Heat dissipation structure of power module and motor controller

Abstract

The embodiment of the utility model discloses a heat dissipation structure of a power module and a motor controller, and relates to the technical field of automobile parts. The heat dissipation structure of the power module comprises a shell, a substrate unit, a heating element and a jet flow plate. The substrate unit comprises a substrate body and pin fins, and the pin fins are arranged on the substrate body. The heating element is arranged on the substrate body. The jet plate is provided with a plurality of jet holes. Wherein the jet flow plate, the substrate body and the shell are matched with one another to form a fluid channel communicated with the jet flow holes, the jet flow holes are used for guiding a coolant to the substrate body, and the pin fins are located in the fluid channel so as to increase the heat dissipation area of the substrate unit. According to the heat dissipation structure of the power module, the pin fins located in the fluid channels are arranged on the substrate body, the heat dissipation area of the substrate unit can be increased, then the heat exchange efficiency in the coolant impact process is improved, meanwhile, the interference of the structural design of the pin fins on the fluid channels is small, secondary complex design does not need to be conducted on the fluid channels, and the cost is reduced. The cost can be reduced, and industrial popularization and production are facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automobile parts, especially relates to a heat dissipation structure of power module and motor controller. BACKGROUND

[0002] The power module is a main heating component, and the junction temperature of the power module is not only a factor affecting output power, but also a main factor affecting the service life of the device. In the entire heat dissipation structure of the power module, the structure of the cooling water channel accounts for about 20% of the entire process. Therefore, the heat dissipation design of the power module is extremely important.

[0003] The current cooling methods of products on the market include substrate cooling and double-sided cooling. Since the heat dissipation area of double-sided cooling is larger than that of substrate cooling, the double-sided cooling has better heat dissipation effect. However, for double-sided cooling, the wire harness of the control signal must be led out from the middle of the cooling plate, which has high requirements for the wire harness and arrangement. Related research shows that the cooling method using impinging jet can improve the convective heat transfer coefficient without causing additional problems such as wire harness arrangement. However, the existing impinging jet cooling method has a relatively simple structure and cannot fully utilize the enhanced heat exchange in the impingement process of the coolant.

[0004] In view of the above shortcomings of the prior art, the utility model aims at providing a heat dissipation structure of power module and motor controller. The heat dissipation structure of the power module can improve the heat dissipation area of the substrate unit and thus improve the heat exchange efficiency in the impingement process of the coolant. At the same time, the structure design of the needle fin has little interference with the fluid channel, and the fluid channel does not need to be designed again, which can reduce the cost and is conducive to industrial promotion and production. SUMMARY

[0005] In view of the above shortcomings of the prior art, the utility model aims at providing a heat dissipation structure of power module and motor controller. The heat dissipation structure of the power module can improve the heat dissipation area of the substrate unit and thus improve the heat exchange efficiency in the impingement process of the coolant. At the same time, the structure design of the needle fin has little interference with the fluid channel, and the fluid channel does not need to be designed again, which can reduce the cost and is conducive to industrial promotion and production.

[0006] The utility model discloses a kind of heat dissipation structures of power module, comprising:

[0007] Shell;

[0008] Substrate unit, including substrate body and needle fin, needle fin is arranged in substrate body;

[0009] Heating element, arranged in substrate body;

[0010] Jet plate has several jet holes;

[0011] Wherein, jet plate, substrate body and shell are mutually cooperated to form fluid channel communicated by jet hole, jet hole is used to guide coolant to substrate body, needle fin is in fluid channel, to improve the heat dissipation area of substrate unit.

[0012] Further, the substrate body is oppositely arranged with the jet plate, the substrate body comprises a heat dissipation region, the projection of the jet hole in the substrate body is the heat dissipation region, and the heat generating element is arranged in the heat dissipation region.

[0013] Further, the number of jet holes is multiple, and two heat generating elements are arranged in any heat dissipation region corresponding to the jet hole.

[0014] Further, the substrate body further comprises a stagnation point region, the needle fin is arranged in the stagnation point region, and the stagnation point region and the heat dissipation region are not overlapped.

[0015] Further, the stagnation point region wraps the heat dissipation region.

[0016] Further, the periphery of any heat dissipation region has a plurality of needle fins arranged in a hexagonal shape.

