Wafer stage device

Abstract

According to the wafer carrying table device provided by the utility model, the structure of the wafer carrying table device is adjusted, so that the wafer carrying table device can adapt to wafers with different thicknesses, and the adaptability of the wafer carrying table device is improved. The wafer carrying table device comprises a carrying table body, the carrying table body is provided with a containing groove used for containing a wafer, and the containing groove is formed in the mode that the surface of the carrying table body is concaved downwards in the axial direction; the bearing platform further comprises a pressing ring opposite to the bearing platform body in the axial direction, the pressing ring can be inserted into the containing groove and indirectly abuts against the groove bottom of the containing groove, the pressing ring is provided with a horizontally-extending pressing connection face and a vertically-extending side wall, the side wall is a straight face wall, and the side wall is in clearance fit with the groove side wall of the containing groove in the radial direction. Therefore, interference between the side wall of the pressing ring and the top wall of the containing groove is avoided, and the adaptation degree of the wafer carrying table device to wafers with different thicknesses is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing device technical field, specifically, relate to a wafer stage device. BACKGROUND

[0002] With the rapid development of science and technology, ion beam etching (IBE) and ion beam deposition (IBD) technology in optical fiber, computer, communication, nanotechnology, new material and integrated optics and many other high-tech fields show its irreplaceable important role. These technologies not only can realize high-precision material removal and material deposition, but also can meet the high quality requirements such as stable film optical property, no scattering and absorption, strong mechanical property and stable chemical property, thereby become the key technology platform in modern high-tech manufacturing.

[0003] However, the traditional ion beam stage design has obvious limitations, especially the thickness of the clamping sample is single. In actual application, when replacing different thickness of sample each time, the existing stage device needs to be removed and replaced with the stage matching the thickness of the new sample. These operations not only take a long time, but also greatly reduce the processing efficiency, which seriously hinders the application potential of ion beam etching and deposition technology in efficient processing. SUMMARY

[0004] The utility model aims at providing a wafer stage device, through adjusting the structure of wafer stage device, wafer stage device can adapt to different thickness of wafer, improve the adaptability of wafer stage device.

[0005] In order to achieve the above object, the utility model provides a wafer stage device, wafer stage device includes the stage body, the stage body has the accommodating groove for accommodating wafer, the accommodating groove is recessed in the axial direction by the surface of the stage body to form, still include the compression ring opposite in the axial direction with the stage body, the compression ring can be inserted into the accommodating groove and indirectly abuts with the groove bottom of the accommodating groove, the compression ring has the compression surface of horizontal extension and the vertical extension side wall, the side wall is straight face wall, the side wall is in the radial direction with the gap fit of the groove side wall of the accommodating groove. By setting the compression ring can be inserted into the accommodating groove, by the compression ring can be inserted into the accommodating groove, the compression ring is inserted into the groove bottom of the accommodating groove in the axial direction, so even if the thickness of wafer changes, different thickness of wafer can be pressed to the groove bottom of the accommodating groove by the compression ring, thereby improving the adaptability of wafer stage device to different thickness of wafer.

[0006] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0007] By arranging the transmission rods and inserting the transmission rods into the carrier body, the transmission rods are guided by the carrier body while ensuring that the compression ring is axially pressed against the groove bottom of the accommodating groove.

[0008] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0009] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0010] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0011] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0012] Optionally, the wafer carrier device further comprises a driving assembly for driving the compression ring to move; the driving assembly comprises a driving part and a plurality of transmission rods extending in the axial direction, the driving part is used to drive the transmission rods to move in the axial direction; one end of the transmission rod is located at one side of the carrier body and is directly or indirectly fixedly connected to the outside of the compression ring, and the other end of the transmission rod is located at the other side of the carrier body and is directly or indirectly fixedly connected to the output end of the driving part.

