Circuit structure for improving ESD protection capability and electronic equipment

Abstract

The utility model relates to a circuit structure for improving the ESD protection capability of a printed circuit board, which comprises the printed circuit board and an ESD protection structure, and is characterized in that a slot and at least two rows of ground holes are arranged between a grounding position of the ESD protection structure and a first functional device positioned on one side of the grounding position of the ESD protection structure; the grounding position of the ESD protection structure is a side far away from the second functional device, and at least two rows of ground holes are arranged between the side far away from the grounding position of the ESD protection structure and the second functional device. The utility model also provides electronic equipment which comprises a functional device and the circuit structure. According to the circuit structure for improving the ESD protection capability of the printed circuit board and the electronic equipment provided by the utility model, functional devices which are easy to break down can be protected, and the ESD is prevented from leaking through the ground to influence surrounding devices.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit structure, concretely is a kind of circuit structure and electronic equipment for improving ESD (Electrostatic Discharge, electrostatic discharge) protection capability. BACKGROUND

[0002] The purpose of ESD protection is to protect electronic equipment from damage caused by electrostatic discharge, which is very important in the design, manufacture and use of electronic products. However, the existing ESD protection structure cannot completely block transient current and voltage, and the transient current and voltage of electrostatic discharge can easily leak through the ground GND of the ESD protection structure and conduct to the surrounding components, which can easily damage the surrounding components. SUMMARY

[0003] The utility model aims at providing a kind of circuit structure and electronic equipment for improving ESD protection capability to solve the problems mentioned in the above background.

[0004] To solve the above problems, in the first aspect, the utility model provides a kind of circuit structure, which includes a printed circuit board and an ESD protection structure, the ESD protection structure is arranged on the printed circuit board, and is used to guide the electrostatic to ground which is conducted to the printed circuit board. Wherein, the first preset area of the surface layer of the printed circuit board is provided with a slot and at least two rows of ground holes, the first preset area is the area between the grounding position of the ESD protection structure and the first functional device arranged on the printed circuit board, wherein the first functional device is a functional device arranged on one side of the grounding position of the ESD protection structure, the slot and the at least two rows of ground holes penetrate the top layer of the printed circuit board, and the at least two rows of ground holes are grounded.

[0005] The above-mentioned circuit structure can guide the energy of electrostatic discharge by slotting and punching in the area between the grounding position of ESD protection and the first functional device, provide an additional discharge path for it, so that it is directly discharged to ground without passing through sensitive components, thereby reducing the impact on the circuit. The purpose of these treatments is to ensure that the sensitive devices on the circuit board are effectively protected when facing electrostatic discharge, thereby improving the availability and durability of the entire system.

[0006] In one embodiment, the ESD protection structure includes a series-connected TVS diode and a capacitor unit, or a parallel-connected TVS diode and an inductor unit.

[0007] In one embodiment, the grounding position of the ESD protection structure is located on the side of the ESD protection structure away from the second functional device, wherein the second functional device is arranged on the printed circuit board.

[0008] In one of the embodiments, the second functional device includes a switching device or other sensitive device that is easily broken down.

[0009] In one of the embodiments, the second predetermined area of the surface layer of the printed board is provided with at least two rows of ground holes.

[0010] In one of the embodiments, when the GND reference layer connected to the grounding position of the ESD protection structure and the ground reference layer of the first functional device are in the same layer of the printed circuit board, a third predetermined area of the layer (i.e. the same layer where the GND reference layer and the ground reference layer of the first functional device are located) of the printed circuit board is also provided with a slot and at least two rows of ground holes, and the third predetermined area is the area between the projection of the grounding position of the ESD protection structure on the layer and the projection of the first functional device provided on the printed circuit board on the layer (the projection of the third predetermined area and the first predetermined area can be completely overlapped or partially overlapped).

[0011] In one of the embodiments, when the GND reference layer connected to the grounding position of the ESD protection structure and the ground reference layer of the second functional device are in the same layer of the printed circuit board, a fourth predetermined area of the layer (i.e. the same layer where the GND reference layer and the ground reference layer of the second functional device are located) of the printed circuit board is also provided with a slot and at least two rows of ground holes, and the fourth predetermined area is the area between the projection of the side away from the grounding position of the ESD protection structure on the layer and the projection of the second functional device provided on the printed circuit board on the layer.

