Solid-state source control system and solid-state source system
By integrating control chips, digital-to-analog converters, and communication chipsets on a printed circuit board, the problems of low integration and scalability of solid-state source control modules are solved, achieving higher integration and reliability while reducing costs.
Patent Information
- Application Number
- CN202520125340.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2035-01-17
AI Technical Summary
Existing solid-state source control modules have low integration and scalability, leading to increased repetitive work, higher costs, and reduced reliability.
The control chip, digital-to-analog converter, and communication chipset are integrated on a printed circuit board. Control is achieved by connecting the control chip with the extended function module, avoiding repeated debugging of the original function module.
It improves the integration and scalability of solid-state source control systems, reduces costs, and enhances reliability.
Smart Images
Figure CN223637918U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to solid state source technical field especially relates to a solid state source control system and solid state source system. BACKGROUND
[0002] Solid state source is a kind of device using solid-state active device to generate microwave signal.It is different from vacuum device, with small size, low power consumption, long life and other advantages. With the development of solid state source technology, solid state source equipment is more and more used in radar, communication and medical industry.
[0003] Solid state source control module is an essential unit module in solid state source equipment, plays a vital role in it. At present, the existing solid state source control module usually uses multiple high-cost control chips and corresponding peripheral circuits to control the corresponding function module of solid state source respectively, however, when the solid state source increases new function module, control chip and peripheral circuit need to be repeatedly designed and laid out, increase repeated debugging circuit and function, cause repetitive work to increase, cost increases, reliability reduces, the integration and expandability of the existing solid state source control module are low. UTILITY MODEL CONTENT
[0004] The utility model aims at overcoming the insufficient integration and expandability of the existing solid state source control module in the prior art, and provides a solid state source control system and solid state source system.
[0005] The technical scheme of the utility model provides a solid state source control system, including printed circuit board, be equipped with the control chip for controlling solid state source, the digital-analog converter for detecting the voltage of solid state source and the communication chip group with host computer communication connection on the printed circuit board, be equipped with multiple peripheral interface on the control chip, the control chip is connected with communication chip group and digital-analog converter respectively.
[0006] In one of the optional technical solutions, the communication chip group includes RS485 serial communication chip, and the control chip is connected with the solid state source through the RS485 serial communication chip.
[0007] In one of the optional technical solutions, the communication chip group further includes an Ethernet chip, and the control chip is connected with the solid state source through the Ethernet chip.
[0008] In one of the optional technical solutions, the communication chip group further includes a CAN bus communication chip, and the control chip is connected with the solid state source through the CAN bus communication chip.
[0009] In one of the optional technical solutions, the printed circuit board is further provided with a temperature sensor for detecting the temperature of the solid-state source, and the temperature sensor is in communication connection with the control chip.
[0010] In one of the optional technical solutions, the printed circuit board is further provided with a flow rate sensor for detecting the flow rate of the cooling liquid of the solid-state source, and the flow rate sensor is in communication connection with the control chip.
[0011] In one of the optional technical solutions, the printed circuit board is further provided with an alarm in communication connection with the control chip.
[0012] In one of the optional technical solutions, the printed circuit board is further provided with a voltage control unit for controlling the on-off of the power supply of the solid-state source, and the voltage control unit is connected with the control chip.
[0013] In one of the optional technical solutions, the printed circuit board is provided with a stamp hole, and the control chip is connected with the solid-state source through the stamp hole.
[0014] The technical scheme of the utility model further provides a solid-state source system, including solid-state source and the solid-state source control system as mentioned above, the control chip of the solid-state source control system is in communication connection with the solid-state source.
