Cutting assembly and cutting device

Abstract

The utility model belongs to the technical field of wafer processing, and discloses a cutting assembly and a cutting device. The cutting assembly comprises a fixing piece, a mounting piece, a support, a first adjusting assembly, a main shaft, a blade and a second adjusting assembly, the fixing piece is used for connecting an external supporting piece, the mounting piece is slidably arranged on the fixing piece in the first direction, the support is connected to the mounting piece, the main shaft is mounted on the support through the first adjusting assembly, and the blade is mounted at the end of the main shaft and used for cutting a wafer. The first adjusting assembly is used for adjusting the parallelism between the blade and the wafer, and the second adjusting assembly is installed on the installation part and can adjust the perpendicularity between the blade and the wafer. According to the cutting assembly, the parallelism and perpendicularity of the blade and the wafer are independently adjusted, mutual influence in the adjusting process is avoided, then the position precision of the blade is ensured, the machining precision of the wafer is ensured, and the product quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially cut component and cutting device. BACKGROUND

[0002] 3D IC (3D stacked chip) process is the solution of breaking Moore's law, it will be stacked together with multiple chips, increase the number of transistors per unit area, on the basis of the key size of transistor does not change, realize the manufacture of high-end chip, design freedom is higher, development time is shorter, it is the most promising one of various packaging technologies.

[0003] 3D IC core lies in the wafer thinning to several microns thickness and keeping high flatness to realize the positioning of chip stacking and connection. With the number of stacked wafers more and more, if the wafer edge is not flat, it is easy to lead to the wafer not tight enough, and cracks or fragments are easy to produce in the subsequent wafer grinding thinning (Grinding) process, which seriously affects the quality and yield. In order to avoid the above situation, one of the wafers is trimmed before the two wafers are combined, that is, the edge of the wafer is cut to 0.5-2.5mm concave by special grinding wheel, forming a step groove.

[0004] In the wafer cutting, the blade must have good levelness and perpendicularity with the surface of the wafer, otherwise it will affect the cutting quality of the wafer, and even lead to the scrap of the material. In the prior art, the blade spindle is connected with the spindle mounting plate, the spindle mounting plate is connected with the height adjusting device, the height adjusting device is used for adjusting the height of the blade, and the adjusting bolt is arranged between the spindle and the spindle mounting plate, which is used for adjusting the levelness and perpendicularity of the blade spindle. However, this adjusting mode will affect the levelness and perpendicularity of the blade spindle, which not only leads to low adjusting efficiency, but also leads to large error.

[0005] Therefore, a cutting assembly and a cutting device are needed to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model discloses a cutting assembly and a cutting device, which can adjust the levelness and perpendicularity of the blade spindle respectively, the mutual influence of the levelness and perpendicularity is small during adjustment, thereby improving the position accuracy of the blade, improving the processing quality of the wafer, and ensuring the product quality.

[0007] To achieve this purpose, the utility model adopts the following technical scheme:

[0008] The cutting assembly comprises:

[0009] The fixing member is used for connecting the external support member.

[0010] a mounting member, the mounting member being slidably arranged on the fixing member along a first direction;

[0011] a support member, the support member being connected to the mounting member;

[0012] a main shaft, a first adjusting assembly connected between the main shaft and the support member, and a blade mounted on an end of the main shaft for cutting a wafer, the first adjusting assembly being capable of rotating the main shaft around the first direction, thereby adjusting parallelism between the blade and the wafer;

[0013] a second adjusting assembly mounted on the mounting member, the second adjusting assembly being capable of rotating the support member around a second direction, thereby adjusting perpendicularity between the blade and the wafer, wherein the second direction is perpendicular to the first direction.

[0014] As an optional technical solution, the support member comprises a connecting plate and a support body, the connecting plate and the support body are connected, the connecting plate is provided with a plurality of arc-shaped holes, the first adjusting assembly comprises a plurality of first adjusting bolts, the plurality of first adjusting bolts are slidably arranged in the plurality of arc-shaped holes one by one, the main shaft is provided with a plurality of first adjusting threaded holes, the plurality of first adjusting threaded holes and the plurality of arc-shaped holes are communicated one by one, and the plurality of first adjusting bolts are threadedly connected with the plurality of first adjusting threaded holes one by one after passing through the plurality of arc-shaped holes one by one, so as to connect the connecting plate to the main shaft.

