Square wafer code scanning positioning machine and multi-station wafer dispensing equipment

Abstract

The utility model relates to the technical field of square wafer processing equipment, in particular to a code scanning positioning machine of a square wafer and multi-station wafer dispensing equipment, and the multi-station wafer dispensing equipment comprises the code scanning positioning machine of the square wafer, a dispensing mechanism and a feeding and discharging mechanism. The loading and unloading mechanism is used for conveying the dispensed wafer into the code scanning positioning machine and the dispensing mechanism of the square wafer so as to carry out code scanning and dispensing on the wafer; the code scanning positioning machine for the square wafer comprises a bearing table which is provided with a bearing plate matched with the square wafer in shape and used for placing the square wafer to be subjected to code scanning; and the code scanning module is arranged on the bearing table and located on one side of the bearing plate, and the code scanning module is used for identifying an identifier on the square wafer to obtain information of the square wafer. The utility model discloses a code scanning positioning machine for a square wafer. The square wafer is placed on the material bearing plate matched with the square wafer in shape, and the code scanning module can recognize the two-dimensional code on the square wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of square wafer processing equipment, and particularly relates to a square wafer code scanning positioning machine and a multi-station wafer dispensing equipment. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer needs to be processed according to the processing process requirement in the production and processing process. The wafer surface is usually marked with an identification code. When a wafer is carried by a mechanical arm in an existing wafer loading machine, a code reader needs to be used to read the identification code on the wafer surface.

[0003] Most of the existing wafer code scanning mechanisms are suitable for code scanning positioning of a circular wafer. The code scanning positioning of the circular wafer usually relies on setting a notch on the circular wafer, and the circular wafer is positioned by recognizing the notch. However, in some special fields, a square wafer also needs to be used. At present, there is a lack of a code scanning positioning scheme for the square wafer in a wafer processing system. CONTENT OF THE UTILITY MODEL

[0004] The present application aims to solve one of the problems in the background art.

[0005] Therefore, the present application provides a square wafer code scanning positioning machine and a multi-station wafer dispensing equipment for realizing code scanning and identification of a square wafer.

[0006] According to the present application, the square wafer code scanning positioning machine comprises the following components.

[0007] A bearing table is provided with a bearing plate matched with the shape of the square wafer, and is used for placing the square wafer to be scanned.

[0008] A code scanning module is arranged on the bearing table and located at one side of the bearing plate. The code scanning module is used for identifying the identification on the square wafer to obtain the information of the square wafer.

[0009] The present application has the following beneficial effects: The square wafer is placed on the bearing plate matched with the shape of the square wafer. Since the wafer is square, the relative position of the two-dimensional code on the square wafer and the code scanning module is approximately opposite when the mechanical hand places the wafer on the bearing plate. Therefore, the code scanning module can identify the two-dimensional code on the square wafer.

[0010] According to one embodiment of the present application, the code scanning module comprises a mounting column, a sliding seat and a code scanning gun. The mounting column is connected to the bearing table. The code scanning gun is slidingly arranged on the sliding seat in the horizontal direction. The sliding seat is slidingly connected to the mounting column in the vertical direction.

[0011] According to one embodiment of the utility model, the bearing area is provided with a rotary positioning module, the rotary positioning module is used for jacking up the square wafer and controlling the rotation of the square wafer to correct the orientation of the square wafer and facilitate directional scanning code of the square wafer.

[0012] According to one embodiment of the utility model, the rotary positioning module comprises:

[0013] A support ring is used for adsorbing the square wafer.

[0014] A second jacking mechanism is used for controlling the support ring to move along the vertical direction and can protrude from the material receiving plate.

[0015] A rotating mechanism drives the support ring to rotate around the vertical direction and synchronously drives the square wafer to rotate when the support ring moves along the vertical direction and can protrude from the material receiving plate.

[0016] According to one embodiment of the utility model, the first jacking mechanism comprises:

[0017] The second jacking mechanism comprises:

[0018] A third screw rod transmission assembly comprises a third transmission gear and a third screw rod, and the third transmission gear is connected with the third screw rod.

[0019] A second driving unit drives the third transmission gear to rotate to drive the third screw rod to rotate.

