Tin wire induction device for semiconductor

Abstract

The utility model relates to a tin wire induction device for a semiconductor, which comprises an installation fixing seat, a tin wire disc fixing assembly is connected onto the installation fixing seat, a tin wire contact induction assembly is connected onto the installation fixing seat, and the tin wire contact induction assembly is arranged below the tin wire disc fixing assembly. According to the utility model, the working efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of tin wire induction devices for semiconductor. BACKGROUND

[0002] Solder wire is composed of tin alloy and additive, alloy composition is divided into tin lead, lead-free additive is uniformly injected into tin alloy middle part, existing solder wire feeder is often used when welding some circuit board and other electronic components, so as to automatically deliver solder wire to some automatic welding equipment or production line.

[0003] Through retrieval, patent: a tin cutting and feeding mechanism with tin shortage alarm and tin blocking alarm (CN202111124786.4), including mounting plate, the mounting plate is provided with hanging tin shaft for the line shaft of tin wire winding to be fitted, the hanging tin shaft is provided with mounting piece for preventing the line shaft of tin wire winding from being separated from the hanging tin shaft, the plate body is provided with guiding mechanism for guiding the pay-off of tin wire, the guiding mechanism includes guiding block and tin shortage alarm device, the guiding block is provided with through hole for tin wire to pass through, the tin shortage alarm device is used for sensing and alarming when there is no tin wire passing through the through hole, the mounting plate is provided with conveying mechanism for driving tin wire to move to make the line shaft pay-off. The above structure is relatively complex, and the replacement is relatively tedious, which affects the operation efficiency.

[0004] In view of the above-mentioned defects, the present design person actively researches and innovates to create a new structure of semiconductor tin wire induction device, so that it has more industrial utilization value. INVENTION CONTENTS

[0005] To solve the above technical problems, the purpose of the utility model is to provide a semiconductor tin wire induction device.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A semiconductor tin wire induction device, comprising a mounting and fixing seat, the mounting and fixing seat is connected with a tin wire disc fixing assembly, the mounting and fixing seat is connected with a tin wire contact induction assembly, the tin wire contact induction assembly is located below the tin wire disc fixing assembly;

[0008] The tin wire disc fixing assembly comprises a tin wire disc fixing plate, one end of the tin wire disc fixing plate is connected to the mounting and fixing seat, the other end of the tin wire disc fixing plate is connected with a bearing, and the bearing is connected with a tin disc shaft;

[0009] The tin wire contact induction assembly comprises a guide plate, a guide wheel base is connected to the guide plate, a notch is formed on one side of the guide wheel base, a sliding groove is formed on the notch, a guide movable base is slidably connected to the sliding groove, the guide movable base is connected to the guide wheel base through a tension spring, parallel guide shafts are connected to the guide wheel base and the guide movable base, tin wire rollers are connected to the guide shafts, two tin wire rollers are below the tension spring, the two tin wire rollers are in contact, a guide rod fixing block is connected to the guide plate, two parallel and spaced guide rods are connected to the guide rod fixing block, and the guide rods are arranged above the tin wire rollers.

[0010] Preferably, the tin wire induction device for semiconductor comprises a tin disc shaft.

[0011] Preferably, the tin wire induction device for semiconductor comprises a tin disc shaft.

[0012] Preferably, the tin wire induction device for semiconductor comprises an adjusting limiting piece, the adjusting limiting piece comprises an adjusting block and a limiting block, the adjusting block is connected to the tin disc fixing plate, and the limiting block is connected to the adjusting block.

[0013] Preferably, the tin wire induction device for semiconductor comprises an adjusting limiting piece, the adjusting limiting piece comprises an adjusting block and a limiting block, the adjusting block is connected to the tin disc fixing plate, and the limiting block is connected to the adjusting block.

[0014] Preferably, the tin wire induction device for semiconductor comprises a proximity switch connected to the guide wheel base.

[0015] By the above scheme, the tin wire induction device for semiconductor has at least the following advantages:

[0016] The tin wire induction device for semiconductor can accurately induce tin wire, ensure normal operation of products, facilitate timely maintenance of operators during tin plugging, prevent influence on other automatic welding equipment, and indirectly improve welding efficiency of other automatic welding equipment.

[0017] The above description is only a summary of the technical scheme of the tin wire induction device for semiconductor, in order to more clearly understand the technical means of the tin wire induction device for semiconductor, and the tin wire induction device for semiconductor can be implemented according to the content of the specification, and the following will be described in detail with the preferred embodiments of the tin wire induction device for semiconductor and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the premise of the drawings.

