Aluminum nitride substrate surface evaporation metallization jig
By designing a multi-layered, openable vapor deposition fixture and a hinged fixture for metallizing aluminum nitride substrates, the problems of uneven vapor deposition and low production capacity of aluminum nitride substrates were solved, achieving efficient batch processing and improving product quality.
Patent Information
- Application Number
- CN202422858845.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-11-22
AI Technical Summary
Existing aluminum nitride substrate evaporation processes suffer from uneven evaporation, low peel strength, and low production capacity, making it difficult to achieve mass production of aluminum nitride substrates.
A metallization fixture for evaporation on aluminum nitride substrates is designed. It adopts a multi-layer stacked openable evaporation fixture structure, combined with hinge connection and limiting protrusion design, to achieve batch evaporation of substrates.
It improves the evaporation efficiency of aluminum nitride substrates, avoids deviation during the evaporation process, and enhances product performance and yield.
Smart Images
Figure CN223660178U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to high -power electronic device manufacturing technical field especially relates to a kind of aluminum nitride substrate surface evaporation metallization fixture. BACKGROUND
[0002] In the manufacture of high-power electronic devices, DCB ceramic substrate is widely used due to its excellent thermal conductivity and mechanical stability. In traditional IGBT modules, alumina ceramic substrate is no longer suitable as packaging material, and ceramic substrates such as aluminum nitride and silicon nitride are gradually replaced.
[0003] Due to the relatively low thermal conductivity of alumina ceramic substrate and the poor matching of thermal expansion coefficient with silicon, as new energy vehicles develop towards high pressure and high power, alumina is no longer suitable as packaging material. Aluminum nitride can be used in high temperature or in the presence of certain radiation. As a heat sink and structural component, aluminum nitride will have a large increase in demand in the semiconductor, new energy and military fields. However, unlike alumina and zirconium-containing toughened alumina, aluminum nitride does not have an oxide film on its surface, and during copper-ceramic bonding, it cannot form spinel structure Cu x O y Therefore, it is necessary to deposit / transform a certain oxide layer on the surface of the aluminum nitride substrate to provide a prerequisite for copper-ceramic bonding. However, in existing aluminum nitride evaporation processes, due to the special material and complex shape of the substrate, problems such as uneven evaporation and low peel strength often occur, which seriously affects the performance and yield of the final product. In addition, evaporation is usually carried out in a single piece and single-sided or double-sided evaporation in a box furnace, which cannot be processed in batches and has low production capacity. UTILITY MODEL CONTENT
[0004] The utility model aims to provide a kind of aluminum nitride substrate surface evaporation metallization fixture, can realize the batch evaporation of substrate, and the efficiency is higher.
[0005] The above technical purpose of the utility model is realized by the following technical scheme:
[0006] The application discloses a surface metalizing jig for aluminum nitride substrates, which is characterized by comprising a bottom open-close type evaporation jig and a stacked open-close type evaporation jig stacked on the bottom open-close type evaporation jig in sequence, wherein the bottom open-close type evaporation jig is placed on a mesh belt, and the stacked open-close type evaporation jig is stacked by at most three groups; the bottom open-close type evaporation jig and the stacked open-close type evaporation jig each comprise an upper jig and a lower jig stacked in sequence, one end of the upper jig and the lower jig is hinged through a hinge, a copper oxide sheet placing groove is formed in the upper jig, a copper oxide sheet is clamped in the copper oxide sheet placing groove, a to-be-evaporated porcelain sheet placing groove is formed in the upper of the lower jig, and a to-be-evaporated porcelain sheet is clamped in the to-be-evaporated porcelain sheet placing groove; and a rectangular slot is formed in the middle of the upper jig and the lower jig.
[0007] Preferably, a lower open-close type evaporation jig is provided with a lower open copper oxide sheet placing groove in the bottom of the lower jig, and a copper oxide sheet is placed on the mesh belt in the copper oxide sheet placing groove in the bottom of the lower jig.
