Wafer up-down throwing cleaning device

Abstract

The utility model discloses a wafer up-down throwing cleaning device which comprises a supporting rod, the top end of the supporting rod is provided with a throwing plate, the throwing plate can move up and down relative to the supporting rod under the driving of a driving assembly, a floating plate is fixedly provided with a throwing box, a flower basket can be placed in the throwing box, and the throwing box is provided with a floating plate. A driving roller is further arranged in the throwing box in a pivoted mode, the outer circumferential face of the driving roller is tangent to the circumferential face of the wafer in the basket, and the driving roller is driven by the rotating assembly to rotate. The wafer cleaning device has the advantages that the design is exquisite, the driving motor drives the sliding rod to move up and down through the driving shaft and the eccentric wheel, so that the throwing plate is driven to move up and down, and wafers are soaked in cleaning liquid up and down. The connecting structure is stable and reliable, convenient to disassemble, replace and maintain, high in moving precision and wide in applicability, and the working efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to a wafer up-and-down polishing and cleaning device. Background Technology

[0002] In the semiconductor cleaning industry, wafers are placed in cassettes and then into the cleaning tank of a cleaning machine for cleaning. Traditionally, cleaning machines involve placing the wafers in cassettes, which are then immersed in the cleaning tank for ultrasonic cleaning. However, this cleaning method is not very effective.

[0003] For example, patent announcement number CN 220208905 U discloses a cradle swing mechanism for a cleaning machine and a wafer cleaning machine, including a cleaning tank, a cradle assembly disposed within the cleaning tank, and a drive assembly disposed outside the cleaning tank that can drive the cradle assembly to swing. The cradle assembly includes a workpiece basket and a swing bracket. The drive assembly includes a motor, an eccentric shaft, a ball joint connecting rod, a swing shaft, and a swing bracket. The motor can drive the eccentric shaft to rotate through a gear set, and the eccentric shaft can drive the swing shaft to swing through the ball joint connecting rod. The swing shaft can drive the swing bracket and the swing bracket to swing, thereby realizing the swing of the workpiece basket. However, this mechanism has a complex structure and an unreasonable layout. In addition, the use of a linkage mechanism for transmission connection makes assembly inconvenient, prone to damage, and requires regular inspection and replacement, greatly increasing the workload. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a wafer up-and-down polishing and cleaning device.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A wafer up-and-down polishing and cleaning device includes a support rod, a polishing plate at the top of the support rod, the polishing plate being able to move up and down relative to the support rod under the drive of a drive assembly, a polishing box being fixedly mounted on the floating plate, a flower basket being placed inside the polishing box, and a drive roller being pivotally mounted inside the polishing box, the outer circumferential surface of the drive roller being tangent to the circumferential surface of the wafer in the flower basket, and the drive roller rotating under the drive of a rotation assembly.

[0007] Preferably, the rotating assembly includes a support fixed to the throwing box, a drive roller pivotally mounted on the support, a driven gear fixed to the drive roller, a rotating shaft pivotally mounted on the support, a driving gear fixed to the rotating shaft, the driving gear meshing with the driven gear; a transmission gear fixed to the rotating shaft, a connecting plate fixed to the throwing box, a connecting shaft pivotally mounted on the connecting plate, a connecting gear fixed to one end of the connecting shaft, the connecting gear and the transmission gear being connected by a transmission chain; a linkage gear fixed to the other side of the connecting shaft, a drive motor fixed to the throwing plate, a drive gear fixed to the motor shaft of the drive motor, the drive gear and the linkage gear being connected by a linkage chain.

[0008] Preferably, the connecting plate is further provided with a waist-shaped hole, a floating plate is provided in the waist-shaped hole, a tensioning shaft is fixed on the floating plate, a tensioning gear is provided on the tensioning shaft, and the tensioning gear meshes with the transmission chain.

[0009] Preferably, the driving assembly includes at least a base plate, a bearing seat fixed on the base plate, a driving shaft pivotally mounted on the bearing seat, an eccentric wheel on the end side of the driving shaft, the central axis of the eccentric wheel being non-coaxial with the central axis of the driving shaft; a sliding rod that can slide up and down is provided inside the support rod, a support plate is provided on the end side of the sliding rod, and the bottom surface of the support plate always abuts against the outer circumferential surface of the eccentric wheel.

