Diamond line block cutting machine

Abstract

The utility model relates to a diamond line cutting machine, which comprises a machine table, a plurality of guide wheels, a plurality of guide wheels and a plurality of tension adjusting arms, the machine table is provided with a base, the base extends upwards to form a base, the base is provided with a plurality of tension adjusting arms, each tension adjusting arm is provided with a tension wheel, the base is provided with a plurality of guide wheels, and the tension wheels and the guide wheels are arranged at intervals; the multiple take-up and pay-off devices are arranged on the two sides of the base respectively, and each take-up and pay-off device is provided with a take-up and pay-off wheel; and the diamond wire penetrates through the plurality of tension wheels, the plurality of guide wheels and the plurality of take-up and pay-off wheels, and a plurality of diamond particles are arranged on the surface of the diamond wire. Therefore, the diamond wire can be wound and unwound through the multiple winding and unwinding devices, the diamond wire moves in a reciprocating mode to cut the wafer, and due to the fact that new diamond particles make contact with the wafer continuously when the diamond wire moves in the reciprocating mode, abrasion is very low, and stability and consistency in the cutting process can be kept easily.

Description

Technical Field

[0001] This utility model relates to a cutting machine, and more particularly to a diamond wire cutting machine. Background Technology

[0002] In semiconductor manufacturing, wafer dicing is the process of separating bare dies from large wafers into smaller wafers. A single large wafer can produce multiple identical or similar wafers, improving production efficiency. After dicing, each individual wafer can be packaged into a wafer carrier.

[0003] Generally speaking, wafer dicing involves cutting wafers using saw blades on a wafer dicing machine. A saw blade is a general term for a thin, circular cutting tool used to cut solid materials. Saw blades are typically made of high-precision cemented carbide materials (such as diamond) and cut at high speeds. Saw blades can easily cause chipping, gouges, and even cracks on the cut edges of the wafer. Furthermore, saw blades become dull due to wear and tear over time, leading to a decrease in precision during the dicing process.

[0004] Existing technology, such as the "Precision Diamond Cutting Machine" in Taiwan Patent M582228, includes: a machine base; a feed mechanism, the feed mechanism including a lifting seat with a rotary power unit assembled thereon; the rotary power unit including a rotary spindle, the rotary spindle driving a cutting tool. The rotary spindle drives the cutting tool to rotate. The lifting seat can reciprocate along at least two lifting slide shafts, causing the cutting tool to reciprocate vertically along the machine base to perform the feed stroke and return stroke. However, please refer to patent M582228. Figure 4 During cutting, because the cutting tool (i.e., the saw blade) is driven to rotate and performs the feed and return strokes in a vertical reciprocating motion, the diamond particles on the cutting tool are prone to wear and tear after long-term use, affecting the stability and consistency of the cutting process.

[0005] Therefore, how to improve the above-mentioned problems is the technical difficulty that the inventor of this utility model intends to solve. Utility Model Content

[0006] In view of the above description, the present invention aims to solve and improve the existing problems and deficiencies.

[0007] To achieve the above objectives, this utility model provides a diamond wire cutting machine, comprising: a machine base, the machine base having a base extending upward from the base to form a pedestal, the pedestal having multiple tension adjusting arms, each tension adjusting arm having a tension wheel, and the pedestal having multiple guide wheels, the tension wheels and guide wheels being spaced apart; multiple take-up and unwinding devices, the multiple take-up and unwinding devices being respectively located on both sides of the pedestal, each take-up and unwinding device having a take-up and unwinding wheel; and a diamond wire, the diamond wire passing through the multiple tension wheels, the multiple guide wheels and the multiple take-up and unwinding wheels, and the surface of the diamond wire having multiple diamond particles.

[0008] Each take-up and release device includes a take-up and release shaft and a power device. The take-up and release reel is mounted on the power device via the take-up and release shaft, making the take-up and release reel rotatable, and the power device drives the take-up and release shaft to move.

[0009] It also includes a wafer fixing device and a sensing device, the wafer fixing device being disposed on the base and the sensing device being disposed on the base.

[0010] The wafer fixing device includes a wafer stage, a wafer support, and a driving device. The wafer stage is connected to the wafer support, and the wafer support is located between the wafer stage and the driving device. The driving device drives the wafer support to move the wafer stage relative to the machine.

[0011] The wafer stage of the wafer fixing device is a vacuum chuck.

[0012] The sensing device is a charge-coupled device (CCD) camera.