[0013] Optionally, a surface of the mounting plate facing the carrier body is axially concave to form a slot, and an outer wall of the compression ring forms an inner wall of the slot; in the disengaged position, the circular platform is located outside the slot; in the compressed position, the circular platform can be inserted into the slot, and a platform surface of the circular platform forms a gap with a bottom of the slot in the axial direction. Thus, the size of the carrier device in the height direction can be further reduced.

[0014] Optionally, the slot further has an outer wall outside the inner wall, and the transmission rod is fixedly connected to a portion of the mounting plate outside the outer wall; the axial size of the outer wall is greater than the axial size of the inner wall. In this way, the portion fixedly connected to the transmission rod is thicker, which is beneficial to improve the structural strength of the carrier device.

[0015] Optionally, the outer wall is gradually inclined away from the inner wall in the axial direction from the bottom of the slot toward the carrier body. Thus, interference with the circular platform can be avoided.

[0016] Other features of the present specification and its advantages will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present specification and, together with the description, serve to explain the principles of the present specification.

[0018] Figure 1 is a structural schematic view of a wafer carrier device in an embodiment of the present utility model;

[0019] Figure 2 is Figure 1 a top view of

[0020] Figure 3 is Figure 1 a partial structural sectional view of

[0021] Reference Signs:

[0022] 100-carrier body; 101-base body; 102-circular platform; 102-1-receiving groove; 102-1a-first region; 102-1b-second region; 201-compression ring; 211-slot; 211a-inner wall; 211b-outer wall; 202-mounting plate; 300-driving assembly; 301-driving part; 302-transmission rod; 303-linkage plate; 305-jacking rod; 305-1-fixed end; 305-2-jacking end. DETAILED DESCRIPTION

[0023] The utility model provides a wafer loading platform device, through the structure of wafer loading platform device is adjusted, so that wafer loading platform device can adapt to the wafer of different thickness, improved the adaptability of wafer loading platform device.

[0024] In order to make the personnel in the technical field better understand the utility model scheme, the utility model is further explained in detail below in combination with the drawings and specific embodiments.

[0025] The relational terms such as "first" and "second" are merely used to distinguish one from another of a same name, and do not necessarily require or imply there is any such actual relationship or order between the parts.

[0026] Please refer to Figures 1 to 3 , Figure 1 is the structure diagram of wafer loading platform device in the utility model embodiment; Figure 2 is Figure 1 the top view of Figure 3 the partial structure section view of Figure 1 .

[0027] As shown in the figure, wafer loading platform device includes loading platform body 100, and loading platform body 100 has base body 101 and round table 102 arranged at base body 101, and round table 102 can be fixedly connected with base body 101, or round table 102 can rotate relative to base body 101.The surface of round table 102 opposite to base body 101 is provided with accommodating groove 102-1, and accommodating groove 102-1 is used to accommodate wafer.Accommodating groove 102-1 is formed by the surface of round table 102 being concave downward along the axial direction.

[0028] Wafer loading platform device further includes compression ring 201 opposite to loading platform body 100 in the axial direction, and the middle part of compression ring 201 is a cavity.Compression ring 201 can move up and down along the axial direction to switch between compression position and release position, and in release position, compression ring 201 moves up to the outside of accommodating groove 102-1, and in compression position, compression ring 201 moves down to the inside of accommodating groove 102-1 and indirectly abuts against the groove bottom of accommodating groove 102-1.Specifically, compression ring 201 has horizontally extending compression surface, and the compression surface is used to vertically fit and abut against the wafer to be compressed.Compression ring 201 also has vertically extending side wall, and the side wall is straight face wall, thereby avoiding that when the side wall is designed as inclined face wall, the side wall interferes with loading platform body 100 when compressing wafers of different thicknesses.At the same time, in order to avoid that the side wall interferes with the groove side wall of accommodating groove 102-1 in the radial direction, the side wall and the groove side wall are gap fitted.