[0010] Preferably, a drive motor is fixed on the substrate, a reducer is fixed on the motor shaft of the drive motor, and the drive shaft is fixed on the reducer.

[0011] Preferably, the flower basket has a built-in support roller, and a set of support grooves are equidistantly formed on the outer circumference of the support roller, the width of the support grooves being equal to or greater than the thickness of the wafer.

[0012] The beneficial effects of this utility model are mainly reflected in:

[0013] 1. The design is ingenious. A drive motor, via a drive shaft and eccentric wheel, moves a sliding rod up and down, thereby moving the polishing plate up and down, allowing the wafer to be immersed in the cleaning solution. This connection structure is stable and reliable, easy to disassemble, replace, and maintain, and offers high movement precision, greatly improving work efficiency and making it widely applicable.

[0014] 2. The drive motor drives the drive roller to rotate through the cooperation of the chain and gears, thereby realizing the rotation of the wafer. This layout achieves high integration, reduces the space occupied, and at the same time, ensures the cleanliness of the cleaning, and has a wide range of applications. Attached Figure Description

[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0016] Figure 1 : A perspective view of a preferred embodiment of the present invention. Detailed Implementation

[0017] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0019] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] like Figure 1 As shown, this utility model discloses a wafer up-and-down polishing and cleaning device, including a support rod 1. A polishing plate 2 is provided at the top of the support rod 1. The polishing plate 2 can move up and down relative to the support rod 1 under the drive of a drive assembly 3. The drive assembly 3 includes at least a substrate 31. A bearing seat 32 is fixed on the substrate 31. A drive shaft 33 is pivotally mounted on the bearing seat 32. An eccentric wheel 34 is provided on the end side of the drive shaft 33. The central axis of the eccentric wheel 34 is not coaxial with the central axis of the drive shaft 33. A sliding rod 35 that can slide up and down is provided inside the support rod 1. A support plate 36 is provided on the end side of the sliding rod 35. The bottom surface of the support plate 36 always abuts against the outer circumferential surface of the eccentric wheel 34. Additionally, a drive motor 37 is fixed on the substrate 31. A reducer 38 is fixed on the motor shaft of the drive motor 37. The drive shaft 33 is fixed on the reducer 38. In the above, the drive motor 37 drives the sliding rod to move up and down through the drive shaft and eccentric wheel, thereby driving the polishing plate 2 to move up and down, so that the wafer is immersed in the cleaning solution. This operation method is stable and reliable, easy to disassemble, replace and maintain, and has high movement accuracy and wide applicability.

[0021] A throwing box 4 is fixed on the floating plate 2. A flower basket 5 can be placed inside the throwing box 4. A drive roller 6 is also pivotally installed inside the throwing box 4. The outer circumferential surface of the drive roller 6 is tangent to the circumferential surface of the wafer 100 inside the flower basket 5. The drive roller 6 rotates under the drive of the rotating component 7. The rotating assembly 7 includes a support 71 fixed on the throwing box 4, a drive roller 6 pivotally mounted on the support 71, a driven gear 72 fixed on the drive roller 6, a rotating shaft 73 pivotally mounted on the support 71, a driving gear 74 fixed on the rotating shaft 73, the driving gear 74 meshing with the driven gear 72; a transmission gear 75 fixed on the rotating shaft 73, a connecting plate 76 fixed on the throwing box 4, a connecting shaft 77 pivotally mounted on the connecting plate 76, a connecting gear 78 fixed at one end of the connecting shaft 77, the connecting gear 78 and the transmission gear 75 being connected by a transmission chain 79; a linkage gear fixed on the other side of the connecting shaft 77, a transmission motor 70 fixed on the throwing plate 2, a drive gear 701 fixed on the motor shaft of the transmission motor 70, the drive gear 701 and the linkage gear being connected by a linkage chain 702.