[0008] Preferably, the copper oxide sheet placing groove and the to-be-evaporated porcelain sheet placing groove are respectively penetrated through the upper jig and the lower jig at the front and rear ends of the copper oxide sheet placing groove and the to-be-evaporated porcelain sheet placing groove, and are communicated with the outside.
[0009] Preferably, the copper oxide sheet placing groove and the to-be-evaporated porcelain sheet placing groove are respectively provided with gaps between the left and right sides of the copper oxide sheet and the to-be-evaporated porcelain sheet.
[0010] Preferably, the area size of the rectangular slot is smaller than the area of the copper oxide sheet and the to-be-evaporated porcelain sheet.
[0011] Preferably, the upper jig and the lower jig are made of 601 type stainless steel.
[0012] Preferably, the copper oxide sheet placing groove and the to-be-evaporated porcelain sheet placing groove are respectively provided with long strip-shaped limiting protrusions on the front and rear sides of the copper oxide sheet and the to-be-evaporated porcelain sheet.
[0013] Preferably, L-shaped limiting protrusions are arranged at the four corners of the upper jig, and L-shaped limiting grooves are formed in the bottom of the lower jig corresponding to the L-shaped limiting protrusions, and the stacked open-close type evaporation jigs are placed in limiting mode through cooperation of the L-shaped limiting protrusions and the L-shaped limiting grooves.
[0014] Preferably, the height distance between the to-be-evaporated porcelain sheet and the adjacent copper oxide sheet is 1.0 mm, the slot depth of the copper oxide sheet placing groove and the to-be-evaporated porcelain sheet placing groove is 0.7 mm, the thickness of the upper jig and the lower jig of the stacked open-close type evaporation jig and the upper jig of the bottom open-close type evaporation jig is 1.4 mm, and the thickness of the lower jig of the bottom open-close type evaporation jig is 2.1 mm.
[0015] Preferably, a gap is provided between the top of the copper oxide sheet and the top of the ceramic sheet to be vapor-deposited.
[0016] In summary, this utility model has the following beneficial effects:
[0017] This invention enables batch vapor deposition of substrates in a tunnel furnace by setting up multi-layer vapor deposition fixtures, thus achieving higher efficiency.
[0018] This invention uses a hinge to connect the upper and lower sets of fixtures, making it easier to pick up and remove vapor-deposited ceramic sheets and copper oxide sheets.
[0019] This invention uses elongated limiting protrusions to limit the placement of vapor-deposited ceramic sheets and copper oxide sheets. L-shaped limiting protrusions and L-shaped limiting grooves limit the placement of adjacent bottom-layer opening and closing vapor deposition fixtures and stacked opening and closing vapor deposition fixtures, preventing displacement during the vapor deposition process and thus affecting the final vapor deposition effect. Attached Figure Description
[0020] Fig. 1 This is a front structural diagram of the present invention;
[0021] Fig. 2 This is a front internal cross-sectional view of the present invention;
[0022] Fig. 3 This is a side view of the structure of this utility model;
[0023] Fig. 4 This is a top view of the present invention;
[0024] Fig. 5 This is a bottom view of the present invention;
[0025] In the diagram: 1-bottom layer openable vapor deposition fixture, 2-layer openable vapor deposition fixture, 3-mesh belt, 4-upper layer fixture, 5-lower layer fixture, 6-hinge, 7-copper oxide sheet placement groove, 8-copper oxide sheet, 9-copper oxide sheet placement groove, 10-ceramic sheet to be vapor deposited, 11-rectangular slot, 12-long strip-shaped limiting protrusion, 13-L-shaped limiting protrusion, 14-L-shaped limiting groove. Detailed Implementation
[0026] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. These embodiments do not constitute a limitation on this utility model.