[0020] A third synchronous block is threadedly connected with the third screw rod, a third support member is connected to the third synchronous block, and the third synchronous block vertically moves along with the rotation of the third screw rod.

[0021] According to one embodiment of the utility model, the second jacking mechanism comprises:

[0022] The rotating mechanism is arranged on the third synchronous block, and the rotating mechanism comprises:

[0023] A driving module is used for providing driving force.

[0024] A transmission module is transmissionally connected with the driving module via a transmission belt, and the transmission module is connected with the support ring at the same time, so that the support ring can be driven to rotate via the transmission module.

[0025] According to one embodiment of the utility model, the rotating mechanism is arranged on the third synchronous block, the bottom ring is fixedly connected on the third synchronous block, the supporting ring is rotatably connected with the bottom ring, the air cavity is formed between the supporting ring and the bottom ring, the vacuum pump is connected on the bottom ring, the air hole communicated with the air cavity is arranged in the supporting ring.

[0026] According to one embodiment of the utility model, the heating platform is arranged on the bearing table, and the heating platform is used for heating the square wafer.

[0027] According to one embodiment of the utility model, the temporary parking frame is arranged above the bearing table, a plurality of support columns for supporting the square wafer are arranged on the temporary parking frame, and the support columns are supported at the edge position and the center position of the square wafer.

[0028] According to one embodiment of the utility model, the temporary parking frame is arranged above the bearing table, a plurality of support columns for supporting the square wafer are arranged on the temporary parking frame, and the support columns are supported at the edge position and the center position of the square wafer.

[0029] The square wafer scanning and positioning machine as described above;

[0030] The dispensing mechanism is used for dispensing the wafer;

[0031] The feeding and discharging mechanism is used for sequentially conveying the square wafer into the square wafer scanning and positioning machine and the dispensing mechanism.

[0032] Other features and advantages of the utility model will be set forth in the following description, and some of them will become apparent from the description, or will be understood from the practice of the utility model. The purposes and other advantages of the utility model are realized and obtained from the structures specifically pointed out in the description, claims and drawings.

[0033] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically described, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0034] The utility model is further described below in combination with the drawings and embodiments.

[0035] Figure 1 It is the structure schematic view of square wafer scanning and positioning machine in the utility model.

[0036] Figure 2 It is the structure schematic view of scanning code mechanism position in the utility model.

[0037] Figure 3 It is the schematic view of position relation between temporary parking frame and bearing plate in the utility model.

[0038] Figure 4 This is a schematic diagram of the temporary parking rack in this utility model.

[0039] Figure 5 This is a schematic diagram of the heating platform in this utility model.

[0040] Figure 6 This is a structural schematic diagram of the rotary positioning module in this utility model.

[0041] Figure 7 This is a schematic diagram of the first lifting mechanism in this utility model.

[0042] Figure 8 This is a schematic diagram of the second lifting mechanism in this utility model.

[0043] Figure 9 This is a structural schematic diagram showing the positional relationship between the support ring and the toothed ring in this utility model.

[0044] Figure 10 It is used to embody Figure 9 Enlarged view of part A of the central support ring structure.

[0045] Figure 11 This is a schematic diagram of the structure of the multi-station wafer dispensing equipment in this utility model.

[0046] In the diagram: 10. Square wafer scanning and positioning machine; 1. Support platform; 11. Material support plate; 12. Frame; 13. Feed port; 14. Operation port; 2. Temporary stop frame; 21. Support column; 3. Scanning module; 4. Rotary positioning module; 41. First lifting mechanism; 411. First support component; 412. First transmission gear; 413. First lead screw; 414. First synchronization block; 415. Second support component; 416. Second transmission gear; 417. Second lead screw transmission component; 418. Second synchronization block; 419. First drive unit; 42. Second lifting mechanism; 421. Second drive unit; 422. Third lead screw transmission assembly; 423. 424. Third transmission gear; 425. Third lead screw; 426. Third synchronizing block; 427. Third support component; 43. Rotating mechanism; 431. Drive module; 432. Transmission module; 433. First rotary transmission gear; 434. Second rotary transmission gear; 435. Third rotary transmission gear; 436. Gear ring; 437. Guide structure; 438. Transmission shaft; 44. Transmission belt; 45. Guide post; 46. Support ring; 461. Air hole; 462. Air chamber; 47. Bottom ring; 48. Plug seal ring; 49. Connecting ring; 5. Heating platform; 6. Anti-warping module; 7. Loading and unloading mechanism; 8. Dispensing mechanism; 9. Glue line detection mechanism. Detailed Implementation

[0047] The utility model will be described further in detail in combination with the drawings. These drawings are all simplified schematic diagrams, and only schematically show the basic structure of the utility model, so they only show the structure related to the utility model.