[0012] In one of the embodiments, the at least two rows of ground holes include 3 rows of ground holes or more than 3 rows of ground holes.

[0013] In one of the embodiments, the shape of the ground hole includes a round hole, a square hole, a polygonal hole or an irregularly shaped hole.

[0014] In one of the embodiments, the shape of the slot includes a straight line, an arc or a U shape.

[0015] In a second aspect, the utility model also provides an electronic device, which comprises:

[0016] The functional device can include the first functional device and the second functional device, etc.

[0017] The circuit structure for improving the ESD protection capability of the functional device.

[0018] The circuit structure and the electronic equipment of the utility model, open the slot and set the ground hole between the grounding position of ESD protection structure and the first function device, can guide the energy of electrostatic discharge, provide additional discharge path for it, make it not pass through the sensitive function device and directly discharge to the ground, thereby reduce the influence to the circuit, can also prolong the path of ESD current to reach the function device, thereby reduce the current density, reduce the impact to the function device, in some cases, the slot can also improve the heat dissipation performance of the circuit board, thereby indirectly improve the tolerance of the circuit board to temperature change, and further improve the resistance to ESD.

[0019] The grounding position of ESD protection structure is set on the side far away from the second function device, can reduce the influence of ESD to the function device, when ESD occurs, the high-energy pulse generated can be conducted to the sensitive function device through the nearest path, thereby causing damage or performance decline.If the grounding position of ESD protection structure is close to the function device, then the ESD current can directly impact these devices, by adjusting the grounding position of ESD protection, it is beneficial to reduce the direct impact to the sensitive device, thereby reducing the influence to the circuit.

[0020] The ground hole is set between the side far away from the grounding position of ESD protection structure and the second function device, can be used as the effective path of ESD energy discharge, so that the ESD current can be rapidly discharged to the ground through these ground holes, instead of through the function device, can effectively protect the function device vulnerable to breakdown, prevent ESD from affecting the surrounding devices through ground leakage, and enhance the blocking ability of ESD. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating laborious work.

[0022] Figure 1 It is a top view structural schematic diagram of the circuit structure 1 for improving the ESD protection capability in an embodiment of the utility model.

[0023] Figure 2 It is a structural schematic diagram of the ESD protection structure 1 in an embodiment of the utility model.

[0024] Figure 3 It is a structural schematic diagram of the ESD protection structure 2 in an embodiment of the utility model.

[0025] Figure 4Another structural schematic view of the circuit structure 1 for improving ESD protection capability in an embodiment of the present application.

[0026] Figure 5 The structural schematic view of the GND reference layer 120 of the circuit structure.

[0027] Figure 6 Another structural schematic view of the GND reference layer 120 of the circuit structure.

[0028] Figure 7 The structural block diagram of the electronic device in an embodiment of the present application.

[0029] The reference signs in the detailed description are as follows:

[0030] Printed circuit board 100, surface layer 110, GND reference layer 120, first preset area 130, second preset area 140, third preset area 150, fourth preset area 160;

[0031] Circuit structure 1 for improving ESD protection capability, grounding position 101, first functional device 102, second functional device 103, ESD protection structure 104, diode 104a, capacitor unit 104b, inductance unit 104c, slot 105, ground hole 106;

[0032] Electronic device 200, functional device 201. Detailed description

[0033] In order to enable personnel in the technical field to better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] The terms "first", "second", etc. in the specification and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0035] Reference to“an embodiment” herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment. The appearances of the phrase“in one embodiment” in various places in the specification are not necessarily referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. As will be apparent to those of ordinary skill in the art, embodiments described herein can be combined with other embodiments.

[0036] Figure 1 A top view structural schematic diagram of the circuit structure 1 for improving ESD protection capability in an embodiment of the utility model is shown, for the convenience of explanation, only the content related to the embodiment of the utility model is shown.

[0037] Please refer to Figure 1 , it is a top view structural schematic diagram of the circuit structure 1 for improving ESD protection capability in an embodiment of the utility model. Figure 1 It can be the top view of the side of the surface layer 110 of the circuit structure 1 (hereinafter referred to as: circuit structure 1) for improving ESD protection capability.