[0013] Therefore, this invention can utilize multiple take-up and take-up devices to take up and put down the diamond wire, causing the diamond wire to move back and forth to cut the wafer. Since new diamond particles will continuously come into contact with the wafer during the reciprocating movement of the diamond wire, the wear is very low, which helps to maintain the stability and consistency of the cutting process. Attached Figure Description

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0015] Figure 1 This is a schematic diagram of the diamond wire cutting machine of this utility model;

[0016] Figure 2 This is a schematic diagram of the first part of the diamond wire cutting machine of this utility model;

[0017] Figure 3 This is a schematic diagram of the second part of the diamond wire cutting machine of this utility model;

[0018] Figure 4This is a side view of the diamond wire cutting machine of this utility model;

[0019] Figure 5 This is a schematic diagram of the first action of the diamond wire cutting machine of this utility model;

[0020] Figure 6 This is a schematic diagram of the second action of the diamond wire cutting machine of this utility model;

[0021] Figure 7 This is a schematic diagram of the third action of the diamond wire cutting machine of this utility model;

[0022] Figure 8 This is a schematic diagram of the diamond wire in this utility model.

[0023] Explanation of reference numerals in the attached figures

[0024] 1. Machine tool;

[0025] 11. Base;

[0026] 12. Base;

[0027] 13. Tension adjustment arm;

[0028] 131. Shaft;

[0029] 14. Tension wheel;

[0030] 141. Shaft;

[0031] 15. Guide wheel;

[0032] 151. Shaft;

[0033] 2. Cable take-up and unwinding device;

[0034] 21. Take-up and pay-off reels;

[0035] 22. Thread take-up and undo spools;

[0036] 23. Power unit;

[0037] 3. Diamond thread;

[0038] 31. Diamond particles;

[0039] 4. Wafer fixing device;

[0040] 41. Wafer stage;

[0041] 42. Wafer support;

[0042] 43. Drive unit;

[0043] 5. Sensing device;

[0044] 6. Wafer. Detailed Implementation

[0045] To make the other features, advantages, and effects of this utility model more apparent, the utility model is now described in detail below with reference to the accompanying drawings:

[0046] Please see Figure 1 and Figure 2 As shown, this utility model provides a diamond wire cutting machine, which includes: a machine base 1, multiple wire take-up and unwinding devices 2, and a diamond wire 3.

[0047] The machine 1 is provided with a base 11, and a base 12 extends upward from the base 11. The base 12 is provided with multiple tension adjustment arms 13, and each of the multiple tension adjustment arms 13 is provided with a tension wheel 14. The base 12 is also provided with multiple guide wheels 15, and the multiple tension wheels 14 and the multiple guide wheels 15 are spaced apart.

[0048] The tension adjusting arm 13 is pivotally connected to the base 12 via a pivot 131 and can rotate freely around the pivot 131. The tension adjusting arm 13 is used to adjust the tension of the diamond wire 3. The tension wheel 14 is mounted on the tension adjusting arm 13 via a pivot 141, allowing the tension wheel 14 to rotate. The guide wheel 15 is mounted on the base 12 via a pivot 151, allowing the guide wheel 15 to rotate. Furthermore, multiple tension wheels 14 and multiple guide wheels 15 are respectively located at both ends of the base 12, with the multiple tension wheels 14 and multiple guide wheels 15 spaced apart.

[0049] Multiple take-up and release devices 2 are respectively located on both sides of the base 12, and each of the multiple take-up and release devices 2 is equipped with a take-up and release wheel 21.

[0050] Each take-up and unwind device 2 includes a take-up / unwind spool 22 and a power unit 23. The take-up / unwind reel 21 is mounted on the power unit 23 via the take-up / unwind spool 22, making the take-up / unwind reel 21 rotatable. The power unit 23 drives the take-up / unwind spool 22, which in turn drives the take-up / unwind reel 21. The power unit 23 can be a motor. The take-up / unwind device 2 is used to repeatedly take up and unwind the diamond wire 3, causing the diamond wire 3 to move back and forth.

[0051] The diamond wire 3 passes through multiple tension rollers 14, multiple guide rollers 15, and multiple take-up and unwind rollers 21, and the surface of the diamond wire 3 is provided with multiple diamond particles 31 (illustrated in...). Figure 8 ).

[0052] Among them, the diamond line 3 is made by using a special technique to attach multiple diamond particles 31 (shown in the diagram). Figure 8 A linear cutting tool made by fixing it to the surface of a steel wire.

[0053] Please see Figure 1 , Figure 3 and Figure 4 As shown, the present invention also includes a wafer fixing device 4 and a sensing device 5. The wafer fixing device 4 is disposed on the base 11, and the sensing device 5 is disposed on the base 12.

