Wafer cleaning machine table

Abstract

The utility model provides a wafer cleaning machine, which belongs to the technical field of semiconductor equipment and comprises a cleaning cavity, a wafer cleaning device and a wafer cleaning device. The exhaust pipe comprises an exhaust pipe inlet and an exhaust pipe outlet, the exhaust pipe extends from the interior of the cleaning cavity to the exterior of the wafer cleaning machine table, and the exhaust pipe outlet is located outside the wafer cleaning machine table; the gas-liquid separation device is detachably connected to the exhaust pipe, the gas-liquid separation device comprises a shell and a baffle, and the shell comprises a gas-liquid mixed gas flow inlet, a gas outlet and a liquid outlet; the baffle is arranged in the shell, and a channel allowing airflow to pass through is formed between the baffle and the shell. According to the wafer cleaning machine provided by the utility model, the gas-liquid separation device is additionally arranged, so that gas and liquid in gas-liquid mixed gas flow can be effectively separated, and liquid residues in the exhaust pipe are reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, specifically to a wafer cleaning machine. Background Technology

[0002] like Figure 1 As shown, a significant problem exists in the design of the cavity exhaust unit (CUP) of a wafer cleaning machine: a normal CUP contains a mixture of gas and liquid airflow, which easily forms liquid residue in the exhaust duct. This liquid residue not only affects the overall exhaust efficiency but can also lead to duct blockage. Once the exhaust duct is blocked, it will cause a series of serious problems. For example, poor ventilation will lead to severe moisture accumulation inside the cavity, which will seriously threaten the quality of wafer products. Moisture accumulation may cause contamination on the wafer surface and even lead to wafer scrapping. Blockage of the exhaust duct may also pose safety risks. Due to changes in internal pressure and potential chemical reactions caused by moisture accumulation, the normal operation of the wafer-level machine may be disrupted, even leading to machine malfunction or shutdown. This will not only affect production efficiency but may also threaten the safety of operators.

[0003] Therefore, the existing CUP exhaust design of wafer cleaning machines has obvious technical defects, and an innovative solution is needed to reduce the probability of exhaust blockage, thereby ensuring the quality of wafer products and production safety. Utility Model Content

[0004] In view of the problems existing in the prior art wafer cleaning equipment, this application provides a wafer cleaning equipment.

[0005] A wafer cleaning machine, comprising:

[0006] A cleaning chamber is located inside the wafer cleaning machine, and the cleaning chamber includes cleaning components;

[0007] An exhaust pipe includes an exhaust pipe inlet and an exhaust pipe outlet. The exhaust pipe inlet is connected to the cleaning chamber. The exhaust pipe extends from inside the cleaning chamber to the outside of the wafer cleaning machine. The exhaust pipe outlet is located outside the wafer cleaning machine.

[0008] A gas-liquid separator is detachably connected to the exhaust pipe. The gas-liquid separator includes a housing and a baffle. The housing includes a gas-liquid mixed flow inlet, a gas outlet, and a liquid outlet. The baffle is disposed inside the housing, and a channel is formed between the baffle and the housing to allow airflow.

[0009] Optionally, the gas-liquid separation device is located in the exhaust pipe section inside the wafer cleaning machine and / or in the exhaust pipe section outside the wafer cleaning machine.

[0010] Optionally, the gas-liquid mixed gas flow inlet is located near the inlet end of the exhaust pipe and flows from the exhaust pipe inlet to the exhaust pipe outlet. The gas-liquid mixed gas flow inlet and the gas outlet are arranged sequentially along the flow direction of the gas-liquid mixed gas flow.

[0011] Optionally, the baffle includes a transverse baffle arranged along an axial direction perpendicular to the housing, and at least one side of the transverse baffle has a gap with the sidewall of the housing, and a gap is provided between the transverse baffle and the gas-liquid mixture inlet and the gas outlet.