[0038] As Figure 1 shown, the circuit structure 1 includes a printed circuit board 100 and an ESD protection structure 104, the ESD protection structure 104 is arranged on the printed circuit board 100, for guiding the static electricity conducted to the printed circuit board to the ground, wherein the first predetermined area 130 of the surface layer 110 of the printed circuit board 100 is provided with a slot 105, and at least two rows of ground holes 106, the first predetermined area 130 is the area between the grounding position 101 of the ESD protection structure 104 and the first functional device 102 arranged on the printed circuit board 100, wherein the first functional device 102 is a functional device arranged on the side of the grounding position 101 of the ESD protection structure 104, the slot 105 and the at least two rows of ground holes 106 penetrate the surface layer 110 of the printed circuit board 100, and the at least two rows of ground holes 106 are connected to the ground.

[0039] Therefore, in the present application, the slot 105 is arranged between the grounding position 101 of the ESD protection structure and the first functional device 102, so as to reduce the possibility of ESD spreading along the edge of the circuit board. By arranging the slot at the position, the energy of the ESD can be guided away from the sensitive devices in the circuit. In some cases, the slot 105 can also improve the heat dissipation performance of the circuit board, so as to indirectly improve the tolerance of the circuit board to temperature changes, and thus improve the resistance to ESD. At least two rows of ground holes 106 are arranged in the first preset area 130, so as to increase the grounding connection points on the circuit board, so that the charge of the ESD can be discharged to the ground through these connection points, without being conducted to the functional devices, such as the first functional device 102, mounted on the printed circuit board 100, so as to prevent the charge of the ESD from being conducted to other devices in the printed circuit board 100, and thus reduce the influence on the circuit.

[0040] In the above embodiment, the two rows of ground holes 106 are arranged between the slot 105 and the grounding position 101 of the ESD protection structure 104, that is, the slot 105 is closer to the first functional device 102. The arrangement direction of each row of ground holes 106 can be the same as the extension direction of the slot 105, and each row of ground holes 106 can be uniformly distributed. The two rows of ground holes 106 can be staggered by a certain distance, that is, each ground hole 106 in one row of ground holes 106 can correspond to the position of the gap between two ground holes 106 in the other row of ground holes 106, and staggered with each other, so as to reduce the mutual interference between the ground holes. A certain distance is also arranged between each ground hole 106 in each row of ground holes 106, so as to ensure the mutual isolation between the ground holes. The distance between each ground hole 106 in each row of ground holes 106 and the distance between each row of ground holes 106 can be designed according to the actual situation of the circuit structure, and is not limited here. In some embodiments, the arrangement direction of the two rows of ground holes 106 can also be different from the extension direction of the slot 105, for example, having an included angle with the extension direction of the slot 105. In some embodiments, the at least two rows of ground holes 106 can also be three rows of ground holes 106, four rows of ground holes 106, and the like. The arrangement direction and the number of the two rows of ground holes 106 can also be adjusted as needed.

[0041] The first functional device 102 and the like mounted on the printed circuit board 100 are mounted on the side of the surface layer 110 of the printed circuit board 100. For example, a pin hole (not shown in the figure) is arranged on the side of the surface layer 110 of the printed circuit board 100, the pin hole at least passes through the surface layer 110, and the pin of the first functional device 102 and the like can be inserted into the pin hole from the side of the surface layer 110 of the printed circuit board 100, so as to be mounted on the side of the surface layer 110 of the printed circuit board 100.

[0042] Therefore, by opening the slot 105 in the first preset area 130 of the surface layer 110 of the printed circuit board 100 and arranging the at least two rows of ground holes 106, the electrostatic charge of the ESD protection structure 104 can be effectively prevented from being conducted to the first functional device 102 and other functional devices through the surface layer 110.

[0043] The ground hole 106 can be a hole extending between the surface layer 110 of the printed circuit board 100 and a ground layer (not shown in the figure) of the printed circuit board 100 and electrically connecting the surface layer 110 and the ground layer. For example, the hole wall of the ground hole 106 is plated with a conductive material, such as a conductive copper foil, to achieve conductivity. The ground hole 106 provides a conductive path between the surface layer 110 and the ground layer, so that the electrostatic discharge charge can be discharged to the ground through the ground hole 106, and further prevented from being conducted to other functional devices through the surface layer 110.

