Silicon carbide bearing table

Abstract

The utility model discloses a silicon carbide bearing platform which comprises a plate part, the front surface of the plate part comprises a central circular table surface and a peripheral front circular ring surface, the back surface of the plate part comprises a central circular sinking groove, a first peripheral back circular ring surface and a second peripheral back circular ring surface which are concentric, and three ejector pin through holes are formed in the plate part. A plurality of groups of linear rows of air suction holes are formed in the central circular truncated cone surface, a plurality of ventilation channels are formed in the side wall of the plate part, vacuumizing holes are formed in the back surface of the plate part, a mounting groove is further formed in the front surface of the plate part, the outer side of the mounting groove penetrates through the periphery of the plate part to form an opening structure, and a positioning through hole is formed in the mounting groove; an avoiding groove is formed in the inner side wall of the mounting groove, two positioning structures are further arranged on the front face of the plate part and located on the annular face of the front face of the periphery, and the positioning structures and positioning columns in the avoiding groove position the wafer in a three-point mode. The silicon carbide wafer bearing platform can reduce the processing difficulty and meet the wafer carrying requirements of wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer, especially to a silicon carbide wafer supporting table. BACKGROUND

[0002] The silicon carbide wafer supporting table is one of the most important components of a workpiece table of a photoetch machine, and is used to support a silicon wafer. An application file with a patent publication number CN116810972A discloses a forming process of a silicon carbide wafer supporting table. The silicon carbide wafer supporting table processed by the forming process has a specific structure including a plate part. The front surface of the plate part includes a center circular table surface and an outer peripheral front surface circular ring surface outside the center circular table surface, and the outer peripheral front surface circular ring surface is lower than the center circular table surface. The back surface of the plate part includes a concentric center circular groove, a first outer peripheral back surface circular ring surface, and a second outer peripheral back surface circular ring surface. The center circular groove is at the center of the plate part. The first outer peripheral back surface circular ring surface is outside the center circular groove. The second outer peripheral back surface circular ring surface is outside the first outer peripheral back surface circular ring surface and is lower than the first outer peripheral back surface circular ring surface. Three top pin through holes arranged in an equilateral triangle and located on the center circular table surface are provided on the plate part. An installation strip hole is provided on the outer peripheral front surface circular ring surface and penetrates the plate part. An inner straight line slot and an outer straight line slot are provided on the inner side and the outer side of the installation strip hole on the back surface of the plate part. The groove bottom of the inner straight line slot is higher than that of the outer straight line slot. Two strip-shaped arc grooves are provided on the first outer peripheral back surface circular ring surface of the back surface of the plate part. A vacuum extraction hole, a positioning hole, and an installation hole are also provided.

[0003] However, the silicon carbide wafer supporting table has the following disadvantages: 1. The wafer supporting table has an installation strip hole, and the installation strip hole penetrates the plate part as a whole. Therefore, it is difficult to process the installation strip hole. 2. The center circular table surface of the wafer supporting table needs to be engraved by a laser engraving machine to form support protrusions. The support protrusions are used to support a wafer. However, it is very difficult to process the support protrusions. In fact, when the support protrusions on the wafer supporting table are processed, other areas between the support protrusions are engraved. Therefore, the area to be engraved by the laser is very large, and the energy consumption of the laser engraving machine is also very large. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model is to provide a silicon carbide wafer supporting table that can reduce the processing difficulty and meet the wafer supporting requirements.

