Wafer scrubbing equipment, wafer scrubbing system and polishing equipment

Abstract

The embodiment of the utility model provides wafer scrubbing equipment, a wafer scrubbing system and polishing equipment. The wafer scrubbing equipment comprises a scrubbing brush and a scrubbing brush regulation and control module, the scrubbing brush regulation and control module is arranged on one side, back to a wafer, of the scrubbing brush, and comprises a telescopic module and a magnetic suction module which are sequentially arranged towards the scrubbing brush; the scrubbing brush comprises a first rotating shaft and a brush head, the first rotating shaft comprises a first end facing the wafer and a second end back to the wafer, the first end of the first rotating shaft is connected with the brush head, and the second end of the first rotating shaft is in magnetic connection with the magnetic module; and the scrubbing brush regulation and control module is configured to regulate and control scrubbing pressure between the scrubbing brush and the wafer through axial stretching and retracting of the telescopic module. Through the arrangement of the magnetic suction module and the telescopic module, flexible magnetic suction connection between the scrubbing brush and the scrubbing brush regulation and control module is realized, and the pressure applied to the surface of the wafer by the brush head can be kept constant in the scrubbing process.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a wafer cleaning device, a wafer cleaning system, and a polishing device. Background Technology

[0002] After wafer polishing, the wafer surface is typically cleaned using a cleaning brush in a cleaning module to remove impurities. When cleaning the wafer surface with the cleaning brush, a constant pressure is applied to the wafer surface by the brush head to ensure uniform cleaning and maintain effectiveness. However, current technologies cannot maintain a constant pressure applied by the brush head to the wafer surface during the cleaning process. Utility Model Content

[0003] In view of this, embodiments of this application provide a wafer cleaning apparatus, a wafer cleaning system, and a polishing apparatus to at least partially solve the above-mentioned problems.

[0004] According to one aspect of this application, a wafer cleaning device is provided, comprising: a cleaning brush and a cleaning brush control module; the cleaning brush control module is disposed on the side of the cleaning brush facing away from the wafer, and includes a telescopic module and a magnetic suction module arranged sequentially toward the cleaning brush; the cleaning brush includes a first rotating shaft and a brush head, the first rotating shaft including a first end facing the wafer and a second end facing away from the wafer, the first end of the first rotating shaft being connected to the brush head and the second end being magnetically connected to the magnetic suction module; the cleaning brush control module is configured to control the cleaning pressure between the cleaning brush and the wafer by axial telescopic extension and retraction of the telescopic module.

[0005] In an optional embodiment, the second end of the first rotating shaft is configured as a curved protrusion protruding toward the magnetic module, the curved protrusion forming a point contact with the magnetic module.

[0006] In an alternative embodiment, the second end of the first rotating shaft is made of a magnetic material.

[0007] In an optional embodiment, the scrubbing brush control module further includes a controller and a pressure sensor disposed between the telescopic module and the magnetic module. The controller is communicatively connected to the pressure sensor and the telescopic module, respectively. The pressure sensor is configured to detect the force between the scrubbing brush and the telescopic module and transmit the detection result to the controller. The controller is configured to control the telescopic module to perform a telescopic action based on the detection result, so that the telescopic module drives the scrubbing brush to move along the rotation axis direction to adjust the force between the scrubbing brush and the wafer.

[0008] In an optional embodiment, the scrubbing brush control module further includes a limiting block located between the telescopic module and the first rotating shaft. The limiting block has a receiving space, and a through hole is provided on the side of the limiting block near the first rotating shaft to connect the receiving space with the outside of the limiting block. The receiving space is used to accommodate a pressure sensor, and the through hole is used to accommodate the magnetic suction module.

[0009] In an optional embodiment, the wafer cleaning device includes a housing extending horizontally along the radial direction of the wafer, a cleaning brush and a cleaning brush control module disposed at a first end of the housing near the wafer, a cleaning drive motor disposed in the housing, the output shaft of the cleaning drive motor being parallel to the first rotating shaft, the cleaning drive motor driving the first rotating shaft to rotate via a transmission belt disposed between the output shaft and the first rotating shaft, the first rotating shaft thereby driving the brush head to rotate to clean the wafer.

[0010] In an optional embodiment, the first end of the housing is provided with an opening facing the wafer, through which the scrubbing brush partially extends from the housing; the second end of the housing opposite to the first end is provided with a swing lifting shaft, the swing lifting shaft being configured to drive the housing to swing around it and drive the housing to rise and fall.

[0011] In an optional embodiment, the housing includes an axial extension extending toward the wafer from the edge of the opening and a radial extension extending radially outward from the axial extension; the wafer wiping device includes a first protective cover sandwiched between the brush head and the first rotating shaft; the first protective cover is located on the wafer-facing side of the radial extension, and the first protective cover includes a protective edge bent toward the housing to surround the radial extension.

[0012] In an optional embodiment, the brush head and the first rotating shaft are connected via a connecting block disposed between them, the connecting block being disposed through the opening, and the first protective cover being sandwiched between the connecting block and the brush head.

[0013] In an optional embodiment, the wafer cleaning apparatus further includes a second protective cover that surrounds a portion of the first protective cover and the brush head, the second protective cover gradually tapering from the bottom of the housing toward the brush head.

[0014] In an optional embodiment, the scrubbing brush includes a pivot seat, in which the first pivot is axially movable; the pivot seat is provided with a snap-fit ​​structure that engages circumferentially with the first pivot, so that the pivot seat and the first pivot rotate together.

[0015] In an optional embodiment, the snap-fit ​​structure includes a limiting bearing, which is mounted on the rotating shaft seat via a second rotating shaft, and the axis of the second rotating shaft is perpendicular to the rotation axis; the limiting bearing includes an inner wheel surface that contacts the second rotating shaft and an outer wheel surface that is opposite to the inner wheel surface; the first rotating shaft is provided with a snap-fit ​​surface for abutting against the outer wheel surface; the limiting bearing snaps with the snap-fit ​​surface of the first rotating shaft via the outer wheel surface.

