Bernoulli chuck and wafer processing apparatus

Abstract

The utility model discloses a bernoulli chuck and wafer processing equipment relates to wafer equipment field. This bernoulli chuck includes: chuck main part, the surface is equipped with annular jet port, and the inside of chuck main part is provided with annular air inlet groove and transition channel, and air inlet groove is communicated with jet port through transition channel and is surrounded, and the slot wall of air inlet groove is provided with the air inlet hole that communicates with outside gas source, the uniform flow plate is annular, is connected with chuck main part and is surrounded and covers air inlet groove, and the uniform flow plate is evenly distributed with a plurality of uniform flow holes, and air inlet groove is communicated with transition channel through a plurality of uniform flow holes. The bernoulli chuck provided by the utility model is even in jet flow rate, and the adsorption effect is more stable and reliable, and the use safety is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer equipment field, specifically, a bernoulli chuck and wafer processing equipment. BACKGROUND

[0002] In the wafer production process, the bernoulli chuck is usually used to fix the wafer, and cooperates with the mechanical hand to realize the carrying of the wafer. In practical application, the bernoulli chuck sprays gas, and realizes the adsorption fixing of the wafer by using the bernoulli principle.

[0003] At present, the bernoulli chuck on the market generally has the situation that the jet flow rate is uneven, that is, the jet flow rate at different positions of the jet port is different. On the one hand, it leads to poor stability of the adsorbed wafer, and on the other hand, it leads to local stress concentration of the wafer, which is easy to cause the deformation and even damage of the wafer. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a bernoulli chuck, which has uniform jet flow rate, more stable and reliable adsorption effect, and higher use safety.

[0005] Another purpose of the utility model is to provide a wafer processing equipment, which has the characteristics that the adsorption effect on the wafer is more stable and reliable, and has higher use safety.

[0006] Embodiments of the utility model provide a technical scheme:

[0007] A bernoulli chuck comprises:

[0008] A chuck body is provided with a ring-shaped jet port on the surface, and a ring-shaped air inlet groove and a transition channel are arranged inside the chuck body, the air inlet groove is in circumferential communication with the jet port through the transition channel, and an air inlet hole in communication with an external air source is arranged on the groove wall of the air inlet groove;

[0009] A uniform flow plate is annular, is connected with the chuck body and circumferentially covers the air inlet groove, a plurality of uniform flow holes are uniformly distributed on the uniform flow plate, and the air inlet groove is in communication with the transition channel through the plurality of uniform flow holes.

[0010] In an optional embodiment, the chuck body comprises a disc shell and a disc core, the disc shell has a receiving cavity, and the disc core is installed in the receiving cavity;

[0011] Part of the outer side wall of the disc core and part of the cavity wall of the receiving cavity form the jet port and the transition channel.

[0012] In an optional embodiment, from one end of the air inlet groove to one end of the jet port, the transition channel gradually moves away from the center of the disc core, and the width of the transition channel gradually decreases.

[0013] In an optional embodiment, the air inlet groove is arranged on the outer sidewall of the disc core, and the uniform flow plate is connected with the disc core to circumferentially cover the air inlet groove.

[0014] In an optional embodiment, the air inlet groove is arranged on the outer sidewall of the disc core, and the uniform flow plate is connected with the disc core to circumferentially cover the air inlet groove.

[0015] In an optional embodiment, the outer sidewall of the disc core comprises a first segment and a second segment connected at an angle, and the air inlet groove is arranged on the first segment.

[0016] The second segment extends away from the first segment to the air outlet in a direction away from the center of the disc core, and the second segment and part of the cavity wall of the accommodating cavity form the transition channel.

[0017] In an optional embodiment, the cavity wall of the accommodating cavity comprises a concave arc segment and a convex arc segment connected with each other, one end of the concave arc segment away from the convex arc segment and the second segment form one end of the transition channel communicated with the air inlet groove, and one end of the convex arc segment away from the concave arc segment and the second segment form the air outlet.

[0018] In an optional embodiment, the Bernoulli chuck further comprises a driving member, the driving member is in transmission connection with the disc core, and is used for driving the disc core to rotate.

[0019] In an optional embodiment, the area of the surface of the disc core surrounded by the air outlet is provided with a vacuum breaking flow channel, and a bottom wall of the vacuum breaking flow channel is provided with a vacuum breaking hole communicated with an external air source.