[0054] The wafer fixing device 4 includes a wafer stage 41, a wafer support 42, and a drive device 43. The wafer stage 41 is connected to the wafer support 42, and the wafer support 42 is located between the wafer stage 41 and the drive device 43. The drive device 43 drives the wafer support 42 to move the wafer stage 41 relative to the machine base 1. The wafer stage 41 of the wafer fixing device 4 can be a vacuum chuck for picking up the wafer 6. The wafer support 42 can include a slide rail, a shaft, or other equivalent device to achieve up-and-down, back-and-forth, or 360-degree rotation. The drive device 43 can include a motor, a rotating shaft, a pulley, a pneumatic cylinder, or other equivalent device to drive the wafer support 42 to move. The sensing device 5 can be a charge-coupled device (CCD camera).

[0055] Please see Figure 1 and Figure 5 As shown, the operation of the diamond wire cutting machine of this utility model is as follows: Before cutting, the wafer 6 is placed on the wafer stage 41 of the wafer fixing device 4, and the wafer 6 is accurately positioned on the wafer stage 41 by the sensing device 5. Then, the wafer stage 41 picks up the wafer 6. Afterwards, the power device 23 of each take-up and unwinding device 2 drives the take-up and unwinding shaft 22. The take-up and unwinding shaft 22 drives the take-up and unwinding wheel 21, causing the take-up and unwinding wheel 21 to rotate. The diamond wire 3 on the take-up and unwinding wheel 21 is released from one end, and the diamond wire 3 is taken up from the other end, so that the diamond wire 3 is repeatedly wound and released, so that the diamond wire 3 is cut into pieces. The diamond wire 3 will reciprocate along the tension wheel 14 and multiple guide wheels 15, bringing the diamond wire 3 close to the wafer 6 on the wafer stage 41 for cutting. The tension can be adjusted by rotating the tension adjustment arm 13 around the pivot 131, keeping the diamond wire 3 under appropriate tension to prevent breakage due to excessive tension. Furthermore, the drive device 43 can drive the wafer support 42 to move, thereby influencing the wafer stage 41 relative to the machine 1. For example, rotating the wafer stage 41 can change the orientation of the wafer 6, or moving the wafer stage 41 up and down, or forward and backward (illustrated in...). Figure 6 and Figure 7 This makes it easier to cut the wafer 6 into individual wafers.

[0056] Therefore, this utility model can use multiple take-up and take-up devices 2 to take up and take down the diamond wire 3, so that the diamond wire 3 moves back and forth to cut the wafer 6. Since new diamond particles 31 will continuously come into contact with the wafer 6 when the diamond wire 3 moves back and forth, the wear is very low, which helps to maintain the stability and consistency of the cutting process.

[0057] The above discussion is merely a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Therefore, any equivalent changes in shape, structure or combination made without departing from the spirit and scope of the present utility model should be covered within the scope of the patent application of the present utility model.

Claims

1. A diamond wire cutting machine, characterized in that, include: A machine platform, the machine platform is provided with a base, the base extends upward to a pedestal, the pedestal is provided with multiple tension adjustment arms, each of the multiple tension adjustment arms is provided with a tension wheel, and the pedestal is also provided with multiple guide wheels, the multiple tension wheels and the multiple guide wheels are arranged at intervals; Multiple take-up and release devices are respectively located on both sides of the base, and each of the multiple take-up and release devices is equipped with a take-up and release reel; as well as A diamond wire passes through multiple tension rollers, multiple guide rollers, and multiple take-up and release rollers, and the surface of the diamond wire is decorated with multiple diamond particles.

2. The diamond wire cutting machine as described in claim 1, characterized in that, Each take-up and release device includes a take-up and release shaft and a power unit, with the take-up and release reel mounted on the power unit via the take-up and release shaft.

3. The diamond wire cutting machine as described in claim 1, characterized in that, It also includes a wafer fixing device and a sensing device, the wafer fixing device being disposed on the base and the sensing device being disposed on the base.

4. The diamond wire cutting machine as described in claim 3, characterized in that, The wafer fixing device includes a wafer stage, a wafer holder and a driving device. The wafer stage is connected to the wafer holder and the wafer holder is located between the wafer stage and the driving device.

5. The diamond wire cutting machine as described in claim 4, characterized in that, The wafer stage of the wafer fixing device is a vacuum chuck.

6. The diamond wire cutting machine as described in claim 3, characterized in that, The sensing device is a charge-coupled device (CCD) camera.

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