[0005] The utility model discloses a silicon carbide wafer support table, including the board department, the front of this board department includes a center round table surface and the outer peripheral front circular surface ring of being at the center round table surface outside, and the outer peripheral front circular surface ring is lower than the center round table surface, the back of the board department includes the concentric center round groove, the first outer peripheral back circular surface ring and the second outer peripheral back circular surface ring, the center round groove is at the center of the board department, the first outer peripheral back circular surface ring is at the center round groove outside, and the second outer peripheral back circular surface ring is at the first outer peripheral back circular surface ring outside and is lower than the first outer peripheral back circular surface ring, three top needle through -holes that are arranged in equilateral triangle and are at the center round table surface are provided on the board department, a plurality of groups of air suction hole straight lines are provided on the center round table surface, and each group of air suction hole straight line includes a plurality of air suction holes arranged in a line, and the air suction hole spreads outwards from the middle part of the center round table surface, a plurality of air passage is provided on the lateral wall of the board department, the air passage is communicated with each group of air suction hole straight line one to one and is communicated with the air suction hole, the end of the air passage is sealed, the back of the board department is provided with the vacuumizing hole communicated with each air passage, the front of the board department is also provided with the installation recess groove convenient for the installation of positioning mechanism, the outside of the installation recess groove is formed with the opening structure through the outer periphery of the board department, the positioning through -hole is provided in the installation recess groove, and the inside wall of the installation recess groove is provided with the avoiding recess groove convenient for the positioning column of positioning mechanism, the front of the board department is also provided with two positioning structures on the outer peripheral front circular surface ring and positions the wafer on the center round table surface, and the positioning structure and the positioning column in the avoiding recess groove three -point position the wafer.

[0006] As a preferred scheme, the center round table surface is also provided with a plurality of concentric circular grooves, and the air suction hole is in the corresponding concentric circular groove.

[0007] As a preferred scheme, the positioning structure includes a positioning shaft fixedly installed on the outer peripheral front circular surface ring, a positioning disc is rotatably installed on the positioning shaft, the bottom disc surface of the positioning disc extends into the center round table surface, and the two positioning discs and the positioning column form a three -point support.

[0008] As a preferred scheme, the bottom disc surface of the positioning disc is flush with the center round table surface.

[0009] As a preferred scheme, the two positioning discs and the positioning column form an isosceles triangle with the positioning column as the vertex.

[0010] As a preferred scheme, at least one positioning counterbore is arranged on the first outer peripheral back circular surface ring.

[0011] As a preferred scheme, the positioning counterbore includes a circular counterbore and a strip-shaped counterbore.

[0012] With the above technical scheme, the utility model discloses the effect is: because the front of board portion still be provided with the installation recess of convenient positioning mechanism installation, the outside of installation recess is formed opening structure and passes through the outer periphery of board portion, the positioning through -hole is arranged in the installation recess, the inner side wall of installation recess is provided with the recess of convenient avoiding the positioning column of positioning mechanism, the front of board portion is located on the outer periphery front circular ring surface still be provided with two positioning structures for positioning the wafer on the center circular table, the positioning structure with the positioning column in the recess three -point positioning wafer, therefore, just process the installation recess on this board portion, and do not need to process through -hole, and the installation recess can be convenient positioning mechanism installation, and through positioning through -hole can be convenient positioning mechanism accurate assembly, at the same time, the positioning column on the positioning mechanism and the recess adaptation, so the whole not only facilitates positioning mechanism installation, and reduces the processing difficulty.And the positioning column and other two positioning structures cooperate each other and can conveniently position the wafer.

[0013] And because the center circular table is also provided with a plurality of concentric circular grooves, the air inlet hole is in the corresponding concentric circular groove, therefore, the air inlet hole is located in the concentric circular groove, and the wafer is supported by the center circular table after being placed on the center circular table, and the concentric circular groove is under negative pressure, so that the wafer is reliably fixed on the silicon carbide wafer, and the wafer is more uniformly stressed.

[0014] And because the positioning structure includes a positioning shaft fixedly installed on the outer periphery front circular ring surface, the positioning disc is rotatably installed on the positioning shaft, the bottom disc surface of the positioning disc extends into the center circular table, and the two positioning discs and the positioning column constitute a three-point support, therefore, the edge of the wafer can be better positioned by the rotating positioning disc, and the wafer can be conveniently rotated during positioning, so that the position of the wafer can be better adjusted.

[0015] And because the bottom disc surface of the positioning disc is flush with the center circular table, the wafer can be better positioned, and the wafer is prevented from entering the gap between the positioning disc and the center circular table.

[0016] And because the two positioning discs and the positioning column constitute an isosceles triangle with the positioning column as the apex, the position of the wafer can be more smoothly adjusted during position adjustment.

[0017] And because the first outer periphery back circular ring surface is also provided with at least one positioning counterbore, the positioning counterbore includes a circular counterbore and a strip-shaped counterbore, so that the assembly of the silicon carbide wafer table can be better facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0018] The utility model will be further described below in connection with the drawings and examples.