[0017] Further, the spacing distance between the jet plate and the substrate body is d, and the diameter of the jet hole is δ, wherein,

[0018] Further, the jet plate is connected with the substrate body and the shell at the same time, and the jet plate can separate the fluid channel to form an upper flow channel and a lower flow channel, the lower flow channel has a coolant inlet, the upper flow channel has a coolant outlet, and the upper flow channel and the lower flow channel are communicated through the jet hole.

[0019] Further, the jet hole comprises one or a combination of a circular hole, a rectangular hole and a triangular hole.

[0020] The utility model discloses an embodiment further discloses a motor controller comprising the heat dissipation structure of power module.

[0021] The heat dissipation structure of power module and the motor controller provided by the utility model have the following beneficial effects, including but not limited to:

[0022] 1) the heat dissipation structure of power module can improve the heat dissipation area of the substrate unit by arranging the needle fin in the fluid channel on the substrate body, thereby improving the heat exchange efficiency in the coolant impact process, at the same time, the interference of the structure design of the needle fin to the fluid channel is small, and the fluid channel does not need to be designed again, which can reduce the cost, is beneficial to industrial promotion and production, and the like.

[0023] 2) the heat generating element of the heat dissipation structure of power module is only arranged in the projection region (i.e. the heat dissipation region) of the jet hole in the substrate body, that is, any jet hole corresponds to a heat generating element, the structure can avoid globally arranging the jet hole based on the technical means of locally strengthening heat transfer, and only arrange the jet hole in the required region, which can not only reduce the manufacturing cost and the influence of the substrate hole on the structural strength, but also can improve the heat dissipation effect of the high temperature region. Attached Figure Description

[0024] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0025] Figure 1 A schematic diagram of the heat dissipation structure of the power module provided in an embodiment of this utility model;

[0026] Figure 2 A top view of the substrate body provided in an embodiment of this utility model;

[0027] Figure 3 A partial isometric view of the heat dissipation structure of the power module provided in an embodiment of this utility model;

[0028] Figure 4 A front view of a portion of the heat dissipation structure of the power module provided in an embodiment of this utility model;

[0029] Figure 5 A schematic diagram of the thermal simulation results of the power module provided in this embodiment of the utility model;

[0030] Figure 6 A schematic diagram of the thermal simulation results of the power module provided for related technologies.

[0031] Icons: 100 - Heat dissipation structure of power module; 10 - Housing; 111 - Substrate body; 1111 - Heat dissipation area; 1112 - Stagnation area; 112 - Needle fin; 12 - Jet plate; 121 - Jet hole; 131 - Upper flow channel; 132 - Lower flow channel; 141 - Coolant inlet; 142 - Coolant outlet. Detailed Implementation

[0032] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0033] It is to be noted that the diagrams provided in the following embodiments only schematically illustrate the basic concept of the present application, and thus only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation, the type, number and proportion of the components in actual implementation can be arbitrarily changed, and the component layout type can also be more complex.

[0034] Please refer to Figures 1-4 , Figure 1 The structural diagram of the heat dissipation structure of the power module provided in the embodiments of the present application is shown in FIG. 1. Figure 2 The top view of the substrate body provided in the embodiments of the present application is shown in FIG. 2. Figure 3 The axial side view of part (substrate unit and fluid ejection plate) of the heat dissipation structure of the power module provided in the embodiments of the present application is shown in FIG. 3. Figure 4 The front view of part (substrate unit and fluid ejection plate) of the heat dissipation structure of the power module provided in the embodiments of the present application is shown in FIG. 4. The present application provides a heat dissipation structure 100 of a power module, which comprises a shell 10, a substrate unit, a heating element (not shown in the figure) and a fluid ejection plate 12. The substrate unit comprises a substrate body 111 and a pin fin 112, and the pin fin 112 is arranged on the substrate body 111. The heating element is arranged on the substrate body 111. The fluid ejection plate 12 has a plurality of fluid ejection holes 121. Among them, the fluid ejection plate 12, the substrate body 111 and the shell 10 cooperate with each other to form a fluid channel communicated by the fluid ejection holes 121, the fluid ejection holes 121 are used to guide the coolant to the substrate body 111, and the pin fin 112 is located in the fluid channel for increasing the heat dissipation area of the substrate unit.

[0035] It is worth noting that the heat dissipation structure 100 of the power module can increase the heat dissipation area of the substrate unit by arranging the pin fin 112 in the fluid channel on the substrate body 111, thereby improving the heat exchange efficiency in the process of coolant impact. At the same time, the structural design of the pin fin 112 has less interference with the fluid channel, and there is no need for secondary complex design of the fluid channel, which can reduce the cost and is beneficial to industrial promotion and production.