[0016] In an optional embodiment, the snap-fit ​​structure includes four limiting bearings evenly arranged around the first rotating shaft, and the first rotating shaft is provided with four snap-fit ​​surfaces, each of which corresponds to one of the limiting bearings.

[0017] In an optional embodiment, the device further includes a guide sleeve disposed in the shaft seat, the first shaft being disposed in the guide sleeve, and the guide sleeve being used to guide the first shaft to move axially.

[0018] In an optional embodiment, the telescopic module includes a voice coil motor for driving the scrubbing brush to move along the rotation axis.

[0019] In an optional embodiment, the brush head is made of an acid and alkali resistant and water-absorbing material.

[0020] In an optional embodiment, the first protective cover and the second protective cover are each made of plastic material.

[0021] In an optional embodiment, the pivot seat and the snap-fit ​​structure are both made of acid and alkali resistant stainless steel.

[0022] In an optional embodiment, the guide sleeve is made of polytetrafluoroethylene (PTFE).

[0023] According to another aspect of this application, a wafer cleaning system is provided, including the wafer cleaning equipment described above and a chuck for carrying the wafer to be cleaned.

[0024] According to another aspect of this application, a polishing apparatus is provided, including the wafer wiping system described in the foregoing aspect.

[0025] The wafer cleaning equipment, wafer cleaning system, and polishing equipment provided in this application embodiment achieve flexible magnetic connection between the cleaning brush and the cleaning brush control module through the setting of the magnetic attraction module in the cleaning brush control module. The setting of the telescopic module allows the cleaning pressure between the cleaning brush and the wafer to be adjusted, which helps to maintain a constant pressure applied by the brush head to the wafer surface during the cleaning process, improves the uniformity of cleaning pressure, thereby improving cleaning performance, reducing local contaminant residue, and avoiding excessive pressure on the wafer and deformation. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 This is a schematic diagram of the internal structure of a wafer cleaning system provided in an optional embodiment of this application;

[0028] Figure 2 This is a cross-sectional schematic diagram of a partial structure of a wafer cleaning device provided in an optional embodiment of this application;

[0029] Figure 3 This is a cross-sectional schematic diagram of a partial structure of another wafer cleaning device provided in an optional embodiment of this application;

[0030] Figure 4 This is a partial structural schematic diagram of a wafer cleaning device provided in an optional embodiment of this application;

[0031] Figure 5 yes Figure 4 Another angle diagram of part of the structure of the wafer cleaning equipment;

[0032] Figure 6 yes Figure 4 Another schematic diagram of part of the structure of the wafer cleaning equipment.

[0033] Figure label:

[0034] 01. Wafer cleaning system; 11. Chuck; 12. Retaining ring; 13. Chuck shaft; 14. First rotating device; 15. First lifting device; 16. Housing; 100. Wafer cleaning equipment; 101. Cleaning brush control module; 110. Cleaning brush; 111. Brush head; 112. First shaft; 1121. Rotation axis; 1122. Spherical crown structure; 1123. Contact surface; 1131. Shaft seat; 1132. Limit bearing; 1133. Second shaft; 1134. First transmission wheel; 1135. Second transmission wheel; 1136. Transition component; 114. Guide sleeve; 120. Swing arm; 121. Swing lifting mechanism 122. Lowering shaft; 123. Second rotating device; 124. Second lifting device; 130. Mounting plate; 131. Scrubbing drive motor; 140. Motor output shaft; 150. Telescopic module; 160. Pressure sensor; 171. Magnetic suction module; 172. Housing; 171. Mounting through hole; 171a. Axial extension; 171b. Radial extension; 172. Connecting block; 173. First protective cover; 174. Second protective cover; 181. Fixing plate; 182. Telescopic module connecting plate; 183. Limiting block; 184. Rotary bearing; 185. Locking nut; 186. Bearing fixing seat; 187. Limiting plate. Detailed Implementation

[0035] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0036] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “an,” and “the” as used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0037] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0038] According to a first aspect of the embodiments of this application, a wafer cleaning apparatus for wafer cleaning is provided to at least partially solve the above-mentioned problems. This wafer cleaning apparatus can be applied to… Figure 1 The wafer cleaning system shown. Figure 1 As shown, the wafer cleaning system 01 may include a chuck 11, a retaining ring 12, a chuck shaft 13, a first rotating device 14, a first lifting device 15, a housing 16, and a wafer cleaning device 100, etc. The chuck 11 is used to hold the wafers to be cleaned and can be a vacuum chuck 11 that uses vacuum adsorption to pick up the wafers. The retaining ring 12 is sleeved on the outside of the chuck 11 to prevent the wafers on the chuck 11 from detaching from the chuck 11. The chuck shaft 13 is connected to the chuck 11 and the retaining ring 12 and is used to drive the chuck 11 and the retaining ring 12 to rotate. The first rotating device 14 and the first lifting device 15 are respectively connected to the chuck shaft 13. The first rotating device 14 is used to drive the chuck shaft 13 to rotate, for example, around... Figure 1 Rotating in the R1 direction, the first rotating device 14 can be a servo motor or other suitable device, and the first lifting device 15 is used to drive the chuck shaft 13 to rise and fall, for example along the R1 direction. Figure 1 The lifting mechanism is located in the L1 direction. The first lifting device 15 can be a voice coil motor or other suitable equipment. The housing 16 can be used to house components such as the chuck 11, retaining ring 12, chuck shaft 13, first rotating device 14, and first lifting device 15.