[0020] The embodiment of the utility model discloses a wafer processing equipment, including preceding described Bernoulli chuck. The Bernoulli chuck includes: chuck main part, surface is provided with annular air outlet, and the inside of chuck main part is provided with annular air inlet groove and transition channel, and the air inlet groove is communicated with the air outlet through the transition channel, and the air inlet groove is provided with the air inlet hole communicated with the external air source on the groove wall;Uniform flow plate, annular, with the chuck main part is connected and circumferentially covers the air inlet groove, and the uniform flow plate is evenly distributed with a plurality of uniform flow holes, and the air inlet groove is communicated with the transition channel through a plurality of uniform flow holes.

[0021] Compared with the prior art, the Bernoulli chuck provided by the utility model is provided with an air inlet groove covered by a uniform flow plate, a plurality of uniform flow holes are uniformly distributed on the uniform flow plate, the airflow entering the air inlet groove through the air inlet hole is uniformly distributed through the plurality of uniform flow holes and then enters the transition channel, the airflow at different positions of the transition channel is uniform, so that the flow rate at different positions of the air outlet is uniform. After the airflow is accelerated and discharged through the annular air outlet, a strong airflow uniformly flowing outward in the circumferential direction is generated on the surface of the chuck, so that a low-pressure area with a pressure lower than the ambient atmospheric pressure is formed between the wafer and the surface of the chuck. Due to the existence of the low-pressure area, the wafer surface is subjected to the pressure of the surrounding atmosphere, so that it is adsorbed and fixed on the surface of the chuck. The greater the airflow rate of the air outlet, the greater the pressure difference between the low-pressure area and the atmospheric pressure, and the stronger the adsorption capacity. By controlling the airflow rate of the air outlet, the force acting on the wafer surface can be adjusted, the consistency of the airflow rate of the air outlet can be controlled, the pressure acting on the wafer surface can be ensured to be stable and uniform, and the wafer surface stress concentration and cracking or warping are avoided. Therefore, the Bernoulli chuck provided by the utility model has the beneficial effects of uniform air jet flow rate, more stable and reliable adsorption effect and higher use safety. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the utility model, and therefore should not be regarded as a limitation on the scope. For ordinary skilled person in the art, other related drawings can also be obtained without creative labor according to these drawings.

[0023] Figure 1 The structural schematic view of the Bernoulli chuck provided for the embodiments of the utility model is shown in the figure.

[0024] Figure 2 The sectional view of the Bernoulli chuck provided for the embodiments of the utility model is shown in the figure.

[0025] Figure 3 The structural schematic view of the chuck core is shown in the figure. Figure 2 The enlarged schematic view of the A area in the figure.

[0026] Figure 4 The structural schematic view of the chuck core is shown in the figure.

[0027] Figure 5 The structural schematic view of the uniform flow plate is shown in the figure.

[0028] Figure 6 The enlarged schematic view of the B area in the figure. Figure 1 The enlarged schematic view of the B area in the figure.

[0029] Icon: 100 - Bernoulli chuck; 110 - chuck body; 111 - jet port; 112 - air inlet groove; 113 - transition channel; 114 - air inlet hole; 115 - chuck shell; 1151 - concave arc segment; 1152 - convex arc segment; 116 - chuck core; 1161 - first segment; 1162 - second segment; 1163 - vacuum breaking flow channel; 1164 - vacuum breaking hole; 118 - air inlet; 120 - flow uniforming plate; 121 - flow uniforming hole; 130 - air source joint. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0032] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0033] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0034] In addition, the terms "first", "second" and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the utility model, still need to explain, unless another explicit provision and limitation, "arrange", "connect" and so on term should do broad sense understanding, for example, "connect" can be fixed connection, also can be detachable connection, or integrally connect, can be mechanical connection, also can be electrical connection, can be direct connection, also can pass through intermediate medium indirectly connect, can be two element internal intercommunication. For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model according to specific circumstances.

[0036] The specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0037] Embodiment

[0038] Please refer to Figure 1 , Figure 2 And Figure 3 , Figure 1 Fig. 1 shows the structure diagram of Bernoulli chuck 100 provided by the embodiment, Figure 2 Fig. 2 shows the sectional view of the Bernoulli chuck 100, Figure 3 Fig. 3 shows the enlarged schematic view of A area in Fig. 2. Figure 2

[0039] The Bernoulli chuck 100 provided by the embodiment can be used for adsorbing and fixing wafers and other elements, the jet flow rate is uniform, the adsorption effect is more stable and reliable, and the use safety is higher.