[0015] As an optional technical solution, the bottom of the mounting member is provided with a supporting plate, the supporting plate is provided with a through slot, the support member further comprises a supporting table, the supporting table is connected to an end of the support body away from the connecting plate, the support body is arranged in the through slot, so that the bottom surface of the supporting table and the top surface of the supporting plate are abutted, the supporting plate is provided with at least two second adjusting threaded holes, the at least two second adjusting threaded holes are arranged in a third direction, the second adjusting assembly comprises at least two second adjusting bolts, the at least two second adjusting bolts are threadedly connected with the at least two second adjusting threaded holes one by one, and the second adjusting bolts abut against the supporting table after extending out of the second adjusting threaded holes.

[0016] As an optional technical solution, the cutting assembly further comprises a locking assembly, the locking assembly being used for locking the support member to the mounting member.

[0017] As an optional technical scheme, the mounting piece is provided with a locking hole, the locking assembly is a locking bolt, the support is provided with a locking threaded hole, and the locking bolt is threadedly connected with the locking threaded hole after penetrating through the locking hole, so that the support is locked to the mounting piece.

[0018] As an optional technical scheme, the cutting assembly further comprises a transmission mechanism, the transmission mechanism comprises a driving motor and a lead screw, the mounting piece is fixedly provided with a lead screw nut, the driving motor and the lead screw are in transmission connection, and the lead screw and the lead screw nut are in threaded connection.

[0019] As an optional technical scheme, the cutting assembly further comprises a sliding rail and a sliding block, one of the fixing piece and the mounting piece is provided with the sliding rail, and the other of the fixing piece and the mounting piece is provided with the sliding block, and the sliding rail and the sliding block are in sliding fit.

[0020] The utility model discloses still adopt following technical scheme:

[0021] The cutting device comprises a support platform, a support frame, a placement table and a detection table, and further comprises the cutting assembly, the support frame and the placement table are arranged on the support platform, the placement table is used for placing a wafer, the cutting assembly is slidably arranged on the support frame along a third direction and can be limited in the support frame, and the detection table is used for detecting the perpendicularity and parallelism of the blade.

[0022] As an optional technical scheme, the cutting device further comprises a guide rail and a sliding seat, the guide rail is fixedly arranged on the support platform, the sliding seat is slidably arranged on the guide rail, and the placement table is arranged on the sliding seat.

[0023] As an optional technical scheme, the cutting assembly is provided with two, and the two cutting assemblies are arranged on the two sides of the placement table.

[0024] The utility model discloses the beneficial effect:

[0025] The utility model discloses a cutting assembly, this cutting assembly includes fixed part, mounting piece, support, first adjusting assembly, main shaft, blade and second adjusting assembly, and fixed part is used for connecting external support, and mounting piece is along the first direction sliding and is established in fixed part, and support is connected in mounting piece, and main shaft is installed in support through first adjusting assembly, and blade is installed in the end of main shaft, is used for cutting wafer, and first adjusting assembly is used for adjusting the parallelism between blade and wafer, and second adjusting assembly is installed in mounting piece, and can adjust the perpendicularity between blade and wafer. This cutting assembly before carrying out wafer cutting, first through second adjusting assembly makes support rotate around second direction, and then adjusts the perpendicularity between blade and wafer, and then adjusts the parallelism of main shaft and wafer through first adjusting assembly, and then ensures the parallelism of blade and wafer, makes the parallelism and perpendicularity of blade carry out the adjustment alone, avoids the mutual influence in the adjustment process, and then ensures the position accuracy of blade, and then ensures the processing accuracy of wafer, and improves product quality.

[0026] The utility model discloses a cutting device, this cutting device includes support platform, support frame, placement platform and detection table, still includes the cutting assembly as described above, and support frame sets up in support platform, and cutting assembly is along the third direction sliding and is established in support frame, and can be limited in support frame, and detection table is used for detecting the perpendicularity and parallelism of blade relative to placement platform. This cutting device can carry out the adjustment alone to the parallelism and perpendicularity of blade, and then ensures the position accuracy of blade, and then improves the processing accuracy of wafer, and improves the quality of product. ACCURACY

[0027] Figure 1 It is the structure schematic diagram of cutting assembly of the utility model embodiment;

[0028] Figure 2 It is Figure 1 The partial close -up of A in

[0029] Figure 3 It is the structure schematic diagram of another visual angle of cutting assembly of the utility model embodiment;

[0030] Figure 4 It is Figure 3 The partial close -up of B in

[0031] Figure 5 It is the structure schematic diagram of cutting device of the utility model embodiment;

[0032] Figure 6 It is the structure schematic diagram of cutting device adjustment of the utility model embodiment.