[0012] Optionally, at least a portion of the transverse baffle faces the exhaust pipe, and the area of ​​the area facing the exhaust pipe is greater than or equal to the cross-sectional area of ​​the exhaust pipe.

[0013] Optionally, the baffle further includes a longitudinal baffle, which is arranged parallel to the axial direction of the housing. One end of the longitudinal baffle is perpendicularly connected to one end of the transverse baffle, and the longitudinal baffle, the transverse baffle, and the housing form a passage that allows airflow.

[0014] Optionally, the cavity formed by the transverse baffle and the longitudinal baffle faces the gas-liquid mixture airflow inlet, and the transverse baffle is disposed above the gas-liquid mixture airflow inlet, while the longitudinal baffle faces the exhaust pipe.

[0015] Optionally, at least a portion of the longitudinal baffle faces the exhaust pipe, and the area of ​​the area facing the exhaust pipe is greater than or equal to the cross-sectional area of ​​the exhaust pipe.

[0016] Optionally, the gas-liquid separation device further includes a liquid storage tank located at the bottom of the outer casing, and the liquid outlet is disposed at the bottom of the liquid storage tank.

[0017] Optionally, the opening is located at the bottom of the housing of the wafer cleaning machine, and the opening is located directly below the liquid outlet. Attached Figure Description

[0018] Figure 1 The diagram shown is a structural schematic of a wafer cleaning machine in the prior art.

[0019] Figure 2 The diagram shows a structural schematic of the wafer cleaning machine provided in Implementation 1.

[0020] Figure 3 Displayed as Figure 2 The diagram shows the structure of the gas-liquid separation device in the wafer cleaning machine.

[0021] Figure 4 The diagram shown is a structural schematic of the wafer cleaning machine provided in Example 2.

[0022] Figure 5 Displayed as Figure 4 The diagram shows the structure of the second gas-liquid separation device in the wafer cleaning machine.

[0023] Figure Labels

[0024] 1. Cleaning chamber; 11. Cleaning assembly; 2. Exhaust pipe; 21. Exhaust pipe inlet; 22. Exhaust pipe outlet; 3. Gas-liquid separator; 31. Outer shell; 311. Gas-liquid mixed flow inlet; 312. Gas outlet; 313. Liquid outlet; 32. Baffle; 321. First transverse baffle; 322. Second transverse baffle; 323. Third transverse baffle; 324. First longitudinal baffle; 325. Second longitudinal baffle; 33. Liquid storage tank; 4. Opening; 5. Wafer.

[0025] 6. Second gas-liquid separation device; 61. Outer shell; 611. Gas inlet; 612. Gas outlet; 62. Baffle; 63. Support. Detailed Implementation

[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0027] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Example 1

[0029] This embodiment provides a wafer cleaning machine, such as Figure 2 The diagram shown is a structural schematic of the wafer cleaning machine provided in this embodiment. Figure 2As can be seen, the wafer cleaning machine includes a cleaning chamber 1 and an exhaust pipe 2. The cleaning chamber 1 is located inside the wafer cleaning machine, and a cleaning assembly 11 and a cleaning exhaust port are provided inside the cleaning chamber 1; the exhaust pipe 2 extends from the cleaning exhaust port of the cleaning chamber 1, from inside the cleaning chamber 1 to the outside of the wafer cleaning machine. Figure 2 As can be seen, the exhaust pipe 2 includes an exhaust pipe inlet 21 and an exhaust pipe outlet 22. The exhaust pipe inlet 21 is located inside the cleaning chamber 1, and the exhaust pipe outlet 22 is located outside the wafer cleaning machine. The gas-liquid mixed gas flow flows along the exhaust pipe inlet 21 to the exhaust pipe outlet 22. The exhaust pipe 2 is detachably connected to a gas-liquid separation device 3.

