Semiconductor factory comprehensive waste gas treatment device

Abstract

The utility model discloses a semiconductor factory affair comprehensive waste gas treatment device which comprises an oxygen catalyst of an existing structure, at least one waste gas treatment mechanism connected with the oxygen catalyst and an ionization treatment mechanism which are connected in sequence, the waste gas treatment mechanism comprises a shell, and a containing cavity is formed in the shell. An inlet is formed in the first side of the lower bottom face of the shell, and an outlet is formed in the second side of the top of the shell. An air guide pipe is integrally formed at the inlet towards the interior of the containing cavity, a plurality of air holes are formed in the end of the air guide pipe, solid filler or liquid filler is arranged in the containing cavity, and a bent part is arranged on the air guide pipe so that the air holes can be located in the solid filler or the liquid filler. The waste gas treatment mechanism adopted by the utility model can react with solid or liquid fillers in a multi-stage manner, so that the waste gas treatment efficiency is improved, and the device is suitable for organic and inorganic comprehensive waste gas.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of waste gas treatment, specifically relates to a kind of semiconductor factory comprehensive waste gas treatment device. BACKGROUND

[0002] A variety of special gases are needed in semiconductor manufacturing process, including process gases, including silane, phosphine, arsenic trihydride, ammonia, boron trichloride, boron trifluoride, chlorine, dichloro sulfone, silicon tetrachloride, hydrogen sulfide, trichlorobenzene, iodized sulfur, hydrogen chloride and the like, these gases are used in different processes of semiconductor manufacturing, and the waste gas generated is collected and treated by exhaust system, and the waste gas will affect the atmospheric environment if it is not well treated before being discharged, at present, for this gas emission, adsorption, incineration or combination of adsorption and incineration is generally used. Incineration method is widely used in semiconductor industry to treat various organic waste gas, and organic matter is converted into CO2 and water through thermal oxidation. The existing semiconductor waste gas incineration treatment equipment has the problems of large volume and occupying too much space, and the comprehensive waste gas refers to the mixed waste gas generated by power devices such as diesel engine used in factory affairs. Therefore, it is very important to obtain a semiconductor factory comprehensive waste gas treatment device for treating the above-mentioned comprehensive waste gas. SUMMARY

[0003] To solve the above at least one technical problem, the utility model provides a kind of semiconductor factory comprehensive waste gas treatment device, including oxygen catalytic converter, at least one waste gas treatment mechanism connected with oxygen catalytic converter and ionization processing mechanism in sequence, the waste gas treatment mechanism includes shell, accommodating cavity is formed in the shell, the first side of the lower bottom surface of the shell is equipped with inlet, the second side of the top of the shell is equipped with outlet;Gas guide pipe is integrally formed in accommodating cavity at inlet, and a plurality of gas holes are formed in the end of gas guide pipe, solid filler or liquid filler is provided in the accommodating cavity, and the gas hole is in the solid filler or liquid filler by being provided with bending portion on the gas guide pipe.

[0004] Through the above technical scheme, the waste gas treatment mechanism used in the utility model can react with solid or liquid filler by multiple stages, increase the efficiency of waste gas treatment, and adapt to organic and inorganic comprehensive waste gas.

[0005] As the above one preferred mode, the first connecting column is integrally formed on the periphery of the inlet, and the first groove is downwardly formed on the periphery of the outlet. The waste gas treatment mechanism is provided with a plurality of first connecting columns, and the first connecting column of the inlet of the next waste gas treatment mechanism is inserted into the first groove of the outlet of the previous waste gas treatment mechanism, so that the plurality of waste gas treatment mechanisms are connected and installed in sequence.

[0006] Through the technical scheme, the waste gas treatment mechanism can be connected in sequence, and can be welded or fixed through a clamp after being inserted.

[0007] As the above-mentioned preferred mode, the oxygen catalyst is connected with the inlet of the first waste gas treatment mechanism through a connecting pipe, and the outlet of the last waste gas treatment mechanism is fixedly connected with the connecting pipe, and the connecting pipe is communicated with the ionization treatment mechanism. The connecting pipe can be welded.

[0008] As the above-mentioned preferred mode, the ionization treatment mechanism comprises a shell and a plurality of UV ultraviolet lamps, the inner wall of the shell is spirally fixed with a socket, and the UV ultraviolet lamp is inserted into the socket. A gas outlet is formed in one side of the shell.