[0048] In the description of the utility model, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model. In addition, the features limited by "first" and "second" can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0049] In the description of the utility model, it needs to be understood that the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0050] A square wafer code scanning positioning machine 10, including bearing table 1, temporary stop frame 2, code scanning module 3 and rotary positioning module 4, bearing table 1 is provided with frame body 12, frame body 12 is provided with feed inlet 13 and operation port 14, feed inlet 13 and operation port 14 are oppositely arranged, code scanning module 3 is arranged on bearing table 1, bearing table 1 is provided with a bearing area, and bearing plate 11 for bearing square wafer is arranged in the bearing area, rotary positioning module 4 is arranged in the bearing area, for receiving square wafer and rotating square wafer so that the position to be identified on square wafer is opposite to code scanning module 3, code scanning module 3 is arranged on one side of rotary positioning module 4, and is arranged on the side close to feed inlet 13, temporary stop frame 2 is arranged directly above the bearing area.

[0051] Temporary stop frame 2 is provided with a plurality of supporting columns 21, which are supported at the edge position of the square wafer and the center position of the square wafer. The frame body 12 is further connected with a detector, which is used to detect whether the square wafer is placed on the temporary stop frame 2, so as to avoid the stacking of square wafers on the temporary stop frame 2.

[0052] The rotating positioning module 4 comprises a first lifting mechanism 41, a second lifting mechanism 42 and a rotating mechanism 43, the first lifting mechanism 41 and the second lifting mechanism 42 are both movable in the vertical direction, wherein the first lifting mechanism 41 can support the peripheral region of the square wafer, and the second lifting mechanism 42 can support the middle region of the square wafer, so that stable support for the square wafer is realized through the cooperation of the first lifting mechanism 41 and the second lifting mechanism 42. In addition, the rotating mechanism 43 is in transmission connection with the second lifting mechanism 42, and the second lifting mechanism 42 can be driven to rotate by the rotating mechanism 43, and since the second lifting mechanism 42 can support the square wafer from the middle, when the rotating mechanism 43 drives the second lifting mechanism 42 to rotate, the second lifting mechanism 42 can drive the square wafer to rotate synchronously, so as to adjust the orientation of the square wafer.

[0053] The first lifting mechanism 41 comprises a first driving unit 419, a first support 411, a first screw rod 413 transmission assembly and a first synchronization block 414. The first driving unit 419 is used for outputting driving force externally, and the first support 411 is arranged along the periphery of the square wafer for supporting the peripheral region of the square wafer. The first screw rod 413 transmission assembly is in cooperation with the first driving unit 419 and the first support 411 at the same time, and the first driving unit 419 outputs driving force to the first screw rod 413 transmission assembly, and the first screw rod 413 transmission assembly drives the first support 411 to move in the vertical direction at the same time, so as to realize the supporting effect of the first support 411 on the peripheral region of the square wafer.

[0054] Specifically, the first screw rod 413 transmission assembly comprises a first transmission gear 412 and a first screw rod 413, the first transmission gear 412 is coaxially connected with the first screw rod 413, and the first transmission gear 412 is connected with the output end of the first driving unit 419 at the same time, so that when the first driving unit 419 outputs driving force externally, the output end of the first driving unit 419 rotates, the first transmission gears 412 in the plurality of first screw rod 413 transmission assemblies are synchronously and synchronously rotated through the transmission of the transmission belt 44, so that the first transmission gear 412 can drive the first screw rod 413 to rotate at the same time.