[0030] Specifically, such as Figure 3 The image shown is an enlarged view of the gas-liquid separator 3. Figure 3 As can be seen, the gas-liquid separation device 3 includes a housing 31. The housing 31 includes a gas-liquid mixing gas inlet 311, a gas outlet 312, and a liquid outlet 313. The gas outlet 312 is located at the uppermost end of the housing 31, the liquid outlet 313 is located at the lowermost end of the housing 31, and the gas-liquid mixing gas inlet 311 is located on the housing 31 between the gas outlet 312 and the liquid outlet 313. Figure 2 As can be seen, the gas-liquid separation device 3 is located on the exhaust pipe 2 section outside the wafer cleaning machine, and the gas-liquid mixed airflow inlet 311 and the gas outlet 312 are arranged sequentially along the gas-liquid mixed airflow direction. Specifically, the gas-liquid mixed airflow inlet 311 is close to the exhaust pipe inlet 21 of the exhaust pipe 2, and the gas outlet 312 is close to the exhaust pipe outlet 022 of the exhaust pipe 02.

[0031] Generally, detachable connections include bolted connections, plug-in connections, snap-fit ​​connections, and other connection methods. Specifically, for example... Figure 2 In this embodiment, the gas-liquid separator 3 is connected to the exhaust pipe 2 via a plug-in connection. Generally, the shape of the outer casing 31 can be selected according to actual conditions; for example, the outer casing 31 can be a cylindrical casing or a square casing. Specifically, in this embodiment, the outer casing 31 is a square casing.

[0032] like Figure 3As shown, the gas-liquid separation device also includes a baffle 32 disposed inside the housing 31. The baffle 32 includes a transverse baffle and a longitudinal baffle. The transverse baffle is arranged along an axis perpendicular to the housing 31, and the longitudinal baffle is arranged parallel to the axis of the housing 31. One end of the transverse baffle is perpendicularly connected to one end of the longitudinal baffle, and a passage for airflow is formed between the transverse baffle, the longitudinal baffle, and the housing 31. The gas-liquid mixed gas flow enters the gas-liquid separation device 3 from the exhaust pipe inlet 21 through the gas-liquid mixed gas flow inlet 311. After colliding with the baffle 32 and the housing 31, the liquid in the gas-liquid mixed gas flow is condensed on the baffle 32 and the housing 31, and the remaining gas flows through the gas outlet 312 and exits through the exhaust pipe outlet 22.

[0033] like Figure 3 As shown, generally, the number of baffles 32 can be set according to the size of the gas-liquid separator 3 and the concentration of water vapor in the gas-liquid mixture. Generally, the baffles 32 include transverse baffles and longitudinal baffles. The more transverse and longitudinal baffles there are, the more obvious the gas-liquid separation effect, but the slower the airflow velocity. Conversely, the fewer transverse and longitudinal baffles there are, the faster the airflow velocity, but the poorer the gas-liquid separation effect. Specifically, as... Figure 3 As shown, the baffle 32 in the gas-liquid separation device 3 provided in this embodiment is provided with three transverse baffles and two longitudinal baffles: including a first transverse baffle 321, a second transverse baffle 322, a third transverse baffle 323, a first longitudinal baffle 324 and a second longitudinal baffle 325.

[0034] Specifically, the first transverse baffle 321 is disposed on the side of the outer casing 31 near the gas-liquid mixing inlet 311, and there is a gap between it and the side of the outer casing 31 away from the gas-liquid mixing inlet 311 to allow airflow; the first longitudinal baffle 324 is disposed perpendicular to the first transverse baffle 321, faces the gas-liquid mixing inlet 311, and there is a gap between the first longitudinal baffle 324 and the outer casing 31; the second transverse baffle 322 is disposed above the first transverse baffle 321, and the second transverse baffle 322 is disposed on the side of the outer casing 31 away from the gas-liquid mixing inlet 311. Furthermore, there is a gap between the second transverse baffle 322 and the side of the housing 31 with the gas-liquid mixed airflow inlet 311, allowing airflow to pass through; the third transverse baffle 323 is disposed above the second transverse baffle 322, and the third transverse baffle 323 is disposed on the side of the housing 31 with the gas-liquid mixed airflow inlet 311, with one side of the third transverse baffle 323 facing the gas outlet 312; the second longitudinal baffle 325 is disposed perpendicular to the third transverse baffle 323 and is fixedly connected to the side of the housing 31 with the airflow outlet 312, and a passage for airflow is formed between the longitudinal baffle, the transverse baffle and the housing.

