Heat dissipation structure of high-power CPU of cantilever all-in-one machine
The heat dissipation structure, composed of copper pipes and copper blocks, combined with a sealing ring design, solves the heat dissipation problem of U-series CPUs during high-power operation, ensuring that the CPU dissipates heat outwards and preventing heat from affecting the screen, thus achieving a highly efficient heat dissipation effect.
Patent Information
- Application Number
- CN202423297073.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-30
AI Technical Summary
The heat dissipation problem of U-series CPUs during high-power operation, especially under IP65 protection level, is difficult to solve effectively because existing technology causes heat to dissipate inwards, affecting the screen.
The heat dissipation structure, composed of copper pipes and copper blocks, combined with a sealing ring design, ensures that the CPU dissipates heat outward. The tight connection of components such as the socket, rear bracket, cover plate, interface board, and heat sink forms an effective heat dissipation path.
While maintaining the IP65 protection rating, it effectively solves the problem of screen heat caused by CPU internal heat dissipation, achieving a highly efficient CPU cooling effect.
Smart Images
Figure CN223611901U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure of cantilever all-in-one machine high power CPU. BACKGROUND
[0002] Although the CPU of U series is named as low power consumption type, since the R frequency all exceeds 4GHZ from 11th generation, the power can reach above 60W after the R frequency runs, and heat dissipation becomes a difficult problem. SUMMARY
[0003] In view of the existing problems in the prior art, the utility model aims at providing a heat dissipation structure of cantilever all-in-one machine high power CPU, and solves the problem of CPU heat dissipation to the shell under the IP65 protection level.
[0004] In order to realize the above-mentioned purpose, the utility model is through the following technical scheme to realize: a heat dissipation structure of cantilever all-in-one machine high power CPU, including box seat, rear hanger, button, cover plate, mainboard, interface board, copper pipe and heat dissipation shell, copper pipe is fixed on heat dissipation shell through heat conduction glue, heat dissipation shell is fixed on rear hanger through M3 screw, box seat is fixed on rear hanger through M6 internal hexagonal screw, interface board is fixed on rear hanger through M3 screw, mainboard is fixed on interface board through M3 screw, rear hanger is installed with USB or button in the hole of left and right sides, rear hanger is fixed on screen body through M4 screw, and cover plate covers rear hanger.
[0005] As preferred, the copper pipe is provided with two, and a red copper block is fixed to the direction of the CPU.
[0006] As preferred, the heat dissipation shell and the rear hanger are provided with a sealing ring.
[0007] As preferred, the rear hanger and the screen body are provided with a sealing ring.
[0008] As preferred, the cover plate and the rear hanger are provided with a sealing ring.
[0009] The utility model has the advantages of:
[0010] The utility model is composed of rear hanger, cover plate, interface board, heat dissipation shell, copper strip, mainboard, cantilever box seat and fixed screw, etc.;There is a sealing ring between the heat dissipation shell and the rear hanger. There is a sealing ring between the rear hanger and the cantilever screen. There is also a sealing ring between the cover plate and the rear hanger. Thus, the requirement of protection level IP65 is met. Under the same protection level IP65, the utility model dissipates heat to the outside for the CPU, and solves the influence of heat on the screen caused by the heat dissipation of the CPU to the inside in the original scheme. BRIEF DESCRIPTION OF DRAWINGS
[0011] The utility model discloses below in conjunction with the drawings and specific embodiments to be described in detail.
[0012] Figure 1 It is the front view of the utility model;
[0013] Figure 2 It is Figure 1 It is the A-A section view of the utility model. Specific embodiments
[0014] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in conjunction with specific embodiments.
[0015] Referring to Figures 1-2 , the specific embodiment adopts the following technical scheme: a heat dissipation structure of cantilever all-in-one machine high-power CPU, including box seat 1, rear hanging piece 2, button 3, cover plate 4, mainboard 5, interface board 6, copper pipe 7 and heat dissipation shell 9, copper pipe 7 is fixed on heat dissipation shell 9 through heat-conducting glue, heat dissipation shell 9 is fixed on rear hanging piece 2 through M3 screw, box seat 1 is fixed on rear hanging piece 2 through M6 internal hexagonal screw, interface board 6 is fixed on rear hanging piece 2 through M3 screw, mainboard 5 is fixed on interface board 6 through M3 screw, USB or button 3 is installed in the hole of the left and right sides of rear hanging piece 2, and rear hanging piece 2 is fixed on the screen body through M4 screw 8.Cover plate 4 covers rear hanging piece 2.
[0016] It is worth noting that the copper pipe 7 is provided with two, and the copper pipe 7 is fixed with a red copper block in the direction of the CPU.
[0017] It is worth noting that the heat dissipation shell 9 and the rear hanging piece 2 are provided with a sealing ring.
[0018] It is worth noting that the rear hanging piece 2 and the screen body (cantilever screen) are provided with a sealing ring.
[0019] In addition, the cover plate 4 and the rear hanging piece 2 are provided with a sealing ring.
[0020] The assembly process of the CPU heat dissipation structure of the specific embodiment is as follows: 2 copper pipes 7 are fixed on the heat dissipation shell 9 through heat-conducting glue, and then a red copper block is fixed in the direction of the CPU; the heat dissipation shell 9 provided with the copper pipe 7 is installed on the rear hanging piece 2 through four M3 screws; then the interface board 6 is fixed on the rear hanging piece 2 through four M3 screws; the box seat 1 is fixed on the rear hanging piece through four M6 internal hexagonal screws; the mainboard 5 is fixed on the interface board 6 through four M3 screws; the USB or button 3 is installed in the hole of the left and right sides of the rear hanging piece; the rear hanging piece provided with the above components is fixed on the screen body through six M4 screws 8; finally, the cover plate 4 is covered; at this time, the whole heat dissipation structure is assembled.
[0021] The embodiment of the present application is used for the CPU heat dissipation to the outside, and solves the influence of the heat on the screen caused by the CPU heat dissipation to the inside in the original scheme.
[0022] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure of a cantilever all-in-one machine high-power CPU, characterized in that, It includes box seat (1), rear hanger (2), button (3), cover plate (4), mainboard (5), interface board (6), copper pipe (7) and heat dissipation shell (9), copper pipe (7) is fixed on heat dissipation shell (9) through heat conductive glue, heat dissipation shell (9) is fixed on rear hanger (2) through M3 screw, box seat (1) is fixed on rear hanger (2) through M6 internal hexagonal screw, interface board (6) is fixed on rear hanger (2) through M3 screw, mainboard (5) is fixed on interface board (6) through M3 screw, rear hanger (2) is installed with USB or button (3) in the hole on the left and right sides, rear hanger (2) is fixed on screen body through M4 screw (8), cover plate (4) covers on rear hanger (2).
2. The cantilevered all-in-one high-power CPU heat dissipation structure of claim 1, wherein, The copper pipe (7) is provided with two copper pipes, and a copper block is fixed on the copper pipe (7) towards the CPU.
3. The heat dissipation structure of a cantilevered all-in-one machine high-power CPU according to claim 1, wherein, The heat dissipation shell (9) is provided with a sealing ring between the heat dissipation shell (9) and the rear hanger (2).
4. The cantilevered all-in-one high-power CPU heat dissipation structure of claim 1, wherein, The rear hanger (2) is provided with a sealing ring between the rear hanger (2) and the screen body.
5. The cantilevered all-in-one high-power CPU heat dissipation structure of claim 1, wherein, The cover plate (4) is provided with a sealing ring between the cover plate (4) and the rear hanger (2).