A detection device
By designing a testing device for NOR Flash boards, an electrical connection without chip removal is achieved using a receiving slot and connectors, solving the problems of deformation and poor contact caused by clamping pins, and ensuring chip performance and testing reliability.
Patent Information
- Application Number
- CN202423182509.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-23
AI Technical Summary
During the production and testing of NOR Flash boards, the clips holding the chip pins can easily cause them to tilt and deform, affecting chip performance. Furthermore, poor contact can easily occur when resoldering after testing.
Design a testing device that uses a receiving groove and a connector on the main body. The contact part of the connector matches the chip pin, enabling electrical connection without removing the chip. The test component is electrically connected to the terminal block, enabling data reading and testing.
It enables electrical connection and testing without disassembling the chip, avoids damage to the pins caused by clamping force, solves the problem of poor contact after pin deformation, and ensures chip performance.
Smart Images
Figure CN223612105U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to memory test technical field especially relates to a detection device. BACKGROUND
[0002] With the rapid development of communication, electronic equipment and intelligent wearing instrument, the demand of flash gradually becomes larger. NOR flash board is a kind of electronic equipment, and its core component is NOR flash memory. The memory can keep data from losing after power off, and NOR flash board can also contain other electronic components, such as controller, interface circuit and the like, to realize the functions of data reading and writing, control and management and the like.
[0003] In the production test process of NOR flash board, problems such as power-on failure are prone to occur, so it is necessary to detect it. In the detection process, the chip is first disassembled and welded from the NOR flash board, and then the pin of the chip is electrically connected with the test equipment to realize data reading, wherein the clip is used to hold the pin for electrical connection.
[0004] The way of holding the pin of the chip by the clip is prone to cause the pin of the chip to be warped and deformed, thereby affecting the performance of the chip. After the test is completed, the chip is re-welded, and the problem of poor contact is prone to occur. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a detection device for detecting the memory without disassembling the chip on the memory, solving the problem that the way of holding the pin of the chip by the clip is prone to cause the pin of the chip to be warped and deformed, thereby affecting the performance of the chip, and the problem that after the test is completed, the chip is re-welded, and the problem of poor contact is prone to occur.
[0006] To achieve this purpose, the utility model adopts the following technical scheme:
[0007] A detection device for testing the memory, the memory includes a circuit board and a chip integrated on the circuit board, comprising:
[0008] A main body, one end of the main body is inwardly recessed to form a containing groove, and the other end of the main body is provided with a wiring end;
[0009] A plurality of connecting pieces are arranged in the containing groove, one end of the connecting piece penetrates through the bottom wall of the containing groove and is connected with the wiring end, and the other end is provided with a contact part; the main body is used for buckling on the circuit board, and the chip is located in the containing groove, and the contact part abuts against the pin of the chip;
[0010] A test assembly is electrically connected with the wiring end.
[0011] As an optional solution of the detection device, the shape of the contact part matches the surface shape of the pin.
[0012] As an optional solution of the detection device, the contact part is a hook structure.
[0013] As an optional solution of the detection device, the test assembly is detachably connected to the other end of the main body.
[0014] As an optional solution of the detection device, the shell of the test assembly is an integral structure with the main body.
[0015] As an optional solution of the detection device, the wiring end comprises a pin, and the main body is plugged with the test assembly through the pin.
[0016] As an optional solution of the detection device, the test assembly is a programmable integrated circuit, which comprises a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the programmable integrated circuit.
[0017] As an optional solution of the detection device, the test assembly is a burner, which comprises a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the burner.
[0018] As an optional solution of the detection device, the test assembly is a logic analyzer, and the lead of the logic analyzer is plugged with the pin.
[0019] As an optional solution of the detection device, the test assembly is an oscilloscope, and the lead end of the oscilloscope is clamped on the pin.
[0020] Beneficial effects:
[0021] In the first aspect of the utility model, when the detection device is used, first the slot of containing groove is downward, and the main body is buckled on the circuit board, so that the contact part can be accurately abutted on the pin of chip, thereby realizing the electrical connection of connecting piece and chip. The test assembly is electrically connected with the wiring end, and the electrical connection of the test assembly and the chip is further realized, so that data reading and various tests can be carried out on the chip. Through the detection device, the chip on the memory does not need to be disassembled, and the electrical connection and test of the chip can be smoothly realized, and at the same time, the way of electrical connection by clamping the pin of chip with the clip in the prior art is avoided, so that the clamping force is not generated on the pin, the performance of the chip is guaranteed, and after the detection is completed, the poor contact problem caused by re-soldering of the deformed pin in the prior art is solved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 is a structural schematic view of the detection device connecting chip provided by the embodiment of the present application.