[0039] like Figure 1 and Figure 2 As shown, the wafer cleaning equipment 100 may include a cleaning brush 110, a cleaning brush control module 101, a swing arm 120, a swing lifting shaft 121, a second rotating device 122, and a second lifting device 123. The swing arm 120 includes a housing 170 extending horizontally along the radial direction of the wafer. The cleaning brush 110 is used to clean the wafer fixed on the chuck 11. The cleaning brush control module is located on the side of the cleaning brush 110 facing away from the wafer. The cleaning brush 110 and the cleaning brush control module can be installed at the first end of the housing 170 near the wafer. The second end of the housing 170 opposite to the first end is provided with a swing lifting shaft 121, which is used to drive the housing 170 to swing around it and to lift the housing 170. The second rotating device 122 and the second lifting device 123 are respectively connected to the swing lifting shaft 121. The second rotating device 122 is used to drive the swing lifting shaft 121 to rotate, for example, around the wafer. Figure 1 The second rotating device 122 can be a servo motor or other suitable device, and the second lifting device 123 is used to drive the swing lifting shaft 121 to move up and down, for example along the R2 direction. Figure 1 The lifting mechanism is located in the L2 direction. The second lifting device 123 can also be a voice coil motor or other suitable equipment. The housing 170 can be equipped with... Figure 2The mounting plate 124 shown is used to install internal components.

[0040] The following is a reference to the appendix. Figure 2-6 The wafer cleaning apparatus 100 for wafer cleaning provided in the embodiments of this application will be described in detail.

[0041] like Figure 2 and Figure 3 As shown in the figure, this application provides a wafer cleaning device 100 for wafer cleaning, including: a cleaning brush control module 101, a cleaning brush 110, and a cleaning drive motor 130. The cleaning brush control module 101 is disposed on the side of the cleaning brush 110 facing away from the wafer, as shown in the figure. Figure 2 The upper side is shown. (As shown) Figure 3 The scrubbing brush control module 101 may include a telescopic module 140, a pressure sensor 150 and a magnetic module 160 arranged sequentially toward the scrubbing brush 110, and also includes a controller (not shown).

[0042] The scrubbing drive motor 130 and the telescopic module 140 are respectively connected to the scrubbing brush 110. The controller is communicatively connected to the telescopic module 140 and the pressure sensor 150. It should be understood that the connection (or linkage) in the embodiments of this application can be either direct or indirect, and both are within the protection scope of the embodiments of this application. The scrubbing drive motor 130, the telescopic module 140, the pressure sensor 150, the scrubbing brush 110, and the controller can all be mounted on the swing arm 120.

[0043] The scrubbing drive motor 130 drives the scrubbing brush 110 to rotate, so that the scrubbing brush 110 scrubs the wafer; the pressure sensor 150 detects the force between the scrubbing brush 110 and the telescopic module 140, and transmits the detection result to the controller; the controller controls the telescopic module 140 to perform a telescopic action according to the detection result, so that the telescopic module 140 drives the scrubbing brush 110 to move along the rotation axis 1121, so as to adjust the force between the scrubbing brush 110 and the wafer. It should be understood that the rotation axis 1121 in this embodiment refers to the straight line on which the scrubbing brush 110 rotates, i.e. Figure 3 The axis referred to in 1121.

[0044] By driving the scrubbing drive motor 130 and the telescopic module 140 to rotate the scrubbing brush 110 and move it along the rotation axis 1121, the complex motion of the scrubbing brush 110 can be decomposed into two simpler motions: rotation and movement along the rotation axis 1121. This allows for separate control of the rotation and movement along the rotation axis 1121 of the scrubbing brush 110, thereby reducing the difficulty of controlling the movement of the scrubbing brush 110 along the rotation axis 1121. In other words, it reduces the difficulty of adjusting the force between the scrubbing brush 110 and the wafer, which helps to maintain a constant force applied by the brush head 111 to the wafer surface.

[0045] As a feasible implementation, the telescopic module 140 may include a mechanical or hydraulic telescopic device. Exemplarily, in some optional embodiments, the telescopic module 140 may include a voice coil motor, such as a servo-controlled voice coil motor, which can be used to drive the scrubbing brush 110 to move along the rotation axis. A voice coil motor is a direct drive motor with characteristics such as simple structure, small size, high speed, and fast acceleration response. In this embodiment, a voice coil motor that performs driving actions along a straight line can be used. By directly driving the scrubbing brush 110 along a straight line with a voice coil motor, the scrubbing brush 110 can move along the rotation axis, eliminating the need for a separate conversion structure to change the driving direction. This simplifies the structure of the telescopic module 140 and reduces the space occupied by the telescopic module 140.

[0046] The scrubbing brush 110 can be placed against the wafer fixed on the chuck 11 by the lower end of the brush head 111, so as to scrub the wafer surface by rotating the brush head 111.

[0047] It should be understood that the force between the scrubbing brush 110 and the telescopic module 140 is either the pressure exerted by the scrubbing brush 110 on the telescopic module 140 or the pressure exerted by the telescopic module 140 on the scrubbing brush 110; these are a pair of equal-magnitude interaction forces. Furthermore, the pressure exerted by the scrubbing brush 110 on the telescopic module 140 originates from the reaction force of the wafer on the scrubbing brush 110 when the scrubbing brush 110 applies pressure to the wafer. Therefore, the force between the scrubbing brush 110 and the telescopic module 140 is equal in magnitude to the pressure exerted by the scrubbing brush 110 on the wafer.