[0055] The plurality of first screw rods 413 all penetrate the first synchronization block 414, and a nut block is arranged between the first synchronization block 414 and the first screw rod 413, the nut block is connected with the first synchronization block 414, and the first nut block is in threaded cooperation with the first screw rod 413. The plurality of first supports 411 are connected on the first synchronization block 414, and in addition, since the first support 411 is arranged along the periphery of the square wafer, the first synchronization block 414 moves along the vertical direction with the first support 411 as the plurality of first screw rods 413 rotate towards the same direction.

[0056] The first synchronous block 414 is also arranged in a ring structure, and the size of the first synchronous block 414 is at least equal to the size of the square wafer to be processed. Preferably, the size of the first synchronous block 414 is greater than the size of the square wafer, so that the plurality of first support members 411 arranged on the first synchronous block 414 can effectively support the peripheral area of the square wafer after being lifted.

[0057] In addition, since the size of the first synchronous block 414 is large, in order to stably synchronize the movement of each first support member 411, a plurality of guide columns 45 are arranged on the first synchronous block 414. The guide columns 45 are connected to the frame, and the plurality of guide columns 45 are arranged on the side edges of the first synchronous block 414, so as to ensure that each area of the first synchronous block 414 does not deviate during movement.

[0058] The first lifting mechanism 41 further comprises a second support member 415, a second screw transmission assembly, and a second synchronous block 418. The second support member 415 is arranged at the center of the square wafer, so as to support the center of the square wafer. The second screw transmission assembly comprises a second transmission gear 416 and a second screw. The second transmission gear 416 is connected to the second screw, and the second transmission gear 416 is drivingly connected to the output end of the first driving unit 419 via a transmission belt 44, so as to drive the second screw to rotate. The second screw penetrates through the second synchronous block 418, and the second screw and the second synchronous block 418 are also connected via a nut block. Meanwhile, one end of the second support member 415 is fixedly installed on the second synchronous block 418, and a guide column 45 for realizing vertical direction guiding is arranged on the second synchronous block 418. Further, when the second transmission gear 416 drives the second screw to rotate, the second screw synchronously drives the second synchronous block 418 to move. The second synchronous block 418 drives the second support member 415 to synchronously displace while moving, and the movement path of the second synchronous block 418 is guided by the guide column 45, so as to ensure that the second synchronous block 418 can stably move in the vertical direction to realize the supporting action on the center of the square wafer.

[0059] The second lifting mechanism 42 comprises a support ring 46, a second driving unit 421, and a third screw transmission assembly 422. The second driving unit 421 can output driving force. The third screw transmission assembly 422 comprises a third transmission gear 423 and a third screw 424. The third transmission gear 423 is drivingly connected to the output end of the second driving unit 421 via a transmission belt 44. The third screw 424 is connected to the third transmission gear 423. When the third transmission gear 423 is driven to rotate by the second driving unit 421, the third transmission gear 423 synchronously drives the third screw 424 to rotate.

[0060] The third screw rod 424 penetrates through the third synchronization block 425 and is connected with the third synchronization block 425 through a nut block connected with the third synchronization block 425 and threadedly matched with the third screw rod 424 to drive the third synchronization block 425 to move vertically when the third screw rod 424 rotates. The third synchronization block 425 is arranged in the space enclosed by the first synchronization block 414, and the third synchronization block 425 is also formed in a ring structure. In addition, in order to reduce the mass of the third synchronization block 425, a plurality of through holes are formed in the third synchronization block 425 to reduce the overall mass of the third synchronization block 425 and reduce the pressure of the third synchronization block 425 on the third screw rod 424. The third synchronization block 425 and the third support 426 are connected through a fixed connecting rod to realize the connected movement between the third synchronization block 425 and the third support 426, and the plurality of third supports 426 drive the support ring 46 to move in the vertical direction.

[0061] More specifically, a plurality of mounting portions are extended from the periphery of the third synchronization block 425, and a guide column 45 is arranged on each mounting portion in the vertical direction to guide the movement stroke of the third synchronization block 425 in the vertical direction, and the plurality of guide columns 45 are symmetrically arranged about the center of the third synchronization block 425 to further ensure stable guidance for each region of the third synchronization block 425 and avoid deviation of the third synchronization block 425 as a whole during movement.