[0044] The ground layer of the printed circuit board 100 can be a layer providing a ground potential / zero potential.

[0045] In some embodiments, the ESD protection structure 104 includes a TVS diode and a capacitor unit connected in series, or a TVS diode and an inductor unit connected in parallel.

[0046] Please refer to Figure 2 , which is a structural schematic diagram of the ESD protection structure 1 in an embodiment of the utility model. As shown in Figure 2 , the ESD protection structure 104 includes a TVS diode 104a and a capacitor unit 104b, wherein the TVS diode 104a and the capacitor unit 104b are connected in series. The ESD protection structure 104 can be connected between the electrostatic input area Q1 and the ground GND, so that the electrostatic input by the electrostatic input area Q1 can be conducted to the ground GND through the ESD protection structure 104.

[0047] The ground GND can be a ground layer of the printed circuit board 100. The electrostatic input area Q1 can be an area or part that can generate static electricity.

[0048] The capacitor unit 104b can include one or more capacitors C1, for example, one capacitor C1, or multiple capacitors connected in series and / or parallel. The capacitor unit 104b can include one or more capacitors C1, for example, one capacitor C1, or multiple capacitors connected in series and / or parallel. Figure 2 In the embodiment, the capacitor unit 104b includes one capacitor C1. The size of the one or more capacitors C1 connected in series and / or parallel can be designed according to actual conditions. The capacitance value of the capacitor unit 104b is greater than 33 pF.

[0049] In ESD protection, TVS diodes and capacitive units can be used in series to provide multi-level protection, for example, the capacitive unit can filter out high-frequency noise first, and the TVS diode is used to cope with ESD events. In some embodiments, the capacitive unit can also play a decoupling role, that is, the capacitive unit can absorb the transient voltage changes caused by ESD events to prevent these changes from affecting the stability of the power supply voltage, and further, the capacitive unit can also temporarily store more charge when the ESD event occurs, thereby reducing the impact of transient voltage on the circuit.

[0050] Please refer to Figure 3 , the structure diagram of the ESD protection structure 2 in an embodiment of the utility model. As shown in Figure 3 , in some embodiments, the ESD protection structure 104 includes a TVS diode 104a and an inductive unit 104c, wherein the TVS diode 104a and the inductive unit 104c are connected in parallel. Similarly, the ESD protection structure 104 can be connected between the electrostatic input area Q1 and the ground GND, so that the static electricity input by the electrostatic input area Q1 can be conducted to the ground GND through the ESD protection structure 104.

[0051] Among them, the inductive unit 104c can include one or more inductors L1, for example, it can include one inductor L1, or a plurality of inductors connected in series and / or parallel. Among them, Figure 3 , an inductor L1 is taken as an example to illustrate the inductive unit 104c. Among them, the size of the one inductor or a plurality of inductors connected in series and / or parallel can be designed according to actual conditions, and the inductance value of the inductive unit 104c is greater than 56nA.

[0052] In ESD protection, TVS diodes and inductive units can be used in parallel to provide a transient high-impedance path to limit the flow of transient current during ESD events, thereby reducing the impact on the subsequent circuit. Using inductive units on key nodes of power input terminals or signal lines can protect sensitive circuits in the back end. Inductors can help absorb or disperse a large amount of charge in ESD events and reduce the direct impact on the back-end circuit. This current limiting effect helps to reduce the impact of ESD events on sensitive components in the circuit.

[0053] In other embodiments, the ESD protection structure can also be other structures, for example, it can also include double NPN tubes (double Schottky diodes), and the specific structure is that one NPN tube 1 is biased to the ground, and the other NPN tube 2 is biased to the electrostatic input area, and the static electricity input by the electrostatic input area can be conducted to the ground.

[0054] In some embodiments, please continue to refer to Figure 1The ground position 101 of the ESD protection structure 104 is located on the side of the ESD protection structure 104 far away from the second functional device 103 arranged on the printed circuit board 100. By adjusting the ground position 101 of the ESD protection structure 104 to a reasonable position, the original easily broken functional device can be avoided or distanced, which is beneficial to reduce the direct impact on the sensitive functional device, thereby reducing the influence on the circuit.

