High-speed flash disk

Abstract

The utility model discloses a high-speed flash disk, and relates to the technical field of electronics. Comprising a circuit board, a controller chip, a flash memory chip, a 5P onboard connector, an LED and thermosetting filling glue. The controller chip is positioned on the middle rear section of one surface of the circuit board, and the flash memory chip is positioned on the other surface of the circuit board; a 4P golden finger bonding pad is arranged on the left side of the controller chip; the 5P onboard connector is positioned between the 4P golden finger bonding pad and the controller chip; the LED is positioned at the top end of the circuit board; and the thermosetting filling adhesive is positioned between the flash memory chip and the circuit board and is used for fixing the flash memory chip and the circuit board. Compared with a traditional high-speed flash disk, the high-speed flash disk provides a heat dissipation design structure better than that of the traditional high-speed flash disk, effectively solves the problem of high power consumption and heat productivity, and realizes compact and miniaturized design, so that the high-speed flash disk has high transmission rate, miniaturization, good heat dissipation performance and strong practicability, and has certain advantages.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic technical field, specifically, the utility model relates to a high speed flash disk. BACKGROUND

[0002] The USB TYPE A connector is the interface of UFD (USB Flash Disk, USB flash disk or USB storage disk), and is the most popular USB interface. The male head width is 12mm, the height is 4.5mm, has good connection stability and supports high power supply capacity. With the development of technology, the USB TYPE A connector can support USB3.2 Gen2 X1 protocol specification, and the transmission rate is up to 10Gbps (1250MB / s), which is significantly improved compared with 5Gbps (500MB / s) of USB3.1 Gen2.

[0003] However, the traditional USB TYPE A connector adopts LCP (Liquid Crystal Polymer, high-performance special engineering plastic) glue core and spring, and the glue core occupies a large space. The number of controller chips, flash memory chips and other circuit components of USB3.2 Gen2 X1 is relatively large, which leads to the large size of the circuit board. When matched with the same size of the USB TYPE A connector, the whole flash disk cannot realize miniaturization, and cannot meet the requirements of modern electronic equipment on lightness, thinness and portability.

[0004] In addition, the performance improvement of USB3.2 Gen2 X1 protocol specification also brings the problem of large power consumption and heat, which needs passive heat dissipation assistance to ensure stable high-speed operation. However, the common metal shell is small, light and thin, and the heat dissipation effect is poor. When touched by hand, the high temperature can be obviously felt, which affects the user experience.

[0005] In view of the above problems, there is an urgent need for a high-speed flash disk which has high transmission rate, miniaturization and good heat dissipation performance, and effectively utilizes the glue core space. UTILITY MODEL CONTENTS

[0006] In order to overcome the shortcomings of the prior art, the utility model provides a high-speed flash disk which has high transmission rate, miniaturization and good heat dissipation performance, and effectively utilizes the glue core space, and has strong practicability.

[0007] The utility model discloses a technical scheme that solves its technical problem is: a high -speed flash memory disc, its improvement lies in, including circuit board, controller chip, flash memory chip, 5P board connector and thermosetting filling glue, the controller chip and flash memory chip are fixed respectively on the opposite first surface and second surface of circuit board, the first surface of circuit board is provided with 4P gold finger pad in one end, 5P board connector is fixed in the first surface of controller chip, and is located between 4P gold finger pad and controller chip, thermosetting filling glue is filled between flash memory chip and circuit board, is used for fixing flash memory chip.

[0008] The first surface of the circuit board is provided with an inclined edge on the top end close to the 4P gold finger pad in the above technical solution, and the inclined edge is used for plug-in guiding.

[0009] The top end of the 4P gold finger pad fixed on the circuit board has a protrusion extending in the width direction in the above technical solution, and the protrusion forms a symmetrical limiting plate edge.

[0010] The 5P board connector top is provided with a limiting concave point in the above technical solution, and the limiting concave point is used for stamping limiting fixation with the metal tubular part assembly.

[0011] The flash memory chip adopts BGA 146Ball in the above technical solution.

[0012] The first surface of the circuit board is provided with an LED in one end in the above technical solution, and the LED is close to the controller chip.

[0013] The thickness of the circuit board is 0.4-0.5mm in the above technical solution.

[0014] The sum of the thickness of the circuit board and the flash memory chip is 1.6-1.7mm in the above technical solution.