[0009] Through the technical scheme, the ionization treatment mechanism can decompose organic waste gas.

[0010] As the above-mentioned preferred mode, the plurality of waste gas treatment mechanisms are arranged obliquely, so that the bottom surface of the shell is inclined, and the air holes are arranged close to the inner wall of the shell. A sealing cover is threadedly connected to the side wall of the shell, so as to replace the internal solid filler or liquid filler.

[0011] Through the technical scheme, the inclined surface can help the replacement of the filler, and a second opening can be formed in the top of the shell, and a second sealing cover is threadedly connected to the second opening, so as to help the injection of the filler.

[0012] Compared with the prior art, the utility model has the advantages that the utility model structure is simple, can treat organic waste gas and inorganic waste gas comprehensive waste gas, and is suitable for the factory of semiconductor production. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the cross section schematic view of the utility model;

[0014] Figure 2 It is the ionization treatment mechanism side cross section schematic view of the utility model;

[0015] Figure 3 It is the multi-stage waste gas treatment mechanism connecting structure schematic view of the utility model;

[0016] REFERENCE SIGNS:

[0017] 1 oxygen catalyst; 2 shell; 3 containing cavity; 4 inlet; 5 outlet; 6 gas guide pipe; 7 air hole; 8 solid filler or liquid filler; 9 first connecting column; 10 first groove; 11 connecting pipe; 12 shell; 13 UV ultraviolet lamp; 14 gas port; 15 second sealing cover; 16 sealing cover. DETAILED DESCRIPTION

[0018] In order for those skilled in the art to better understand the present application, so as to make a clearer limitation to the scope of the present application, the present application is described in detail below with respect to certain specific embodiments of the present application. It should be noted that the following is only certain specific embodiments of the present application concept and is only a part of the embodiments of the present application, wherein the specific and direct description of the related structure is only for the convenience of understanding the present application, and each specific feature does not of course, directly limit the scope of the present application.

[0019] Referring to the drawings, the present application adopts the following technical solutions, the present application provides a kind of semiconductor factory comprehensive waste gas treatment device, including the oxygen catalytic converter 1 of existing structure connected in sequence, at least one waste gas treatment mechanism connected with oxygen catalytic converter 1, ionization processing mechanism, the waste gas treatment mechanism includes shell 2, the accommodating cavity 3 is formed in the shell 2, the first side of the lower bottom surface of the shell 2 is equipped with inlet 4, the second side of the top of the shell 2 is equipped with outlet 5;Integrally formed with gas guide pipe 6 in accommodating cavity 3 at inlet 4, the end of gas guide pipe 6 is equipped with a plurality of air holes 7, the accommodating cavity 3 is equipped with solid filler or liquid filler 8, the gas guide pipe 6 is equipped with bending part to make air hole 7 in the solid filler or liquid filler 8.

[0020] Through the above technical solution, the waste gas treatment mechanism used in the present application can be reacted with solid or liquid filler in multiple stages, increase the efficiency of waste gas treatment, adapt to organic and inorganic comprehensive waste gas.

[0021] As one of the above preferred manners, the first connecting column 9 is integrally formed on the periphery of the inlet 4, and the first recess 10 is formed downward on the periphery of the outlet 5. The waste gas treatment mechanism is provided with a plurality of first connecting columns 9 of the inlet 4 of the next waste gas treatment mechanism inserted into the first recess 10 of the outlet 5 of the previous waste gas treatment mechanism, so that the plurality of waste gas treatment mechanisms are connected and installed in sequence.

[0022] Through the above technical solution, the waste gas treatment mechanism of the present application can be connected in sequence by inserting, and can be welded or fixed by clamp after insertion, multiple processing is adopted, and various mixed waste gas can be used.

[0023] As one of the above preferred manners, the oxygen catalytic converter 1 is connected to the inlet 4 of the first waste gas treatment mechanism through the connecting pipe 11, and the outlet 5 of the last waste gas treatment mechanism is fixedly connected to the connecting pipe 11, and the connecting pipe 11 is communicated with the ionization processing mechanism. The connecting pipe 11 can be welded.

[0024] As one preferred mode of the above, the ionization processing mechanism comprises a shell 12, a plurality of UV ultraviolet lamps 13, the inner wall of the shell 12 is spirally fixed with a socket, the UV ultraviolet lamp 13 is inserted into the socket, and the socket is connected to the power supply.