[0062] The rotating mechanism 43 includes a driving module 431 for providing driving force and a transmission module 432 in transmission connection with the driving module 431 through a transmission belt 44 and connected with the second jacking mechanism 42, so that the jacking mechanism can be driven to rotate through the transmission module 432. The driving module 431, the first driving unit 419 and the second driving unit 421 can all be driven by a driving motor.

[0063] Specifically, the transmission module 432 includes a first rotating transmission gear 433, a second rotating transmission gear 434, a third rotating transmission gear 435 and a gear ring 436. The second rotating transmission gear 434 is coaxially connected with the third rotating transmission gear 435, the first rotating transmission gear 433 is coaxially connected with the output end of the driving module 431, the second rotating transmission gear 434 is connected with the first rotating transmission gear 433 through the transmission belt 44 to enable the second rotating transmission gear 434 to rotate synchronously with the first rotating transmission gear 433, and the third rotating transmission gear 435 is connected with the support ring 46 through the transmission module 432 to enable the support ring 46 to rotate synchronously with the third rotating transmission gear 435 when the third rotating transmission gear 435 rotates.

[0064] More specifically, the transmission module 432 further comprises a gear ring 436 rotationally connected to the third synchronizing block 425, and the gear ring 436 is in transmission connection with the third rotary transmission gear 435 via the transmission belt 44, so as to drive the gear ring 436 to rotate synchronously when the third rotary transmission gear 435 rotates.

[0065] It should be noted that the transmission module 432 and the driving module 431 are both connected to the third synchronizing block 425, so that the rotating mechanism 43 can move up and down along the vertical direction with the third synchronizing block 425 and the support ring 46. The third synchronizing block 425 is fixedly connected with a bottom ring 47 through a third support 426, the inner circle of the bottom ring 47 is provided with a limiting groove, the support ring 46 is embedded in the limiting groove on the bottom ring 47, the support ring 46 and the inner side wall of the limiting groove are sealed by a packing seal ring 48, the support ring 46 is rotationally connected with the bottom ring 47, and an annular air cavity 462 is formed between the support ring 46, the inner side wall of the limiting groove and the packing seal ring 48. The support ring 46 is fixedly connected with the gear ring 436 through a connecting ring 49. The wall thickness of the support ring 46 is provided with an air hole 461 arranged along the axial direction of the support ring 46, the air hole 461 is in communication with the air cavity 462, and a vacuum pump is connected to the outer side wall of the bottom ring 47. When the vacuum pump is started, the square wafer is firmly adsorbed on the support ring 46 through the air hole 461.

[0066] When the second lifting mechanism 42 is started, the third synchronizing block 425 and the third support 426 control the support ring 46 to move up and down. After the support ring 46 is lifted, the vacuum pump is started to firmly adsorb the square wafer on the support ring 46. Then, the rotating mechanism 43 is started to drive the gear ring 436 to rotate through the transmission module 432, so as to drive the support ring 46 to rotate and adjust the position of the square wafer.

[0067] In addition, when the gear ring 436 receives the transmission belt 44 led out by the third rotary transmission gear 435, because the distance between the third rotary transmission gear 435 and the gear ring 436 is far, the meshing area between the gear ring 436 and the transmission belt 44 is reduced when the transmission belt 44 led out by the third rotary transmission gear 435 flows through the gear ring 436, and in severe cases, it may affect the stability of the transmission process between the gear ring 436 and the third rotary transmission gear 435. Therefore, in order to increase the meshing area between the transmission belt 44 and the gear ring 436 and ensure the stability of the transmission process, it is necessary to control the inclination angle of the transmission belt 44 between the third rotary transmission gear 435 and the gear ring 436, so that the meshing area between the gear ring 436 and the transmission belt 44 is larger.

[0068] For the control of the inclination angle of the transmission belt 44, a guide structure 437 is arranged in the leading direction of the third rotating transmission gear 435 and the leading direction between the gear ring 436 and the third rotating transmission gear 435, the guide structure 437 can guide the transmission belt 44 flowing between the third rotating transmission gear 435 and the gear ring 436, so as to adjust the cutting-in position and direction of the transmission belt 44 between the gear ring 436 and the third rotating transmission gear 435, thereby improving the meshing area of the transmission belt 44 on the gear ring 436 and ensuring the stability of the gear ring 436 when driving the second lifting mechanism 42 to rotate.