[0022] In the above-mentioned configuration, the drive motor drives the drive roller to rotate through the interaction of the chain and gears, thereby realizing the rotation of the wafer. This layout achieves high integration, reduces the space occupied, and at the same time, ensures the cleanliness of the cleaning process, making it widely applicable.

[0023] The connecting plate 76 is also provided with a waist-shaped hole 761, a floating plate is provided in the waist-shaped hole 761, and a return spring is also provided in the waist-shaped hole. One end of the return spring abuts against the floating plate. A tensioning shaft 762 is fixedly provided on the floating plate, and a tensioning gear 763 is provided on the tensioning shaft 762. The tensioning gear 763 meshes with the transmission chain 79, and the tensioning gear 763 can keep the transmission chain 79 in a taut state at all times.

[0024] The flower basket 5 has a built-in support roller 51. A set of support grooves 52 are equidistantly opened on the outer circumference of the support roller 51. The width of the support grooves 52 is equal to or greater than the thickness of the wafer 100.

[0025] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0026] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer up-and-down polishing and cleaning device, including a support rod (1), characterized in that: The top of the support rod (1) is provided with a projectile plate (2). The projectile plate (2) can move up and down relative to the support rod (1) under the drive of the drive assembly (3). A projectile box (4) is fixed on the projectile plate (2). A flower basket (5) can be placed in the projectile box (4). A drive roller (6) is also pivotally provided in the projectile box (4). The outer circumferential surface of the drive roller (6) is tangent to the circumferential surface of the wafer (100) in the flower basket (5). The drive roller (6) rotates under the drive of the rotation assembly (7).

2. The wafer up-and-down polishing and cleaning device according to claim 1, characterized in that: The rotating assembly (7) includes a support (71) fixed on the throwing box (4), a drive roller (6) pivotally mounted on the support (71), a driven gear (72) fixed on the drive roller (6), a rotating shaft (73) pivotally mounted on the support (71), a driving gear (74) fixed on the rotating shaft (73), the driving gear (74) meshing with the driven gear (72); a transmission gear (75) fixed on the rotating shaft (73), and a connecting plate (76) fixed on the throwing box (4). A connecting shaft (77) is pivotally provided on the connecting plate (76). A connecting gear (78) is fixedly provided at one end of the connecting shaft (77). The connecting gear (78) and the transmission gear (75) are connected by a transmission chain (79). A linkage gear is fixedly provided on the other side of the connecting shaft (77). A transmission motor (70) is fixedly provided on the throwing plate (2). A drive gear (701) is fixedly provided on the motor shaft of the transmission motor (70). The drive gear (701) and the linkage gear are connected by a linkage chain (702).

3. The wafer up-and-down polishing and cleaning device according to claim 2, characterized in that: The connecting plate (76) is also provided with a waist-shaped hole (761), a floating plate is provided in the waist-shaped hole (761), a tensioning shaft (762) is fixed on the floating plate, a tensioning gear (763) is provided on the tensioning shaft (762), and the tensioning gear (763) meshes with the transmission chain (79).

4. The wafer up-and-down polishing and cleaning device according to claim 1, characterized in that: The drive assembly (3) includes at least a base plate (31), a bearing seat (32) is fixed on the base plate (31), a drive shaft (33) is pivotally mounted on the bearing seat (32), an eccentric wheel (34) is provided on the end side of the drive shaft (33), the central axis of the eccentric wheel (34) is not coaxial with the central axis of the drive shaft (33); the support rod (1) is provided with a sliding rod (35) that can slide up and down, a support plate (36) is provided on the end side of the sliding rod (35), and the bottom surface of the support plate (36) always abuts against the outer circumferential surface of the eccentric wheel (34).

5. The wafer up-and-down polishing and cleaning device according to claim 4, characterized in that: A drive motor (37) is fixed on the substrate (31), a reducer (38) is fixed on the motor shaft of the drive motor (37), and the drive shaft (33) is fixed on the reducer (38).

6. The wafer up-and-down polishing and cleaning device according to claim 1, characterized in that: The flower basket (5) has a built-in support roller (51), and a set of support grooves (52) are equally spaced on the outer circumference of the support roller (51). The width of the support grooves (52) is equal to or greater than the thickness of the wafer (100).

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