[0035] Generally, the size of the baffles 32 can be consistent or inconsistent. The shape of the baffles 32 is set according to the shape of the outer shell 31 of the gas-liquid separator 3. The shape of the baffles 32 can be circular or square. Specifically, in this embodiment, the shape of the baffles 32 is square. Generally, at least a portion of the transverse baffles and longitudinal baffles face the exhaust pipe 2, and the area of ​​the transverse baffles and longitudinal baffles facing the exhaust pipe 2 is greater than or equal to the cross-sectional area of ​​the exhaust pipe 2. Specifically, in this example, the third transverse baffle 323 and the first longitudinal baffle 324 are baffles facing the exhaust pipe 2, and the area of ​​the third transverse baffle 323 and the first longitudinal baffle 324 facing the exhaust pipe 2 is greater than or equal to the cross-sectional area of ​​the exhaust pipe 2. Generally, the width L1 of the baffles 32 is less than or equal to the width L1′ of the outer shell 31. Specifically, in this embodiment, the width L1 of the baffles 32 is equal to the width L1′ of the outer shell 31 to achieve better fit of the baffles 32 to the outer shell 31. Generally, the length L2 of the transverse baffle is greater than the length L2′ of the outer shell 31. Specifically, the length L2 of the transverse baffle is greater than 1 / 2 of the length L2′ of the outer shell 31, and the length L2 of the transverse baffle is less than 4 / 5 of the length L2′ of the outer shell 31. Further, the length L2 of the transverse baffle is greater than 3 / 5 of the length L2′ of the outer shell 31, and the length L2 of the transverse baffle is less than 7 / 10 of the length L2′ of the outer shell 31. Specifically, in this embodiment, the length L2 of the transverse baffle ranges from 5cm to 20cm.

[0036] Generally, the position of the baffle 32 can be set according to the actual situation of the gas-liquid separator 3. Specifically, in this embodiment, the first transverse baffle 321, the second transverse baffle 322, and the third transverse baffle 323 are staggered in the axial direction of the outer shell 31. The leftmost end of the first transverse baffle 321 is located to the left of the rightmost end of the second transverse baffle 322, and the leftmost end of the third transverse baffle 323 is located to the left of the rightmost end of the second transverse baffle 322. The first transverse baffle 321 is located above the gas-liquid mixing gas inlet 311, and the cavity formed by the first transverse baffle 321 and the first longitudinal baffle 324 faces the gas-liquid mixing gas inlet 311. Generally, the height difference between the transverse baffles can be set according to the height of the gas-liquid separator 3. Generally, the total height of the gas-liquid separator 3 is between 30cm and 50cm. In this embodiment, the total height of the gas-liquid separator 3 is 40cm. The total height of the baffle 32 is greater than or equal to half the total height of the gas-liquid separator 3, and less than or equal to four-fifths of the total height of the gas-liquid separator 3. The height difference between the transverse baffles is between 5cm and 15cm. Specifically, in this embodiment, the height difference between the transverse baffles is 8cm. This staggered distribution increases the difficulty of the gas-liquid mixed airflow rising, resulting in a longer contact time between the gas-liquid mixed airflow and the baffle 32, thus increasing the time for water vapor to condense into water vapor on the baffle 32.