[0023] In the figure:
[0024] 100, circuit board; 200, chip; 210, pin;
[0025] 1, main body; 11, accommodating groove; 12, wiring end; 2, connecting piece; 21, contact part. DETAILED DESCRIPTION
[0026] The present application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, and not to limit the present application. In addition, it should be noted that, in order to facilitate the description, only the parts related to the present application are shown in the drawings, rather than all the structures.
[0027] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0028] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or it can include the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the vertical and oblique above of the first feature to the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the vertical and oblique below of the first feature to the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0029] In the description of the present embodiment, the terms "upper", "lower", "right", and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.
[0030] Please refer to the drawingsFigure 1 The embodiment relates to a detection device for testing a memory, the memory comprising a circuit board 100 and a chip 200 integrated on the circuit board 100, the detection device comprising a main body 1, a connecting piece 2 and a test assembly; one end of the main body 1 is inwardly recessed to form a containing groove 11, and the other end of the main body 1 is provided with a wiring end 12; a plurality of connecting pieces 2 are arranged in the containing groove 11, one end of the connecting piece 2 penetrates through the bottom wall of the containing groove 11 and is connected with the wiring end 12, and the other end is provided with a contact part 21; the main body 1 is used for being buckled on the circuit board 100, and the chip 200 is located in the containing groove 11, and the contact part 21 abuts against the pin 210 of the chip 200; and the test assembly is electrically connected with the wiring end 12.
[0031] Specifically, the main body 1 is a cuboid box structure, wherein a cuboid containing groove 11 is formed in the bottom of the main body 1, and a plurality of connecting pieces 2 are arranged in the containing groove 11, the number of the connecting pieces 2 can be equal to the number of pins 210 of the chip 200, of course, the number of the connecting pieces 2 can also be greater than the number of the pins 210, so that each pin 210 of the chip 200 is connected by the corresponding connecting piece 2. The positions of the connecting pieces 2 correspond to the positions of the pins 210. Further, one end of the connecting piece 2 penetrates through the main body 1 and is connected with the wiring end 12. When the detection device is used, first, the slot of the containing groove 11 is downward, and the main body 1 is buckled on the circuit board 100, since the edge of the chip 200 is limited by the containing groove 11, the contact part 21 can accurately abut against the pin 210 of the chip 200, so that the connecting piece 2 is electrically connected with the chip 200.
[0032] The test assembly is electrically connected with the wiring end 12, and further realizes the electrical connection between the test assembly and the chip 200, so that data reading and various tests can be performed on the chip 200. Through the detection device, the electrical connection and the test of the chip 200 can be successfully realized without disassembling the chip 200 on the memory, meanwhile, the clamping mode of the pin 210 for electrical connection in the prior art is avoided, so that the clamping force is not generated on the pin 210, the performance of the chip 200 is ensured, and the poor contact problem caused by the re-welding of the deformed pin 210 in the prior art is solved.
[0033] Optionally, the shape of the contact part 21 matches the surface shape of the pin 210.
[0034] In the embodiment, the shape of the contact portion 21 is reasonably designed according to the surface shape of the pin 210 to match the pin 210. For example, the pin 210 is a convex arc surface or a circular arc surface, and the contact portion 21 can be a U-shaped arc surface with a size slightly larger than the surface size of the pin 210, which wraps the convex arc surface or the circular arc surface of the pin 210 to increase the contact area of the contact portion 21 and the pin 210, thereby ensuring the reliability of the electrical contact.
[0035] Optionally, the contact portion 21 is a hook structure.
[0036] Specifically, the contact portion 21 can be a hook structure to form a test hook capable of fully contacting the pin 210, and the test hook is provided with a through hole which can be matched with the pin 210. The pitch, length and hole diameter of the test hook are adapted to the pitch, height and size of the pin 210. The hook structure can adapt to different surface shapes of the pin 210, effectively improving the adaptability.
[0037] Optionally, the test assembly is detachably connected to the other end of the main body 1.
[0038] In one implementation form of the embodiment, the test assembly can be directly fixed to the outer wall of the main body 1 through clamping or fasteners, thereby ensuring the compactness of the overall detection device structure.
[0039] Specifically, the clamping method can directly set corresponding clamping structures, such as clamping protrusions and clamping grooves or clamping protrusions and clamping holes, on the outer wall of the main body 1 and the shell of the corresponding test assembly. Of course, the two can also be connected through fasteners, which can adopt rivets or threaded parts. The specific installation position can be determined according to the stability of the installation, and the embodiment is not limited in particular.
[0040] Optionally, the shell of the test assembly and the main body 1 are integrated.