[0036] In optional embodiments, the heating element mainly refers to a semiconductor device used for power conversion and control, which generates heat due to switching loss, conduction loss, etc. during work, and needs efficient heat dissipation to guarantee performance and service life. Specifically, the heating element can include a plurality of switch tubes in the form of bipolar transistors, insulated gate bipolar transistors, metal oxide semiconductor field effect transistors, thyristors and / or diodes, which are packaged in the substrate body 111 as a chip structure.

[0037] In optional embodiments, the coolant as a cooling medium can include cooling liquid, air, cooling oil, etc. to achieve the purpose of heat transfer.

[0038] Please refer again to Figure 1 and Figure 4 The substrate body 111 is arranged opposite to the jet plate 12, and the substrate body 111 comprises a heat dissipation area 1111, the projection of the jet hole 121 on the substrate body 111 is the heat dissipation area 1111, and the heat generating element is arranged in the heat dissipation area 1111. It can be understood that the opposite arrangement means that the substrate body 111 and the jet plate 12 are arranged opposite to each other in the direction of the upper and lower symmetry, that is, they are arranged in the direction of facing each other. Figure 4 It can be understood that the opposite arrangement means that the substrate body 111 and the jet plate 12 are arranged opposite to each other in the direction of the upper and lower symmetry, that is, they are arranged in the direction of facing each other.

[0039] It is worth noting that the heat generating element of the heat dissipation structure 100 of the power module is arranged only in the projection area of the jet hole 121 on the substrate body 111 (i.e. the heat dissipation area 1111), that is, any jet hole 121 corresponds to a heat generating element, and this structure can avoid globally arranging the jet hole 121 based on the technical means of locally strengthening heat transfer, and only arrange the jet hole 121 in the area that needs to be arranged. Not only can it reduce the manufacturing cost and the influence of the substrate aperture on the structural strength, but also can improve the heat dissipation effect of the high temperature area.

[0040] In the embodiment, the number of jet holes 121 is multiple, and two heat generating elements are arranged in the heat dissipation area 1111 corresponding to any jet hole 121. It can be understood that arranging two heat generating elements in the heat dissipation area 1111 of the jet hole 121 can make full use of the local heat transfer effect of jet cooling and improve the heat transfer efficiency from the surface of the heat generating element to the cooling medium. At the same time, each jet hole 121 corresponds to two heat generating elements, which can more efficiently utilize the cavity area of the jet hole 121 (i.e. the area covered by the jet), and avoid resource waste. It can also be understood that according to different specific implementation environments, the number of heat generating elements corresponding to the jet hole 121 can also be 1, 3, etc., as long as it can effectively utilize the cavity area of the jet hole 121. The embodiment does not constitute a limitation on the specific number of heat generating elements in the heat dissipation area 1111, but only exemplifies it.

[0041] In the optional embodiment, as shown in the figure, the number of jet holes 121 is 18, and two heat generating elements (not shown in the figure) are arranged in the heat dissipation area 1111 corresponding to any jet hole 121. Among them, the jet holes 121 are arranged in the form of two rows and nine columns, so that the substrate unit has easy processability, and at the same time, the heat generating elements can be separated to further improve the heat transfer efficiency when the jet impacts.

[0042] Please refer again to Figures 1-3The substrate body 111 further comprises a stagnation point area 1112, in which the needle fins 112 are arranged, and the stagnation point area 1112 is not overlapped with the heat dissipation area 1111. It can be understood that the area directly below the jet flow hole 121 is the area in which the coolant directly impacts the heat dissipation area 1111 of the substrate body 111. If the needle fins 112 are arranged in this area, the coolant will be dispersed due to the presence of the needle fins 112, weakening the direct impact effect of the jet flow. The structure that the stagnation point area 1112 is not overlapped with the heat dissipation area 1111 can enable the coolant to impact the substrate surface at a higher speed and energy, thereby improving the local heat transfer performance.

[0043] Optionally, the stagnation point area 1112 wraps the heat dissipation area 1111.

[0044] Specifically, as shown in the embodiment, the heat dissipation area 1111 is 18 corresponding to the number of jet flow holes 121, and the stagnation point area 1112 wraps the heat dissipation area 1111. This structure design can ensure that the coolant spreads radially after impacting the substrate body 111, fully covers the surrounding of the heat dissipation area 1111, and improves the overall heat exchange effect. At the same time, the stagnation point area 1112 wraps the heat dissipation area 1111, which can ensure that the coolant can impact the needle fins 112 of the stagnation point area 1112 from any direction after reaching the heat dissipation area 1111, ensuring the contact area of the coolant and the substrate unit, and further improving the heat exchange efficiency.