[0048] The detection results transmitted from the pressure sensor 150 to the controller may include the detected force between the scrubbing brush 110 and the telescopic module 140. Upon receiving the detected force, the controller compares it with a preset target force. When the detected force is greater than the target force, the controller controls the telescopic module 140 to retract, thereby moving the scrubbing brush 110 away from the wafer along the rotation axis 1121 to reduce the force between the scrubbing brush 110 and the telescopic module 140. When the detected force is less than the target force, the controller controls the telescopic module 140 to extend, thereby moving the scrubbing brush 110 closer to the wafer along the rotation axis 1121 to increase the force between the scrubbing brush 110 and the telescopic module 140. This process continues until the detected force equals the target force, ensuring that the pressure applied by the scrubbing brush 110 to the wafer is equal to the target force. It should be understood that the preset target force is the constant force that the force between the scrubbing brush 110 and the telescopic module 140 needs to be maintained. The target force can be a single force or a range of forces, both of which are within the protection scope of this application embodiment.

[0049] In the wafer cleaning apparatus 100 provided in this application embodiment, the cleaning drive motor 130 and the telescopic module 140 are respectively connected to the cleaning brush 110, and the controller is electrically connected to the telescopic module 140 and the pressure sensor 150 respectively. The cleaning drive motor 130 can drive the cleaning brush 110 to rotate, so that the cleaning brush 110 cleans the wafer. The pressure sensor 150 can detect the force between the cleaning brush 110 and the telescopic module 140 and transmit the detection result to the controller. The controller can control the telescopic module 140 to perform telescopic action according to the detection result, so that the telescopic module 140 drives the cleaning brush 110 to move along the rotation axis 1121, thereby adjusting the force between the cleaning brush 110 and the wafer. Based on the detection results fed back by the pressure sensor 150, the magnitude of the force between the scrubbing brush 110 and the wafer can be adjusted in real time. When the force between the scrubbing brush 110 and the wafer is greater than the target force, the force between the scrubbing brush 110 and the wafer can be reduced. When the force between the scrubbing brush 110 and the wafer is less than the target force, the force between the scrubbing brush 110 and the wafer can be increased, so that the force between the scrubbing brush 110 and the wafer is maintained at the target force, thereby keeping the pressure applied by the brush head 111 of the scrubbing brush 110 to the wafer surface constant.

[0050] like Figure 3As shown, in some optional embodiments, the scrubbing brush 110 includes a brush head 111 and a first rotating shaft 112. A first end of the first rotating shaft 112 facing the wafer is connected to the brush head 111; a second end of the first rotating shaft 112 facing away from the wafer is connected to a magnetic module 160. The magnetic module 160 can transmit force when the telescopic module 140 extends to push the first rotating shaft 112; when the telescopic module 140 retracts to pull the first rotating shaft 112, it can pull up the rotating shaft 112 through magnetic attraction. The magnetic module 160 can form a relatively flexible magnetic connection with the first rotating shaft 112. During the circumferential rotation of the first rotating shaft 112, the magnetic module 160 and the pressure sensor 150 can remain stationary, thereby maintaining the magnetic connection while facilitating pressure monitoring and avoiding difficulties in wiring arrangement such as tangling of the pressure sensor 150. In a preferred embodiment, the second end of the first rotating shaft 112 is configured as a curved protrusion protruding toward the magnetic module 160, such as a spherical crown structure 1122. The curved protrusion makes point contact with the magnetic module, thereby further improving the connection flexibility, reducing frictional resistance and collision damage, and providing a small range of yaw freedom during the axial movement and circumferential rotation of the first rotating shaft 112.

[0051] The scrubbing drive motor 130 is connected to the first rotating shaft 112 via a transmission assembly. The transmission assembly includes a shaft seat 1131 sleeved on the outside of the first rotating shaft 112, and the scrubbing drive motor 130 is connected to the shaft seat 1131. The shaft seat 1131 and the first rotating shaft 112 can be movably connected, and the first rotating shaft 112 can move axially along the rotation axis 1121 within the shaft seat 1131. Furthermore, by sleeved on the outside of the first rotating shaft 112, the shaft seat 1131 can guide the first rotating shaft 112 to move along the rotation axis 1121 and, to a certain extent, restrict the first rotating shaft 112 from moving in directions other than the rotation axis 1121, thereby ensuring the stable rotation of the first rotating shaft 112. Furthermore, the rotating shaft seat 1131 is provided with a snap-fit ​​structure that snaps into the first rotating shaft 112. When the rotating shaft seat 1131 rotates around the rotation axis 1121 under the drive of the transmission component, the rotating shaft seat 1131 drives the first rotating shaft 112 to rotate around the rotation axis 1121 through the snap-fit ​​structure.

[0052] The first rotating shaft 112 may be provided with a locking structure that engages with the locking structure of the rotating shaft seat 1131. The locking structure and the locking structure may be two structures that fit together with a concave-convex shape, or other suitable structures, as long as they can achieve locking and allow the first rotating shaft 112 to move along the rotation axis 1121.

[0053] like Figure 2As shown, in some optional embodiments, the telescopic module 140, pressure sensor 150, and scrubbing brush 110 are located on the rotation axis 1121. The output shaft 131 of the scrubbing drive motor 130 is parallel to the rotation axis 1121 of the first rotating shaft 112 and the scrubbing brush 110, and the orthographic projection of the scrubbing drive motor 130 on the rotation axis 1121 is located in the area where one or more of the telescopic module 140, pressure sensor 150, and scrubbing brush 110 are located on the rotation axis 1121.

[0054] In this embodiment, the telescopic module 140, the pressure sensor 150, and the scrubbing brush 110 are located on the rotation axis 1121, which facilitates the pressure sensor 150 in detecting the force between the telescopic module 140 and the scrubbing brush 110. By setting the output shaft 131 of the scrubbing drive motor 130 to be parallel to the rotation axis 1121 of the scrubbing brush 110, the scrubbing drive motor 130 can be offset relative to the telescopic module 140, pressure sensor 150, and scrubbing brush 110, that is, set to the side of the telescopic module 140, pressure sensor 150, and scrubbing brush 110. Furthermore, by setting the orthographic projection of the scrubbing drive motor 130 on the rotation axis 1121 to be located in the area where one or more of the telescopic module 140, pressure sensor 150, and scrubbing brush 110 are located on the rotation axis 1121, the position of the scrubbing drive motor 130 in the direction of the rotation axis 1121 can be kept within the range of the telescopic module 140, pressure sensor 150, and scrubbing brush 110. This avoids increasing the size of the wafer scrubbing equipment 100 in the direction of the rotation axis 1121 due to the scrubbing drive motor 130, which is beneficial to the miniaturization of the wafer scrubbing equipment 100.