[0029] The axial projection of the pressing ring 201 on the bottom of the accommodating groove 102-1 forms a projection range, which corresponds to a first area 102-1a of the bottom of the accommodating groove 102-1, and a second area 102-1b inside the first area 102-1a. The second area 102-1b allows the wafer to be exposed to the outside, and the wafer in the first area 102-1a is covered by the pressing ring 201 and tightly pressed by the pressing ring 201.

[0030] By setting the pressing ring 201 to be inserted into the accommodating groove 102-1, the pressing ring 201 is inserted into the bottom of the accommodating groove 102-1 in the axial direction, so that even if the thickness of the wafer changes, the wafer of different thickness can be pressed to the bottom of the accommodating groove 102-1 by the pressing ring 201, thereby improving the adaptability of the wafer carrier device to wafers of different thickness.

[0031] In some embodiments, the wafer carrier device further comprises a driving assembly 300 for driving the pressing ring 201 to move.

[0032] The driving assembly 300 comprises a driving part 301 and a plurality of transmission rods 302 extending in the axial direction, the transmission rods 302 extending in the axial direction, and the driving part 301 driving the transmission rods 302 to move in the axial direction. One end of the transmission rod 302 is located on one side of the carrier body 100 and is directly or indirectly fixedly connected to the outer side of the pressing ring 201.

[0033] In one embodiment, the outer side of the pressing ring 201 is further fixedly connected with an annular mounting plate 202, and the transmission rod 302 is fixedly connected with the mounting plate 202. The pressing ring 201 and the mounting plate 202 are an integral structure. The transmission rod 302 and the mounting plate 202 are fixedly connected by clamping, screwing or other ways. Of course, the transmission rod 302 can also be directly fixedly connected with the pressing ring 201. Those skilled in the art can choose by themselves. The other end of the transmission rod 302 is located on the other side of the carrier body 100 and is directly or indirectly fixed with the output end of the driving part 301. By means of the mounting plate 202, the transmission rod 302 can be fixed to the outer side of the pressing ring 201, so that the force directly applied to the pressing ring 201 can be avoided, and the uniformity of the pressure applied by the pressing ring 201 to the wafer can be ensured.

[0034] By setting the transmission rod 302 and inserting the transmission rod 302 into the carrier body 100, the transmission rod 302 is guided and matched with the carrier body 100, and at the same time, the pressing ring 201 is axially pressed to the bottom of the accommodating groove 102-1.

[0035] In the above embodiments, the number of transmission rods 302 can be one or several. The carrier device comprises at least two transmission rods 302, which are evenly arranged around the compression ring 201. The transmission rods 302 are cooperated with each other to ensure the accuracy of the compression of the wafer and the compression ring 201 in the radial direction.

[0036] In the example shown in the figure, three transmission rods 302 are further included, which are arranged at the three corners of a triangle.

[0037] In some other embodiments, the carrier device further comprises a linkage plate 303, which is arranged parallel to the carrier body 100 and located on the side of the carrier body 100 opposite to the compression ring 201. In the axial direction, the compression ring 201 is on the upper side of the carrier body 100, and the linkage plate 303 is on the lower side of the carrier body 100. That is, in the axial direction, the carrier device is located between the compression ring 201 and the linkage plate 303.

[0038] The output end of the driving part 301 is connected to the linkage plate 303 to drive the linkage plate 303 to move axially, and the transmission rods 302 are fixedly connected to the linkage plate 303. By arranging the linkage plate 303, the synchronous movement of the plurality of transmission rods 302 can be achieved.

[0039] In the example shown in the figure, the driving part 301 comprises a cylinder and a piston rod, the piston rod can move relative to the cylinder, one of the cylinder and the piston rod in the present application is the fixed end 305-1, and the other is the output end. The driving part 301 is arranged between the linkage plate 303 and the carrier body 100, the cylinder is fixedly connected to one of the linkage plate 303 and the carrier body 100, and the piston rod is fixedly connected to the other one. By arranging the driving part 301 in the area between the linkage plate 303 and the carrier body 100, the space in the height direction of the carrier device can be saved.