[0040] The Bernoulli chuck 100 includes chuck main body 110, the surface of chuck main body 110 is provided with jet port 111, and the inside of chuck main body 110 is provided with air inlet groove 112 and transition channel 113, air inlet groove 112 communicates with jet port 111 through transition channel 113, and the groove wall of air inlet groove 112 is provided with air inlet hole 114 communicated with external gas source.

[0041] Taking adsorbing wafers as an example, in actual application, the gas provided by external gas source flows into air inlet groove 112 through air inlet hole 114, then reaches jet port 111 through transition channel 113, and is sprayed out from jet port 111, forming a low-pressure area on the lower surface of the wafer, and realizing the adsorption and fixation of the wafer.

[0042] In order to ensure that the jet flow rate of jet port 111 is uniform, the Bernoulli chuck 100 provided by the embodiment further includes flow uniformizing plate 120, flow uniformizing plate 120 is connected with chuck main body 110 and covers air inlet groove 112, a plurality of flow uniformizing holes 121 are uniformly distributed on flow uniformizing plate 120, and air inlet groove 112 communicates with transition channel 113 through a plurality of flow uniformizing holes 121.

[0043] ​It can be understood that in the prior art, the gas flow rate in the area corresponding to the gas injection port 111 and the gas inlet hole 114 is higher than that in other areas, resulting in uneven gas flow rate, thereby causing uneven force on different parts of the wafer, poor adsorption stability, easy deformation or damage of the wafer, and the like.

[0044] In the embodiment, the uniform flow plate 120 covers the gas inlet groove 112. The gas flowing into the gas inlet groove 112 through the gas inlet hole 114 is uniformly distributed through the plurality of uniform flow holes 121 on the uniform flow plate 120 before entering the transition channel 113, so that the gas flow is uniform at different parts of the transition channel 113, thereby making the gas flow rate uniform at different parts of the gas injection port 111.

[0045] It can be seen that the Bernoulli chuck 100 provided in the embodiment has more stable and reliable adsorption effect, can prevent the wafer from deforming or being damaged due to uneven force, and has higher use safety.

[0046] In the embodiment, the chuck body 110 includes a disc shell 115 and a disc core 116. The disc shell 115 has a receiving cavity, and the disc core 116 is installed in the receiving cavity. Part of the outer wall of the disc core 116 and part of the cavity wall of the receiving cavity form an annular gas injection port 111 and a transition channel 113. The transition channel 113 is in circumferential communication with the gas injection port 111.

[0047] In order to generate a stable and uniform high-speed gas flow under the wafer, the gas injection port 111 in the embodiment sprays gas outward in the circumferential direction. Specifically, from one end connected to the gas inlet groove 112 to one end connected to the gas injection port 111, the transition channel 113 gradually moves away from the center of the disc core 116.

[0048] In fact, in the embodiment, the gas injection port 111 and the gas inlet groove 112 are both annular, the track of the gas inlet groove 112 is coaxial with the track of the gas injection port 111, and the track radius of the gas inlet groove 112 is smaller.

[0049] In order to improve the gas flow rate, in the embodiment, from one end connected to the gas inlet groove 112 to one end connected to the gas injection port 111, the width of the transition channel 113 gradually decreases.

[0050] That is, after the gas flow passes through the uniform flow plate 120, the gas flow is continuously accelerated in the process of flowing along the transition channel 113 to the gas injection port 111 due to the gradually decreasing width of the transition channel 113, and finally is sprayed out of the gas injection port 111 at a high speed.

[0051] Please refer to Figure 4 and Figure 5 , Figure 4 Fig. 4 shows a structural schematic diagram of the disc core 116, Figure 5 Fig. 5 shows a structural schematic diagram of the uniform flow plate 120.

[0052] In the embodiment, the air inlet groove 112 is annularly arranged on the outer side wall of the disc core 116, and the flow uniformizing plate 120 is in the form of a ring. The flow uniformizing plate 120 is connected with the disc core 116 and circumferentially covers the air inlet groove 112.