[0055] As a feasible implementation method, the snap-fit ​​structure includes, for example... Figure 4 The limiting bearing 1132 is shown. The limiting bearing 1132 is mounted on the rotating shaft seat 1131 via a second rotating shaft 1133, and the axis of the second rotating shaft 1133 can be set perpendicular to the rotation axis 1121. The limiting bearing 1132 includes an inner wheel surface that contacts the second rotating shaft 1133 and an outer wheel surface that faces away from the inner wheel surface; the first rotating shaft 112 is provided with a snap-fit ​​surface 1123 for abutting against the outer wheel surface. This snap-fit ​​surface 1123 serves as the mating structure for the limiting bearing 1132, allowing the limiting bearing 1132 to snap into the first rotating shaft 112 via the outer wheel surface.

[0056] The number of limiting bearings 1132 can be one or more. Matching the shape of the outer wheel surface can be understood as being possible. The outer wheel surface of the limiting bearing 1132 can be a cylindrical surface, and the engaging surface 1123 of the first rotating shaft 112 can be a plane. Alternatively, the outer wheel surface of the limiting bearing 1132 and the engaging surface 1123 of the first rotating shaft 112 can be a convex surface and a concave surface, respectively, as long as the engaging of the limiting bearing 1132 with the first rotating shaft 112 can be achieved and the first rotating shaft 112 can be allowed to move along the rotation axis 1121.

[0057] In this embodiment of the application, the snap-fit ​​structure may include a limiting bearing 1132, which is mounted on a rotating shaft seat 1131 via a second rotating shaft 1133, and the axis of the second rotating shaft 1133 is perpendicular to the rotation axis 1121. The limiting bearing 1132 includes an inner wheel surface that contacts the second rotating shaft 1133 and an outer wheel surface that is opposite to the inner wheel surface; the first rotating shaft 112 is provided with a locking surface 1123 for abutting against the outer wheel surface; the limiting bearing 1132 is locked with the locking surface 1123 of the first rotating shaft 112 through the outer wheel surface. Since the outer wheel surface of the limiting bearing 1132 can rotate around the second rotating shaft 1133, when the first rotating shaft 112 moves along the rotation axis 1121, the friction between the locking surface 1123 of the first rotating shaft 112 and the limiting bearing 1132 can be reduced by the rotation of the outer wheel surface of the limiting bearing 1132, thereby improving the efficiency of the first rotating shaft 112 moving along the rotation axis 1121.

[0058] like Figure 4 As shown, in some optional embodiments, the snap-fit ​​structure includes four limiting bearings 1132 evenly arranged around the first rotating shaft 112, and the first rotating shaft 112 may be provided with four snap-fit ​​surfaces 1123, with each snap-fit ​​surface 1123 corresponding to one of the limiting bearings 1132.

[0059] In this embodiment of the application, the four limiting bearings 1132 evenly arranged around the first rotating shaft 112 and the four locking surfaces 1123 of the first rotating shaft 112 included in the locking structure can evenly distribute the force between the locking structure and the first rotating shaft 112 evenly among the four limiting bearings 1132 and the four locking surfaces 1123 when the locking structure is engaged with the first rotating shaft 112 to transmit force. This can effectively prevent the limiting bearings 1132 or the locking surfaces 1123 from being damaged due to stress concentration.

[0060] like Figure 3As shown, in some optional embodiments, the wafer cleaning apparatus 100 further includes a guide sleeve 114, which is disposed in the rotating shaft seat 1131, and the first rotating shaft 112 is disposed in the guide sleeve 114; the guide sleeve 114 is used to guide the first rotating shaft 112 to move axially. When the first rotating shaft 112 moves along the rotation axis 1121, there can be relative sliding between the first rotating shaft 112 and the guide sleeve 114, and the surface of the guide sleeve 114 in contact with the first rotating shaft 112 can be made as smooth as possible, thereby reducing the frictional resistance encountered by the first rotating shaft 112 as it moves along the rotation axis 1121.

[0061] In this embodiment, the first rotating shaft 112 is guided to move along its axial direction by the guide sleeve 114, so that the first rotating shaft 112 can move along the rotation axis 1121 under the drive of the telescopic module 140, so as to adjust the force between the brush head 111 of the scrubbing brush 110 and the wafer under the drive of the first rotating shaft 112.

[0062] like Figure 2 and Figure 3 As shown, in some optional embodiments, the transmission assembly includes a first transmission wheel 1134, a second transmission wheel 1135, and a transition member 1136; the first transmission wheel 1134 is sleeved on the outside of the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the scrubbing drive motor 130; and the first transmission wheel 1134 and the second transmission wheel 1135 are connected by the transition member 1136.

[0063] The first transmission wheel 1134 and the second transmission wheel 1135 can be transmission components such as gears or pulleys. The transition member 1136 can be a transmission belt or a transition gear that meshes with the first transmission wheel 1134 and the second transmission wheel 1135 respectively. For example, when the transition member 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are gears, the transmission belt can be a chain that meshes with the teeth of the first transmission wheel 1134 and the second transmission wheel 1135, or it can be a toothed belt with teeth that mesh with the teeth of the first transmission wheel 1134 and the second transmission wheel 1135. When the transition member 1136 is a transmission belt and the first transmission wheel 1134 and the second transmission wheel 1135 are pulleys, the transmission belt can mesh with the first transmission wheel 1134 and the second transmission wheel 1135 through friction. Of course, the embodiments of this application do not limit the specific forms of the first transmission wheel 1134, the second transmission wheel 1135, and the transition member 1136, as long as they can cooperate with each other to transmit force.