[0040] In the above embodiments, the carrier device further comprises a plurality of jacking rods 305 axially penetrating the carrier body 100, the jacking rods 305 have a fixed end 305-1 and a jacking end 305-2. The fixed end 305-1 is fixedly connected to the linkage plate 303, and the jacking end 305-2 has a jacking position and a falling position; in the jacking position, the jacking end 305-2 protrudes from the carrier body 100 and is located between the carrier body 100 and the compression ring 201 in the axial direction, and in the falling position, the jacking end 305-2 is retracted into the carrier body 100.

[0041] Specifically, the carrier body 100 is provided with a plurality of insertion holes, which axially penetrate the carrier body 100. The insertion holes axially penetrate the second region 102-1b. The jacking rod 305 is arranged in the insertion hole and is axially movable along the insertion hole. Thus, the wafer can be first placed in the accommodating groove 102-1, and then the pressing ring 201 is pressed against the groove bottom of the accommodating groove 102-1.

[0042] In some other embodiments, the surface of the mounting plate 202 facing the carrier body 100 is axially recessed to form an insertion groove 211. The outer ring wall of the pressing ring 201 constitutes an inner ring side groove wall 211a of the insertion groove 211. In the disengaged position, the carrier 102 is located outside the insertion groove 211; in the pressing position, the carrier 102 can be inserted into the insertion groove 211, and the carrier top surface of the carrier 102 is axially spaced from the groove bottom of the insertion groove 211. Thus, the size of the carrier device in the height direction can be further reduced.

[0043] In the above manner, the insertion groove 211 further has an outer ring side groove wall 211b located outside the inner ring side groove wall 211a, and the transmission rod 302 is fixedly connected to the portion of the mounting plate 202 located outside the outer ring side groove wall 211b; the axial dimension of the outer ring side groove wall 211b is greater than the axial dimension of the inner ring side groove wall 211a. In this way, the portion fixedly connected to the transmission rod 302 is thicker, which is beneficial to improve the structural strength of the carrier device.

[0044] Optionally, in the direction axially from the groove bottom of the insertion groove 211 towards the carrier body 100, the outer ring side groove wall 211b gradually inclines away from the inner ring side groove wall 211a. Thus, interference with the carrier 102 can be avoided.

[0045] The use method of the carrier device in the present application will be described below with reference to a specific embodiment.

[0046] In use, the linkage plate 303 is driven to move upward in the axial direction, the transmission rod 302 moves upward relative to the carrier body 100, and the pressing ring 201 is further driven to move upward away from the carrier body 100. At the same time, the jacking end 305-2 of the jacking rod 305 moves upward to be between the pressing ring 201 and the carrier body 100. At this time, the wafer is placed on the jacking end 305-2.

[0047] After the wafer is in place, the linkage plate 303 is driven to move downward in the axial direction, and in the process of the downward movement of the linkage plate 303, the lifting end 305-2 is driven to retract into the circular table 102, so as to bring the wafer into the accommodating groove 102-1. The downward movement of the linkage plate 303 drives the transmission rod 302 to move downward relative to the carrier body 100, that is, to move towards the carrier body 100. In turn, the compression ring 201 is driven to move downward until the compression ring 201 enters the accommodating groove 102-1 and presses the wafer against the groove bottom. Thus, the wafer and the carrier are pressed tightly.

[0048] The principle and implementation mode of the present application are described by using specific examples in the present application, and the above examples are only used to help understand the core idea of the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the principle of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A wafer stage device, characterized in that, The carrier body (100) has a receiving groove (102-1) for receiving a wafer, the receiving groove (102-1) is concave along the axial direction by the carrier body (100) to form; Further comprising a pressing ring (201) opposite to the carrier body (100) in the axial direction, the pressing ring (201) can be inserted into the receiving groove (102-1) and indirectly abuts the groove bottom of the receiving groove (102-1), the pressing ring (201) has a horizontally extending pressing surface and a vertically extending side wall, the side wall is a straight wall, and the side wall is in clearance fit with the groove side wall of the receiving groove (102-1) in the radial direction.