[0055] In some embodiments, the second functional device 103 is a sensitive device easily broken. For example, it can be a switching device. The switching device can be a multi-way selection switch in a communication module, such as a single-pole double-throw switch, a double-pole double-throw switch, etc. The second functional device 103 can also be a sensor, a photoelectric device, or other sensitive devices easily broken, which can be set according to actual conditions and is not specifically limited here.

[0056] In some embodiments, the first functional device 102 can also be a sensitive device easily broken. For example, it can be a switching device. Since the slot 105 is opened in the first preset area 130 between the ground position 101 of the ESD protection structure and the first functional device 102, and at least two rows of ground holes 106 are arranged, the static electricity can be well prevented from being discharged to the sensitive devices easily broken, so the ground position 101 of the ESD protection structure 104 can not be adjusted to a position far away from the sensitive devices.

[0057] Please refer to Figure 4 Another structural diagram of the circuit structure 1 for improving the ESD protection capability in an embodiment of the utility model.

[0058] The second preset area 140 of the surface layer 110 of the printed circuit board 100 is provided with at least two rows of ground holes 106, and the second preset area 140 is the area between the side of the ESD protection structure 104 far away from the ground position 101 and the second functional device 103. The ground holes 106 arranged in the area between the side of the ESD protection structure 104 far away from the ground position 101 and the second functional device 103 can be used as an effective path for ESD energy discharge, so that the ESD current can be quickly discharged to the ground through the ground holes 106, which can avoid the direct impact of the ESD energy on the second functional device 103, protect the second functional device 103 or other sensitive devices from the influence of electrostatic discharge, and enhance the blocking capability of ESD protection.

[0059] In the above embodiments, the two rows of grounding holes 106 in the second preset area 140 are arranged in the area between the side of the ESD protection structure 104 far from the grounding position 101 and the second functional device 103. The two rows of grounding holes 106 can also be staggered by a certain distance, i.e., each grounding hole 106 in one row of grounding holes 106 can correspond to the position of the gap between two grounding holes 106 in the other row of grounding holes 106, and staggered with each other to reduce the mutual interference between the grounding holes. Each grounding hole in each row of grounding holes is also arranged with a certain spacing to ensure the mutual isolation between the grounding holes. The spacing between each grounding hole in each row of grounding holes and the distance between each row of grounding holes is designed according to the actual situation of the circuit structure, and is not specifically limited here. In some embodiments, the at least two rows of grounding holes 106 can also be three rows of grounding holes 106, four rows of grounding holes 106, etc., and the arrangement direction and number of the two rows of grounding holes 106 can also be adjusted as needed.

[0060] Please refer to Figure 5 , Figure 5 for the structural diagram of the GND reference layer 120 of the circuit structure. In some embodiments, when the GND reference layer 120 connected by the grounding position 101 of the ESD protection structure 104 and the grounding reference layer of the first functional device 102 are in the same layer of the printed circuit board 100, a slot 105 is also opened in the third preset area 150 of the layer (i.e., the same layer where the GND reference layer 120 and the grounding reference layer of the first functional device 102 are located) of the printed circuit board 100 and is arranged with at least two rows of grounding holes 106. The third preset area 150 is the area between the projection of the grounding position 101 of the ESD protection structure 104 on the layer and the projection of the first functional device 102 arranged on the layer of the printed circuit board 100, wherein the projections of the third preset area 150 and the first preset area 130 can completely coincide or partially coincide.

[0061] That is, Figure 5 The GND reference layer 120 shown in the above embodiments can be both the GND reference layer connected by the grounding position 101 of the ESD protection structure 104 and the grounding reference layer of the first functional device 102.

[0062] When the GND reference layer 120 connected by the grounding position 101 of the ESD protection structure 104 and the grounding reference layer of the first functional device 102 are in the same layer, a current loop can be formed, which can cause the ESD current to circulate between the two grounding positions, increasing the risk of impact on the functional device. Opening a slot 105 and arranging a grounding hole 106 in the third preset area can cut off this unnecessary current loop, protect sensitive devices, and improve the ESD discharge efficiency.