[0069] The square wafer code scanning positioning machine 10 in the application further comprises a heating platform 5 and an anti-warping module 6, the heating platform 5 can preheat the square wafer supported by the square wafer rotating lifting assembly, the heating platform 5 is arranged in a plurality of annular structures which are nested and spaced apart, in the embodiment, two heating platforms 5 are arranged, the heating platform 5 located at the periphery is a material receiving plate 11, the material receiving plate 11 is arranged in an outer square and inner circle structure, the heating platform 5 located at the inner circle is arranged in a circular structure, and the support ring 46 is arranged between the two heating platforms 5, and a through hole is formed in the heating platform 5, the through hole is arranged corresponding to the first lifting mechanism 41 to accommodate the first lifting mechanism 41 to move in the vertical direction.

[0070] The plurality of anti-warping modules 6 are arranged around the heating platform 5 located at the outer side, each anti-warping module 6 can work independently, through the cooperation of the anti-warping module 6 and the heating platform 5, the square wafer in the warped state can be flattened, so as to ensure the overall flatness of the square wafer. When the pressure head of the anti-warping module 6 contacts the square wafer, the contact between the two is point contact, and the pressure head can adjust the orientation of the square wafer according to the flatness of the surface of the square wafer, so as to realize flexible adjustment of the flattening of the square wafer, and avoid the occurrence of adverse conditions such as damage to the square wafer caused by forcibly flattening the square wafer.

[0071] The utility model discloses a kind of multi-station wafer dispensing equipment, including the square wafer code scanning positioning machine 10 of any one embodiment described above, dispensing mechanism 8, glue line detection mechanism 9 and feeding mechanism 7, feeding mechanism 7 is close to the feeding port 13 side in the square wafer code scanning positioning machine 10 and is arranged. Among them, dispensing mechanism 8 is used to carry out dispensing operation to wafer, feeding mechanism 7 can transport square wafer to the square wafer code scanning positioning machine 10 and carry out code scanning, and square wafer is heated and corrected, then square wafer is transported to dispensing mechanism 8 and carries out dispensing, then the square wafer after dispensing is transported to glue line detection mechanism 9 and carries out glue line detection or additional glue height detection.

[0072] The implementation principle of the application is:

[0073] In the dispensing operation process, the robot clamps the square wafer through the feeding port 13 to place the square wafer above the supporting plate 11. First, the square wafer is supported by the first lifting mechanism 41 of the square wafer rotating lifting module, and then the second lifting mechanism 42 is lifted to lift the square wafer, so that the square wafer is separated from the first lifting mechanism 41 by a certain distance. Then the rotating mechanism 43 drives the second lifting mechanism 42 to rotate, so that the second lifting mechanism 42 can drive the square wafer to rotate synchronously to adjust the orientation of the square wafer, so that the code scanning module 3 scans the square wafer to obtain the position information and identity information of the square wafer. In the process of obtaining the position information of the square wafer, if the code scanning module 3 fails to obtain the complete two-dimensional code on the square wafer, the rotating positioning module 4 is controlled to adjust the position of the square wafer until the code scanning module 3 obtains the complete two-dimensional code, thereby realizing the scanning of the square wafer.

[0074] When the operation speed of the robot does not match the operation speed of the code scanning and positioning, or the feeding and discharging mechanism fails, and there are extra square wafers on the robot, the robot can place the square wafers on the temporary stop rack 2. The supporting column 21 supports the edge and center position of the square wafer, so that the robot is emptied, the square wafer in the supporting area which has completed the code scanning and positioning operation is taken out, and the square wafer in the temporary stop area is taken out and placed in the supporting area for code scanning and other operations.

[0075] In this process, the robot does not need to be shut down, and manual intervention is not required for error correction and treatment, which greatly improves the overall efficiency of the dispensing operation process.