[0037] Generally, the material selection for baffle 32 should take into account factors such as the concentration, temperature, and pressure of water vapor in the gas-liquid mixture, as well as the presence of corrosive substances. For example, baffle 32 can be made of alloy materials such as quartz, stainless steel, titanium alloy, or nickel alloy.

[0038] Please continue reading. Figure 3 The gas-liquid separation device 3 provided in this embodiment also includes a liquid storage tank 33, which is located at the bottom of the outer shell 31, i.e., the lowest part of the gas-liquid separation device 3, and is used to store condensed liquid to prevent liquid backflow. A liquid outlet 313 is also provided at the bottom of the liquid storage tank 33. The collected liquid is temporarily stored in the liquid storage tank 33 and then flows out of the gas-liquid separation device through the liquid outlet 313. Generally, the material selection of the liquid storage tank 33 should consider factors such as whether the liquid is corrosive. The material of the liquid storage tank 33 can be stainless steel, plastic, or other corrosion-resistant materials.

[0039] Please continue reading. Figure 2 The wafer cleaning machine provided in this embodiment also includes an opening 4. The opening 4 is located at the bottom of the wafer cleaning machine and directly below the liquid outlet 313, and is used to guide the liquid discharged from the liquid outlet 313 so that it can smoothly leave the wafer cleaning machine. To facilitate subsequent processing of these liquids, a container specifically for receiving liquids can be placed directly below the opening 4.

[0040] The wafer cleaning machine provided in this embodiment places the wafer 5 inside the wafer cleaning machine and cleans the wafer 5 through the cleaning component 11. The cleaned gas-liquid mixture is discharged through the exhaust pipe 2. By adding a gas-liquid separator 3 in the exhaust pipe 2, the gas and liquid in the gas-liquid mixture can be effectively separated, reducing the liquid residue in the exhaust pipe. This not only significantly improves the cleanliness and quality of wafer cleaning and reduces maintenance costs caused by pipe blockage, but also extends the service life of the equipment and meets environmental protection requirements, demonstrating excellent technical effects and environmental performance.

[0041] Example 2

[0042] This embodiment also provides a wafer cleaning machine. For example... Figure 4 The diagram shown is a structural schematic of the wafer cleaning machine provided in this embodiment. The wafer cleaning machine includes a cleaning chamber 1, an exhaust pipe 2, a gas-liquid separation device 3, and a second gas-liquid separation device 6. The second gas-liquid separation device 6 is detachably connected to the exhaust pipe 2 outside the wafer cleaning machine, i.e., at the exhaust pipe outlet 22, and is used to further separate the gas coming out of the gas-liquid separation device 3, as well as the liquid in the gas that may be carried by the outside air entering the wafer cleaning machine through the exhaust pipe 2. The gas-liquid separation device 3 can be the gas-liquid separation device in Embodiment 1.

[0043] like Figure 4 The diagram shown is a schematic representation of the structure of the second gas-liquid separation device 6. Figure 5 As can be seen, the second gas-liquid separation device 6 includes a housing 61 and a baffle 62 located inside the housing 61. The housing 61 is provided with a gas inlet 611 and a gas outlet 612. The baffle 62 is fixedly installed on the housing 61 by a bracket 63. The baffle 62 is arranged perpendicular to the axial direction of the housing 61. One side of the baffle 62 faces the gas inlet 611, and there is a certain gap between the baffle 62 and the gas inlet 611. The other side of the baffle 62 faces the gas outlet 612, and there is a certain gap between the baffle 62 and the gas outlet 612. At least one of the four sides of the baffle 62 has a gap with the housing 61, forming an airflow passage from the gas inlet 611 to the gas outlet 612.

[0044] Generally, fixed installation methods include: pasting, welding, riveting, and other connection methods. Generally, the total height of the second gas-liquid separator 6 is between 10cm and 30cm. The baffle 62 can be circular or square; in this embodiment, the baffle 62 is square. Generally, the baffle 62 is positioned in the middle of the second gas-liquid separator 6, and the area of ​​the baffle 62 facing the exhaust pipe 2 is greater than or equal to the cross-sectional area of ​​the exhaust pipe 2.

