High-precision component laser micro-welding instrument

Abstract

The utility model provides a high-precision component laser micro-welding instrument, which belongs to the technical field of laser micro-welding instruments and particularly comprises a base, a micro-welding instrument main body is arranged at the top of the base, a motor is fixed at the top of the base, a material supply part is arranged at the top of the base and is positioned below the micro-welding instrument main body, and an auxiliary material part is arranged at the top of a material supply frame and is positioned below the micro-welding instrument main body. The feeding part is assembled to clamp the base plate and is matched with the motor to drive the base plate to move; the auxiliary part is assembled to separate the solder balls and control movement of the solder balls, the motor, the feeding part and the auxiliary part are adopted, the solder balls can be linearly arranged after being separated, and alignment of the substrate and the micro-welding instrument body can be conveniently completed.

Description

Technical Field

[0001] This utility model relates to the field of laser micro-welding instrument technology, specifically a high-precision laser micro-welding instrument for components. Background Technology

[0002] A high-precision laser micro-welding machine is an advanced device used for welding tiny, precision components. Laser micro-welding machines typically operate based on the thermal effect of lasers. Their laser generator produces a high-energy-density laser beam, which is focused onto the tiny area to be welded using an optical focusing system. When the laser energy acts on the welding area, the material rapidly absorbs the laser energy and converts it into heat, causing the material at the welding area to melt instantly, forming a molten pool. This molten pool then cools and solidifies, achieving a high-precision weld connection.

[0003] Current laser micro-welding equipment primarily clamps the substrate individually, without considering how to move it. However, when welding circuit boards for electronic devices, numerous tiny components may need to be soldered. The inability to move the substrate increases the path the welding head must take between different solder joints, slowing down the welding speed and reducing production efficiency. This hinders the integration of the entire production process and makes solder ball loading difficult, potentially requiring complex procedures each time solder balls are added. For example, manually placing each solder ball near the welding position might be necessary, which is time-consuming in large-scale production or continuous welding. Furthermore, the complex loading process frequently interrupts the welding process, reducing overall work efficiency.

[0004] Therefore, this invention provides a high-precision laser micro-welding instrument for components that can separate solder balls and then linearly arrange them, facilitating the alignment of the substrate and the main body of the micro-welding instrument. Summary of the Invention

[0005] To address the problems of existing technologies, such as the inability to move the substrate and the inconvenience of solder ball loading, a high-precision laser micro-welding instrument for electronic components has been designed.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a high-precision laser micro-welding instrument for components, including a base, a micro-welding instrument body set on the top of the base, a motor fixed on the top of the base, a feeding component set on the top of the base, and the feeding component located below the micro-welding instrument body; an auxiliary component set on the top of the feeding rack; the feeding component is assembled to clamp the substrate and cooperate with the motor to drive the substrate to move; the auxiliary component is assembled to separate solder balls and control the movement of the solder balls.

[0007] Furthermore, a lifting mechanism is fixed to the top of the base. The lifting mechanism is located on the side of the motor away from the feeding component. A telescopic rod is slidably connected to the inner side of the lifting mechanism through a connecting component. The main body of the micro-welding instrument is fixed to the output end of the telescopic rod.

[0008] Furthermore, the feeding component includes a threaded rod and a guide rod. The threaded rod is rotatably connected to the top of the base via a connecting component. The end of the threaded rod near the motor is driven by the output end of the motor via a belt and a pulley. The guide rod is rotatably connected to the top of the base via a connecting component, and the threaded rod is located on the side of the guide rod near the motor. Two limiting rods are fixedly connected to the top of the base via a connecting component. A base plate is threadedly installed on the outside of the threaded rod, and the base plate is slidably engaged with the outside of the guide rod and the two limiting rods.

[0009] Furthermore, the feeding component also includes two sets of T-shaped columns, with two T-shaped columns forming a set. Both sets of T-shaped plates are fixed to the top of the base plate. A spring is fixed to the bottom of each T-shaped column. A cover plate is slidably connected to the outside of each set of T-shaped plates. The other end of the spring is fixed to the top of the cover plate. Two soft pads are fixed to the top of the base plate, and the soft pads are located at the bottom of the cover plate. A handle is fixed to the top of each cover plate.