[0015] After the above technical scheme is used, the following beneficial effects are obtained: by integrating the control chip, the digital-analog converter and the communication chip group on the printed circuit board, the integration degree is improved, when the solid-state source needs to expand the function module, only needs to connect the expansion function module with the printed circuit board, controls through the control chip, the digital-analog converter and the communication chip group, does not need to repeatedly debug the original function module, reduces the cost, improves the scalability and reliability. BRIEF DESCRIPTION OF DRAWINGS
[0016] The disclosure of the utility model will become more easily understood with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes, and are not intended to limit the scope of protection of the utility model. In the drawings:
[0017] Figure 1 It is a structural schematic view of a solid-state source control system provided by an embodiment of the utility model;
[0018] Figure 2 It is a circuit structure schematic view of a control chip shown in the figure; Figure 1
[0019] Figure 3 It is a circuit structure schematic view of a digital-analog converter shown in the figure; Figure 1
[0020] Figure 4 It is a circuit structure schematic view of a communication chip group shown in the figure;Figure 1 Circuit structure diagram of RS485 serial communication chip of communication chip set shown in the figure;
[0021] Figure 5 For Figure 1 Circuit structure diagram of Ethernet chip of communication chip set shown in the figure;
[0022] Figure 6 For Figure 1 Circuit structure diagram of CAN bus communication chip of communication chip set shown in the figure;
[0023] Figure 7 For Figure 1 Circuit structure diagram of temperature sensor shown in the figure;
[0024] Figure 8 For Figure 1 Circuit structure diagram of flow rate sensor shown in the figure;
[0025] Figure 9 For Figure 1 Circuit structure diagram of voltage control unit shown in the figure. DETAILED DESCRIPTION
[0026] The specific embodiments of the present application will be further described below with reference to the accompanying drawings.
[0027] It is easy to understand that according to the technical scheme of the present application, a person skilled in the art can replace various structural modes and implementation modes without changing the essential spirit of the present application. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical scheme of the present application, and should not be regarded as the whole or as a limitation or restriction of the technical scheme of the present application.
[0028] In this specification, the orientation terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or possibly mentioned are defined with respect to the structure shown in the drawings, which are relative concepts, so they may change accordingly according to their different positions, different use states. Therefore, these or other orientation terms should not be interpreted as restrictive terms.
[0029] As Figures 1-8 The solid-state source control system provided by the embodiment of the present application comprises a printed circuit board 10, a control chip 11 for controlling the solid-state source, a digital-to-analog converter 12 for detecting the voltage of the solid-state source, and a communication chip set 13 for communicating with the solid-state source. The control chip 11 is provided with a plurality of peripheral interfaces, and the control chip 11 is connected with the communication chip set 11 and the digital-to-analog converter 12 respectively.
[0030] The solid-state source control system provided by the utility model is mainly used for controlling the output power of the solid-state source, such as 15kw.
[0031] The solid-state source control system provided by the embodiment mainly comprises a control chip 11, a digital-analog converter 12 and a communication chip set 13, the control chip 11, the digital-analog converter 12 and the communication chip set 13 are arranged on the front surface of the printed circuit board 10, and the control chip 11 controls the power output of the solid-state source according to the signal collection and communication of the digital-analog converter 12 and the communication chip set 13.
[0032] As shown in the figure, Figure 2 The control chip 11 comprises a control interface MCU_PE1-MCU_PE10 connected with the control interface of the solid-state source, a digital-analog interface ADC1_RF_DETECTDR1 and ADC1_RF_DETECTDR2 connected with the digital-analog converter 12, a communication interface connected with the communication chip set 13, a power interface MCU_3V3 connected with the external power supply, a standby interface MCU_PG1-MCU_PG10, light emitting diodes D1, D2, D3 and other functional interfaces, etc., and the light emitting diodes D1, D2, D3 are used for judging whether the control chip 11 is normally powered.
[0033] The digital-analog converter 12 is used for collecting the voltage of the solid-state source, transmitting the voltage of the solid-state source and the standard voltage to the control chip 11, and judging whether the voltage of the solid-state source is normal. Figure 3 As shown in the figure, The digital-analog converter 12 comprises a voltage detection interface DAC Parameter Set connected with the solid-state source, a standard voltage interface DAC_5V used for providing a standard voltage range, and a signal transmission interface Pha_SYNC and Pha_LDAC connected with the digital-analog interface ADC1_RF_DETECTDR1 and ADC1_RF_DETECTDR2 of the control chip 11.
