Chip testing device

Abstract

The utility model provides a chip testing device. The chip testing device comprises a probe card, a first support fixed to the upper surface of the probe card, a first lifting assembly arranged on the first support and a light source assembly. The probe card is provided with a light hole. The first support is arranged on one side of the light hole, a first sliding groove is vertically formed in the side, facing the light hole, of the first support, and a first sliding block is arranged in the first sliding groove; the light source assembly comprises a supporting plate, a light-emitting diode fixed to the lower surface of the supporting plate and a relay, the supporting plate is fixed to the first sliding block, the light-emitting diode is located on the axis of the light hole, and the relay is electrically connected with the light-emitting diode and used for controlling the working state of the light-emitting diode; the first lifting assembly is connected with the first sliding block and used for driving the first sliding block to vertically slide along the first sliding groove. The chip testing device provided by the utility model can be used for improving the sensitivity degree of the light source for testing the chip and the convenience of the optimal working distance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor integrated circuit testing, and particularly relates to a chip testing device. BACKGROUND

[0002] Silicon-based optoelectronic technology is a technology of integrating optical and electronic functions on a silicon chip, which brings revolutionary changes to multiple fields such as high-speed data communication, optical sensing and biophotonics. For optical sensing chips, after design and production are completed, in order to verify whether there is a deviation between the design value and the actual value, the performance of the chip needs to be tested, and in particular, the determination of the sensitivity of the light source and the optimal working distance has always been the focus of chip testing. However, the existing chip testing device has a relatively complex structure, and it is inconvenient to operate when testing the sensitivity of the light source and the optimal working distance of the chip. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides a chip testing device for improving the convenience when testing the sensitivity of the light source and the optimal working distance of the chip.

[0004] In order to achieve the above-mentioned purpose, the chip testing device provided by the embodiments of the present application comprises a probe card, a first support fixed on the upper surface of the probe card, a first lifting assembly arranged on the first support, and a light source assembly.

[0005] A light transmission hole is formed in the probe card;

[0006] The first support is arranged on one side of the light transmission hole, a first sliding groove is vertically formed on the side of the first support facing the light transmission hole, and a first sliding block is arranged in the first sliding groove.

[0007] The light source assembly comprises a support plate, a light-emitting diode fixed on the lower surface of the support plate, and a relay, the support plate is fixed on the first sliding block, the light-emitting diode is located on the axis of the light transmission hole, the relay is electrically connected with the light-emitting diode, and is used for controlling the working state of the light-emitting diode.

[0008] The first lifting assembly is connected with the first sliding block, and is used for driving the first sliding block to vertically slide along the first sliding groove.

[0009] In a possible implementation, two insertion holes corresponding to the two pins of the light-emitting diode are formed in the support plate, and the two pins of the light-emitting diode are respectively inserted into the corresponding insertion holes.

[0010] In a possible implementation, the first lifting assembly comprises a first knob and a first transmission assembly, the first knob is arranged on a side of the first support away from the light transmission hole, one end of the first transmission assembly is connected with the first knob, and the other end of the first transmission assembly is connected with the first sliding block through a side wall of the first sliding groove, and the first transmission assembly is used to drive the first sliding block to vertically slide in the first sliding groove when the first knob rotates.

[0011] In a possible implementation, the chip testing device further comprises a second support and a second lifting assembly arranged on the second support, the second support and the first support are oppositely arranged on two sides of the light transmission hole; a second sliding groove is vertically arranged on a side of the second support facing the first support, and a second sliding block is arranged in the second sliding groove;

[0012] One end of the support plate is fixed on the first sliding block, and the other end of the support plate is fixed on the second sliding block.

[0013] The second lifting assembly is connected with the second sliding block and is used to drive the second sliding block to vertically slide in the second sliding groove.

[0014] In a possible implementation, the second lifting assembly comprises a second knob and a second transmission assembly, the second knob is arranged on a side of the second support away from the light transmission hole, one end of the second transmission assembly is connected with the second knob, and the other end of the second transmission assembly is connected with the second sliding block through a side wall of the second sliding groove, and the second transmission assembly is used to drive the second sliding block to vertically slide in the second sliding groove when the second knob rotates.

[0015] In a possible implementation, a bottom end of the first sliding block extends towards the second support to form a first extension part, a bottom end of the second sliding block extends towards the first support to form a second extension part, one end of the support plate is fixed on an upper surface of the first extension part, and the other end of the support plate is fixed on an upper surface of the second extension part.