2. The wafer boat apparatus of claim 1, wherein, The outer ring side of the pressing ring (201) is further fixedly connected with an annular mounting plate (202), the mounting plate (202) further comprises an insertion slot (211) formed by concave on the surface of the mounting plate (202) facing the carrier body (100), and the outer ring wall of the pressing ring (201) constitutes the inner ring side slot wall (211a) of the insertion slot (211); The carrier body (100) has a base body (101) and a circular table (102) arranged on the base body (101), and the receiving groove (102-1) is arranged on the surface of the circular table (102) opposite to the base body (101); the circular table (102) can be inserted into the insertion slot (211), and the table surface of the circular table (102) is in clearance with the slot bottom of the insertion slot (211) in the axial direction.

3. The wafer boat apparatus of claim 2, wherein, Further comprising a driving assembly (300) for vertically moving the pressing ring (201); The driving assembly (300) comprises a driving part (301) and a plurality of transmission rods (302) extending in the axial direction, and the driving part (301) drives the transmission rods (302) to move in the axial direction; One end of the transmission rod (302) is located on one side of the carrier body (100) and is directly or indirectly fixedly connected to the outer side of the pressing ring (201); The other end of the transmission rod (302) is located on the other side of the carrier body (100) and is directly or indirectly fixed to the output end of the driving part (301).

4. The wafer boat apparatus of claim 3, wherein, The transmission rod (302) is fixedly connected with the mounting plate (202).

5. The wafer boat apparatus of claim 4, wherein, The insertion slot (211) further comprises an outer ring side slot wall (211b) located outside the inner ring side slot wall (211a), and the transmission rod (302) is fixedly connected to the part of the mounting plate (202) located outside the outer ring side slot wall (211b); The axial dimension of the outer ring side slot wall (211b) is greater than that of the inner ring side slot wall (211a).

6. The wafer boat apparatus of claim 5, wherein, In the axial direction from the slot bottom of the insertion slot (211) to the direction close to the carrier body (100), the outer ring side slot wall (211b) gradually inclines away from the inner ring side slot wall (211a).

7. The wafer boat apparatus of claim 6, wherein, There are at least two transmission rods (302), and the transmission rods (302) are arranged around the pressing ring (201).

8. The wafer boat apparatus of claim 7, wherein, The driving assembly (300) further comprises a linkage plate (303) arranged parallel to the carrier body (100) and located on the side of the carrier body (100) opposite to the compression ring (201); The output end of the driving part (301) is connected to the linkage plate (303) to drive the linkage plate (303) to move axially, and the transmission rods (302) are fixedly connected to the linkage plate (303).

9. The wafer boat apparatus of claim 8, wherein, The driving part (301) comprises a cylinder and a piston rod, the driving part (301) is arranged between the linkage plate (303) and the carrier body (100), the cylinder is fixedly connected to one of the linkage plate (303) and the carrier body (100), and the piston rod is fixedly connected to the other one of the linkage plate (303) and the carrier body (100).

10. The wafer boat apparatus of claim 9, wherein, Further comprising a plurality of jacking rods (305) axially penetrating the carrier body (100), the jacking rod (305) has a fixed end (305-1) and a jacking end (305-2), the fixed end (305-1) is fixedly connected to the linkage plate (303), and the jacking end (305-2) has a jacking position and a falling-back position; In the jacking position, the jacking end (305-2) protrudes from the carrier body (100) and is axially located between the carrier body (100) and the compression ring (201); in the falling-back position, the jacking end (305-2) is retracted into the carrier body (100).

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