematic diagram of the internal structure of the packaging cover according to an embodiment of the present utility model;

[0016] Figure 4 This is a schematic diagram of the internal cross-sectional structure of the laser diode according to an embodiment of the present invention.

[0017] In the diagram: 1. Base; 2. Conductive support; 3. Reflector cup; 4. Inner substrate; 5. Upper light-emitting chip; 6. Lower light-emitting chip; 7. Conductive connecting piece; 8. Encapsulation cover; 9. Epoxy resin; 10. Power connection pin. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Please see Figure 1-4 This utility model provides an embodiment of a packaged laser diode, including a base 1. Conductive supports 2 are fixedly installed on both sides of the upper surface of the base 1. The conductive supports 2 adopt an inverted "L" shaped structure design. An inner substrate 4 is fixedly installed between the two conductive supports 2. An upper light-emitting chip 5 is fixedly installed on the upper surface of the inner substrate 4, and a lower light-emitting chip 6 is fixedly installed on the lower surface of the inner substrate 4. Conductive connecting pieces 7 are electrically connected to both sides of the upper light-emitting chip 5 and the lower light-emitting chip 6. The conductive connecting pieces 7 are electrically connected to the conductive supports 2. Thus, the conductive connecting pieces 7 can conduct electricity and connect to the conductive supports 2, ensuring the normal use of the light-emitting chips.

[0022] In order to improve the light reflection and refraction effect of the lower light-emitting chip 6, a reflector cup 3 is fixedly installed on the upper surface of the base 1;

[0023] Among them, the reflector cup 3 adopts a conical structure design. The outer wall of the inner ring of the reflector cup 3 is coated with highly reflective white oil. The highly reflective white oil can effectively improve the reflective illumination effect of the reflector cup 3 and improve the reflective illumination effect of the lower light-emitting chip 6.

[0024] Based on the above structure, this utility model has an upper light-emitting chip 5 and a lower light-emitting chip 6 respectively disposed on the upper and lower outer surfaces of the inner substrate 4. The upper light-emitting chip 5 can perform upper-end light emission processing, while the lower light-emitting chip 6 can perform lower-end light emission processing. This utility model has a reflector cup 3 disposed below the lower light-emitting chip 6. The light beam emitted by the lower light-emitting chip 6 can be reflected by the reflector cup 3, thereby reflecting the light beam of the lower light-emitting chip 6 upward. By using it in conjunction with the upper light-emitting chip 5, this utility model can have the practical application characteristics of dual-chip light emission, which can effectively improve the lighting brightness and lighting effect of this utility model, and has strong practicality.

[0025] As an optimized technical solution of this utility model, since this utility model adopts a dual-chip structure design, it is necessary to add an internal heat-conducting and heat dissipation structure to help the internal chip dissipate heat. In actual implementation, several sets of heat dissipation fins can be installed on the lower surface of the base 1 of this utility model. The heat dissipation fins can be made of high thermal conductivity materials, such as silver, copper, etc., so as to conduct the internal temperature out through the heat dissipation fins. The heat dissipated can be exchanged with the outside through the heat dissipation fins, thereby conducting heat to cool the inside, improving the service life and avoiding overheating damage.

[0026] In this embodiment, the base 1 is provided with an outer packaging cover 8. The top of the outer packaging cover 8 adopts a convex lens spherical structure design for focusing light. The convex lens spherical packaging cover 8 can effectively improve the focusing irradiation effect of the laser diode of this utility model.

[0027] The space between the outer casing 8 and the base 1 is filled with epoxy resin 9. The epoxy resin 9 can tightly bond the chip with the conductive support 2 and the inner substrate 4 to form a reliable connection and effectively prevent current leakage, ensuring the stable operation of the circuit. In addition, epoxy resin 9 also has good mechanical strength and thermal stability, and can maintain stable performance within a certain temperature range, thus facilitating the packaging of laser diodes.

[0028] In this embodiment, in order to ensure the normal power-on operation of the laser diode of this utility model, power-on pins 10 are fixedly installed on both sides of the lower surface of the base 1, and the two power-on pins 10 are electrically connected to the two conductive supports 2 respectively.

[0029] Working principle: Those skilled in the art can use the laser diode of this invention through conventional methods;

[0030] The laser diode of this invention has an upper light-emitting chip 5 and a lower light-emitting chip 6 respectively disposed on the upper and lower outer surfaces of the inner substrate 4. The upper light-emitting chip 5 can perform upper-end light emission processing, while the lower light-emitting chip 6 can perform lower-end light emission processing. The light beam emitted by the lower light-emitting chip 6 can be reflected by the emitting cup 3, thereby reflecting the light beam of the lower light-emitting chip 6 upward by the reflecting cup 3. By using it in conjunction with the upper light-emitting chip 5, this invention can have the practical application characteristics of dual-chip light emission, which can effectively improve the lighting brightness and lighting effect of this invention, and has strong practicality.

[0031] Furthermore, the convex spherical encapsulation cover 8 of this invention can effectively improve the focusing irradiation effect of the laser diode and increase the brightness of the focused illumination. At the same time, epoxy resin 9 is filled between the encapsulation cover 8 and the base 1. The epoxy resin 9 can tightly bond the chip with the conductive support 2 and the inner substrate 4 to form a reliable connection and effectively prevent current leakage, ensuring the stable operation of the circuit. In addition, epoxy resin 9 also has good mechanical strength and thermal stability, and can maintain stable performance within a certain temperature range, thus facilitating the encapsulation and use of laser diodes.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A packaged laser diode, comprising a base (1), characterized in that, Conductive brackets (2) are fixedly installed on both sides of the upper surface of the base (1). The conductive brackets (2) adopt an inverted "L" shaped structure design. An inner substrate (4) is fixedly installed between the two conductive brackets (2). An upper light-emitting chip (5) is fixedly installed on the upper surface of the inner substrate (4). A lower light-emitting chip (6) is fixedly installed on the lower surface of the inner substrate (4). Conductive connecting pieces (7) are electrically connected to both sides of the upper light-emitting chip (5) and the lower light-emitting chip (6). The conductive connecting pieces (7) are electrically connected to the conductive brackets (2). A reflector cup (3) is fixedly installed on the upper surface of the base (1).

2. The packaged laser diode according to claim 1, characterized in that: The reflector cup (3) adopts a conical structure design, and the outer wall of the inner ring of the reflector cup (3) is coated with highly reflective white oil.

3. A packaged laser diode according to claim 1, characterized in that: The base (1) is provided with an outer packaging cover (8), and the top of the outer packaging cover (8) adopts a light-concentrating convex mirror spherical structure design.

4. A packaged laser diode according to claim 3, characterized in that: The interior between the encapsulation cover (8) and the base (1) is filled with epoxy resin (9).

5. A packaged laser diode according to claim 1, characterized in that: The base (1) has two power-connecting pins (10) fixedly installed on both sides of its lower surface, and the two power-connecting pins (10) are electrically connected to the two conductive supports (2) respectively.

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