[0010] Furthermore, the auxiliary components include a chassis, which is fixed to the top of the base, and a feed plate is slidably connected through the top of the chassis.

[0011] Furthermore, the auxiliary components also include a partition plate, which is fixed to the inside of the chassis. A guide plate is fixed to the side of the chassis near the bottom plate. A through hole is opened through the top of the bottom wall of the guide plate. A solenoid valve is fixed through the side of the chassis near the bottom plate.

[0012] The beneficial effects of this utility model are as follows:

[0013] (1) The high-precision laser micro-welding instrument for components described in this utility model adopts a feeding component that can clamp the substrate and move the clamping plate with the help of a motor to quickly change the position of the substrate. This facilitates the alignment of the substrate and the main body of the micro-welding instrument with the lifting machine and telescopic rod, thereby achieving precise alignment between the substrate and the main body of the micro-welding instrument, improving welding efficiency and precision, and providing a strong guarantee for the production of high-quality micro-welding products.

[0014] (2) The high-precision laser micro-welding instrument for components described in this utility model adopts auxiliary components and solenoid valves, which can separate solder balls and arrange them linearly to achieve the supply of a specified number and position of solder balls. This not only improves the precision of the micro-welding process and ensures stable solder joint quality, but also optimizes the production process, reduces material waste, meets the high-precision welding requirements, and helps improve product performance and production efficiency. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2This is a three-dimensional structural diagram of the feeding component of this utility model;

[0018] Figure 3 This is a cross-sectional schematic diagram of the auxiliary component of this utility model;

[0019] Figure 4 for Figure 1 Enlarged view of point A.

[0020] In the diagram: 1. Base; 2. Lifting platform; 3. Telescopic rod; 4. Micro-welding instrument body; 5. Feeding component; 51. Threaded rod; 52. Guide rod; 53. Limiting rod; 54. Base plate; 55. Soft pad; 56. T-shaped column; 57. Cover plate; 58. Handle; 6. Auxiliary components; 61. Chassis; 62. Feed plate; 63. Guide plate; 64. Divider plate; 65. Solenoid valve; 66. Through hole; 7. Motor. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Example: Figures 1 to 4 As shown, a high-precision laser micro-welding device for electronic components includes a base 1, a micro-welding device body 4 on the top of the base 1, a motor 7 fixed on the top of the base 1, a feeding component 5 on the top of the base 1, and the feeding component 5 located below the micro-welding device body 4. An auxiliary component 6 is located on the top of the feeding frame. The feeding component 5 is assembled to hold the substrate and to move the substrate in conjunction with the motor 7. The auxiliary component 6 is assembled to separate solder balls and to control the movement of the solder balls. A lifting mechanism 2 is fixed on the top of the base 1. The lifting mechanism 2 is located on the side of the motor 7 away from the feeding component 5. A telescopic rod 3 is slidably connected to the inner side of the lifting mechanism 2 through a connecting component. The micro-welding device body 4 is fixed to the output end of the telescopic rod 3.

[0023] In this embodiment, the operator controls the elevator 2 to adjust the height of the micro-welding instrument body 4, and controls the telescopic rod 3 to move the micro-welding instrument body 4 to the top of the position where the substrate needs to be welded, thus adjusting the position of the micro-welding instrument body 4.

[0024] Specifically, the feeding component 5 also includes two sets of T-shaped posts 56, with two T-shaped posts 56 forming a set. Both sets of T-shaped plates are fixed to the top of the base plate 54. A spring is fixed to the bottom of each T-shaped post 56. A cover plate 57 is slidably connected to the outside of each set of T-shaped plates. The other end of the spring is fixed to the top of the cover plate 57. Two soft pads 55 are fixed to the top of the base plate 54, and the soft pads 55 are located at the bottom of the cover plate 57. A handle 58 is fixed to the top of each cover plate 57.