[0027] like Figs. 1 to 5The illustrated aluminum nitride substrate surface metallization fixture includes a bottom-type opening and closing evaporation fixture 1 and stacked opening and closing evaporation fixtures 2 sequentially stacked on top of the bottom-type opening and closing evaporation fixture 1. The bottom-type opening and closing evaporation fixture 1 is placed on a mesh belt 3. Up to three sets of stacked opening and closing evaporation fixtures 2 are arranged. Both the bottom-type opening and closing evaporation fixture 1 and the stacked opening and closing evaporation fixtures 2 include an upper fixture 4 and a lower fixture 5 stacked on top of each other. The upper fixture 4 and the lower fixture 5 are hinged at one end by a hinge 6. A copper oxide sheet placement groove 7 is provided above the upper fixture 4, and a copper oxide sheet 8 is inserted in the copper oxide sheet placement groove 7. A ceramic sheet to be vapor-deposited is provided above the lower fixture 5, and a ceramic sheet 10 to be vapor-deposited is inserted in the ceramic sheet placement groove 9. A rectangular slot 11 is provided through the middle of the copper oxide sheet placement groove 7 and the ceramic sheet to be vapor-deposited placement groove 9, respectively, in the upper fixture 4 and the lower fixture 5.
[0028] The bottom of the lower fixture 5 of the bottom opening-type vapor deposition fixture 1 has an opening in the copper oxide sheet placement groove 7, and copper oxide sheets 8 are placed on the mesh belt 3 in the copper oxide sheet placement groove 7 at the bottom of the lower fixture 5.
[0029] The copper oxide sheet placement tank 7 and the ceramic sheet placement tank 9 are connected to the upper fixture 4 and the lower fixture 5 at both ends and are connected to the outside. The copper oxide sheet placement tank 7, the ceramic sheet placement tank 9 and the rectangular slot 11 allow atoms to escape for evaporation.
[0030] The copper oxide sheet placement tank 7 and the ceramic sheet placement tank 9 are respectively provided with gaps between the copper oxide sheet 8 and the left and right sides of the ceramic sheet 10 to be vaporized.
[0031] The area of the rectangular slot 11 is smaller than that of the copper oxide sheet 8 and the ceramic sheet to be vapor-deposited 10. The upper fixture 4 and the lower fixture 5 are made of 601 stainless steel.
[0032] The copper oxide sheet placement tank 7 and the ceramic sheet to be vaporized placement tank 9 are respectively provided with long strip-shaped limiting protrusions 12 on the front and rear sides of the copper oxide sheet 8 and the ceramic sheet to be vaporized 10.
[0033] The upper fixture 4 has L-shaped limiting protrusions 13 at each of its four corners. The lower fixture 5 has L-shaped limiting grooves 14 at its bottom corresponding to the L-shaped limiting protrusions 13. The upper and lower stacked opening and closing vapor deposition fixture 2 is positioned by the L-shaped limiting protrusions 13 and L-shaped limiting grooves 14.
[0034] The height distance between the ceramic sheet 10 to be vapor-deposited and the adjacent copper oxide sheet 8 is 1.0 mm. The groove depth of the copper oxide sheet placement groove 7 and the ceramic sheet placement groove 9 to be vapor-deposited is 0.7 mm. The thickness of the upper fixture 4 and the lower fixture 5 of the stacked opening and closing vapor deposition fixture 2 and the upper fixture 4 of the bottom opening and closing vapor deposition fixture 1 is 1.4 mm. The thickness of the lower fixture 5 of the bottom opening and closing vapor deposition fixture 1 is 2.1 mm.
[0035] A gap is provided at the top of both the copper oxide sheet 8 and the ceramic sheet 10 to be vapor-deposited.
[0036] This invention enables batch vapor deposition of substrates in a tunnel furnace by setting up multi-layer vapor deposition fixtures, thus achieving higher efficiency.
[0037] This invention uses a hinge to connect the upper and lower sets of fixtures, making it easier to pick up and remove vapor-deposited ceramic sheets and copper oxide sheets.