[0033] In the drawing:

[0034] 1, cutting assembly; 2, support platform; 3, support frame; 4, placing table; 5, guide rail; 6, sliding seat; 7, detection table; 8, adjusting cylinder; 9, adjusting guide rail;

[0035] 10, fixing piece;

[0036] 20, mounting piece;

[0037] 30, support; 31, connecting plate; 311, arc-shaped hole; 32, support body; 33, supporting table;

[0038] 40, main shaft; 41, blade;

[0039] 50, first adjusting bolt;

[0040] 60, second adjusting bolt;

[0041] 70, locking bolt;

[0042] 81, driving motor; 82, screw rod;

[0043] 91, sliding rail; 92, sliding block. DETAILED DESCRIPTION

[0044] The utility model will be further explained in detail below in combination with the drawings and examples. It can be understood that the specific examples described here are only used to explain the utility model, and not to limit the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0045] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0046] In the utility model, unless another definite provision and limitation, first feature is in second feature "on" or "under" can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature is "on", "above" and "upper surface" of second feature includes that first feature is directly above and obliquely above second feature, or only indicates that horizontal height of first feature is higher than second feature. First feature is "under", "below" and "under surface" of second feature includes that first feature is directly below and obliquely below second feature, or only indicates that horizontal height of first feature is less than second feature.

[0047] In the description of the present embodiment, the terms "upper", "lower", "right", "left", "horizontal", "vertical", and "radial" are terms that refer to the orientation of the device as shown in the drawings and are used only to facilitate the description and are not intended to limit the scope of the present utility model. In addition, the terms "first" and "second" are used only to distinguish between two elements and do not have any special meaning.

[0048] As shown in Figures 1 to 4 The cutting assembly 1 provided in the present embodiment includes a fixing member 10, a mounting member 20, a bracket 30, a main shaft 40, a first adjusting assembly, a blade 41, a second adjusting assembly, and a detection table 7. The fixing member 10 is used to connect an external support. The mounting member 20 is slidably arranged on the fixing member 10 along a first direction. The bracket 30 is connected to the mounting member 20. The first adjusting assembly is connected between the main shaft 40 and the bracket 30. The blade 41 is installed at the end of the main shaft 40 and is used to cut a wafer. The first adjusting assembly can make the main shaft 40 rotate around the first direction, thereby adjusting the parallelism between the blade 41 and the wafer. The second adjusting assembly is installed on the mounting member 20. The second adjusting assembly can make the bracket 30 rotate around a second direction, thereby adjusting the perpendicularity between the blade and the wafer. The second direction is perpendicular to the first direction. The detection table 7 is used to detect the perpendicularity and the parallelism of the blade 41.

[0049] Specifically, in the embodiment, before the wafer is cut, the perpendicularity of the blade is detected by the detection gauge 7 first, if the perpendicularity does not meet the requirement, the second adjusting assembly is used to adjust the rotation of the support 30 around the second direction relative to the mounting 20, so that the perpendicularity of the blade 41 on the spindle 40 and the wafer plane meets the requirement, then the parallelism of the blade is detected by the detection gauge 7, if the parallelism does not meet the requirement, the first adjusting assembly is used to adjust the rotation of the spindle 40 around the first direction relative to the support 30, so that the parallelism of the blade 41 on the spindle 40 and the wafer plane meets the requirement, the cutting assembly 1 can adjust the perpendicularity and the parallelism of the blade 41 separately by setting the first adjusting assembly and the second adjusting assembly, so as to reduce the mutual influence in the adjustment process of the perpendicularity and the parallelism, and improve the position accuracy of the blade 41, so as to ensure the processing accuracy of the wafer and the quality of the product.

[0050] Specifically, in the embodiment, the first direction is the height direction (Z direction) of the cutting device, and the second direction is the width direction (Y direction) of the cutting device.