[0019] Figure 1 is a perspective view of an embodiment of the present application;

[0020] Figure 2 is a reverse perspective view of an embodiment of the present application;

[0021] In the drawings: 1, plate part; 2, central circular table surface; 3, outer peripheral front circular surface; 4, mounting groove; 5, avoiding groove; 6, positioning through hole; 7, thimble through hole; 8, air suction hole; 9, concentric circular groove; 10, positioning disc; 11, strip-shaped counterbore; 12, vacuumizing hole; 13, air passage; 14, central circular counterbore; 15, first outer peripheral back circular surface; 16, second outer peripheral back circular surface; 17, circular counterbore. DETAILED DESCRIPTION

[0022] The present application will be further described in detail below through specific embodiments.

[0023] As shown in Figure 1 and Figure 2 , a silicon carbide carrier table includes a plate part 1, the front surface of which includes a central circular table surface 2 and an outer peripheral front circular surface 3 outside the central circular table surface 2, the outer peripheral front circular surface 3 being lower than the central circular table surface 2; the back surface of the plate part 1 includes a concentric central circular counterbore 14, a first outer peripheral back circular surface 15 and a second outer peripheral back circular surface 16, the central circular counterbore 14 being at the center of the plate part 1, the first outer peripheral back circular surface 15 being outside the central circular counterbore 14, and the second outer peripheral back circular surface 16 being outside the first outer peripheral back circular surface 15 and lower than the first outer peripheral back circular surface 15; the plate part 1 is provided with three thimble through holes 7 arranged in an equilateral triangle and on the central circular table surface 2, the central circular table surface 2 is provided with a plurality of groups of air suction hole 8 straight lines, each group of air suction hole 8 straight line includes a plurality of air suction holes 8 arranged in a straight line, the air suction holes 8 spread outward from the middle part of the central circular table surface 2, the sidewall of the plate part 1 is provided with a plurality of air passages, the air passages correspond to each group of air suction hole 8 straight line to communicate the air suction holes 8, the end of the air passage is sealed, the back surface of the plate part 1 is provided with a vacuumizing hole 12 communicating with each air passage, the vacuumizing hole 12 is used for mounting an air suction nozzle, the air suction nozzle is used for communicating with an air suction system, the air passages communicate with each other, so the number of vacuumizing holes 12 is one, so that one air suction nozzle can realize air suction of all air passages.

[0024] The front surface of the plate part 1 is also provided with a mounting groove 4 for facilitating the installation of the positioning mechanism, the outer side of the mounting groove 4 is formed as an opening structure penetrating through the outer periphery of the plate part 1, a positioning through hole 6 is arranged in the mounting groove 4, and the inner side wall of the mounting groove 4 is provided with an avoiding groove 5 for facilitating the avoidance of the positioning column of the positioning mechanism, and the front surface of the plate part 1 is also provided with two positioning structures on the outer periphery front surface circular surface 3 for positioning the wafer on the center circular table surface 2, and the positioning structures and the positioning column in the avoiding groove 5 three-point position the wafer.

[0025] The positioning mechanism in the embodiment is a common positioning mechanism of the silicon carbide wafer supporting table at present, mainly including a mounting plate and a positioning column, wherein, since the mounting groove 4 is arranged in the embodiment, the mounting plate is directly installed in the mounting groove 4, and the mounting plate is integrally positioned and installed by adapting the positioning through hole 6 in the mounting groove 4 through a positioning pin. The positioning column is located in the avoiding groove 5, and the positioning column has a radial elastic sliding displacement, so as to push and adjust the position of the wafer when the wafer is placed, and finally the positioning column falls into the avoiding groove 5 to jointly constrain and position the wafer with the other positioning structure.

[0026] As shown in Figure 1 The center circular table surface 2 is also provided with a plurality of concentric circular grooves 9, and the air suction holes 8 are all located in the corresponding concentric circular grooves 9. When the wafer is placed on the center circular table surface 2 and the air suction holes 8 are suctioned, the entire concentric circular groove 9 will generate a negative pressure to adsorb the wafer as a whole. The vacuum adsorption effect is good, and the stress is also more reasonable. At the same time, since the concentric circular groove 9 is adopted, the machining difficulty of the concentric circular groove 9 is lower than that of the support protrusion in the background art, and the machining precision requirement of the concentric circular groove 9 is also lower.