[0019] Figure 1 is a structural schematic diagram of the present application;

[0020] Figure 2 is a partial enlarged view of the tin wire disc fixing assembly of the present application;

[0021] Figure 3 is a structural schematic diagram of the tin wire contact sensing assembly of the present application. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0024] EMBODIMENT

[0025] As shown in Figure 1 , Figure 2 and Figure 3 , a tin wire sensing device for semiconductor includes a mounting fixed seat 1, the mounting fixed seat 1 is connected with a tin wire disc fixing assembly 2, the mounting fixed seat 1 is connected with a tin wire contact sensing assembly 3, the tin wire contact sensing assembly 3 is arranged below the tin wire disc fixing assembly 2;

[0026] The tin wire disc fixing assembly 2 includes a tin wire disc fixing plate 21, one end of the tin wire disc fixing plate 21 is connected to the mounting fixed seat 1, the other end of the tin wire disc fixing plate 21 is connected with a bearing 22, and the bearing 22 is connected with a tin disc shaft 23;

[0027] The tin wire contact induction assembly 3 comprises a guide plate 31, a guide wheel base 32 is connected to the guide plate 31, a notch is formed on one side of the guide wheel base 32, a sliding groove is formed on the notch, a guide movable base 33 is slidably connected to the sliding groove, the guide movable base 33 is connected to the guide wheel base 32 through a tension spring 34, parallel guide shafts 35 are connected to the guide wheel base 32 and the guide movable base 33, tin wire rollers 36 are connected to the guide shafts 35, two tin wire rollers 36 are below the tension spring, the two tin wire rollers 36 are in contact, a guide rod fixing block 37 is connected to the guide plate 31, two parallel and spaced guide rods 38 are connected to the guide rod fixing block 37, and the guide rods 38 are arranged above the tin wire rollers 36.

[0028] The tin disc shaft 23 is connected with a tin disc fixing block 24 in the utility model, and the tin disc can be fixed.

[0029] The tin disc shaft 23 is connected with a tin disc buffer wheel 25 in the utility model, the tin disc fixing plate 21 is connected with an adjusting limiting piece for limiting the speed of the tin disc buffer wheel 25, wherein the adjusting limiting piece comprises an adjusting block 26 and a limiting block 27, the adjusting block 26 is connected to the tin disc fixing plate 21, and the limiting block 27 is connected to the adjusting block 26; the rotating resistance of the tin disc buffer wheel can be adjusted through the adjusting limiting piece, so that the rotating speed of the tin disc is controlled.

[0030] An adjusting hole is formed in the adjusting block 26, and the adjusting block is connected to the tin disc fixing plate 21 through the adjusting hole

[0031] The guide wheel base 32 is connected with a proximity switch 39, and the state that the tin wire passes through the tin wire rollers can be monitored in real time through the proximity switch.

[0032] The working principle of the utility model is as follows:

[0033] In specific work, the tin disc is connected to the tin disc shaft and is fixed through the tin disc fixing block, the resistance of the tin disc buffer wheel is adjusted, the tin wire passes between the guide rods and the tin wire rollers after the adjustment is completed, the tin wire rollers press the tin wire at this time, there is a gap between the guide movable base and the guide wheel base at this time, the proximity switch does not work, the lamp connected with the proximity switch is long and bright, and it is ensured that the tin wire is in the specified position, if the tin wire rollers are in contact, the lamp is not bright, and manual inspection is required.

[0034] It should be noted that similar labels and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0035] In the description of the present application, it should be noted that the terms "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0036] In addition, the terms "horizontal", "vertical", and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0037] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] The above is only the preferred embodiment of the present application, and is not used to limit the present application, and it should be noted that for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection range of the present application.

Claims

1. A tin wire inductor device for semiconductors, characterized by: The application relates to a tin wire installation fixing base (1) which is connected with a tin wire disc fixing assembly (2) and a tin wire contact sensing assembly (3), wherein the tin wire contact sensing assembly (3) is arranged below the tin wire disc fixing assembly (2). The tin wire disc fixing assembly (2) comprises a tin wire disc fixing plate (21) which is connected with the tin wire disc fixing base (1) at one end, and a bearing (22) is connected with the other end of the tin wire disc fixing plate (21), and a tin disc shaft (23) is connected with the bearing (22). The tin wire contact sensing assembly (3) comprises a guide plate (31) which is connected with a guide wheel base (32), a gap is formed in one side of the guide wheel base (32), a sliding groove is formed in the gap, a guide movable base (33) is slidably connected with the sliding groove, the guide movable base (33) is connected with the guide wheel base (32) through a tension spring (34), parallel guide shafts (35) are connected with the guide wheel base (32) and the guide movable base (33), tin wire rollers (36) are connected with the guide shafts (35), two tin wire rollers (36) are arranged below the tension spring and are in contact with each other, a guide rod fixing block (37) is connected with the guide plate (31), two parallel and spaced guide rods (38) are connected with the guide rod fixing block (37), and the guide rods (38) are arranged above the tin wire rollers (36).

2. A tin wire inductor for semiconductor devices as claimed in claim 1, wherein: The tin disc shaft (23) is connected with a tin disc fixing block (24).

3. A tin wire inductor for semiconductor devices as claimed in claim 1, wherein: The tin disc shaft (23) is connected with a tin disc buffer wheel (25), and the tin wire disc fixing plate (21) is connected with an adjusting limiting piece for limiting the speed of the tin disc buffer wheel (25).

4. A tin wire inductor for semiconductor devices according to claim 3, wherein: The adjusting limiting piece comprises an adjusting block (26) and a limiting block (27), the adjusting block (26) is connected with the tin wire disc fixing plate (21), and the limiting block (27) is connected with the adjusting block (26).

5. A tin wire inductor for semiconductor devices as claimed in claim 4, wherein: An adjusting hole is formed in the adjusting block (26), and the adjusting block is connected with the tin wire disc fixing plate (21) through the adjusting hole.

6. A tin wire inductor for semiconductor devices as defined in claim 1, wherein: The guide wheel base (32) is connected with a proximity switch (39).

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