[0051] Specifically, in the embodiment, the detection gauge 7 is a micrometer, which can abut against the blade 41, and when the spindle 40 drives the blade 41 to rotate, the change of the value of the micrometer can be observed to determine whether the perpendicularity and the parallelism of the blade 41 meet the requirement, and the micrometer can be magnetically attracted to any position according to the actual use, and in the embodiment, the micrometer is attracted to the sample plate because the wafer placing table 4 is not magnetic.

[0052] Further, as shown in Figure 2 The support 30 includes a connecting plate 31 and a support body 32, the connecting plate 31 and the support body 32 are connected, the connecting plate 31 is provided with a plurality of arc-shaped holes 311, the first adjusting assembly includes a plurality of first adjusting bolts 50, the plurality of first adjusting bolts 50 are slidably arranged in the plurality of arc-shaped holes 311 one by one; the spindle 40 is provided with a plurality of first adjusting threaded holes, the plurality of first adjusting threaded holes and the plurality of arc-shaped holes 311 are communicated one by one, and the plurality of first adjusting bolts 50 are threadedly connected with the plurality of first adjusting threaded holes one by one after passing through the plurality of arc-shaped holes 311 one by one, so as to connect the connecting plate 31 to the spindle 40.

[0053] Specifically, in the embodiment, a square hole is formed in the middle of the connecting plate 31, the bracket body 32 is inserted into the square hole and connected to the connecting plate 31 by welding, and the plurality of first adjusting bolts 50 are threaded through the plurality of arc-shaped holes 311 and correspondingly threaded into the plurality of first adjusting threaded holes, so as to connect the connecting plate 31 to the main shaft 40 and ensure the stability of the connection between the bracket 30 and the main shaft 40. When adjusting the position of the bracket 30 and the main shaft 40, the plurality of first adjusting bolts 50 are loosened, so that the plurality of first adjusting bolts 50 slide along the plurality of arc-shaped holes 311 one by one, and the main shaft 40 can rotate in the first direction, thereby adjusting the parallelism of the blade 41 on the main shaft 40 and the wafer.

[0054] Specifically, the connecting plate 31 is square, the arc-shaped hole 311 is provided with four arc-shaped holes 311, and the four arc-shaped holes 311 are respectively located at the four corners of the connecting plate 31. This arrangement can ensure that the arrangement of the arc-shaped holes 311 is more balanced, avoid arranging the arc-shaped holes 311 at the weak position of the connecting plate 31, improve the connection stability of the main shaft 40 and the connecting plate 31, and improve the structural strength; the first adjusting assembly includes four first adjusting bolts 50, the main shaft 40 is provided with four first adjusting threaded holes, the four first adjusting threaded holes and the four arc-shaped holes 311 are in one-to-one correspondence, and the four first adjusting bolts 50 are threaded through one second arc-shaped hole 311 and correspondingly threaded into one second adjusting threaded hole, so as to connect the connecting plate 31 to the main shaft 40. This arrangement is convenient for adjustment, improves the adjustment efficiency, and is conducive to improving the stress balance of the main shaft 40.

[0055] Further, as shown in Figure 3 and Figure 4 , the bottom of the mounting member 20 is provided with a support plate, the support plate is provided with a through slot, the bracket 30 further includes a supporting table 33, the supporting table 33 is connected to one end of the bracket body 32 away from the connecting plate 31, the bracket body 32 is arranged in the through slot, so that the bottom surface of the supporting table 33 and the top surface of the support plate abut, the support plate is provided with at least two second adjusting threaded holes, the at least two second adjusting threaded holes are arranged in the third direction, the second adjusting assembly includes at least two second adjusting bolts 60, the at least two second adjusting bolts 60 are correspondingly threaded into the at least two second adjusting threaded holes, and the second adjusting bolt 60 abuts against the supporting table 33 after extending out of the second adjusting threaded hole. Specifically, in the embodiment, the second adjusting threaded hole is provided with two second adjusting threaded holes, the second adjusting assembly includes two second adjusting bolts 60, and the two second adjusting bolts 60 and the two second adjusting threaded holes are correspondingly threaded.