[0045] In the embodiment, the periphery of any heat dissipation area 1111 has a plurality of needle fins 112 arranged in a hexagonal shape.

[0046] It is worth noting that the plurality of needle fins 112 arranged in a regular hexagonal shape can ensure the impact heat transfer effect of the coolant from multiple directions, avoiding the situation that the coolant cannot contact the needle fins 112 and cannot improve the heat dissipation and cooling effect. Specifically, as shown in FIGS. 11 and 12, the plurality of needle fins 112 arranged in a hexagonal shape can be arranged in a layer-by-layer arrangement form and expand outwardly away from the heat dissipation area 1111, so as to further improve the heat dissipation area of the substrate unit. Figure 2 and Figure 3 It is worth noting that the plurality of needle fins 112 arranged in a regular hexagonal shape can ensure the impact heat transfer effect of the coolant from multiple directions, avoiding the situation that the coolant cannot contact the needle fins 112 and cannot improve the heat dissipation and cooling effect. Specifically, as shown in FIGS. 11 and 12, the plurality of needle fins 112 arranged in a hexagonal shape can be arranged in a layer-by-layer arrangement form and expand outwardly away from the heat dissipation area 1111, so as to further improve the heat dissipation area of the substrate unit.

[0047] In the embodiment, the distance between the jet flow plate 12 and the substrate body 111 is d, and the diameter of the jet flow hole is δ, wherein,

[0048] It is worth noting that, can ensure that the flow rate and pressure of the coolant jet flow are in the best state when reaching the surface of the substrate body 111. At this time, the core area of the jet flow directly impacts the substrate body 111, effectively improving the local intensified heat transfer effect. In addition, it can also ensure that the jet flow does not diffuse too early after flowing out of the jet flow hole, and can maintain a high kinetic energy, thereby enhancing the impact ability of the jet flow.

[0049] In the embodiment, the jet plate 12 is connected with the substrate body 111 and the shell 10 at the same time, and the jet plate 12 can separate the fluid channel to form an upper layer flow channel 131 and a lower layer flow channel 132, the lower layer flow channel 132 has a coolant inlet 141, the upper layer flow channel 131 has a coolant outlet 142, and the upper layer flow channel 131 and the lower layer flow channel 132 are communicated through the jet hole 121.

[0050] In the embodiment, the jet hole 121 includes one or a combination of a circular hole, a rectangular hole and a triangular hole.

[0051] It is worth noting that the power module heat dissipation structure 100 is applied in the following specific application scenarios: in the flow process, the coolant can enter the lower layer flow channel 132 from the coolant inlet 141 at a flow rate of 8 L / min, and then flow into the upper layer flow channel 131 through the jet hole 121. After the coolant flows out of the jet hole 121, it will impact on the substrate body 111 at a high flow rate. The coolant sweeps the pin fins 112 on the substrate body 111 to take away the heat from the heat generating elements and thus cool the power module heat dissipation structure 100.

[0052] Please refer to Figure 5 and Figure 6 , the simulation results of the impinging jet structure and the thermal simulation results of the related art are shown in the figure. As can be seen from the figure, the main heat generating elements of the power module heat dissipation structure 100 are directly opposite to the jet, and the peak value of the corresponding convective heat transfer coefficient can reach 18000 W / (m2·K), and the cooling performance can be improved by 20%-30%.

[0053] The utility model embodiment further provides a motor controller, including foregoing power module heat dissipation structure 100, with all its beneficial effects.

[0054] It should be understood that in addition to the motor controller, the power module heat dissipation structure 100 can also be applied to other structural devices such as high voltage DC-DC converter (HV DCDC), charging controller (CharCon), on-board charger (OBC) and the like.

[0055] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed by the present application should be covered by the claims of the present application.

[0056] In the description of the present application, numerous specific details are provided, such as examples of components and / or methods, to provide a thorough understanding of embodiments of the present application. One skilled in the relevant art will recognize, however, that the application can be practiced without one or more of the specific details, or with other equipment, systems, assemblies, methods, components, materials, parts, and the like. In other instances, well-known structures, materials, or operations are not specifically shown or described in detail in order to avoid obscuring aspects of embodiments of the present application.