[0053] It can be understood that the flow uniformizing plate 120 circumferentially covers the air inlet groove 112 to form an annular cavity structure. After the gas is input into the annular cavity structure through the air inlet holes 114 arranged on the groove wall of the air inlet groove 112, the gas in the annular cavity structure is uniformly distributed through the plurality of flow uniformizing holes 121 on the flow uniformizing plate 120 and then uniformly flows into the transition channel 113.

[0054] In order to further improve the uniformity of the gas sprayed through the gas injection port 111, in the embodiment, the number of the air inlet holes 114 is multiple. The plurality of air inlet holes 114 are uniformly and spacedly arranged in sequence along the extension direction of the air inlet groove 112 on the groove bottom wall of the air inlet groove 112. In actual application, the number of the air inlet holes 114 can be adjusted according to requirements and can be 6 or 8.

[0055] In fact, in the embodiment, the outer side wall of the disc core 116 includes a first segment 1161 and a second segment 1162 connected at an angle. The air inlet groove 112 is annularly arranged on the first segment 1161. The second segment 1162 extends away from the first segment 1161 to the gas injection port 111 in a direction away from the center of the disc core 116. The second segment 1162 forms the transition channel 113 with part of the cavity wall of the accommodating cavity.

[0056] The cavity wall of the accommodating cavity includes a concave arc segment 1151 and a convex arc segment 1152 connected with each other. The end of the concave arc segment 1151 away from the convex arc segment 1152 is connected with the end of the transition channel 113 formed by the second segment 1162 and the air inlet groove 112. The end of the convex arc segment 1152 away from the concave arc segment 1151 is connected with the second segment 1162 to form the gas injection port 111.

[0057] In order to ensure smooth flow of the gas in the transition channel 113 and avoid speed loss, in the embodiment, the concave arc segment 1151 and the convex arc segment 1152 are smoothly connected. After the gas in the air inlet groove 112 passes through the flow uniformizing plate 120, the gas first enters the end of the transition channel 113 formed by the concave arc segment 1151 and the second segment 1162. The structure of the concave arc segment 1151 provides sufficient space for the gas to enter. Then, the flowing gas gradually flows to the gas injection port 111. In this process, the structure of the convex arc segment 1152 gradually reduces the width of the transition channel 113, so that the gas can be continuously accelerated.

[0058] In fact, the Bernoulli chuck 100 provided by the embodiment further comprises a driving member (not shown in the figure) and a gas source connector 130. The driving member is connected with the disc core 116 through the gas source connector 130 and drives the disc core 116 to rotate. In actual application, the wafer is adsorbed, the disc core 116 is driven to rotate by the driving member, the airflow at the air jet port 111 is rotated by the rotation of the disc core 116, and the wafer is driven to rotate by the friction between the gas and the wafer, so as to facilitate the surface polishing, cleaning and other treatments of the wafer. In actual application, the driving member can be a motor or the like.

[0059] The bottom wall of the disc core 116 is provided with an air inlet 118, the air inlet hole 114 is communicated with the air inlet 118, the gas source connector 130 is communicated with the air inlet 118, and the gas source connector 130 is further connected with an external gas source and is used for conveying the airflow provided by the external gas source to the air inlet hole 114 through the air inlet 118.

[0060] In actual application, the gas source connector 130 inputs the gas provided by the external gas source into the air inlet 118 on the bottom wall of the disc core 116, and then the gas flows into the air inlet groove 112 through the plurality of air inlet holes 114. Then, the airflow flowing into the air inlet groove 112 is uniformly distributed after passing through the plurality of uniform flow holes 121 on the uniform flow plate 120, and finally flows along the transition channel 113 to the air jet port 111 and is uniformly sprayed out of the air jet port 111.

[0061] Please refer to Figure 6 , Figure 6 It is an enlarged schematic view of the B region in Figure 1 .

[0062] In actual application, after the airflow is sprayed out of the annular air jet port 111 at high speed, a vacuum region is formed between the wafer and the disc core 116, the center of the wafer is tightly attached to the surface of the disc core 116, there is an air layer between the edge of the wafer and the disc core 116, the force on the edge is not uniform with the force on the center, and the wafer will be warped.