[0064] In this embodiment, the transmission assembly may include a first transmission wheel 1134, a second transmission wheel 1135, and a transition member 1136. The first transmission wheel 1134 is sleeved on the outside of the rotating shaft seat 1131, and the second transmission wheel 1135 is connected to the output shaft 131 of the scrubbing drive motor 130. Furthermore, the first transmission wheel 1134 and the second transmission wheel 1135 are connected by the transition member 1136. The output shaft 131 of the scrubbing drive motor 130 can output power through the second transmission wheel 1135, and transmit the power to the rotating shaft seat 1131 through the transition member 1136 and the first transmission wheel 1134, thereby driving the first rotating shaft 112 and the brush head 111 to rotate through the rotating shaft seat 1131. Furthermore, the transition piece 1136, the first transmission wheel 1134, and the second transmission wheel 1135 allow the scrubbing drive motor 130 to transmit power to the shaft seat 1131 indirectly, meaning the scrubbing drive motor 130 does not need to directly contact the shaft seat 1131. This reduces the restrictions on the arrangement of the scrubbing drive motor 130 and makes its arrangement more flexible.

[0065] like Figure 3 As shown, in some optional embodiments, the pressure sensor 150 is located between the telescopic module 140 and the magnetic module 160. When the telescopic module 140 applies a force to the first rotating shaft 112, or the first rotating shaft 112 applies a force to the telescopic module 140, adjacent components of the telescopic module 140, pressure sensor 150, magnetic module 160, and first rotating shaft 112 can abut against each other to transmit force.

[0066] The telescopic module 140 can be connected to the first rotating shaft 112 via the pressure sensor 150 and the magnetic module 160. The force between the scrubbing brush 110 and the telescopic module 140 is equal to the force exerted by the first rotating shaft 112 on the pressure sensor 150 via the magnetic module 160, or the force between the pressure sensor 150 and the telescopic module 140. Therefore, by placing the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the force between the scrubbing brush 110 and the telescopic module 140 can be detected by the pressure sensor 150. Of course, the pressure sensor 150 can also be placed in other locations, such as at the end of the telescopic module 140 away from the first rotating shaft 112, all of which are within the protection scope of this application embodiment.

[0067] In this embodiment, by setting the pressure sensor 150 between the telescopic module 140 and the magnetic module 160, the pressure sensor 150 can be placed on the force transmission path between the scrubbing brush 110 and the telescopic module 140, which facilitates accurate detection of the force between the scrubbing brush 110 and the telescopic module 140.

[0068] like Figure 3As shown, in some optional embodiments, the wafer cleaning apparatus 100 may further include a limiting block 183 located between the telescopic module 140 and the first rotating shaft 112. The limiting block 183 includes a receiving space, and a through hole is provided on the side of the limiting block 183 near the first rotating shaft 112, communicating the receiving space with the outside of the limiting block 183. The receiving space is used to receive the pressure sensor 150, and the through hole is used to receive the magnetic module 160, and the magnetic module 160 is movable along the rotation axis 1121 within the through hole.

[0069] It should be understood that, in order to prevent the magnetic module 160 from falling out of the through hole, the maximum distance between the second end of the first rotating shaft 112 and the limiting block 183 along the rotation axis 1121 should be less than the size of the magnetic module 160 along the rotation axis 1121.

[0070] In this embodiment, the limiting block 183 can accommodate the pressure sensor 150 and the magnetic module 160. By positioning the limiting block 183 between the telescopic module 140 and the first rotating shaft 112, the pressure sensor 150 and the magnetic module 160 can be positioned between them, facilitating their installation. Furthermore, the magnetic module 160 can move along the rotation axis 1121 within the through hole, reducing restrictions on its installation and making it more flexible.

[0071] like Figure 2 and Figure 3 As shown, in some optional embodiments, the wafer cleaning apparatus 100 further includes a housing 170, a first end of which is configured with an opening toward the wafer, through which a cleaning brush 110 extends partially from the housing, for example, a first rotating shaft 112 is at least partially located within the housing 170, and a brush head 111 is located outside the housing 170. The housing 170 includes an axial extension 171a extending toward the wafer from the edge of the opening and a radial extension 171b extending radially outward from the axial extension. The axial extension 171a and the radial extension 171b form a mounting through-hole 171, and a first end of the first rotating shaft 112 is connected to the brush head 111 via a connecting block 172 located in the mounting through-hole 171; a first protective cover 173 is disposed between the brush head 111 and the connecting block 172, covering the mounting through-hole 171, the first protective cover 173 including a protective edge bent toward the housing 170 to surround the radial extension. The housing 170 is provided with a second protective cover 174 that is fitted over the first protective cover 173 and the brush head 111. The second protective cover 174 surrounds the first protective cover 173 and the brush head 174, and the second protective cover 174 gradually decreases in size from the bottom of the housing 170 toward the brush head 111.

[0072] The brush head 111 and the first protective cover 173 can be mounted on the connecting block 172, thereby providing a stable mounting position for the brush head 111 and the first protective cover 173, ensuring their normal operation. The first protective cover 173, covering the mounting through-hole 171, prevents impurities or dirt on the wafer surface from entering the mounting through-hole 171 and then into the housing 170 of the wafer cleaning equipment 100 during wafer cleaning. The second protective cover 174, fitted over the first protective cover 173 and the brush head 111, further blocks cleaning fluid or impurities and dirt from the wafer surface from entering the mounting through-hole 171, thus preventing these impurities or dirt from adversely affecting the internal components of the wafer cleaning equipment 100.