[0038] This invention uses elongated limiting protrusions to limit the placement of vapor-deposited ceramic sheets and copper oxide sheets. L-shaped limiting protrusions and L-shaped limiting grooves limit the placement of adjacent bottom-layer opening and closing vapor deposition fixtures and stacked opening and closing vapor deposition fixtures, preventing displacement during the vapor deposition process and thus affecting the final vapor deposition effect.
[0039] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Those skilled in the art can make various modifications or equivalent substitutions to the present utility model within its substance and protection scope, and such modifications or equivalent substitutions should also be considered to fall within the protection scope of the present utility model's technical solution.
Claims
1. A metallization fixture for evaporating metallization on the surface of an aluminum nitride substrate, characterized in that, The system includes a bottom-type evaporation coating fixture and a stacked evaporation coating fixture arranged sequentially on top of the bottom-type evaporation coating fixture. The bottom-type evaporation coating fixture is placed on a conveyor belt. Up to three sets of stacked evaporation coating fixtures are arranged. Both the bottom-type and stacked evaporation coating fixtures include an upper fixture and a lower fixture arranged on top of each other. One end of the upper fixture and the lower fixture are hinged together by a hinge. A copper oxide sheet placement groove is provided on the top of the upper fixture, and a copper oxide sheet is held in the copper oxide sheet placement groove. A ceramic sheet to be evaporated is provided on the top of the lower fixture, and a ceramic sheet to be evaporated is held in the ceramic sheet placement groove. Rectangular slots are provided through the middle of the copper oxide sheet placement groove and the ceramic sheet to be evaporated groove, respectively, on the upper and lower fixtures.
2. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The bottom of the lower layer of the bottom-opening vapor deposition fixture has an opening at the bottom for placing copper oxide sheets. Copper oxide sheets are placed on the mesh belt in the copper oxide sheet placement groove at the bottom of the lower layer fixture.
3. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The copper oxide sheet placement tank and the ceramic sheet placement tank to be vaporized are both penetrated by the upper and lower fixtures at their front and rear ends, respectively, and are connected to the outside.
4. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The copper oxide sheet placement groove and the ceramic sheet to be vaporized placement groove are respectively provided with gaps between the copper oxide sheet and the left and right sides of the ceramic sheet to be vaporized.
5. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The area of the rectangular slots is smaller than that of the copper oxide sheet and the ceramic sheet to be vapor-deposited.
6. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The upper and lower fixtures are made of 601 stainless steel.
7. The aluminum nitride substrate surface metallization fixture according to claim 2, characterized in that: The copper oxide sheet placement groove and the ceramic sheet to be vaporized placement groove are respectively provided with long strip-shaped limiting protrusions on the front and rear sides of the copper oxide sheet and the ceramic sheet to be vaporized.
8. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The upper fixture has L-shaped limiting protrusions at each of the four corners, and the lower fixture has L-shaped limiting grooves at the bottom corresponding to the L-shaped limiting protrusions. The upper and lower stacked opening and closing vapor deposition fixtures are positioned by the cooperation of the L-shaped limiting protrusions and the L-shaped limiting grooves.
9. The aluminum nitride substrate surface metallization fixture according to claim 1, characterized in that: The height distance between the ceramic sheet to be deposited and the adjacent copper oxide sheet is 1.0 mm. The groove depth of both the copper oxide sheet placement groove and the ceramic sheet placement groove is 0.7 mm. The thickness of the upper and lower fixtures of the stacked opening and closing evaporation fixture and the upper fixture of the bottom opening and closing evaporation fixture is 1.4 mm. The thickness of the lower fixture of the bottom opening and closing evaporation fixture is 2.1 mm.
10. A metallization fixture for evaporating aluminum nitride substrate surface according to claim 1, characterized in that: A gap is provided between the top of the copper oxide sheet and the top of the ceramic sheet to be vaporized.