[0057] Reference throughout this specification to "an embodiment", "embodiments" or "certain embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application and is not necessarily included in all embodiments. Thus, the appearances of the phrase "in one embodiment", "in an embodiment", or "in certain embodiments" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the application can be combined in any suitable manner in one or more other embodiments. It is understood that other variations and modifications of the applications' embodiments described and illustrated herein will appear to those skilled in the art and can be made without departing from the spirit and scope of the application.

[0058] It is also to be understood that one or more of the elements of the drawings shown can be implemented in a more separated or more integrated manner, or even removed, because in certain cases this is not operational or because it can be useful according to the specific application.

[0059] In addition, unless explicitly stated otherwise, any arrows shown in the drawings should be understood to represent exemplary directional flows and should not be construed as limiting. Further, unless specifically stated otherwise, the use of the term "or" in this document generally means "and / or", that is unless the context clearly indicates otherwise. Combinations of components or steps will also be generally considered to be explicitly presented to the extent that the combinations are not made unambiguously clear within the context of the various embodiments.

[0060] As used in the description of the application and throughout the claims that follow, unless otherwise indicated the use of "a" or "an" can mean "one or more". Also, as used in the description of the application and throughout the claims that follow, unless otherwise indicated the use of "in" includes "in" and "on".

[0061] The above description of the illustrated embodiments of the application (including what is in the Abstract) is not intended to be exhaustive or to limit the application to the precise forms disclosed. While specific embodiments of, and examples for, the application are described herein for illustrative purposes, various equivalent modifications are possible within the spirit and scope of the application, as those skilled in the relevant art will recognize and appreciate. As indicated, these modifications can be made to the application in light of the foregoing description of the described embodiments of the application and

[0062] The systems and methods have been described generally at this point as facilitating an understanding of the details of the application. Moreover, various specific details have been given for providing a thorough understanding of embodiments of the application. However, one skilled in the relevant art will recognize and appreciate that embodiments of the application can be practiced without one or more of the specific details, or with other devices, systems, assemblages, methods, components, materials, parts, and the like. In other instances, well known structures, materials, and / or operations have not been shown or described in detail to avoid obscuring aspects of embodiments of the application.

Claims

1. A heat dissipating structure of a power module, characterized by, The application relates to a heat dissipation structure of a power module. The heat dissipation structure comprises a shell, a substrate unit, a heating element and a jet plate. The substrate unit comprises a substrate body and needle fins arranged on the substrate body. The heating element is arranged on the substrate body. The jet plate has a plurality of jet holes. The jet plate, the substrate body and the shell are matched with each other to form a fluid channel communicated by the jet holes, the jet holes are used for guiding coolant to the substrate body, and the needle fins are located in the fluid channel and used for increasing the heat dissipation area of the substrate unit.

2. The heat dissipating structure of a power module according to claim 1, wherein The substrate body and the jet plate are oppositely arranged, the substrate body comprises a heat dissipation area, the projection of the jet hole on the substrate body is defined as the heat dissipation area, and the heating element is arranged in the heat dissipation area.

3. The heat dissipating structure of a power module according to claim 2, wherein The number of the jet holes is plural, and two heating elements are arranged in the heat dissipation area corresponding to any jet hole.

4. The heat dissipating structure of a power module according to claim 2, wherein The substrate body further comprises a stagnation point area, the needle fins are arranged on the stagnation point area, and the stagnation point area and the heat dissipation area are not overlapped.

5. The heat dissipating structure of a power module according to claim 4, wherein The stagnation point area wraps the heat dissipation area.

6. The heat dissipating structure of a power module according to claim 4, wherein The periphery of any heat dissipation area has a plurality of needle fins arranged in a hexagonal shape.

7. The heat dissipating structure of a power module according to claim 2, wherein The spacing distance between the jet plate and the substrate body is d, and the diameter of the jet hole is δ, wherein, 8. The heat dissipating structure of a power module according to claim 1, wherein The jet plate is connected with the substrate body and the shell at the same time, the jet plate can divide the fluid channel into an upper flow channel and a lower flow channel, the lower flow channel has a coolant inlet, the upper flow channel has a coolant outlet, and the upper flow channel and the lower flow channel are communicated through the jet holes.

9. The heat dissipating structure of a power module according to claim 1, wherein The jet hole comprises one or a combination of a circular hole, a rectangular hole and a triangular hole.

10. An electric machine controller characterized by The heat dissipation structure of the power module comprises any one of the heat dissipation structures in claims 1-9.

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