[0073] In this embodiment of the application, the wafer cleaning equipment 100 may also include components such as a fixing plate 181, a telescopic module connecting plate 182, a rotary bearing 184, a locking nut 185, a bearing fixing seat 186, and a limiting plate 187.

[0074] like Figures 3-6 As shown, a fixing plate 181 is provided between the end of the telescopic module 140 away from the pressure sensor 150 and the housing 170 of the wafer cleaning equipment 100, so that the position of the telescopic module 140 can be fixed by the fixing plate 181. The end of the telescopic module 140 near the pressure sensor 150 is connected to the telescopic module connecting plate 182. The pressure sensor 150 is mounted on the telescopic module connecting plate 182, and a limiting block 183 for accommodating the pressure sensor 150 can be installed on the telescopic module connecting plate 182 to restrict the movement of the pressure sensor 150. The rotary bearing 184 can be sleeved outside the rotating shaft seat 1131. The rotating shaft seat 1131 can be fixed by the locking nut 185, connecting the rotating shaft seat 1131 to the inner ring of the rotary bearing 184. This allows the inner ring of the rotary bearing 184 to rotate relative to its outer ring when the rotating shaft seat 1131 rotates, thus reducing the resistance to rotation of the rotating shaft seat 1131 while simultaneously installing it via the rotary bearing 184. The bearing mounting seat 186 has a mounting position where the rotary bearing 184 can be installed. The displacement of the bearing can be limited by the limiting plate 187, preventing the rotary bearing 184 from dislodging from the mounting position. The bearing mounting seat 186 can be connected to the housing 170 of the wafer cleaning equipment 100, allowing the bearing to be fixed within the wafer cleaning equipment 100 via the bearing mounting seat 186 and the limiting plate 187.

[0075] In an optional embodiment, at least the second end or the entire first rotating shaft 112 is made of a magnetic material, such as SUS440C, thereby giving it high hardness, wear resistance, and high corrosion resistance, so that it is less susceptible to wear and deformation during movement, improving the accuracy of brush head pressure adjustment, and is less susceptible to chemical corrosion, reducing the pollution of the cleaning environment by metal ions and improving wafer cleanliness.

[0076] In an optional embodiment, the brush head 111 is made of an acid and alkali resistant and absorbent material, such as PVA cotton, which has a soft, compressible, and elastic surface after absorbing water, thus providing a good cleaning effect and preventing scratches on the wafer surface.

[0077] In an optional embodiment, the first protective cover 173 and the second protective cover 174 are respectively made of plastic material, such as polypropylene, which has acid and alkali resistance, good chemical stability and mechanical properties, can reduce the corrosion of the first protective cover 173 and the second protective cover 174 by cleaning liquids such as cleaning fluid during the scrubbing process, and has low density, light weight and low price.

[0078] In an optional embodiment, the pivot seat 1131 and the snap-fit ​​structure (limit bearing 1132) can be made of acid and alkali resistant stainless steel materials, such as SUS 304, SUS 316L, SUS 440C, etc., so that they have high hardness, high corrosion resistance and wear resistance, thereby reducing metal ion contamination during the wafer cleaning process and improving the cleaning effect.

[0079] In an optional embodiment, the guide sleeve 114 may be made of polytetrafluoroethylene, which has acid and alkali resistance, wear resistance, and a low coefficient of friction, thereby reducing frictional resistance during the axial movement of the first rotating shaft 112.

[0080] like Figure 1 As shown, according to a second aspect of the embodiments of this application, a wafer cleaning system 01 is also provided, including the wafer cleaning device 100 in any embodiment of the first aspect of this application.

[0081] It should be understood that the wafer cleaning system 01 in this embodiment is based on the same inventive concept as the aforementioned wafer cleaning equipment 100 embodiment. Its specific implementation and beneficial effects can be referred to the above embodiments, and will not be repeated here.

[0082] According to a third aspect of the embodiments of this application, a polishing apparatus is also provided, including the wafer wiping system 01 in the second aspect embodiments of this application.

[0083] The polishing equipment in this application embodiment may further include a polishing module, which performs chemical mechanical polishing on the wafer. It should be understood that chemical mechanical polishing (CMP), also known as chemical mechanical planarization (CMP), is an ultra-precision surface processing technology that achieves global planarization, enabling the wafer to undergo chemical mechanical polishing through the combined action of chemicals and machinery.

[0084] Specifically, the polishing module may include a carrier head, a polishing disk, a liquid supply device, a dresser, and a polishing pad. The carrier head loads the wafer to be polished and abuts it against the polishing pad above the polishing disk to polish the wafer using the polishing pad. The liquid supply device supplies polishing fluid between the polishing pad and the wafer. The dresser is used to dress the surface of the polishing pad. The polishing pad is placed on the polishing disk, and the carrier head and dresser can be located on opposite sides of the polishing pad, so that while the carrier head polishes the wafer through the polishing pad, the dressing disk of the dresser can simultaneously dress the polishing pad. After the wafer polishing is completed, the wafer surface can be wiped clean using the aforementioned wafer cleaning equipment.

[0085] It should be understood that the polishing equipment in this embodiment is based on the same inventive concept as the aforementioned wafer cleaning equipment embodiment. Its specific implementation and beneficial effects can be referred to the above embodiments, and will not be repeated here.

[0086] It should be noted that, depending on the implementation needs, the various components / steps described in the embodiments of this application can be broken down into more components / steps, or two or more components / steps or parts of the operation of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of this application.