[0056] Further, the cutting assembly 1 further comprises a locking assembly, which is used for locking the support 30 to the mounting piece 20. Specifically, in the embodiment, the locking assembly is arranged to lock the support 30 and the mounting piece 20, so as to ensure the stability of the blade 41 during the cutting process.

[0057] Further, as shown in Figure 3 and Figure 4 , the mounting piece 20 is provided with locking holes, the locking assembly is a locking bolt 70, and the support 30 is provided with locking threaded holes, the locking bolt 70 is screwed with the locking threaded holes after passing through the locking holes, so as to lock the support 30 to the mounting piece 20. Specifically, in the embodiment, the mounting piece 20 is provided with six locking holes, which are arranged in two rows, and the three locking holes in each row are arranged at intervals, and the support 30 is also provided with six locking threaded holes, which are arranged one by one corresponding to the six locking holes, and the locking holes are slightly larger when processed, so that the locking bolt 70 can move in the locking hole, thereby facilitating the adjustment of the movement of the support 30 around the second direction, and thereby adjusting the perpendicularity of the blade 41 and the wafer.

[0058] Further, as shown in Figure 1 , the cutting assembly 1 further comprises a transmission mechanism, which comprises a driving motor 81 and a lead screw 82, and the mounting piece 20 is fixedly provided with a lead screw 82 nut, the driving motor 81 and the lead screw 82 are in transmission connection, and the lead screw 82 and the lead screw 82 nut are in threaded connection. Specifically, in the embodiment, the lead screw 82 extends along the first direction, the driving motor 81 drives the lead screw 82 to rotate, thereby causing the lead screw 82 nut to move along the axis direction of the lead screw 82, thereby adjusting the position of the mounting piece 20 along the first direction, so as to ensure that the blade 41 can contact the wafer, and complete the cutting work of the wafer.

[0059] Further, as shown in Figure 1 , the cutting assembly 1 further comprises a slide rail 91 and a sliding block 92, one of the fixing piece 10 and the mounting piece 20 is provided with the slide rail 91, and the other of the fixing piece 10 and the mounting piece 20 is provided with the sliding block 92, and the slide rail 91 and the sliding block 92 are in sliding cooperation. Specifically, in the embodiment, the arrangement of the slide rail 91 and the sliding block 92 can have a good guiding effect on the fixing piece 10 and the mounting piece 20, so as to ensure the stability of the mounting piece 20 during the movement, and at the same time, the position accuracy of the blade 41 can be ensured, so as to avoid shaking during the cutting process.

[0060] As shown in Figure 5 and Figure 6As shown, the embodiment provides a cutting device, which comprises a support platform 2, a support frame 3 and a placing table 4, and further comprises a cutting assembly 1, the support frame 3 and the placing table 4 are arranged on the support platform 2, the placing table 4 is used for placing a wafer, the cutting assembly 1 is arranged on the support frame 3 in a sliding manner along a third direction and can be limited in the support frame 3. Specifically, in the embodiment, a first direction is a height direction (Z direction) of the cutting device, a second direction is a width direction (Y direction) of the cutting device, and a third direction is a length direction (X direction) of the cutting device. The cutting assembly 1 is arranged on the support frame 3 in a sliding manner along the X direction and can be limited in the support frame 3, so that the cutting device can be applied to the processing of wafers with different diameters, and the versatility of the cutting device is improved. The support platform 2 can ensure the installation stability of the support frame 3 and the placing table 4, and the support frame 3 can limit the cutting assembly 1 to ensure the stability of the cutting assembly 1 during cutting, thereby ensuring the processing precision of the wafer.

[0061] Specifically, in the embodiment, the cutting device further comprises an adjusting cylinder 8, a cylinder body of the adjusting cylinder 8 is fixedly installed on the support frame 3, and a telescopic rod of the adjusting cylinder 8 is fixedly connected to a fixing piece 10 of the cutting assembly 1. The adjusting cylinder 8 can drive the cutting assembly 1 to move along the X direction through telescopic movement, thereby adjusting the cutting position of the blade 41.

[0062] Specifically, in the embodiment, the cutting device further comprises an adjusting guide rail 9, the fixing piece 10 of the cutting assembly 1 and the adjusting guide rail 9 are in sliding fit, thereby making the cutting assembly 1 have good directivity when moving, and improving the stability in use.

