Power distribution device and charging equipment

Abstract

The embodiment of the utility model provides a power distribution device and charging equipment comprising the power distribution device, and relates to the technical field of energy. The power distribution device is used for distributing input current into at least one path and outputting the current, the power distribution device comprises a circuit board and a plurality of electronic components, the plurality of electronic components are all fixed on the circuit board, the power distribution device further comprises an enclosure frame, an adhesive layer and partition ribs, the enclosure frame is fixed on the circuit board, and the adhesive layer is fixed on the partition ribs. The plurality of electronic components comprise at least one electronic component positioned on the inner side of the enclosure frame and at least two electronic components positioned on the outer side of the enclosure frame; the glue layer is located in the enclosure frame and fixed on the circuit board, at least one electronic component located on the inner side of the enclosure frame comprises a component shell and a pin fixed on the component shell, the pin is electrically connected with the circuit board, and the glue layer covers the pin; the partition rib is located outside the enclosure frame, the partition rib is fixed on the enclosure frame or the circuit board, and at least two electronic components located outside the enclosure frame are distributed on different sides of the partition rib.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of energy, in particular to a power distribution device and a charging device. BACKGROUND

[0002] Due to the complex application scene of the charging station, frequent charging and discharging will cause the temperature of the charging device to change frequently. However, in order to meet the current flow requirement, the copper content of the internal circuit board of the power distribution device is large, and in the case of a large number of temperature cycles, condensation will be formed on the surface of the internal circuit board of the power distribution device, which will cause the risk of short circuit and damage of the circuit board.

[0003] In the related art, the circuit board is surrounded by a plastic part, and then glue is poured into the space surrounded by the plastic part, so that the glue covers the entire circuit board and completely wraps the surface of the circuit board in the glue layer. However, the protection method of the related art has a high cost and is not conducive to the heat dissipation of some electronic components. CONTENT OF THE UTILITY MODEL

[0004] The present application provides a power distribution device and a charging device comprising the power distribution device, which reduces the risk of short circuit or damage of the circuit board caused by condensation and reduces the amount of glue layer.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0006] The first aspect of the present application provides a power distribution device for distributing input current into at least one path and outputting, the power distribution device comprising a circuit board and a plurality of electronic components, the plurality of electronic components are fixed on the circuit board, the power distribution device further comprises a frame, a glue layer and a spacer, the frame is fixed on the circuit board, the plurality of electronic components include at least one electronic component located inside the frame and at least two electronic components located outside the frame; the glue layer is located inside the frame and fixed on the circuit board, the at least one electronic component located inside the frame includes a component shell and a pin fixed on the component shell, the pin is electrically connected with the circuit board, and the glue layer covers the pin; the spacer is located outside the frame, the spacer is fixed on the frame or fixed on the circuit board, and the at least two electronic components located outside the frame are distributed on different sides of the spacer.

[0007] The circuit board of the power distribution device is used to carry a plurality of electronic components, and the power distribution is realized through the circuit board and the plurality of electronic components thereon, so that the input current is distributed into at least one path and output. The frame is installed on the circuit board, and then the glue liquid is poured towards the inner side of the frame. After the glue liquid solidifies, a glue layer is formed, which covers the circuit board on the inner side of the frame and covers the pins, so that at least one electronic component located on the inner side of the frame has no metal conductor (pin) exposed outside the glue layer, thereby protecting the electronic component in the frame and reducing the risk of condensation on the circuit board causing short circuit or damage of the circuit board. In addition, the partition rib is located outside the frame and separates the electronic components on the outer side of the frame, so that the creepage distance between the electronic components on the outer side of the frame is increased, and the part of the condensation on the outer side of the frame is blocked and guided, thereby reducing the risk of the condensation contacting multiple electronic components and causing the circuit board to fail. That is, the glue is poured only on the inner side of the frame to form a glue layer, and the outer side of the frame does not need to be poured with glue. By setting the partition rib, the electronic components in the non-glued area and the high-voltage network are separated. In this way, the glue pouring can be more targeted, which can not only play a good protection role and reduce the risk of condensation causing short circuit or damage of the circuit board, but also reduce the amount of glue layer and production cost. Moreover, after the glue pouring is completed, the frame remains in the power distribution device and is fixed on the circuit board. In this way, the frame can also play an insulating role, thereby enhancing the insulation performance between the electronic components on the outer side of the frame and the electronic components on the inner side of the frame.

[0008] In an embodiment of the present application, the partition rib is fixed on the frame and extends towards the outer side of the frame. The surface of the partition rib towards the circuit board is adhesively fixed to the surface of the circuit board.

[0009] The partition rib is fixed on the frame. During the installation of the frame, the partition rib can also be installed on the circuit board together with the frame. After the frame and the partition rib are installed on the circuit board, the surface of the partition rib is adhesively fixed to the surface of the circuit board, thereby reducing the possibility of the partition rib being raised or bent, and reducing the risk of relative displacement between the partition rib and the circuit board during the glue pouring process and after the glue pouring is completed, which is conducive to the smooth progress of the glue pouring process. In addition, the partition rib is fixed to the circuit board by adhesion, that is, the partition rib is fixed to the circuit board without screws or welding, which is conducive to the assembly of the frame (the partition rib is located on the frame) and the circuit board.

[0010] In an embodiment of the present application, the power distribution device further comprises a flexible glue strip. The surface of the partition rib towards the circuit board is adhesively fixed to the surface of the circuit board through the glue strip.

[0011] The flexible glue strip can deform under stress. In the case that the surface of the partition rib towards the circuit board has dimensional errors or unevenness, the glue strip can absorb the matching tolerance by deformation, so that the partition rib can be stably adhesively fixed to the circuit board, which is also conducive to the installation and fixation of the frame.

[0012] In an embodiment of the present application, the power distribution device further comprises a mounting seat, a protective shell and a fastener, the mounting seat and the protective shell are fixed by the fastener, the circuit board is located in a space surrounded by the mounting seat and the protective shell, and the circuit board is fixed on the mounting seat or the protective shell, the surrounding frame and the partition rib are located on the board surface of the circuit board facing the protective shell, and the protective shell abuts against the partition rib.

[0013] The mounting seat and the protective shell can protect the circuit board, and the circuit board is installed between the mounting seat and the protective shell. After the protective shell and the mounting seat are connected by the fastener, the protective shell abuts against the partition rib and presses the partition rib on the circuit board, thereby reducing the possibility of the partition rib being raised or bent, and enabling the partition rib to better increase the creepage distance and reduce the risk of failure of the partition rib.