[0015] The utility model has the advantages that the utility model improves the data transmission rate of flash memory disc through adopting BGA 146Ball flash memory chip and advanced controller chip, the inverted bevel design of the front end of the circuit board not only optimizes the plug-in experience, but also further reduces the size of the flash memory disc, realizes miniaturization design, is convenient for carrying and using, the effective use of the heat sink around the controller chip and the thermosetting filling glue significantly improves the heat dissipation performance, ensures the stable operation of the flash memory disc under high strength use, makes full use of the glue core space, through the reasonable component layout and the setting of the limiting plate edge, ensures the compactness and stability of the structure of the flash memory disc, the ingenious design of the LED indicator lamp provides the intuitive working state indication for the user, enhances the practicality and user experience of the product, realizes the perfect balance of high-speed flash memory disc in performance, size and heat dissipation, and has higher practical value. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a top view of the high-speed flash disk of the utility model;

[0017] Figure 2 is a front view of the high-speed flash disk of the utility model;

[0018] Figure 3 is a left view of the high-speed flash disk of the utility model;

[0019] Figure 4 is a top view of the bottom surface of the high-speed flash disk of the utility model;

[0020] Figure 5 is a comparison schematic view of the high-speed flash disk and the existing flash disk in the utility model.

[0021] Drawing number: 1, circuit board; 2, controller chip; 3, flash memory chip; 4, 5P on-board connector; 5, LED; 6, heat-curing filling glue; 7, 4P gold finger pad; 8, bevel; 9, limiting plate edge; 10, limiting concave point. DETAILED DESCRIPTION

[0022] The application will be further described below in conjunction with the drawings and examples.

[0023] The concept, specific structure and generated technical effects of the application will be clearly and completely described below in conjunction with the examples and drawings, so as to fully understand the purposes, features and effects of the application. Obviously, the described examples are only some of the examples of the application, but not all the examples, and other examples obtained by those skilled in the art based on the examples of the application without creative labor are within the protection scope of the application. In addition, all the coupling / connection relations involved in the patent are not single direct connection between components, but the more optimal coupling structure can be composed by adding or reducing coupling auxiliary components according to the specific implementation situation. The various technical features in the application can be interactively combined without mutual contradiction and conflict.

[0024] It should be noted that all the directionality indications (such as up, down, left, right, front, back, etc.) in the examples of the application are only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directionality indications also change accordingly.

[0025] It is also needed to state that when an element is named as "fixed on" or "set on" another element, it can be directly on another element or a middle element can exist simultaneously. When an element is named as "connected" another element, it can be directly connected another element or a middle element can exist simultaneously.

[0026] In addition, the description involving "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the present application.

[0027] The utility model provides a kind of high-speed flash disk, including circuit board, controller chip, flash memory chip, 5P on-board connector and thermosetting filling glue.

[0028] Among them, controller chip and flash memory chip are fixed on the opposite first surface and second surface of circuit board, and the first surface of circuit board is provided with 4P gold finger pad at one end, 5P on-board connector is fixed on the first surface of controller chip, and is between 4P gold finger pad and controller chip, thermosetting filling glue is filled between flash memory chip and the circuit board, for fixing flash memory chip.

[0029] Specifically, the first surface of circuit board and the top end close to 4P gold finger pad are provided with bevel, and the bevel is used for plug-in direction, the top end of 4P gold finger pad of circuit board has protrusion extending along width direction, the protrusion forms symmetrical limit plate edge, 5P on-board connector top is provided with limit concave point, limit concave point is used for stamping limit fixing with metal tubular assembly assembly, flash memory chip adopts BGA 146Ball, one end of the first surface of circuit board is provided with LED, LED is close to the controller chip, the thickness of circuit board is 0.4-0.5mm, and the sum of the thickness of circuit board and flash memory chip is 1.6-1.7mm.

[0030] Please refer to Figures 1-4 , high-speed flash disk, including circuit board 1, controller chip 2, flash memory chip 3, 5P on-board connector 4, LED 5 and thermosetting filling glue 6.

[0031] The thickness of the circuit board 1 is 0.4mm-0.5mm, and the total thickness of the flash memory chip 3 is 1.6mm-1.7mm, which replaces the glue core. The circuit board 1 is provided with a bevel 8 at the front end, which is convenient for plugging and guiding. The USB TYPE A connector has a total of 9P (5P spring sheet, 4P flat copper terminal), and the circuit board 1 is designed with 4P gold finger pad 7, which replaces the 4P flat copper terminal of the connector. The 5P on-board connector 4 replaces the 5P spring sheet, and the 5P on-board connector 4 has a reserved limiting concave point 10 at the top, which is assembled with a metal tubular part and is used for stamping limiting and fixing. The LED 5 is placed in the middle of the tail, which is used for indicating the working state.

[0032] The controller chip 2 is the largest heat-generating component, and as long as the heat dissipation of the controller chip is solved, the overall heat dissipation is solved, and the touch temperature is reduced. Therefore, the position for mounting the heat sink is reserved for the largest heat-generating controller chip, and the passive heat dissipation structure is used on the small-size storage product. The controller chip 2 is placed at the top of the circuit board 1, and the rear end is used for the shell structure to increase the heat dissipation structure.