[0027] As shown in Figure 1 The positioning structure includes a positioning shaft fixedly installed on the outer periphery front surface circular surface 3, the positioning shaft is rotatably installed with a positioning disc 10, the bottom disc surface of the positioning disc 10 extends into the center circular table surface 2, and the two positioning discs 10 and the positioning column constitute a three-point support. The bottom disc surface of the positioning disc 10 is flush with the center circular table surface 2, and preferably the positioning disc 10 and the center circular table surface 2 are in contact with each other.

[0028] The two positioning discs 10 and the positioning column constitute an isosceles triangle with the positioning column as the apex. At least one positioning counterbore is arranged on the first outer periphery back surface circular surface 15. The positioning counterbore includes a circular counterbore 17 and a strip-shaped counterbore 11.

[0029] The positioning counterbore is mainly used for facilitating the better positioning of the wafer supporting table during installation, and ensuring the accuracy of the installation angle.

[0030] The above-described embodiments are only preferred embodiments of the present application, and are not intended to limit the scope of the present application. Various modifications and improvements can be made to the technical solutions of the present application without departing from the design spirit of the present application, and all such modifications and improvements shall fall within the protection scope of the present application as defined by the claims.

Claims

1. A silicon carbide carrier table comprising a plate portion, a front surface of the plate portion including a central circular table surface and an outer peripheral front surface annular surface outside the central circular table surface, the outer peripheral front surface annular surface being lower than the central circular table surface; a back surface of the plate portion including a concentric central circular recess at a center of the plate portion, a first outer peripheral back surface annular surface outside the central circular recess, and a second outer peripheral back surface annular surface outside the first outer peripheral back surface annular surface and lower than the first outer peripheral back surface annular surface; and three pin through holes arranged in an equilateral triangle and on the central circular table surface, characterized in that: The center circular platform is provided with several groups of straight lines of air suction holes, each group of straight lines of air suction holes includes a plurality of air suction holes arranged in a straight line, the air suction holes spread from the middle part of the center circular platform, the side wall of the plate part is provided with several air passage channels, the air passage channels correspond to each group of straight lines of air suction holes and communicate with the air suction holes, the end part of the air passage channel is sealed, the back surface of the plate part is provided with a vacuum hole communicating with each air passage channel, the front surface of the plate part is also provided with a mounting groove for mounting a positioning mechanism, the outside of the mounting groove is provided with an opening structure penetrating the outer periphery of the plate part, the mounting groove is provided with a positioning through hole, the inner side wall of the mounting groove is provided with an avoiding groove for avoiding a positioning column of the positioning mechanism, the front surface of the plate part is also provided with two positioning structures for positioning a wafer on the center circular platform on the outer periphery front circular surface, the positioning structures and the positioning column in the avoiding groove three-point position the wafer.

2. A silicon carbide wafer support table as in claim 1, wherein: The center circular platform is also provided with several concentric circular grooves, and the air suction holes are in the corresponding concentric circular grooves.

3. A silicon carbide wafer support table as defined in claim 2, wherein: The positioning structure includes a positioning shaft fixedly installed on the outer periphery front circular surface, and a positioning disc is rotatably installed on the positioning shaft, the bottom disc surface of the positioning disc extends into the center circular platform, and the two positioning discs and the positioning column form a three-point support.

4. A silicon carbide wafer support table as defined in claim 3, wherein: The bottom disc surface of the positioning disc is flush with the center circular platform.

5. A silicon carbide wafer support table as defined in claim 4, wherein: The two positioning discs and the positioning column form an isosceles triangle with the positioning column as the apex.

6. A silicon carbide wafer support table as defined in claim 5, wherein: The first outer periphery back circular surface is also provided with at least one positioning counterbore.

7. A silicon carbide wafer support table as defined in claim 6, wherein: The positioning counterbore includes a circular counterbore and a strip-shaped counterbore.

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