[0063] It is appreciated that in other embodiments, please refer to Figure 4 and Figure 6 , Figure 6 Another structural diagram of the GND reference layer 120 of the circuit structure. When the GND reference layer 120 connected by the ground position 101 of the ESD protection structure 104 and the ground reference layer of the second functional device 103 are in the same layer of the printed circuit board 100, a slot 105 is also opened in a fourth predetermined area 160 of the layer (i.e. the same layer where the GND reference layer 120 and the ground reference layer of the second functional device 103 are located) of the printed circuit board 100 and is separated by at least two rows of ground holes 106, and the fourth predetermined area 160 is the area between the projection of the side away from the ground position 101 of the ESD protection structure 104 on the layer and the projection of the second functional device 103 on the layer of the printed circuit board 100.

[0064] That is, Figure 6 The GND reference layer 120 shown in the above figure can also be the GND reference layer connected by the ground position 101 of the ESD protection structure 104 and the ground reference layer of the second functional device 103.

[0065] In some embodiments, the two rows of ground holes 106 in the third predetermined area 150 are arranged between the slot 105 and the projection of the ESD protection structure 104 on the layer, i.e. the slot 105 in the third predetermined area 150 can be closer to the projection of the first functional device 102 on the layer. In some embodiments, the two rows of ground holes 106 on the fourth predetermined area 160 are arranged between the slot 105 and the projection of the side away from the ground position 101 of the ESD protection structure 104 on the layer, i.e. the slot 105 in the fourth predetermined area 160 can be closer to the projection of the second functional device 103 on the layer.

[0066] The arrangement direction of each row of ground holes 106 in the third preset area 150 and the fourth preset area 160 can be the same as the extension direction of the slot 105, and each row of ground holes 106 can be uniformly distributed. The two rows of ground holes 106 can be staggered by a certain distance, that is, each ground hole 106 in one row of ground holes 106 can correspond to the position of the gap between two ground holes 106 in another row of ground holes 106, and staggered with each other to reduce the mutual interference between the ground holes. Each ground hole 106 in each row of ground holes 106 is also provided with a certain spacing to ensure the mutual isolation between the ground holes. The spacing between each ground hole 106 in each row of ground holes and the distance between each row of ground holes can be designed according to the actual situation of the circuit structure, and is not specifically limited here. In some embodiments, the arrangement direction of the two rows of ground holes 106 can also be different from the extension direction of the slot 105, for example, having an included angle with the extension direction of the slot 105. The arrangement direction and number of the two rows of ground holes 106 can also be adjusted as needed.

[0067] In some embodiments, the at least two rows of ground holes 106 include three rows of ground holes 106 or more than three rows of ground holes 106, which are set according to the actual situation and are not specifically limited here.

[0068] In some embodiments, the ground holes 106 can include but are not limited to round holes, square holes, polygonal holes or other irregularly shaped holes, which are set according to the actual situation and are not specifically limited here. When the ground holes 106 are set as round holes, the diameter of the round holes is 0.2 mm; when the ground holes 106 are set as square holes, the length of the square holes is 0.2 mm and the width is 0.2 mm.

[0069] In some embodiments, each hole in each row of holes in the two rows of ground holes 106 or the multiple rows of ground holes 106 can have different shapes, and these holes can appear in the same row or multiple rows in any combination. In addition, the two rows of holes or the multiple rows of holes can be staggered, parallel, symmetrical or other arrangements, and the specific design is set according to the actual situation of the circuit layout, which is not specifically limited here. By allowing the ground holes 106 to have different shapes and can be arranged in the same row or multiple rows in any combination, and the two rows of ground holes or the multiple rows of ground holes can be staggered or other arrangements, the flexibility and diversity of the structure can be improved, the needs of different application scenarios can be met, the space utilization rate is improved, and the layout of the ground holes 106 is more compact and reasonable.

[0070] In some embodiments, the shape of the slot 105 includes a straight line shape, an arc shape, a bent shape (for example, an L shape) or a U shape. It can be understood that the shape of the slot 105 can also be other straight line segment shapes or curve shapes, or a combination of other straight line segment shapes and curve shapes, and the specific design is set according to the actual situation of the circuit layout, which is not limited here. The width or depth of the slot is at least 0.1 mm.