[0033] The flash memory chip 3 is placed at the bottom of the circuit board 1, and when plugging, it is used to support the upper circuit board. The width of the glue core is 11.3mm, so the width of the circuit board is 11.3mm. The width of the conventional flash memory chip is 11.5mm-14mm. In order to match the width of the circuit board, the BGA 146Ball (width 10mm) is adopted. After the flash memory chip 3 is attached and welded, the thermosetting filling glue 6 is filled between the front end and the circuit board 1, which is solidified at about 140 DEG C. The flash memory chip 3 and the circuit board 1 form an integral whole, and the stability is improved.

[0034] Further, other peripheral components, the top surface selects the component with a height lower than the P on-board connector 4, and the bottom surface selects the component with a height lower than the flash memory chip 3, so as to avoid short circuit with the metal shell during assembly.

[0035] In the above process, the circuit board gold finger, 5P on-board connector and flash memory chip are used to replace the traditional USB TYPE A connector glue core and spring sheet terminal structure, save space, realize compact and small design, and the front end is reserved with a limiting plate edge. Small-size flash memory chip is used, and the assembly direction is opposite to that of the traditional one. The metal shell is matched, and the up-down limiting is used to improve the precision and contact of the connector. The position for mounting the heat sink is reserved for the largest heat-generating controller chip, and the passive heat dissipation structure is used on the small-size storage product. The filling glue commonly used in the work rule vehicle-mounted product is used to improve the structural stability.

[0036] Through the above process, the utility model discloses through adopting BGA 146Ball flash memory chip and advanced controller chip, has promoted the data transmission rate of flash disk, the design of the inverted bevel that is set up at the front end of circuit board not only has optimized the plug -in experience, further reduced the volume of flash disk still, has realized miniaturization design, is convenient for carrying and using, through the effective use of the fin and the thermosetting filling glue that are installed around controller chip, has improved the heat dissipation performance significantly, has guaranteed the stable operation of flash disk under the high intensity use, has made full use of the glue core space, through the reasonable component layout and the setting of limiting plate edge, has guaranteed the compactness and stability of the structure of flash disk, the ingenious design of LED pilot lamp has provided the intuitive working state indication for user, has strengthened the practicality and user experience of product, has realized the perfect balance of high -speed flash disk in performance, size and heat dissipation, has higher practical value.

[0037] As Figure 5 The size of the present application is shown in the figure (a) as a conventional small size USB 3.1 Gen2, and the size of the present application is shown in the figure (b). Compared with the conventional small size USB 3.1 Gen2, the length is reduced by 41%, and the overall size is reduced by more than 46%. The present application provides a better heat dissipation design structure than the conventional high-speed flash disk, and reserves a passive heat dissipation structure. The present application is a super-speed miniaturization design, and provides specific technical solutions and ideas to promote the development of related technologies. The present application has certain advantages.

[0038] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A high-speed flash drive, characterized in that, This includes circuit boards, controller chips, flash memory chips, 5P onboard connectors, and thermosetting filler adhesive; The controller chip and the flash memory chip are respectively fixed to the first and second surfaces opposite to each other on the circuit board; A 4P gold finger pad is provided at one end of the first surface of the circuit board; the 5P onboard connector is fixed to the first surface of the controller chip and is located between the 4P gold finger pad and the controller chip. The thermosetting filler adhesive is filled between the flash memory chip and the circuit board to fix the flash memory chip.

2. The high-speed flash drive according to claim 1, characterized in that, A bevel is provided on the first surface of the circuit board near the top of the 4P gold finger pads, the bevel being used for insertion and removal guidance.

3. The high-speed flash drive according to claim 2, characterized in that, The circuit board has a protrusion extending along the width direction at the top of the 4P gold finger pads, which forms a symmetrical limiting plate edge.

4. The high-speed flash drive according to claim 1, characterized in that, The 5P board connector has a limiting recess on its top, which is used for stamping and limiting fixation when assembled with a metal tubular component.

5. The high-speed flash drive according to claim 1, characterized in that, The flash memory chip is a BGA 146Ball.

6. The high-speed flash drive according to claim 1, characterized in that, An LED is provided at one end of the first surface of the circuit board; the LED is close to the controller chip.

7. The high-speed flash drive according to claim 1, characterized in that, The thickness of the circuit board is 0.4-0.5mm.

8. The high-speed flash drive according to claim 1, characterized in that, The combined thickness of the circuit board and the flash memory chip is 1.6-1.7 mm.

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