[0025] In this embodiment, the operator holds the handle 58 and moves the two cover plates 57 along the outside of the T-shaped column 56 toward the side closer to the micro-welding instrument body 4. The two cover plates 57 compress the spring, and then the substrate is placed on top of the two soft pads 55. The two handles 58 are released, and the spring compresses the two cover plates 57 to fix the substrate, thereby achieving the clamping of the substrate.

[0026] Specifically, the feeding component 5 includes a threaded rod 51 and a guide rod 52. The threaded rod 51 is rotatably connected to the top of the base 1 through a connecting component. The end of the threaded rod 51 near the motor 7 is driven by the output end of the motor 7 through a belt and a pulley. The guide rod 52 is rotatably connected to the top of the base 1 through a connecting component, and the threaded rod 51 is located on the side of the guide rod 52 near the motor 7. Two limiting rods 53 are fixedly connected to the top of the base 1 through a connecting component. A base plate 54 is threadedly installed on the outside of the threaded rod 51, and the base plate 54 is slidably engaged with the outside of the guide rod 52 and the two limiting rods 53.

[0027] In this embodiment, the operator starts the motor 7 to rotate forward. The motor 7 drives the threaded rod 51 to rotate forward through the belt and pulley. The threaded rod 51 drives the base plate 54 to move towards the side closer to the chassis 61 through the meshing action. The base plate 54 drives the substrate and cover plate 57 to move towards the side closer to the chassis 61 through the T-shaped column 56, so that the position of the substrate to be welded and the main body 4 of the micro-welding instrument are on the same vertical plane, which facilitates welding.

[0028] Once the welding is complete, the operator controls the motor 7 to reverse and drive the substrate and base plate 54 back to their original positions, and then pulls the handle 58 to remove the substrate.

[0029] Specifically, the auxiliary component 6 includes a housing 61, which is fixed to the top of the base 1, and a feed plate 62 is slidably connected through the top of the housing 61.

[0030] In this embodiment, the operator presses the feed plate 62 with their hand towards the side near the base plate 54, and at the same time, relies on the friction between their fingers and the feed plate 62 to move the feed plate 62 towards the side near the micro soldering machine body 4, so that the feed plate 62 is removed from the chassis 61, releasing the restriction on the back of the chassis 61, and then the solder ball is guided into the inside of the chassis 61, and then the feed plate 62 is restored to its original position.

[0031] Specifically, the auxiliary component 6 also includes a partition plate 64, which is fixed to the inside of the chassis 61. A guide plate 63 is fixed to the side of the chassis 61 near the bottom plate 54. A through hole 66 is opened through the top of the bottom wall of the guide plate 63. A solenoid valve 65 is fixed through the side of the chassis 61 near the bottom plate 54.

[0032] In this embodiment, multiple sets of partition plates 64, guide plates 63, and through holes 66 are provided. Under the action of gravity, the solder balls move along the bottom wall of the chassis 61 towards the side near the guide plate 63. During the movement, the solder balls are separated individually by the partition plates 64 and then arranged one by one on the side of the solenoid valve 65 near the chassis 61. Two adjacent partition plates restrict the solder balls. When the position of the substrate to be soldered and the main body of the micro soldering device 4 are on the same vertical plane, the solenoid valve 65 at the top of the corresponding position is opened. Under the action of gravity and the push of other solder balls, the solder balls pass through the solenoid valve 65, are guided by the guide plate 63, and fall into the inside of the through hole 66. After the solder balls pass through the solenoid valve 65, the solenoid valve 65 is closed, and the main body of the micro soldering device 4 is started to melt and solder the solder balls.

[0033] Working principle: Before using this device, the operator manually moves the feed plate 62 out of the chassis 61, then guides the solder balls into the inside of the chassis 61, and then restores the feed plate 62 to its original position. During the movement, the solder balls are separated individually by the partition plate 64. The operator holds the handle 58 and moves the two cover plates 57 along the outside of the T-shaped column 56 towards the side closer to the micro soldering machine body 4, places the substrate on top of the two soft pads 55, and releases the two handles 58 to fix the substrate.