[0087] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0088] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A wafer cleaning device, characterized in that, include: Scrubbing brush and scrubbing brush control module; The scrubbing brush control module is located on the side of the scrubbing brush facing away from the wafer, and includes a telescopic module and a magnetic suction module arranged sequentially toward the scrubbing brush. The scrubbing brush includes a first rotating shaft and a brush head. The first rotating shaft includes a first end facing the wafer and a second end facing away from the wafer. The first end of the first rotating shaft is connected to the brush head, and the second end is magnetically connected to the magnetic module. The scrubbing brush control module is configured to adjust the scrubbing pressure between the scrubbing brush and the wafer through the axial extension and retraction of the telescopic module.

2. The wafer cleaning equipment according to claim 1, characterized in that, The second end of the first rotating shaft is configured as a curved protrusion protruding toward the magnetic module, and the curved protrusion makes point contact with the magnetic module.

3. The wafer cleaning equipment according to claim 1, characterized in that, The second end of the first rotating shaft is made of magnetic material.

4. The wafer cleaning equipment according to claim 1, characterized in that, The scrubbing brush control module further includes a controller and a pressure sensor disposed between the telescopic module and the magnetic module. The controller is communicatively connected to the pressure sensor and the telescopic module. The pressure sensor is configured to detect the force between the scrubbing brush and the telescopic module and transmit the detection result to the controller. The controller is configured to control the telescopic module to perform a telescopic action based on the detection result, so that the telescopic module drives the scrubbing brush to move along the rotation axis to adjust the force between the scrubbing brush and the wafer.

5. The wafer cleaning equipment according to claim 4, characterized in that, The scrubbing brush control module also includes a limiting block located between the telescopic module and the first rotating shaft. The limiting block has a receiving space, and the side of the limiting block near the first rotating shaft has a through hole that connects the receiving space to the outside of the limiting block. The accommodating space is used to accommodate the pressure sensor, and the through hole is used to accommodate the magnetic module.

6. The wafer cleaning equipment according to claim 1, characterized in that, The wafer cleaning equipment includes a housing extending horizontally along the radial direction of the wafer. The cleaning brush and the cleaning brush control module are disposed at a first end of the housing near the wafer. A cleaning drive motor is disposed in the housing. The output shaft of the cleaning drive motor is parallel to the first rotating shaft. The cleaning drive motor drives the first rotating shaft to rotate through a transmission belt disposed between the output shaft and the first rotating shaft. The first rotating shaft then drives the brush head to rotate to clean the wafer.

7. The wafer cleaning equipment according to claim 6, characterized in that, The first end of the housing is provided with an opening facing the wafer, through which the scrubbing brush partially extends from the housing; the second end of the housing opposite to the first end is provided with a swing lifting shaft, which is configured to drive the housing to swing around it and drive the housing to rise and fall.

8. The wafer cleaning equipment according to claim 7, characterized in that, The housing includes an axial extension extending toward the wafer from the edge of the opening and a radial extension extending radially outward from the axial extension. The wafer cleaning device includes a first protective cover sandwiched between the brush head and the first rotating shaft; the first protective cover is located on the wafer-facing side of the radial extension, and the first protective cover includes a protective edge bent toward the housing to surround the radial extension.

9. The wafer cleaning equipment according to claim 8, characterized in that, The brush head and the first rotating shaft are connected via a connecting block disposed between them, the connecting block being disposed through the opening, and the first protective cover being sandwiched between the connecting block and the brush head.

10. The wafer cleaning equipment according to claim 9, characterized in that, The wafer cleaning equipment also includes a second protective cover that surrounds a portion of the first protective cover and the brush head, and the second protective cover gradually tapers from the bottom of the housing toward the brush head.

11. The wafer cleaning apparatus according to any one of claims 1-10, characterized in that, The scrubbing brush includes a pivot seat, in which the first pivot is axially movable; the pivot seat is provided with a snap-fit ​​structure that engages circumferentially with the first pivot, so that the pivot seat and the first pivot rotate together.

12. The wafer cleaning equipment according to claim 11, characterized in that, The snap-fit ​​structure includes a limiting bearing, which is mounted on the rotating shaft seat via a second rotating shaft. The axis of the second rotating shaft is perpendicular to the rotation axis, which is the straight line where the rotating shaft of the scrubbing brush rotates. The limiting bearing includes an inner wheel surface that contacts the second rotating shaft and an outer wheel surface that is opposite to the inner wheel surface; the first rotating shaft is provided with a snap-fit ​​surface for abutting against the outer wheel surface; the limiting bearing is snapped into the snap-fit ​​surface of the first rotating shaft through the outer wheel surface.

13. The wafer cleaning equipment according to claim 12, characterized in that, The snap-fit ​​structure includes four limiting bearings evenly arranged around the first rotating shaft. The first rotating shaft is provided with four snap-fit ​​surfaces, and each snap-fit ​​surface corresponds to one of the limiting bearings.

14. The wafer cleaning equipment according to claim 11, characterized in that, The device further includes a guide sleeve disposed in the rotating shaft seat, and the first rotating shaft is disposed in the guide sleeve. The guide sleeve is used to guide the first rotating shaft to move axially.

15. The wafer cleaning apparatus according to any one of claims 1-10, characterized in that, The telescopic module includes a voice coil motor, which drives the scrubbing brush to move along the rotation axis.

16. The wafer cleaning equipment according to claim 1, characterized in that, The brush head is made of an acid and alkali resistant and water-absorbing material.

17. The wafer cleaning equipment according to claim 10, characterized in that, The first protective cover and the second protective cover are both made of plastic material.

18. The wafer cleaning equipment according to claim 11, characterized in that, The pivot seat and the snap-fit ​​structure are both made of acid and alkali resistant stainless steel.

19. The wafer cleaning equipment according to claim 14, characterized in that, The guide sleeve is made of polytetrafluoroethylene.

20. A wafer cleaning system, characterized in that, The wafer cleaning apparatus includes any one of claims 1 to 19 and a chuck for carrying the wafer to be cleaned.

21. A polishing device, characterized in that, Includes the wafer cleaning system as described in claim 20.

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