[0076] It should be noted that the square wafer code scanning and positioning machine 10 also combines the square wafer preheating function. When the square wafer in the supporting area is rotated to the required orientation, the first lifting mechanism 41 gradually retracts, at this time the distance between the square wafer and the heating platform 5 is reduced, and the temperature of the square wafer received by the heating platform 5 gradually increases. Until the temperature of the square wafer reaches the set preheating temperature, the square wafer will be completely placed on the surface of the heating platform 5 for direct heating until the square wafer reaches the required set temperature. The anti-warping module 6 can press against the edge of the square wafer to prevent the edge of the square wafer from warping during the heating process.

[0077] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0078] The above-described ideal embodiments according to the present application are for inspiration, and through the above description, relevant personnel can certainly make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content in the specification, and the technical scope must be determined by the scope of claims.

Claims

1. A square wafer code scanning positioning machine, characterized in that, The utility model relates to a square wafer scanning device, including, A bearing platform (1) is provided with a material bearing plate (11) matched with the shape of square wafer on the bearing platform (1), which is used for placing the square wafer to be scanned, and a rotating positioning module (4) is arranged on the bearing platform (1), which is used for lifting the square wafer and controlling the rotation of the square wafer to correct the orientation of the square wafer and facilitate the directional scanning of the square wafer; A scanning module (3) is arranged on the bearing platform (1) and located on one side of the material bearing plate (11), which is used for identifying the mark on the square wafer to obtain the information of the square wafer; The rotating positioning module (4) comprises: A support ring (46) is used for adsorbing the square wafer; A second lifting mechanism (42) is used for controlling the support ring (46) to move along the vertical direction and can protrude from the material bearing plate (11); A rotating mechanism (43) drives the support ring (46) to rotate around the vertical direction when the support ring (46) moves along the vertical direction and can protrude from the material bearing plate (11), and synchronously drives the square wafer to rotate.

2. The square wafer scanning and positioning machine of claim 1, wherein, The scanning module (3) comprises a mounting column, a sliding seat and a scanning gun, the mounting column is connected to the bearing platform (1), the scanning gun is slidably arranged on the sliding seat along the horizontal direction, and the sliding seat is slidably connected to the mounting column along the vertical direction.

3. The square wafer scanning and positioning machine of claim 1, wherein, The second lifting mechanism (42) comprises: A third screw transmission assembly (422) comprises a third transmission gear (423) and a third screw rod (424), the third transmission gear (423) is connected with the third screw rod (424); A second driving unit (421) drives the third transmission gear (423) to rotate to drive the third screw rod (424) to rotate; A third synchronous block (425) is threadedly connected with the third screw rod (424), the third synchronous block (425) is connected with a third support (426), and the third synchronous block (425) vertically moves with the third synchronous block (425) and the third support (426) driven by the rotation of the third screw rod (424).

4. The square wafer scanning and positioning machine of claim 3, wherein, The rotating mechanism (43) is arranged on the third synchronous block (425), and the rotating mechanism (43) comprises: A driving module (431) is used for providing driving force; A transmission module (432) is in transmission connection with the driving module (431) through a transmission belt (44), and the transmission module (432) is connected with the support ring (46) at the same time, so that the support ring (46) can be driven to rotate through the transmission module (432).

5. The square wafer scanning and positioning machine of claim 4, wherein, The third synchronization block (425) is fixedly connected with a bottom ring (47), the support ring (46) is rotatably connected with the bottom ring (47), an air cavity (462) is formed between the support ring (46) and the bottom ring (47), a vacuum pump is connected to the bottom ring (47), and the support ring (46) is provided with an air hole (461) in communication with the air cavity (462) to adsorb the square wafer.

6. The square wafer scanning and positioning machine of claim 1, wherein, Further comprising a heating platform (5) arranged on the bearing table (1), the heating platform (5) is used for heating the square wafer.

7. The square wafer scanning and positioning machine of claim 1, wherein, Further comprising a temporary parking frame (2) arranged above the bearing table (1), the temporary parking frame (2) is provided with a plurality of support columns (21) for supporting the square wafer, and the support columns (21) are supported at the edge position and the center position of the square wafer.

8. A multi-station wafer dispensing equipment, characterized in that, Comprise: The square wafer scanning code positioning machine according to any one of claims 1-7; A dispensing mechanism (8) for dispensing the wafer; A feeding and discharging mechanism (7) for sequentially conveying the square wafer into the square wafer scanning code positioning machine (10) and the dispensing mechanism (8).

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