[0014] In an embodiment of the present application, the side of the partition rib away from the circuit board has a groove, and the part of the protective shell abutting against the partition rib extends into the groove.

[0015] Since the protective shell is connected and fixed with the mounting seat by the fastener, and the circuit board is fixed between the protective shell and the mounting seat, the possibility of relative displacement between the protective shell, the circuit board and the fastener is low, but there is still a risk of relative displacement between the surrounding frame and the circuit board. Therefore, in the case that the protective shell presses the partition rib, the part of the protective shell abutting against the partition rib extends into the groove of the partition rib to form cooperation and limiting, and through the plug-in cooperation between the protective shell and the groove, the possibility of loosening of the surrounding frame is reduced, and the surrounding frame can be firmly fixed on the circuit board. In addition, the risk of bending or bending of the partition rib can be further reduced.

[0016] In an embodiment of the present application, the surrounding frame comprises a fixed surrounding frame and a positioning column, the surrounding frame surrounds at least one electronic component of the plurality of electronic components, and the positioning column is fixed on the surrounding frame. The circuit board has a positioning hole, and the positioning column is inserted into the positioning hole.

[0017] During installation of the surrounding frame, the positioning column on the surrounding frame can be aligned with the positioning hole on the circuit board and inserted. The cooperation between the positioning column and the positioning hole can play a positioning role, facilitating installation of the surrounding frame on the circuit board and making the installation position of the surrounding frame more accurate. The surrounding frame limits the injected glue liquid, and the glue layer formed after the glue liquid solidifies is located inside the surrounding frame.

[0018] In an embodiment of the present application, the surrounding frame further comprises a blocking plate fixed on the surrounding frame, the blocking plate protrudes towards the inside of the surrounding frame, there is a gap between the blocking plate and the circuit board, and the distance between the blocking plate and the circuit board is greater than the distance between the device shell of at least one electronic component located inside the surrounding frame and the circuit board.

[0019] After the frame is mounted on the circuit board, during the process of pouring glue into the inner side of the frame, the ring frame plays a peripheral limiting role on the glue liquid, limiting the glue liquid in the area surrounded by the ring frame, and the blocking plate limits the height of the glue liquid, and the glue liquid is poured into the gap between the blocking plate and the circuit board (it can also slightly exceed the blocking plate), and the blocking plate plays a hindering role on the glue liquid, reducing the possibility of glue liquid overflowing from the top of the ring frame. Moreover, the distance between the blocking plate and the circuit board is greater than the distance between the device shell and the circuit board, so that the pins on the device shell can be covered by the glue layer, and at least one electronic component located inside the ring frame has no metal conductor (pin) exposed outside the glue layer, thereby protecting the electronic component inside the ring frame.

[0020] In an embodiment of the present application, the at least one electronic component located inside the frame includes a switching device for controlling the on-off of the current, and the switching device includes a device shell and a pin. In the thickness direction of the circuit board, the height of the device shell of the switching device is greater than the height of the frame.

[0021] The switching device controls the on-off of the current to achieve the distribution of the current. The frame is arranged on the surface of the circuit board where the switching device is arranged. Since the height of the frame is lower than the height of the switching device, after the glue is poured into the frame, the glue layer does not cover the entire device shell of the switching device, thereby reducing the height of the glue layer. In the case of effectively protecting the pins of the switching device, the influence of the glue layer on the heat dissipation of the switching device is reduced, the amount of glue is reduced, and the material required for the frame is reduced, thereby saving the production cost and reducing the weight of the circuit board and the power distribution device.

[0022] In an embodiment of the present application, the power distribution device further includes a metal sheet and a bottom frame. The plurality of electronic components are fixed on the same surface of the circuit board. The metal sheet is fixed on the surface of the circuit board away from the plurality of electronic components. The metal sheet is electrically connected to at least one of the plurality of electronic components. The bottom frame is arranged outside the metal sheet and surrounds a glue pouring space with the circuit board. The circuit board has a glue pouring hole communicating with the glue pouring space, and the glue pouring hole is located inside the frame.

[0023] The current input or output through the metal sheet can be distributed through the corresponding electronic component (for example, the switching device). During the glue pouring process, the glue pouring space in the bottom frame can be poured through the glue pouring hole first. After the glue liquid in the glue pouring space is filled, the glue liquid will overflow from the glue pouring hole. Then, the space surrounded by the frame is poured with glue. After the glue liquid in the frame is filled and solidified, the glue layer covers the circuit board inside the frame and fills at least part of the gap between the electronic component and the circuit board, thereby protecting the electrical connection position of the electronic component and the circuit board.

[0024] In a second aspect of the present application, a charging device is provided, which includes a power conversion device, a plurality of charging interfaces, and a power distribution device as described above, which is electrically connected to the power conversion device and the plurality of charging interfaces, and is configured to distribute the direct current output by the power conversion device to at least one charging interface.

[0025] The power distribution device can distribute the current from the power conversion device according to the needs of the charging interfaces, and distribute the current output by the power conversion device to one or more corresponding charging interfaces. The charging device provided by the present application includes the power distribution device described above, and thus can solve the same technical problems and achieve the same technical effects as the power distribution device described above, which will not be described here.

[0026] In an embodiment of the present application, the power distribution device further includes a metal sheet and a busbar, the plurality of electronic components include a switching device configured to control the on-off of the current, the metal sheet is electrically connected to the switching device, and the busbar is in contact with the metal sheet and is electrically connected to the output end of the power conversion device and / or the input end of the at least one charging interface.

[0027] The current output from the output end of the power conversion device passes through the corresponding busbar, metal sheet and switching device, and is delivered to the input end of one or more corresponding charging interfaces. The on-off of the current is controlled by the switching device, and the current output by the power conversion device is distributed to the corresponding charging interfaces. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A structural schematic diagram of a charging device provided by an embodiment of the present application is shown in FIG. 1;

[0029] Figure 2 A structural schematic diagram of another charging device provided by an embodiment of the present application is shown in FIG. 2;

[0030] Figure 3 A structural schematic diagram of a power distribution device provided by an embodiment of the present application is shown in FIG. 3;

[0031] Figure 4 A split view of the power distribution device provided by an embodiment of the present application is shown in FIG. 4;

[0032] Figure 5 A structural schematic diagram of a glue layer provided by an embodiment of the present application is shown in FIG. 5;

[0033] Figure 6 A structural schematic diagram of a glue layer provided by an embodiment of the present application is shown in FIG. 5; Figure 5 An enlarged view of position A in FIG. 5;

[0034] Figure 7 A structural schematic diagram of a plurality of electronic components provided by an embodiment of the present application is shown in FIG. 6;