[0041] In another implementation form of the embodiment, the shell of the test assembly and the main body 1 can be directly formed as an integrated structure, that is, the shell of the test assembly and the main body 1 are processed and manufactured through an integrated forming process, thereby ensuring the economy, and also reducing the intermediate connection and assembly, and in addition, the integrated structure can also ensure the compactness of the overall detection device structure.
[0042] Optionally, the wiring terminal 12 includes a pin, and the main body 1 is plugged with the test assembly through the pin.
[0043] In the embodiment, the wiring terminal 12 can adopt a standard pin to achieve electrical connection through plugging with the test assembly. The whole connection process is simple and convenient, and the wiring terminal 12 is designed as a standard pin, which is more easily matched with the universal interface of the test assembly without changing the interface type of the test assembly.
[0044] The test component can be of various types according to the specific reading and testing function.
[0045] In one implementation of the embodiment, the test component is a programmable integrated circuit, and the programmable integrated circuit includes a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the programmable integrated circuit.
[0046] Specifically, the programmable integrated circuit is a semi-custom circuit such as an FPGA (Field-Programmable Gate Array), and the wiring cable is a Dupont wire. The female head of the Dupont wire is plugged with the pin of the terminal 12, and the male head can be directly inserted into the PCB expansion interface of the FPGA. Alternatively, the female head of the Dupont wire is plugged with the pin of the terminal 12, and the female head at the other end is inserted into the 40-pin IO expansion interface of the FPGA. Through the FPGA, the detection device can perform programming operation on the memory.
[0047] In one implementation of the embodiment, the test component is a burner, and the burner includes a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the burner.
[0048] Specifically, the wiring cable can also be a Dupont wire. The female head of the Dupont wire is plugged with the pin of the terminal 12, and the male head is sequentially inserted into the slot of the burner. Through the burner, the memory can be read and written.
[0049] In one implementation of the embodiment, the test component is a logic analyzer, and the lead of the logic analyzer is plugged with the pin.
[0050] Specifically, the lead of the logic analyzer can be directly plugged with the pin of the terminal 12, thereby realizing electrical connection. The logic analyzer has various testing and analyzing functions, and can comprehensively test and analyze the memory.
[0051] In one implementation of the embodiment, the test component is an oscilloscope, and the lead end of the oscilloscope is clamped on the pin.
[0052] Specifically, the lead of the oscilloscope can be directly clamped on the pin of the terminal 12, thereby realizing electrical connection. The oscilloscope can capture the waveform of the memory.
[0053] The above test components include, but are not limited to, the listed programmable integrated circuit, burner, logic analyzer, and oscilloscope. The above test components can be selected according to needs, and the specific structure and working principle of the test components are not described in detail.
[0054] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.
Claims
1. A detection device for testing a memory, the memory comprising a circuit board (100) and a chip (200) integrated on the circuit board (100), characterized in that, The utility model relates to a test assembly for chip (200) of circuit board (100), which comprises: a main body (1), one end of the main body (1) is inwardly recessed to form a containing groove (11), the other end of the main body (1) is provided with a wiring terminal (12); a plurality of connecting pieces (2) are arranged in the containing groove (11), one end of the connecting piece (2) penetrates through the bottom wall of the containing groove (11) and is connected with the wiring terminal (12), and the other end is provided with a contact part (21); the main body (1) is used for buckling on the circuit board (100), and the chip (200) is located in the containing groove (11), and the contact part (21) abuts against the pin (210) of the chip (200); a test assembly is electrically connected with the wiring terminal (12).
2. The detection device of claim 1, wherein, The shape of the contact part (21) matches the surface shape of the pin (210).
3. The detection device of claim 2, wherein, The contact part (21) is a hook structure.
4. The detection device of claim 1, wherein, The test assembly is detachably connected at the other end of the main body (1).
5. The detection device of claim 1, wherein, The shell of the test assembly and the main body (1) are an integral structure.
6. The detection device of claim 1, wherein, The wiring terminal (12) comprises a pin, and the main body (1) is plugged with the test assembly through the pin.
7. The detection device of claim 6, wherein, The test assembly is a programmable integrated circuit, which comprises a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the programmable integrated circuit.
8. The detection device of claim 6, wherein, The test assembly is a burner, which comprises a wiring cable, one end of the wiring cable is plugged with the pin, and the other end of the wiring cable is connected with the interface of the burner.
9. The detection device of claim 6, wherein, The test assembly is a logic analyzer, and the lead wire of the logic analyzer is plugged with the pin.
10. The detection device of claim 6, wherein, The test assembly is an oscilloscope, and the lead wire end of the oscilloscope is clamped on the pin.