[0063] In order to ensure that the wafer is uniformly stressed and avoid wafer warping or cracking, in the embodiment, the region surrounded by the air jet port 111 on the surface of the disc core 116 is provided with a vacuum breaking flow channel 1163, the bottom wall of the vacuum breaking flow channel 1163 is provided with a vacuum breaking hole 1164 communicated with an external gas source, and the vacuum breaking hole 1164 and the vacuum breaking flow channel 1163 are used for supplementing the gas between the center region of the wafer and the disc core 116, so as to ensure that the stress on the center region of the wafer and the edge region is uniform, avoid stress concentration, and protect the wafer from warping or cracking.

[0064] In summary, the Bernoulli chuck 100 provided by the embodiment has uniform jet flow rate, more stable and reliable adsorption effect, and higher use safety.

[0065] In addition, the embodiment further provides a wafer processing equipment, and the wafer processing equipment can be a cleaning equipment and the like, and is provided with the Bernoulli chuck 100.

[0066] Benefiting from the beneficial effect of the Bernoulli chuck 100, the wafer processing equipment provided by the embodiment has the characteristics that the adsorption effect on the wafer is more stable and reliable, and the wafer can be prevented from being damaged in the process of processing the wafer, and the use safety is higher.

[0067] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can be variously changed and modified. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A Bernoulli chuck, characterized in that, The Bernoulli chuck comprises: a chuck body (110) having a ring-shaped air jet opening (111) on a surface thereof, and a ring-shaped air inlet groove (112) and a transition passage (113) arranged inside the chuck body (110), the air inlet groove (112) being in circumferential communication with the air jet opening (111) through the transition passage (113), and the air inlet groove (112) being provided with air inlet holes (114) in communication with an external air source on a groove wall thereof; a uniform flow plate (120) in the form of a ring, connected to the chuck body (110) and circumferentially covering the air inlet groove (112), the uniform flow plate (120) being uniformly provided with a plurality of uniform flow holes (121), and the air inlet groove (112) being in communication with the transition passage (113) through the plurality of uniform flow holes (121).

2. The Bernoulli chuck according to claim 1, characterized in that The chuck body (110) comprises a disc shell (115) and a disc core (116), the disc shell (115) having a receiving cavity, and the disc core (116) being mounted in the receiving cavity; part of an outer side wall of the disc core (116) and part of a cavity wall of the receiving cavity form the air jet opening (111) and the transition passage (113).

3. The Bernoulli chuck according to claim 2, characterized in that From one end of the air inlet groove (112) to one end of the air jet opening (111) in communication, the transition passage (113) gradually moves away from the center of the disc core (116), and the width of the transition passage (113) gradually decreases.

4. The Bernoulli chuck according to claim 2, characterized in that The air inlet groove (112) is annularly arranged on the outer side wall of the disc core (116), and the uniform flow plate (120) is connected to the disc core (116) to circumferentially cover the air inlet groove (112).

5. The Bernoulli chuck according to claim 4, characterized in that The number of the air inlet holes (114) is a plurality, and the plurality of air inlet holes (114) are uniformly and spacedly arranged on a groove bottom wall of the air inlet groove (112) along an extension direction of the air inlet groove (112).

6. The Bernoulli chuck according to claim 2, wherein The outer side wall of the disc core (116) comprises a first segment (1161) and a second segment (1162) connected at an angle, and the air inlet groove (112) is annularly arranged on the first segment (1161); The second segment (1162) extends away from the first segment (1161) at one end thereof to the air jet opening (111) away from the center of the disc core (116), and the second segment (1162) and part of the cavity wall of the receiving cavity form the transition passage (113).

7. The Bernoulli chuck according to claim 6, characterized in that The cavity wall of the receiving cavity comprises a concave arc segment (1151) and a convex arc segment (1152) connected to each other, one end of the concave arc segment (1151) away from the convex arc segment (1152) and the second segment (1162) form one end of the transition passage (113) in communication with the air inlet groove (112), and one end of the convex arc segment (1152) away from the concave arc segment (1151) and the second segment (1162) form the air jet opening (111).

8. The Bernoulli chuck according to claim 2, wherein The Bernoulli chuck further comprises a driving member in transmission connection with the disc core (116) for driving the disc core (116) to rotate.

9. The Bernoulli chuck according to claim 2, wherein The area of the disc core (116) surface surrounded by the air jet port (111) is provided with a vacuum breaking flow channel (1163), and a bottom wall of the vacuum breaking flow channel is provided with a vacuum breaking hole (1164) in communication with an external air source.

10. A wafer processing apparatus, characterized by, A Bernoulli chuck (100) as claimed in any of claims 1-9.

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