[0035] Figure 8 Another arrangement of multiple electronic components provided by the embodiment of the present application is shown in the figure;

[0036] Figure 9 A structure diagram of a protective shell provided by the embodiment of the present application is shown in the figure;

[0037] Figure 10 For Figure 9 A local enlarged view at B in the middle;

[0038] Figure 11 A structure diagram of another protective shell provided by the embodiment of the present application is shown in the figure;

[0039] Figure 12 A structure diagram of a rubber strip provided by the embodiment of the present application is shown in the figure;

[0040] Figure 13 A structure diagram of a surrounding frame provided by the embodiment of the present application is shown in the figure;

[0041] Figure 14 A structure diagram of a blocking plate provided by the embodiment of the present application is shown in the figure;

[0042] Figure 15 A height diagram of a surrounding frame provided by the embodiment of the present application is shown in the figure;

[0043] Figure 16 A structure diagram of a bottom frame provided by the embodiment of the present application is shown in the figure.

[0044] Reference signs:

[0045] 100 - charging device; 101 - device cabinet; 102 - charging gun; 103 - charging host; 104 - charging terminal; 105 - power conversion device; 1051 - power module; 106 - power distribution device; 107 - charging interface; 108 - cable; 109 - busbar; 1 - circuit board; 11 - through hole; 12 - positioning hole; 13 - glue pouring hole; 2 - electronic component; 21 - component shell; 22 - pin; 23 - switching device; 3 - surrounding frame; 31 - surrounding frame; 32 - positioning column; 33 - blocking plate; 34 - arc segment; 4 - glue layer; 5 - spacer; 51 - groove; 6 - rubber strip; 7 - shell; 71 - mounting seat; 72 - protective shell; 721 - shell part; 722 - protrusion part; 73 - fastener; 8 - metal sheet; 9 - bottom frame; 91 - glue pouring space; 92 - surrounding plate; 93 - bottom plate. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0047] In the present application, the terms "first", "second", etc. are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or implying a specified number of indicated technical characteristics. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features.

[0048] In the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0049] In addition, in the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described as "exemplary" or "for example" in the present application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of "exemplary" or "for example" is intended to present concepts in a concrete manner. In the present application, the word "exemplary" or "for example" is used to present concepts in a concrete manner.

[0050] In the drawings of the embodiments of the present application, the entity structures of components, assemblies, etc. are represented by guide lines; the hollow structures of openings, holes, spaces, cavities, etc. are represented by guide lines with arrows.

[0051] The embodiments of the present application provide a charging device 100, which can be a charging pile, for example, an integrated charging pile, Figure 1 An exemplary structure of a charging device 100 (an integrated charging pile) is shown, referring to Figure 1 The charging device 100 includes a device cabinet 101 and at least one charging gun 102, for example, Figure 1 The case of multiple charging guns 102 is shown in FIG. 1. In the case where the charging gun 102 does not perform a charging operation, the charging gun 102 can be plugged into the device cabinet 101 for personnel to take at any time.

[0052] For another example, the charging device 100 can also be a split charging pile, Figure 2 An exemplary structure of another charging device 100 (a split charging pile) is shown, referring to Figure 2 The charging device 100 includes a charging host 103, at least one charging terminal 104, and at least one charging gun 102, for example, Figure 2 The case of multiple charging terminals 104 and multiple charging guns 102 is shown. Each charging terminal 104 is electrically connected to the charging host 103, and each charging terminal 104 corresponds to one or more charging guns 102. In the case where the charging gun 102 does not perform a charging operation, the charging gun 102 can be plugged into the corresponding charging terminal 104 for personnel to take from the charging terminal 104.

[0053] In addition, referring to Figure 1And Figure 2 The charging device 100 further comprises a power conversion device 105, a power distribution device 106 and a plurality of charging interfaces 107. The input end of the power conversion device 105 is configured to receive alternating current, and the output end of the power conversion device 105 is configured to output direct current. For example, the power conversion device 105 can comprise a plurality of power modules 1051, which comprise a plurality of AC-DC modules, and in some other examples, the plurality of power modules 1051 comprise a plurality of AC-DC modules and a plurality of DC-DC modules. The output end of the plurality of AC-DC modules is connected to the input end of the plurality of DC-DC modules through a DC bus, and the output end of the plurality of DC-DC modules outputs direct current. The output end of the power conversion device 105 is electrically connected to the input end of the power distribution device 106, and the output end of the power distribution device 106 is electrically connected to the input end of the plurality of charging interfaces 107. The power distribution device 106 is configured to distribute the direct current output by the power conversion device 105 to one or more corresponding charging interfaces 107, and to make the output end of the charging interface 107 output direct current, so as to charge the device to be charged (for example, an electric vehicle) through the charging gun 102.

[0054] In the example in which the charging device 100 is an integrated charging pile, referring to Figure 1 The power conversion device 105, the power distribution device 106 and the plurality of charging interfaces 107 can be arranged in the device cabinet 101, and each charging interface 107 can be electrically connected to the corresponding charging gun 102 through the cable 108. Figure 2 In the example in which the charging device 100 comprises the charging host 103 and at least one charging terminal 104, referring to The power conversion device 105 and the power distribution device 106 can be arranged in the charging host 103, and the charging interface 107 can be arranged in the terminal cabinet of the charging terminal 104, and each charging interface 107 is electrically connected to the corresponding charging gun 102 through the cable 108.

[0055] It should be noted that Figure 1 And Figure 2 The charging device 100 shown in the above examples is only an example of the two charging devices 100 provided by the present application, and is not a limitation on the charging device 100 of the present application.

[0056] The embodiment of the present application further provides a power distribution device 106, wherein the power distribution device 106 is configured to distribute the input current into at least one path and output, Figure 3 An example is shown to illustrate the overall structure of a power distribution device 106, Figure 4 An example is shown to illustrate the split structure of a power distribution device 106. Referring to Figure 3 And Figure 4The power distribution device 106 comprises a housing 7 and a circuit board 1, which can be arranged in the housing 7, and the circuit board 1 can be a printed circuit board (PCB).

[0057] The housing 7 can be a one-piece housing or a split housing, for example, the power distribution device 106 comprises a mounting base 71, a protective shell 72 and fasteners 73, the mounting base 71 and the protective shell 72 are fixed by the fasteners 73 (e.g., screws, rivets, etc.), and the circuit board 1 is fixed in the space surrounded by the mounting base 71 and the protective shell 72, wherein the mounting base 71, the protective shell 72 and the fasteners 73 constitute at least part of the housing 7. The housing 7 protects the internal circuit board 1, and in other examples, the power distribution device 106 can also not be provided with the housing 7, that is, the circuit board 1 is exposed.