[0063] Further, referring to Figure 5 , the cutting device further comprises a guide rail 5 and a sliding seat 6, the guide rail 5 is fixedly arranged on the support platform 2, the sliding seat 6 is arranged on the guide rail 5 in a sliding manner, and the placing table 4 is arranged on the sliding seat 6. Specifically, in the embodiment, the guide rail 5 of the cutting device is fixedly arranged on the support platform 2, and the sliding seat 6 on which the placing table 4 is arranged is arranged on the guide rail 5 in a sliding manner. The position of the placing table 4 can be moved conveniently, thereby facilitating the placement of the wafer on the placing table 4, improving the convenience in use, and providing guidance for the movement of the placing table 4 to ensure the stability of the placing table 4.

[0064] Optionally, in the embodiment, the cutting device further comprises an adjusting motor, an adjusting lead screw and an adjusting lead screw nut. The adjusting motor is fixedly arranged on the support platform 2, the output shaft of the adjusting motor is fixedly connected to the adjusting lead screw, and the adjusting lead screw nut is fixedly installed on the sliding seat 6. When the adjusting motor is started, the adjusting lead screw is driven to rotate, thereby driving the sliding seat 6 to move along the axial direction of the adjusting lead screw, thereby improving the convenience of the movement of the placing table 4 and improving the placement efficiency of the wafer.

[0065] Further, the cutting assembly 1 is provided with two, two cutting assemblies 1 are provided on both sides of the placing table 4 respectively. Specifically, in the embodiment, two cutting assemblies 1 are symmetrically arranged on the support frame 3 about the placing table 4, and can slide along the X direction, thereby being capable of simultaneously cutting the wafer on the placing table 4, and improving the processing efficiency of the wafer.

[0066] The horizontal and vertical adjustment process of the cutter 41 of the cutting device is described in detail below. First, the dial gauge is adsorbed on the sample plate, and the dial head of the dial gauge is in contact with the upper edge or lower edge of the cutter 41 on the main shaft 40, then the driving motor 81 is driven to rotate, driving the cutter 41 to move up and down, and the reading of the dial gauge is observed. If the reading of the dial gauge is large, it indicates that the verticality of the cutter 41 and the placing table 4 is large, then the locking bolt 70 is loosened, and then the second adjusting bolt 60 is adjusted, so that the bracket 30 rotates around the second direction, thereby adjusting the verticality of the cutter 41 relative to the placing table 4. After adjustment, the locking bolt 70 is tightened; then the dial head of the dial gauge is in contact with the left edge or right edge of the cutter 41 on the main shaft 40, then the adjusting motor is driven to move the placing table 4 along the second direction, and the reading of the dial gauge is observed. If the reading is large, it indicates that the parallelism of the cutter 41 and the placing table 4 is large, at this time the first adjusting bolt 50 is loosened, so that the main shaft 40 rotates around the first direction relative to the bracket 30, and after adjustment the first adjusting bolt 50 is tightened, and the adjustment is completed.

[0067] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claims.

Claims

1. A cutting assembly characterized in that, The cutting assembly (1) comprises: a fixing member (10) for connecting an external support; a mounting member (20) slidingly arranged on the fixing member (10) along a first direction; a bracket (30) connected to the mounting member (20); a main shaft (40), a first adjusting assembly connected between the main shaft (40) and the bracket (30), and a blade (41) mounted on an end of the main shaft (40) for cutting a wafer, the first adjusting assembly being capable of rotating the main shaft (40) around the first direction, thereby adjusting parallelism between the blade (41) and the wafer; a second adjusting assembly mounted on the mounting member (20), the second adjusting assembly being capable of rotating the bracket (30) around a second direction, thereby adjusting perpendicularity between the blade (41) and the wafer, wherein the second direction is perpendicular to the first direction.

2. The cutting assembly of claim 1, wherein, The bracket (30) comprises a connecting plate (31) and a bracket body (32), the connecting plate (31) and the bracket body (32) being connected, the connecting plate (31) being provided with a plurality of arc-shaped holes (311), the first adjusting assembly comprising a plurality of first adjusting bolts (50), the plurality of first adjusting bolts (50) being slidingly arranged in the plurality of arc-shaped holes (311) one by one; the main shaft (40) being provided with a plurality of first adjusting threaded holes, the plurality of first adjusting threaded holes and the plurality of arc-shaped holes (311) being communicated one by one, the plurality of first adjusting bolts (50) being threadedly connected with the plurality of first adjusting threaded holes one by one after passing through the plurality of arc-shaped holes (311) one by one, so as to connect the connecting plate (31) to the main shaft (40).