[0045] The wafer cleaning machine provided in this embodiment places the wafer 5 inside the wafer cleaning machine and cleans the wafer 5 through the cleaning component 11. The cleaned gas-liquid mixture is discharged through the exhaust pipe 2. By adding a gas-liquid separator 3 in the exhaust pipe 2 and a second gas-liquid separator 6 at the exhaust pipe outlet 22, it is possible not only to effectively separate the gas and liquid in the gas-liquid mixture flowing out of the cleaning chamber, but also to effectively separate the gas and liquid entering the wafer cleaning machine from the air.

[0046] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer cleaning machine, characterized in that, include: A cleaning chamber is located inside the wafer cleaning machine, and the cleaning chamber includes cleaning components; An exhaust pipe includes an exhaust pipe inlet and an exhaust pipe outlet. The exhaust pipe inlet is connected to the cleaning chamber. The exhaust pipe extends from inside the cleaning chamber to the outside of the wafer cleaning machine. The exhaust pipe outlet is located outside the wafer cleaning machine. A gas-liquid separator is detachably connected to the exhaust pipe. The gas-liquid separator includes a housing and a baffle. The housing includes a gas-liquid mixed flow inlet, a gas outlet, and a liquid outlet. The baffle is disposed inside the housing and forms a passage between the baffle and the housing that allows airflow to pass through.

2. The wafer cleaning machine according to claim 1, characterized in that, The gas-liquid separation device is located in the exhaust pipe section inside the wafer cleaning machine and / or in the exhaust pipe section outside the wafer cleaning machine.

3. The wafer cleaning machine according to claim 2, characterized in that, The gas-liquid mixture flows from the exhaust pipe inlet to the exhaust pipe outlet, and the gas-liquid mixture inlet and the gas outlet are arranged sequentially along the flow direction of the gas-liquid mixture.

4. The wafer cleaning machine according to claim 1, characterized in that, The baffle includes a transverse baffle arranged along an axial direction perpendicular to the housing, and at least one side of the transverse baffle has a gap with the sidewall of the housing, forming a passage that allows airflow to flow from the gas-liquid mixture inlet to the gas outlet.

5. The wafer cleaning machine according to claim 4, characterized in that, At least a portion of the transverse baffle faces the exhaust pipe, and the area of ​​the area facing the exhaust pipe is greater than or equal to the cross-sectional area of ​​the exhaust pipe.

6. The wafer cleaning machine according to claim 4, characterized in that, The baffle also includes a longitudinal baffle, which is arranged parallel to the axial direction of the outer shell. One end of the longitudinal baffle is perpendicularly connected to one end of the transverse baffle, and the longitudinal baffle, the transverse baffle and the outer shell form a passage that allows airflow.

7. The wafer cleaning machine according to claim 6, characterized in that, The cavity formed by the transverse baffle and the longitudinal baffle faces the gas-liquid mixture airflow inlet, and the transverse baffle is disposed above the gas-liquid mixture airflow inlet, while the longitudinal baffle faces the exhaust pipe.

8. The wafer cleaning machine according to claim 7, characterized in that, At least a portion of the longitudinal baffle faces the exhaust pipe, and the area of ​​the area facing the exhaust pipe is greater than or equal to the cross-sectional area of ​​the exhaust pipe.

9. The wafer cleaning machine according to claim 1, characterized in that, The gas-liquid separation device further includes a liquid storage tank located at the bottom of the outer casing, and the liquid outlet is located at the bottom of the liquid storage tank.

10. The wafer cleaning machine according to claim 9, characterized in that, The wafer cleaning machine also includes an opening located at the bottom of the housing of the wafer cleaning machine and directly below the liquid outlet.

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