[0058] Referring to Figure 4 The power distribution device 106 further comprises a plurality of electronic components 2, wherein the plurality of electronic components 2 can comprise at least one of a relay, a contactor, an inductor, a capacitor, and a chip, and the plurality of electronic components 2 are all fixed on the circuit board 1, for example, the plurality of electronic components 2 are all fixed on the same board surface of the circuit board 1, and in other examples, the plurality of electronic components 2 can also be fixed on different board surfaces of the circuit board 1. The plurality of electronic components 2 can comprise a plurality of different electronic components 2, or a plurality of the same electronic components 2, which is not limited in the present application.

[0059] In addition, referring to Figure 4 The power distribution device 106 further comprises a surrounding frame 3 (similar to a ring-shaped structure), which is fixed on the circuit board 1, and the material of the surrounding frame 3 can be selected as needed, for example, the surrounding frame 3 can be a rubber frame, or a plastic frame, which is not limited in the present application.

[0060] Referring to Figure 4 The plurality of electronic components 2 comprises at least one electronic component 2 located inside the surrounding frame 3 (the surrounding frame 3 surrounds the at least one electronic component 2), and at least two electronic components 2 located outside the surrounding frame 3. That is, at least one electronic component 2 of the plurality of electronic components 2 on the circuit board 1 is located inside the surrounding frame 3, and at least two electronic components 2 of the plurality of electronic components 2 on the circuit board 1 are located outside the surrounding frame 3. In other words, the surrounding frame 3 surrounds part of the electronic components 2 on the circuit board 1, and the other electronic components 2 on the circuit board 1 are located outside the surrounding frame 3 except for the electronic components 2 inside the surrounding frame 3.

[0061] For example, in Figure 4In the shown example, a plurality of electronic components 2 are arranged inside the frame 3 and outside the frame 3. In other examples, one electronic component 2 is arranged inside the frame 3 and a plurality of electronic components 2 are arranged outside the frame 3.

[0062] With reference to Figure 4 , the power distribution device 106 further comprises a glue layer 4 which can be formed by pouring glue inside the frame 3 and solidifying the glue. Figure 5 An example of the structure of the glue layer 4 is shown in Figure 5 , the glue layer 4 is arranged inside the frame 3 and fixed on the circuit board 1, at least one electronic component 2 arranged inside the frame 3 comprises a component shell 21 (the structure inside the component shell 21 is not shown in the drawings) and a pin 22 fixed on the component shell 21, the glue layer 4 covers the pin 22, wherein the glue layer 4 covers the part of the pin 22 located on the side of the circuit board 1 facing the component shell 21.

[0063] In the part of the pin 22 located on the side of the circuit board 1 facing the component shell 21, there are two cases, in one case, with reference to Figure 6 , Figure 6 is an enlarged view of A in Figure 5 , the pin 22 in the drawing passes through the circuit board 1 and a part of the pin 22 is located on the side of the circuit board 1 facing the component shell 21, another part of the pin 22 is located on the side of the circuit board 1 away from the component shell 21, in this case, the part of the pin 22 located on the side of the circuit board 1 facing the component shell 21 refers to the part of the pin 22 located inside the dashed box K1 in Figure 6 , the height of the glue layer 4 can cover the part of the pin 22 located inside the dashed box K1 (i.e. the part of the pin 22 located on the side of the circuit board 1 facing the component shell 21), in this way, the electronic component 2 has no metal conductor exposed outside the glue layer 4, thereby achieving the protection of the electronic component 2 inside the frame 3 and reducing the risk of condensation on the circuit board 1 causing short circuit or damage of the circuit board 1. In another case (not shown in the drawings), the pin 22 can be located entirely on the side of the circuit board 1 facing the component shell 21, in this case, the height of the glue layer 4 can cover the entire pin 22.

[0064] With reference to Figure 5 (also with reference to Figure 6), the electronic component 2 can be an electronic component 2a, the electronic component 2a includes a component shell 21 and a pin 22, the pin 22 is fixed on the surface of the component shell 21 towards the circuit board 1, the electronic component 2a is electrically connected with the circuit board 1 through the pin 22 of the electronic component 2a, the gap (the area pointed by the arrow F1) between the component shell 21 of the electronic component 2a and the circuit board 1, that is, the gap between the surface of the component shell 21 of the electronic component 2a towards the circuit board 1 and the circuit board 1, the gap is filled by the adhesive layer 4, that is, the part of the pin 22 located on the side of the circuit board 1 towards the component shell 21 is covered by the adhesive layer 4, in this way, the electronic component 2a has no metal conductor exposed outside the adhesive layer 4, so as to realize the protection of the electronic component 2 in the frame 3 and reduce the risk of short circuit or damage of the circuit board 1 caused by condensation on the circuit board 1.

[0065] In addition, in some examples, there are also some electronic components 2 with low height in the frame 3, such components 2 (for example, patch components, surface mount components, etc.) can be completely covered by the adhesive layer 4.

[0066] The power distribution device 106 further includes a partition rib 5, Figure 7 An example shows a structure of the partition rib 5, in order to facilitate the distinction, Figure 7 The electronic components 2 in the frame 3 are all filled with grid-like shadows, referring to Figure 7 The partition rib 5 is fixed on the frame 3 and extends towards the outside of the frame 3, wherein the partition rib 5 can be in the form of a long strip, or can be bent or curved, which is not specifically limited in the present application. The number of the partition rib 5 can also be set as needed, for example, the partition rib 5 can be provided with one, or the partition rib 5 can be provided with multiple, Figure 7 An example in which the partition rib 5 is provided with multiple is shown.

[0067] In Figure 7 In the example shown, the partition rib 5 is fixed with the frame 3, and in the process of installing the frame 3, the partition rib 5 can also be installed on the circuit board 1 together with the frame 3. In some other examples, the partition rib 5 is not connected with the frame 3, and the partition rib 5 is located on the outside of the circuit board 1, and the partition rib 5 is separately installed on the circuit board 1, for example, the frame 3 is first installed on the circuit board 1, and then the partition rib 5 is installed on the circuit board 1, in this way, the installation of the partition rib 5 can be more flexible and more targeted.