[0025] Through the above technical scheme, the ionization processing mechanism can decompose organic waste gas.

[0026] As one preferred mode of the above, the plurality of waste gas processing mechanisms are arranged obliquely, so that the bottom surface of the shell 2 is inclined, and the air holes 7 are arranged close to the inner wall of the shell 2. The sealing cover 16 is threadedly connected to the side wall of the shell 2, so as to replace the internal solid filler or liquid filler 8. The oblique arrangement and the air holes close to the inner wall of the shell can increase the distance of the waste gas passing through the filler and increase the reaction efficiency.

[0027] Through the above technical scheme, the inclined arrangement can help the replacement of the filler, and a second opening can be further formed in the top of the shell 2, and a second sealing cover 15 is threadedly connected to the second opening, so as to help the injection of the filler.

[0028] Compared with the prior art, the utility model has the advantages that the utility model structure is simple, can handle the comprehensive waste gas of organic waste gas and inorganic waste gas, and is suitable for the factory of semiconductor production.

[0029] The term "comprising" or any other similar term is intended to encompass the inclusion of one or more elements, features, or steps without excluding the inclusion of other elements, features, or steps. The term "comprising" is intended to mean "including, but not limited to".

[0030] In the description of the utility model, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and other terms indicating direction or positional relationship are based on the direction or positional relationship shown in the drawings, which is only for the convenience of description, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] So far, the technical scheme of the utility model has been described in combination with the preferred embodiments shown in the drawings, but those skilled in the art can easily understand that the protection scope of the utility model is obviously not limited to these specific embodiments. Without deviating from the principles of the utility model, those skilled in the art can make equivalent changes or replacements to related technical features, and the technical scheme after these changes or replacements will fall within the protection scope of the utility model.

Claims

1. A comprehensive waste gas treatment device for semiconductor plants, characterized in that: The application relates to a waste gas treatment device, which comprises an oxygen catalyst (1), at least one waste gas treatment mechanism connected with the oxygen catalyst (1) and an ionization treatment mechanism in sequence, wherein the waste gas treatment mechanism comprises a shell (2) with a containing cavity (3) formed in the shell (2), an inlet (4) formed on the first side of the lower bottom surface of the shell (2), and an outlet (5) formed on the second side of the top of the shell (2); a gas guide pipe (6) is integrally formed in the containing cavity (3) at the inlet (4), a plurality of air holes (7) are formed in the end of the gas guide pipe (6), solid or liquid fillers (8) are arranged in the containing cavity (3), and a bending part is arranged on the gas guide pipe (6) so that the air holes (7) are arranged in the solid or liquid fillers (8).

2. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 1, characterized by: A first connecting column (9) is integrally formed on the periphery of the inlet (4), and a first groove (10) is formed on the periphery of the outlet (5) downwards.

3. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 2, characterized by: The waste gas treatment mechanism is provided with a plurality of waste gas treatment mechanisms, the first connecting column (9) of the inlet (4) of the next waste gas treatment mechanism is inserted into the first groove (10) of the outlet (5) of the previous waste gas treatment mechanism, so that the plurality of waste gas treatment mechanisms are connected and installed in sequence in an oblique direction.

4. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 1, characterized by: The oxygen catalyst (1) is connected with the inlet (4) of the first waste gas treatment mechanism through a connecting pipe (11), the outlet (5) of the last waste gas treatment mechanism is fixedly connected with the connecting pipe (11), and the connecting pipe (11) is communicated with the ionization treatment mechanism.

5. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 1, characterized by: The ionization treatment mechanism comprises a shell (12) and a plurality of UV ultraviolet lamps (13), and the inner wall of the shell (12) is spirally fixed with sockets, and the UV ultraviolet lamps (13) are inserted into the sockets.

6. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 1, characterized by: The plurality of waste gas treatment mechanisms are arranged in an oblique direction, so that the bottom surface of the shell (2) is inclined, and the air holes (7) are arranged close to the inner wall of the shell (2).

7. The semiconductor plant integrated exhaust gas treatment apparatus according to claim 6, characterized by: A sealing cover (16) is threadedly connected on the side wall of the shell (2), so that the internal solid or liquid fillers (8) can be replaced.

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