[0071] It can be understood that when the slot is opened and the via hole is arranged in the preset area, the arrangement of the via hole 106 can be planned according to the shape of the slot 105, that is, the shape and position of the via hole 106 should closely follow the contour of the slot 105 to ensure the effective distribution of the via hole 106. For example, when the slot 105 is L-shaped, the via holes 106 are evenly distributed along the long side and the short side of the L-shaped slot 105, respectively, and the via holes 106 on the long side or the short side of the L-shaped slot 105 should closely follow the contour of the slot 105 to ensure the effective distribution of the via holes; the two rows of via holes 106 or the multiple rows of via holes 106 are arranged on the same side of the L-shaped slot 105 and are staggered with each other to reduce the mutual interference between the via holes, and a certain spacing is also arranged between each via hole 106 in each row of via holes 106 to ensure the mutual distance between the via holes.

[0072] Please refer to Figure 7 , which is a structural block diagram of an electronic device in an embodiment of the present application. As shown in Figure 7 , the electronic device 200 includes a functional device 201 and the circuit structure 1 for improving the ESD protection capability in any of the preceding embodiments, and the electronic device can improve the ESD protection capability of the functional device 201.

[0073] Among them, the functional device 201 can include the first functional device 102 described above, and can also include the second functional device 103 described above, etc. The functional device 201 can be a functional chip, a switching device, etc. close to the circuit structure 1.

[0074] Among them, the specific structure of the circuit structure 1 can refer to the content in any of the preceding embodiments, which will not be repeated here.

[0075] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments. The above has carried out the detailed introduction to the embodiment of the utility model, the principle and implementation mode of the utility model have been set forth in this article by applying specific examples, the above embodiment explanation is only for helping understanding the method and its core idea of the application; at the same time, for the general technical personnel in the field, according to the idea of the application, the specific implementation mode and application range will have changes, and the above is described, the content of the specification should not be understood as the limitation of the application. Any modification, equivalent replacement and improvement etc. within the spirit and principle of the above embodiments should be included in the protection scope of the technical scheme.

Claims

1. A circuit structure for improving ESD protection capability, characterized by, The application relates to a printed circuit board and an ESD protection structure arranged on the printed circuit board for leading electrostatic discharge to ground. The first preset area of the surface layer of the printed circuit board is provided with a slot and at least two rows of ground holes, the first preset area is the area between the grounding position of the ESD protection structure and the first functional device arranged on the printed circuit board, the first functional device is the functional device arranged on one side of the grounding position of the ESD protection structure, the slot and the at least two rows of ground holes penetrate the top layer of the printed circuit board, and the at least two rows of ground holes are connected to ground. The ESD protection structure comprises a series-connected TVS diode and a capacitor unit or a parallel-connected TVS diode and an inductor unit. The grounding position of the ESD protection structure is located on the side of the ESD protection structure away from the second functional device arranged on the printed circuit board.

2. The circuit structure of claim 1, wherein, The second functional device is a switching device.

3. The circuit structure of claim 1, wherein, The second preset area of the surface layer of the printed circuit board is provided with at least two rows of ground holes, the second preset area is the area between the side of the ESD protection structure away from the grounding position and the second functional device.

4. The circuit structure according to claim 3, characterized in that When the GND reference layer connected with the grounding position of the ESD protection structure and the ground reference layer of the first functional device are in the same layer of the printed circuit board, a slot and at least two rows of ground holes are further arranged in the third preset area of the layer of the printed circuit board, the third preset area is the area between the projection of the grounding position of the ESD protection structure on the layer and the projection of the first functional device arranged on the layer of the printed circuit board.

5. The circuit structure of claim 3, wherein, When the GND reference layer connected with the grounding position of the ESD protection structure and the ground reference layer of the second functional device are in the same layer of the printed circuit board, a slot and at least two rows of ground holes are further arranged in the fourth preset area of the layer of the printed circuit board, the fourth preset area is the area between the projection of the side of the ESD protection structure away from the grounding position on the layer and the projection of the second functional device arranged on the layer of the printed circuit board.

6. The circuit structure of claim 1, wherein, The application relates to a printed circuit board and an ESD protection structure arranged on the printed circuit board for leading electrostatic discharge to ground.

7. The circuit structure of claim 3, wherein, The ground hole comprises a round hole, a square hole, a polygonal hole or an irregularly-shaped hole, and the shape of the slot comprises a straight line segment, an arc or a U shape.

8. The circuit structure according to any one of claims 1 to 7, characterized in that, The application relates to a printed circuit board and an ESD protection structure arranged on the printed circuit board for leading electrostatic discharge to ground. ​ 9. An electronic device, comprising: ​

Images