[0068] At least two electronic components 2 located outside the frame 3 are distributed on different sides of the partition rib 5, in Figure 7In the shown example, multiple electronic components 2 are arranged outside the enclosure 3, and multiple partitions 5 can also be arranged on the enclosure 3, which separate the multiple electronic components 2 into multiple areas. For example, electronic component 2b and electronic component 2c are arranged on different sides of partition 5a, and for another example, electronic component 2d and electronic component 2e are arranged on the same side of partition 5b, and electronic component 2f and electronic component 2g are arranged on the same side of partition 5b.

[0069] In some other examples, one electronic component 2 can be arranged on one side of a partition 5, and multiple electronic components 2 can be arranged on the other side of the partition 5.

[0070] In the example where multiple partitions 5 are arranged, one electronic component 2 can be arranged between any two adjacent partitions 5, or multiple electronic components 2 can be arranged between any two adjacent partitions 5. Alternatively, one electronic component 2 can be arranged between any two partitions 5 out of multiple (four or more) partitions 5, and multiple electronic components 2 can be arranged between the other two partitions 5 out of the multiple partitions 5.

[0071] In some other examples, only one partition 5 can be arranged on the enclosure 3, and part of the multiple electronic components 2 arranged outside the enclosure 3 can be arranged on one side of the partition 5, and the other part of the multiple electronic components 2 can be arranged on the other side of the partition 5.

[0072] That is, the partition 5 arranged on the enclosure 3 can separate at least two electronic components 2 arranged outside the enclosure 3, and the partition 5 arranged on the outside of the enclosure 3 can separate the multiple electronic components 2, increase the creepage distance between the multiple electronic components 2 arranged outside the enclosure 3, and block and guide part of the condensation arranged outside the enclosure 3, thereby reducing the risk that the condensation arranged outside the enclosure 3 contacts the multiple electronic components 2 and causes the circuit board 1 to fail.

[0073] The enclosure 3 is arranged inside the power distribution device 106 and fixed on the circuit board 1, and the enclosure 3 can also play an insulating role, thereby enhancing the insulation performance between the electronic components 2 arranged outside the enclosure 3 and the electronic components 2 arranged inside the enclosure 3, and further ensuring the normal operation of the circuit board 1.

[0074] The enclosure 3 is arranged inside the power distribution device 106 and fixed on the circuit board 1, and the enclosure 3 can also play an insulating role, thereby enhancing the insulation performance between the electronic components 2 arranged outside the enclosure 3 and the electronic components 2 arranged inside the enclosure 3, and further ensuring the normal operation of the circuit board 1.

[0075] Figure 7Only one arrangement of the plurality of electronic components 2 is shown in the figure, Figure 8 Another arrangement of the plurality of electronic components 2 is shown in the figure, Figure 7 and Figure 8 The electronic components 2 in the figure are filled with grid-like shading, and the electronic components 2 inside the frame 3 and the electronic components 2 outside the frame 3 can be any suitable electronic components 2, and the electronic components 2 inside the frame 3 and the electronic components 2 outside the frame 3 can be arranged in any suitable manner, which is not specifically described in the present application.

[0076] In some examples, the electronic components 2 inside the frame 3 can include one or more switching devices 23 (for example, relays, contactors, etc.) for controlling the on-off of current, for example, in Figure 7 The electronic components 2 shown inside the frame 3 in the figure can all be switching devices 23 in the example shown, which control the on-off of current to achieve the distribution of current. The electronic components 2 inside the frame 3 can also have no switching device 23, for example, in Figure 8 The electronic components 2 shown inside the frame 3 in the figure are not switching devices 23 in the example shown.

[0077] In addition, in the example shown in Figure 7 The circuit board 1 also has a through hole 11 for a bolt to pass through, and the bolt can pass through the through hole 11 and lock the circuit board 1 with other structures, for example, the power distribution device 105 also includes a busbar 109 (the busbar 109 can be auxiliary reference Figure 1 and Figure 2 ), and the bolt can lock the circuit board 1 with the busbar 109 (for example, a copper bar). In order to facilitate the electrical connection between the circuit board 1 and the busbar 109, referring back to Figure 6 The power distribution device 106 can also include a metal sheet 8, which can be a copper bar, copper sheet or aluminum bar, etc. The plurality of electronic components 2 are fixed on the same board surface of the circuit board 1, the metal sheet 8 is fixed on the board surface of the circuit board 1 away from the plurality of electronic components 2, and the metal sheet 8 is electrically connected to at least one electronic component 2. After the bolt locks the circuit board 1 and the busbar 109, the metal sheet 8 can be in contact with the busbar 109 to achieve electrical connection between the busbar 109 and the corresponding electronic component 2. In the above example, the current on the busbar 109 and the metal sheet 8 also flows through the bolt corresponding to the through hole 11. In the case where a plurality of through holes 11 and bolts are provided, a spacer 5 can be provided between adjacent two through holes 11 to increase the creepage distance of adjacent two bolts, thereby reducing the possibility of short circuit between adjacent two bolts.

[0078] In some examples, referring back to Figure 1, the power conversion device 105 includes a plurality of power modules 1051, the busbar 109(a) is electrically connected to the output end of the power module 1051(a), and the busbar 109(a) is also electrically connected to the input end of the charging interface 107(a) corresponding to the power module 1051(a), and the current output by the power module 1051(a) can be directly delivered to the corresponding charging interface 107(a) through the busbar 109(a). In the case where the charging interface 107(b) needs to call the current of the power module 1051(a), the current of the power module 1051(a) can be delivered to the metal sheet 8 corresponding to the busbar 109(a) through the busbar 109(a), and then flow through the switching device 23 electrically connected to the metal sheet 8, and the current is distributed to the busbar 109(b) through the switching device 23, and the busbar 109(b) is electrically connected to the charging interface 107(b), so as to realize the allocation of the current of the power module 1051(a) to the charging interface 107(b).

[0079] In other examples, referring to Figure 2 , the output end of the power conversion device 105 is connected to the busbar 109(c), the input end of the charging interface 107 is connected to the busbar 109(d), and the busbar 109(c) and the busbar 109(d) contact different metal sheets 8, respectively. That is, the busbar 109(c) connected to the output end of the power conversion device 105 is not directly connected or contacted with the busbar 109(d) connected to the input end of the charging interface 107, and the current output from the power conversion device 105 needs to pass through the power distribution device 106 before being delivered to the charging interface 107.

[0080] Continuing to refer to Figure 5 and Figure 6 , in the example that the power distribution device 106 further includes the metal sheet 8, referring to Figure 15 , the metal sheet 8 can be provided with one or more (the present application shows the case that the metal sheet 8 is provided with multiple metal sheets 8), and the metal sheet 8 is fixed on the board surface of the circuit board 1 away from the plurality of electronic components 2, for example, the metal sheet 8 can be fixed on the circuit board 1 by any suitable manner such as crimping, bonding, welding, etc., and the present application does not make specific limitation on the fixing manner of the metal sheet 8 and the circuit board 1.