[0034] Figures 4-6 The communication chip set 13 is used for communication connection between the control chip 11 and the solid-state source, and is used for transmitting control signals and parameters.
[0035] The control principle of the control chip 11, the digital-analog converter 12 and the communication chip set 13 can adopt the prior art, which is not the improvement point of the utility model and will not be described here.
[0036] The material of the printed circuit board 10 is glass reinforced epoxy resin laminated composite material, which further reduces the cost.
[0037] The control chip 11 is an STM32 single-chip micro system control chip, which can provide rich peripherals and interfaces, and further reduces the cost.
[0038] The utility model discloses, through with the control chip, digital analog converter and communication chip group integration in printed circuit board, improve the integration, when solid state source needs to expand function module only needs to connect with printed circuit board, through control chip, digital analog converter and communication chip group control, do not need to repeat the debugging to the original function module, reduce the cost, improve the scalability and reliability.
[0039] In one embodiment, as shown in Figure 4 The communication chip set 13 includes an RS485 serial communication chip 131, and the control chip 11 is connected with the solid state source through the RS485 serial communication chip 131.
[0040] The RS485 serial communication chip 131 is used for communication connection between the control chip 11 and the solid state source, the control chip 11 transmits data to the RS485 serial communication chip 131, and the RS485 serial communication chip 131 transmits data to the host computer. Figure 4 As shown in
[0041] The RS485 serial communication chip 131 can be set according to user requirements, for example, four RS485 serial communication chips 131 can be set to form four RS485 serial communication channels.
[0042] In one embodiment, as shown in Figure 5 The communication chip set 13 further includes an Ethernet chip 132, and the control chip 11 is connected with the solid state source through the Ethernet chip 132.
[0043] The Ethernet chip 132 is used for communication connection between the control chip 11 and the solid state source, the control chip 11 transmits data to the Ethernet chip 132, and the Ethernet chip 132 transmits data to the host computer. Figure 5 As shown in
[0044] In one embodiment, as shown in Figure 6As shown, the communication chipset 13 further comprises a CAN bus communication chip 133, through which the control chip 11 is connected with the solid-state source.
[0045] The CAN bus communication chip 133 is used for communication connection between the control chip 11 and the solid-state source, and the control chip 11 transmits data to the CAN bus communication chip 133, and the CAN bus communication chip 133 transmits data to the host computer. As shown in Figure 6 The CAN bus communication chip 133 comprises a fifth communication interface CAN_TX, CAN_RX connected with the control chip 11, a sixth communication interface CAN_P, CAN_N connected with the host computer, and the like.
[0046] In one embodiment, as shown in Figure 1 and Figure 7 The printed circuit board 10 further comprises a temperature sensor 14 for detecting the temperature of the solid-state source, and the temperature sensor 14 is in communication connection with the control chip 11.
[0047] The temperature sensor 14 is used for detecting the temperature of the solid-state source and transmitting the temperature of the solid-state source to the control chip 11 to determine whether the temperature of the solid-state source is normal. As shown in Figure 2 and Figure 7 The temperature sensor 14 comprises a temperature detection interface TEM1_VC, TEM1_DA connected with the solid-state source, a temperature output interface Tem1_Data connected with the control chip 11, and the like.
[0048] The number of the temperature sensor 14 can be set according to user requirements, and when the number of the temperature sensor 14 is multiple, the multiple temperature sensors 14 are used for detecting the temperature of the corresponding position of the solid-state source.
[0049] In one embodiment, as shown in Figure 1 and Figure 8 The printed circuit board 10 further comprises a flow rate sensor 15 for detecting the flow rate of the cooling liquid of the solid-state source, and the flow rate sensor 15 is in communication connection with the control chip 11.