[0034] The operator starts the motor 7 to rotate forward, driving the substrate and cover plate 57 to move closer to the chassis 61. The operator controls the lifting platform 2 to adjust the height of the micro-welding instrument body 4. When the position on the substrate to be welded and the micro-welding instrument body 4 are on the same vertical plane, the operator controls the telescopic rod 3 to move the micro-welding instrument body 4 to the top of the position on the substrate to be welded. Then, the operator controls the solenoid valve 65 at the top of the corresponding position to open. The solder ball passes through the solenoid valve 65 and falls into the inside of the through hole 66. After the solder ball passes through the solenoid valve 65, the operator closes the solenoid valve 65 and starts the micro-welding instrument body 4 to melt the solder ball. After the solder ball melts, it passes through and moves to the designated position on the substrate. When the solder ball solidifies, the welding is completed.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-precision laser micro-welding instrument for electronic components, comprising a base (1), characterized in that: The base (1) is provided with a micro welding instrument body (4) on the top, a motor (7) is fixed on the top of the base (1), a feeding component (5) is provided on the top of the base (1), and the feeding component (5) is located below the micro welding instrument body (4). An auxiliary component (6) is provided on the top of the feeding rack. The feeder (5) is assembled to hold the substrate and works with the motor (7) to move the substrate. Auxiliary component (6) is assembled to separate solder balls and control the movement of solder balls.

2. The high-precision laser micro-welding instrument for components according to claim 1, characterized in that: The top of the base (1) is fixed with a lifting machine (2). The lifting machine (2) is located on the side of the motor (7) away from the feeding component (5). The inner side of the lifting machine (2) is slidably connected to a telescopic rod (3) through a connecting component. The main body (4) of the micro welding instrument is fixed to the output end of the telescopic rod (3).

3. The high-precision laser micro-welding instrument for components according to claim 2, characterized in that: The feeding component (5) includes a threaded rod (51) and a guide rod (52). The threaded rod (51) is rotatably connected to the top of the base (1) through a connecting component. The end of the threaded rod (51) near the motor (7) is driven by the output end of the motor (7) through a belt and a pulley. The guide rod (52) is rotatably connected to the top of the base (1) through a connecting component, and the threaded rod (51) is located on the side of the guide rod (52) near the motor (7). Two limiting rods (53) are fixedly connected to the top of the base (1) through a connecting component. A base plate (54) is threadedly installed on the outside of the threaded rod (51), and the base plate (54) is slidably engaged with the outside of the guide rod (52) and the two limiting rods (53).

4. The high-precision laser micro-welding instrument for components according to claim 3, characterized in that: The feeding component (5) also includes two sets of T-shaped columns (56), with the two T-shaped columns (56) forming a set. Both sets of T-shaped plates are fixed to the top of the base plate (54). A spring is fixed to the bottom of each T-shaped column (56). A cover plate (57) is slidably connected to the outside of each set of T-shaped plates. The other end of the spring is fixed to the top of the cover plate (57). Two soft pads (55) are fixed to the top of the base plate (54), and the soft pads (55) are located at the bottom of the cover plate (57). A handle (58) is fixed to the top of each cover plate (57).

5. The high-precision laser micro-welding instrument for components according to claim 4, characterized in that: The auxiliary component (6) includes a housing (61), which is fixed to the top of the base (1), and a feed plate (62) is slidably connected through the top of the housing (61).

6. The high-precision laser micro-welding instrument for components according to claim 5, characterized in that: The auxiliary component (6) also includes a partition plate (64), which is fixed to the inside of the chassis (61). A guide plate (63) is fixed on the side of the chassis (61) near the bottom plate (54). A through hole (66) is opened through the top of the bottom wall of the guide plate (63). A solenoid valve (65) is fixed through the side of the chassis (61) near the bottom plate (54).

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