[0081] The metal sheet 8 is electrically connected with at least one of the plurality of electronic components 2, for example, one metal sheet 8 is electrically connected with one electronic component 2, for another example, one metal sheet 8 is electrically connected with a plurality of electronic components 2, for another example, a plurality of metal sheets 8 are electrically connected with one electronic component 2, for another example, a plurality of metal sheets 8 are electrically connected with a plurality of electronic components 2, and the present application does not make specific limitations in this regard. The metal sheet 8 can be electrically connected with the electronic component 2 in various ways. In one example provided by the present application, the pin 22 of the switch device 23 is connected with the metal sheet 8 through the circuit board 1, and the metal sheet 8 can be electrically connected with one or more switch devices 23 through the corresponding pin 22.

[0082] With reference to Figure 7 and Figure 8 The spacer rib 5 can be in a strip shape (for example, the spacer rib 5a), and the spacer rib 5 can also be in a bent shape (for example, the spacer rib 5c). In the bent shape, the spacer rib 5c can avoid the electronic component 2 outside the surrounding frame 3.

[0083] In some examples, the spacer rib 5 can be pressed on the circuit board 1, for example, in the example in which the power distribution device 106 further includes the mounting seat 71, the protective shell 72 and the fastener 73, the spacer rib 5 can be pressed on the circuit board 1 by the protective shell 72, Figure 9 An example shows a structure of the protective shell 72, in which the mounting seat 71 and the protective shell 72 are fixed by the fastener 73, the circuit board 1 is fixed in the space surrounded by the mounting seat 71 and the protective shell 72, the surrounding frame 3 and the spacer rib 5 are located on the board surface of the circuit board 1 facing the protective shell 72, and the protective shell 72 abuts against the spacer rib 5.

[0084] For example, the protective shell 72 includes a shell portion 721 and a convex rib portion 722 (or a convex portion), the convex rib portion 722 is fixed on the side of the shell portion 721 facing the circuit board 1, and in the case that the shell portion 721 covers the circuit board 1 outside, the convex rib portion 722 abuts against the spacer rib 5. The convex rib portion 722 can be integrally formed with the shell portion 721, the convex rib portion 722 can also be fixed on the shell portion 721 by screws or rivets, and the convex rib portion 722 can also be bonded on the shell portion 721, and the present application does not make specific limitations on the fixing manner of the convex rib portion 722 and the shell portion 721.

[0085] The circuit board 1 is installed between the mounting seat 71 and the protective shell 72, after the protective shell 72 is connected with the mounting seat 71 by the fastener 73, the protective shell 72 abuts against the spacer rib 5, for example, by the convex rib portion 722 abutting against the spacer rib 5, and thereby pressing the spacer rib 5 on the circuit board 1, reducing the possibility of the spacer rib 5 being raised or bent, so that the spacer rib 5 can better increase the creepage distance of the electronic components 2 on both sides, and reduce the risk of the spacer rib 5 failing to function.

[0086] In addition, the protective shell 72 can also be inserted into the partition rib 5, for example, the side of the partition rib 5 away from the circuit board 1 has a groove 51, Figure 10 An exemplary structure of the groove 51 is shown, and the part of the protective shell 72 abutting against the partition rib 5 extends into the groove 51, for example, the convex rib part 722 (or the protruding part) of the protective shell 72 is inserted into the groove 51.

[0087] Since the protective shell 72 is connected and fixed with the mounting seat 71 by the fastener 73, and the circuit board 1 is fixed between the protective shell 72 and the mounting seat 71, the possibility of relative displacement between the protective shell 72, the circuit board 1 and the fastener 73 is low, but there is still a risk of relative displacement between the surrounding frame 3 and the circuit board 1. Therefore, in the case that the protective shell 72 is pressed against the partition rib 5, the part of the protective shell 72 abutting against the partition rib 5 extends into the groove 51 of the partition rib 5 to form cooperation and limiting, and through the insertion cooperation between the protective shell 72 and the groove 51, the possibility of loosening of the surrounding frame 3 is reduced, so that the surrounding frame 3 can be firmly attached to the circuit board 1, and the possibility of relative displacement between the surrounding frame 3 and the circuit board 1 is reduced, and in addition, the risk of bending or folding of the partition rib 5 can be further reduced.

[0088] In other examples, the partition rib 5 can not be provided with a groove 51, and in such examples, the protective shell 72 does not need to be inserted into the partition rib 5, Figure 11 Another exemplary protective shell 72 is shown, which can be applied in such examples. Among them, the convex rib part 722 (or the protruding part) of the protective shell 72 abuts against the partition rib 5 to press the partition rib 5 against the circuit board 1.

[0089] In some examples, the surface of the partition rib 5 facing the circuit board 1 and the board surface of the circuit board 1 can be fixed to each other by adhesion, that is, the surrounding frame 3 is mounted on the circuit board 1, and the surface of the partition rib 5 and the board surface of the circuit board 1 are adhesively fixed, which further reduces the possibility of warping or bending of the partition rib 5 during the process of pouring glue and after the pouring of glue is completed, reduces the risk of relative displacement between the partition rib 5 and the circuit board 1, and is beneficial to the smooth progress of the pouring process. In addition, the partition rib 5 is fixed to the circuit board 1 by means of screw-free and welding-free (adhesion), which is beneficial to production and manufacturing.

[0090] Among them, the adhesion method of the partition rib 5 and the circuit board 1 can be various, for example, the power distribution device 106 can also include a flexible glue strip 6, Figure 12The structure of the adhesive strip 6 is exemplarily shown, which can be any structure with adhesion and flexibility, such as a foam adhesive, a rubber strip with adhesive on both sides, etc., and the present application does not make specific limitations thereto. The flexible adhesive strip 6 can be deformed under force, and the surface of the spacer 5 facing the circuit board 1 is bonded and fixed to the surface of the circuit board 1 through the adhesive strip 6. In the case that the surface of the spacer 5 facing the circuit board 1 has dimensional errors or unevenness, the adhesive strip 6 can absorb the fitting tolerance by deformation, so that the spacer 5 can be stably bonded to the circuit board 1, which is also conducive to the installation and fixation of the surrounding frame 3.