[0050] The flow rate sensor 15 is used for detecting the flow rate of the cooling liquid of the solid-state source and transmitting the flow rate of the cooling liquid to the control chip 11 to determine whether the flow rate of the cooling liquid of the solid-state source is normal. As shown in Figure 2 and Figure 8 The flow rate sensor 15 comprises a flow rate detection interface FLOW1_VC, FLOW_DA connected with the solid-state source, a flow rate output interface TIM2_Flow1 connected with the control chip 11, and the like.
[0051] The number of the flow rate sensors 15 can be set according to user requirements, and when the number of the flow rate sensors 15 is multiple, the multiple flow rate sensors 15 are used to detect the flow rate of the cooling liquid at the corresponding position of the solid state source.
[0052] In one of the embodiments, as shown in Figure 1 The printed circuit board 10 is further provided with an alarm 16 in communication connection with the control chip 11.
[0053] The alarm 16 is used to issue an alarm prompt, such as a beeping sound, when the solid state source temperature and / or the flow rate of the cooling liquid of the solid state source is abnormal, so as to timely remind the user.
[0054] In one of the embodiments, as shown in Figure 1 and Figure 9 The printed circuit board 10 is further provided with a voltage control unit 17 for controlling the on-off of the power supply of the solid state source, and the voltage control unit 17 is connected with the control chip 11.
[0055] The voltage control unit 17 is used to control the on-off of the power supply of the solid state source according to the control signal of the control chip 11. As shown in Figure 9 The voltage control unit 17 includes a voltage control interface Vctrl_ULA1, Vctrl_ULA2 connected with the control chip 11, a power supply control interface Vctrl_1A, Vctrl_1B, Vctrl_2A, Vctrl_2B connected with the power supply of the solid state source, and a case big lamp P2 for displaying whether the power supply of the voltage control unit 17 is normal, etc.
[0056] In one of the embodiments, the printed circuit board 10 is provided with a stamp hole, and the control chip 11 is connected with the solid state source through the stamp hole.
[0057] The upper and lower ends of the printed circuit board 10 are connected with the signal through the stamp hole, so as to facilitate integration.
[0058] The technical scheme of the utility model further provides a solid state source system, which comprises a solid state source and the solid state source control system as described above, and the solid state source is in communication connection with the control chip of the solid state source control system.
[0059] The above only describes the principle and the preferred embodiment of the utility model. It should be noted that, for those skilled in the art, on the basis of the principle of the utility model, a plurality of other variants can also be made, which should also be regarded as the protection scope of the utility model.
Claims
1. A solid-state source control system, characterized by, The printed circuit board is provided with a control chip for controlling a solid-state source, a digital-to-analog converter for detecting voltage of the solid-state source, and a communication chip set in communication connection with a host computer.
2. The solid-state source control system of claim 1, wherein, The communication chip set comprises an RS485 serial communication chip, and the control chip is connected with the solid-state source through the RS485 serial communication chip.
3. The solid-state source control system of claim 1, wherein, The communication chip set further comprises an Ethernet chip, and the control chip is connected with the solid-state source through the Ethernet chip.
4. The solid-state source control system of claim 1, wherein, The communication chip set further comprises a CAN bus communication chip, and the control chip is connected with the solid-state source through the CAN bus communication chip.
5. The solid-state source control system of claim 1, wherein, The printed circuit board is further provided with a temperature sensor for detecting temperature of the solid-state source, which is in communication connection with the control chip.
6. The solid state source control system of claim 5, wherein, The printed circuit board is further provided with a flow rate sensor for detecting flow rate of cooling liquid of the solid-state source, which is in communication connection with the control chip.
7. The solid state source control system of claim 6, wherein, The printed circuit board is further provided with an alarm in communication connection with the control chip.
8. The solid state source control system of any of claims 1-7, wherein, The printed circuit board is further provided with a voltage control unit for controlling on-off of power supply of the solid-state source, which is connected with the control chip.
9. The solid-state source control system of claim 1, wherein, The printed circuit board is provided with a stamp hole, and the control chip is connected with the solid-state source through the stamp hole.
10. A solid state source system characterized by, The solid-state source control system according to any one of claims 1-9 is in communication connection with a control chip of the solid-state source control system.