3. The cutting assembly of claim 2, wherein, A support plate is arranged on a bottom of the mounting member (20), the support plate being provided with a through slot, the bracket (30) further comprising a supporting table (33), the supporting table (33) being connected to an end of the bracket body (32) away from the connecting plate (31), the bracket body (32) being arranged in the through slot, so that a bottom surface of the supporting table (33) and a top surface of the support plate are abutted, the support plate being provided with at least two second adjusting threaded holes, the at least two second adjusting threaded holes being arranged in a third direction, the second adjusting assembly comprising at least two second adjusting bolts (60), the at least two second adjusting bolts (60) being threadedly connected with the at least two second adjusting threaded holes one by one, and the second adjusting bolts (60) abutting against the supporting table (33) after extending out of the second adjusting threaded holes.

4. The cutting assembly of claim 3, wherein, The cutting assembly further comprises a locking assembly for locking the bracket (30) to the mounting member (20).

5. The cutting assembly of claim 4, wherein, The mounting piece (20) is provided with a locking hole, the locking assembly is a locking bolt (70), the bracket (30) is provided with a locking threaded hole, and the locking bolt (70) is threadedly connected with the locking threaded hole after penetrating through the locking hole, so as to lock the bracket (30) to the mounting piece (20).

6. The cutting assembly of any of claims 1-5, wherein, The cutting assembly further comprises a transmission mechanism, the transmission mechanism comprises a driving motor (81) and a lead screw (82), the mounting piece (20) is fixedly provided with a lead screw nut, the driving motor (81) and the lead screw (82) are in transmission connection, and the lead screw (82) and the lead screw nut are in threaded connection.

7. The cutting assembly of claim 6, wherein, The cutting assembly further comprises a sliding rail (91) and a sliding block (92), one of the fixing piece (10) and the mounting piece (20) is provided with the sliding rail (91), and the other of the fixing piece (10) and the mounting piece (20) is provided with the sliding block (92); the sliding rail (91) and the sliding block (92) are in sliding fit.

8. Cutting device, characterized in that The cutting device comprises a support platform (2), a support frame (3), a placement table (4) and a detection table (7), further comprises the cutting assembly (1) as claimed in any one of claims 1-7, the support frame (3) and the placement table (4) are arranged on the support platform (2), the placement table (4) is used for placing a wafer, the cutting assembly (1) is arranged on the support frame (3) in a sliding manner along a third direction and can be limited in the support frame (3), and the detection table (7) is used for detecting perpendicularity and parallelism of the blade (41); wherein the first direction, the second direction and the third direction are perpendicular to each other.

9. The cutting device of claim 8, wherein, The cutting device further comprises a guide rail (5) and a sliding seat (6), the guide rail (5) is fixedly arranged on the support platform (2), and the sliding seat (6) is arranged on the guide rail (5) in a sliding manner, and the placement table (4) is arranged on the sliding seat (6).

10. The cutting device of claim 9, wherein, The cutting assembly (1) is provided with two, and the two cutting assemblies (1) are arranged on two sides of the placement table (4) respectively. The mounting piece (20) is provided with a locking hole, the locking assembly is a locking bolt (70), the bracket (30) is provided with a locking threaded hole, and the locking bolt (70) is threadedly connected with the locking threaded hole after penetrating through the locking hole, so as to lock the bracket (30) to the mounting piece (20). The cutting assembly further comprises a transmission mechanism, the transmission mechanism comprises a driving motor (81) and a lead screw (82), the mounting piece (20) is fixedly provided with a lead screw nut, the driving motor (81) and the lead screw (82) are in transmission connection, and the lead screw (82) and the lead screw nut are in threaded connection. The cutting assembly further comprises a sliding rail (91) and a sliding block (92), one of the fixing piece (10) and the mounting piece (20) is provided with the sliding rail (91), and the other of the fixing piece (10) and the mounting piece (20) is provided with the sliding block (92); the sliding rail (91) and the sliding block (92) are in sliding fit.

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