[0091] In addition, the surface of the surrounding frame 3 facing the circuit board 1 and the circuit board 1 can also be fixed by bonding, for example, the surface of the surrounding frame 3 and the surface of the circuit board 1 are bonded through a bonding layer. In the process of pouring glue, the bonding layer can not only reduce the possibility of relative displacement between the surrounding frame 3 and the circuit board 1, but also play a sealing role, reducing the risk of glue leakage from the surrounding frame 3 to the outside, which is conducive to the smooth progress of the pouring process.

[0092] Regarding the installation method of the surrounding frame 3, Figure 13 The structure of the surrounding frame 3 is exemplarily shown, referring to Figure 13 The surrounding frame 3 includes a fixed surrounding frame 31 and a positioning column 32, for example, the positioning column 32 is integrally formed with the surrounding frame 31. The surrounding frame 31 surrounds at least one electronic component 2 in the plurality of electronic components 2, that is, the electronic component 2 inside the surrounding frame 3 is also inside the surrounding frame 31, and the positioning column 32 is fixed on the surrounding frame 31. The circuit board 1 has a positioning hole 12, and the positioning column 32 is inserted into the positioning hole 12. The cooperation between the positioning column 32 and the positioning hole 12 can play a positioning role, which is conducive to the installation of the surrounding frame 3 on the circuit board 1.

[0093] In Figure 13 In the example shown, in order to make the installation position of the surrounding frame 3 more accurate, the positioning column 32 can be provided with a plurality of (for example, two), and in other examples, the positioning column 32 can also be provided with one, and the present application does not make specific limitations to the number of positioning columns 32. In the example that the positioning column 32 is provided with a plurality of, the number of positioning holes 12 is the same as the number of positioning columns 32, wherein each positioning column 32 can be inserted into the corresponding positioning hole 12.

[0094] In some examples, the surrounding frame 3 can also include one or more blocking plates 33 fixed with the surrounding frame 31, for example, the surrounding frame 31 and the blocking plate 33 are integrally formed, Figure 14 The structure of the blocking plate 33 is exemplarily shown. Referring to Figure 13 and Figure 14The barrier plate 33 protrudes from the surrounding frame 31 toward the inside of the surrounding frame 31. There is a gap between the barrier plate 33 and the circuit board 1, and the adhesive injected into the surrounding frame 31 can fill this gap. That is, after the surrounding frame 3 is installed on the circuit board 1, during the process of injecting adhesive into the inside of the surrounding frame 3, the surrounding frame 31 plays an external limiting role for the adhesive, confining the adhesive within the area enclosed by the surrounding frame 31. The barrier plate 33 limits the height of the adhesive, and the adhesive is injected and filled into the gap between the barrier plate 33 and the circuit board 1 (the adhesive may also slightly exceed the barrier plate 33). By hindering the adhesive, the barrier plate 33 reduces the possibility of the adhesive overflowing from the top of the surrounding frame 31.

[0095] Among them, reference Figure 13 and Figure 14 Multiple barrier plates 33 can be provided. Some barrier plates 33 protrude a shorter distance towards the inside of the surrounding frame 31, such as barrier plate 33a, while some barrier plates 33 protrude a longer distance towards the inside of the surrounding frame 31, such as barrier plate 33b. The barrier plates 33 with shorter protrusion distances can avoid some devices disposed on the circuit board 1 and located inside the surrounding frame 31. In other examples, the multiple barrier plates 33 may protrude an equal distance towards the inside of the surrounding frame 31.

[0096] When multiple barrier plates 33 are provided, they can be placed at the required positions around the frame 31 as needed. In some other examples, only one barrier plate 33 may be provided. In some other examples, the barrier plate 33 may be in a ring shape.

[0097] Furthermore, the position of the barrier plate 33 on the surrounding frame 31 can be set according to the required adhesive layer 4 thickness. For example, in one example provided in this application, referring to... Figure 13 and Figure 14 Each barrier plate 33 is disposed on the side of the surrounding frame 31 opposite to the circuit board 1. In some other examples, the barrier plate 33 may also be disposed in the central region of the surrounding frame 31.

[0098] The distance between the barrier plate 33 and the circuit board 1 needs to be greater than the distance between the device housing 21 of at least one electronic component 2 located inside the surrounding frame 31 and the circuit board 1, so that the adhesive layer between the barrier plate 33 and the circuit board 1 can cover the pins 22 on the device housing 21. For example... Figure 15 An example is shown showing the height of a frame 3, with reference to Figure 15 L1 is the distance between the device housing 21 of electronic component 2 and the circuit board 1, that is, the distance between the surface of device housing 21 facing the circuit board 1 and the circuit board 1. L2 is the distance between the barrier plate 33 and the circuit board 1, that is, the distance between the surface of barrier plate 33 facing the circuit board 1 and the circuit board 1. The dimension of L2 is larger than the dimension of L1.

[0099] The overall height of the frame 3 can also be set as required, for example, the height of the frame 3 can be designed according to the required height of the glue layer 4. Referring to Figure 15 In the case where the electronic components 2 inside the frame 3 include the switching device 23, the pins 22 of the switching device 23 can be fixed to the surface of the device shell 21 of the switching device 23 facing the circuit board 1, and in the thickness direction of the circuit board 1, the distance (L1) between the surface of the device shell 21 of the switching device 23 facing the circuit board 1 and the circuit board 1 is less than the height (L3) of the frame 3, the height (L4) of the device shell 21 of the switching device 23 is greater than the height (L3) of the frame 3, and the height (L4) of the device shell 21 of the switching device 23 refers to the distance between the surface of the device shell 21 facing away from the circuit board 1 and the surface of the circuit board 1.

[0100] Since the height (L3) of the frame 3 is higher than the distance (L1) between the bottom surface of the device shell 21 of the switching device 23 and the circuit board 1, the glue layer 4 formed after the glue solution is poured will cover the pins 22 of the switching device 23, so that the pins 22 are not exposed outside the glue layer 4 after pouring the glue, thereby protecting the electrical connection position of the switching device 23 and the circuit board 1, and reducing the possibility of condensation wetting the pins 22 of the switching device 23 on the circuit board 1 and causing short circuit.

[0101] And since the height (L3) of the frame 3 is lower than the height (L4) of the device shell 21 of the switching device 23, after pouring the glue inside the frame 3 is completed, the glue layer 4 will not cover the entire device shell 21 of the switching device 23, thereby reducing the height of the glue layer 4, reducing the influence of the glue layer 4 on the heat dissipation of the switching device 23, and reducing the amount of glue layer 4 and the material required for the frame 3, saving production costs, and reducing the weight of the circuit board 1 and the power distribution device 106.

[0102] In the case where the power distribution device 106 includes the metal sheet 8, the power distribution device 106 can further include a structure for protecting the metal sheet 8, for example, the power distribution device 106 can further include a bottom frame 9, Figure 16 An exemplary structure of a bottom frame 9 is shown, referring to Figure 16 The bottom frame 9 covers the metal sheet 8 and forms a glue pouring space 91 with the circuit board 1. For example, the bottom frame 9 includes a fixed surrounding plate 92 and a bottom plate 93, wherein the surrounding plate 92 and the bottom plate 93 can be integrally formed, the surrounding plate 92 surrounds the outer periphery of the plurality of metal sheets 8, the bottom plate 93 is located on the side of the surrounding plate 92 away from the circuit board 1, and the bottom plate 93 has the glue pouring space 91 between the bottom plate 93 and the circuit board 1.

[0103] The circuit board 1 has a glue-filling hole 13 communicating with the glue-filling space 91, that is, glue can be filled into the glue-filling space 91 through the glue-filling hole 13, and after the filled glue solidifies, another glue layer (on the side of the circuit board 1 different from the glue layer 4 in the surrounding frame 3) can be formed in the bottom frame 9, and the glue layer 4 in the bottom frame 9 can protect the metal sheet 8. After the glue filling is completed, the bottom frame 9 can be left in the power distribution device 106 to form a protection structure to avoid the circuit board 1 from being bumped or damaged during installation or transportation, and the bottom frame 9 fixed on the circuit board 1 can also have a good insulation effect, reducing the insulation distance requirement between the external structure and the circuit board 1. In some other examples, the bottom frame 9 can be removed after the glue filling is completed.

[0104] Referring to Figure 16 , the glue-filling hole 13 is located on the inner side of the surrounding frame 3, and during the glue filling process, the glue-filling space 91 in the bottom frame 9 can be filled with glue first through the glue-filling hole 13, and after the glue-filling space 91 is filled with glue, the glue will overflow from the glue-filling hole 13, and then the space surrounded by the surrounding frame 3 is filled with glue, and after the glue in the surrounding frame 3 is filled and solidified, a glue layer 4 is formed (the glue layer 4 is auxiliary Figure 11 , the glue layer 4 in the surrounding frame 3 covers the circuit board 1 on the inner side of the surrounding frame 3 and fills part of the gap between the electronic components 2 and the circuit board 1, protecting the electrical connection position of the electronic components 2 on the inner side of the surrounding frame 3.

[0105] In examples in which the surrounding frame 3 has a glue-filling hole 13 on the inner side, referring to Figure 16 , the surrounding frame 3 can have an outwardly protruding arc-shaped section 34 to surround the glue-filling hole 13 on the inner side of the surrounding frame 3. For example, in the case where the surrounding frame 3 includes a surrounding ring 31 (the surrounding ring 31 is auxiliary Figure 14 ), the arc-shaped section 34 can be formed on the surrounding ring 31 and become part of the surrounding ring 31. In this example, the surrounding frame 3 is a special-shaped frame, and its structure is designed according to the installation and matching requirements. In some other examples, the surrounding frame 3 can also be a rectangular frame or a circular frame, and the glue-filling hole 13 can still be surrounded on the inner side of the surrounding frame 3, and the surrounding frame 3 in this example does not have a clear arc-shaped section 34.

[0106] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power distribution device for distributing an input current into at least one output path, characterized in that, The power distribution device includes a circuit board and multiple electronic components, the multiple electronic components being fixed on the circuit board. The power distribution device also includes: The frame is fixed to the circuit board, and the plurality of electronic components include at least one electronic component located inside the frame and at least two electronic components located outside the frame. An adhesive layer is located within the frame and fixed to the circuit board. The at least one electronic component located inside the frame includes a device housing and pins fixed to the device housing. The pins are electrically connected to the circuit board, and the adhesive layer covers the pins. A partition bar is located outside the enclosure frame and is fixed to the enclosure frame or to the circuit board. The at least two electronic components located outside the enclosure frame are distributed on different sides of the partition bar.

2. The power distribution device according to claim 1, characterized in that, The partition rib is fixed to the frame and extends outward from the frame. The partition rib is bonded and fixed to the surface of the circuit board.

3. The power distribution device according to claim 1, characterized in that, The power distribution device also includes a flexible adhesive strip, and the surface of the rib facing the circuit board is bonded and fixed to the surface of the circuit board by the adhesive strip.

4. The power distribution device according to claim 1, characterized in that, The power distribution device further includes a mounting base, a protective shell, and fasteners. The mounting base and the protective shell are fixed by the fasteners. The circuit board is located within the space enclosed by the mounting base and the protective shell. The circuit board is fixed on the mounting base or on the protective shell. The frame and the partition are both located on the surface of the circuit board facing the protective shell. The protective shell abuts against the partition.

5. The power distribution device according to claim 4, characterized in that, The rib has a groove on the side opposite to the circuit board, and the protective shell extends into the groove to abut against the rib.

6. The power distribution device according to claim 1, characterized in that, The enclosure includes a surrounding frame and a positioning post. The surrounding frame surrounds at least one of the plurality of electronic components. The positioning post is fixed to the surrounding frame. The circuit board has a positioning hole, and the positioning post is inserted into the positioning hole.

7. The power distribution device according to claim 6, characterized in that, The enclosure also includes a barrier plate fixed to the surrounding frame, the barrier plate protruding toward the inside of the surrounding frame, and the distance between the barrier plate and the circuit board is greater than the distance between at least one device housing located inside the surrounding frame and the circuit board.

8. The power distribution device according to claim 1, characterized in that, The at least one electronic component located inside the frame includes a switching device for controlling on / off states. The switching device includes the device housing and the pins. In the thickness direction of the circuit board, the height of the device housing of the switching device is greater than the height of the frame.

9. The power distribution device according to any one of claims 1-8, characterized in that, The power distribution device further includes a metal sheet and a base frame. The plurality of electronic components are fixed on the same surface of the circuit board. The metal sheet is fixed on the surface of the circuit board opposite to the plurality of electronic components. The metal sheet is electrically connected to at least one of the plurality of electronic components. The base frame covers the metal sheet and forms a potting space with the circuit board. The circuit board has a potting hole communicating with the potting space. The potting hole is located inside the frame.

10. A charging device, characterized in that, The device includes a power conversion device, a plurality of charging interfaces, and a power distribution device as described in any one of claims 1-9, wherein the power distribution device is electrically connected to the power conversion device and the plurality of charging interfaces, and the power distribution device is used to distribute the DC power output by the power conversion device to at least one of the charging interfaces.

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