[0016] In a possible implementation, a lower surface of the probe card is arranged with probes, a tray is arranged below the probes, and a wafer is placed on the tray, and the probes are used to contact pads or bumps of chips on the wafer.

[0017] In a possible implementation, an upper surface of the probe card is further arranged with a data interface, and the probe card receives test signals of an ATE tester through the data interface.

[0018] In a possible implementation, the relay is electrically connected with the ATE tester, and is configured to control the light-emitting diode to emit light after receiving a driving signal of the ATE tester.

[0019] In a possible implementation, the relay is welded on the upper surface of the probe card, and the relay is electrically connected with the light-emitting diode through a flying wire.

[0020] The chip testing device provided in the present application comprises a probe card, a first support fixed on the upper surface of the probe card, a first lifting assembly arranged on the first support, and a light source assembly. A light-transmitting hole is arranged on the probe card. The first support is arranged on one side of the light-transmitting hole. A first sliding groove is vertically arranged on the side of the first support facing the light-transmitting hole. A first sliding block is arranged in the first sliding groove. The light source assembly comprises a support plate, a light-emitting diode fixed on the lower surface of the support plate, and a relay. The support plate is fixed on the first sliding block. The light-emitting diode is located on the axis of the light-transmitting hole. The relay is electrically connected with the light-emitting diode and is configured to control the working state of the light-emitting diode. The first lifting assembly is connected with the first sliding block and is configured to drive the first sliding block to vertically slide along the first sliding groove. The chip testing device provided in the present application can be used to improve the sensitivity of the light source of the tested chip and the convenience when the chip works at the optimal distance. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a structural schematic diagram of a chip testing device provided in an embodiment of the present application;

[0022] Figure 2 FIG. 2 is a structural schematic diagram of a chip testing system provided in an embodiment of the present application;

[0023] Figure 3 FIG. 3 is a control circuit schematic diagram of a light-emitting diode provided in an embodiment of the present application;

[0024] REFERENCE SIGNS

[0025] 11-probe card; 111-probe; 112-light-transmitting hole; 12-first support; 121-first sliding groove; 122-first sliding block; 13-light source assembly; 131-support plate; 132-light-emitting diode;

[0026] 141-first knob; 15-second support; 151-second sliding groove; 152-second sliding block;

[0027] 16-relay; 171-second knob;

[0028] 21-tray; 22-wafer; 23-motor driving module; 24-function control module; 25-loading module; 26-communication module; 31-ATE testing head; 32-ATE controller. DETAILED DESCRIPTION

[0029] The technical solutions and advantages of the embodiments of the present application will be more apparent from the following description of the embodiments of the present application in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0030] Unlike conventional chip testing, optical sensor type chips have more stringent requirements for testing conditions. In order to ensure that the functions and performances of the chips meet the application, strong testing and packaging strategies are needed, and the sensitivity of the light source and the optimal working distance of the chip are tested. When the chip testing device tests the sensitivity of the light source and the optimal working distance of the chip, the height of the light source is uncontrollable, and the structure of the device is relatively complex, and the convenience during testing is poor.

[0031] To solve the above technical problems, the embodiments of the present application provide a chip testing device for improving the controllability of the distance between the light source and the chip while improving the convenience of testing the sensitivity of the light source and the optimal working distance of the chip. The technical solutions of the present application will be described in detail below in conjunction with the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, but cannot be understood as limiting the present application.

[0032] Figure 1 A structural schematic diagram of a chip testing device provided by the embodiments of the present application is shown in FIG. 1, which can include a probe card 11, a first support 12 fixed on the upper surface of the probe card 11, a light source assembly 13, and a first lifting assembly arranged on the first support 12. Figure 1

[0033] The probe card 11, as an important device of the chip testing device, can preliminarily measure the optical and electrical performances of the chip before the chip is packaged, so as to screen out defective chips, which can not only reduce the cost of chip packaging, but also ensure the reliability of the chip.

[0034] The lower surface of the probe card 11 can be arranged with probes. In some embodiments, the probe card 11 can include a printed circuit board (PCB) and probes, wherein the PCB can serve as a carrier of the probes, and the probes can be arranged on the lower surface of the PCB. The material of the probes can be selected from tungsten, beryllium copper, etc. to improve the electrical conductivity.

[0035] Figure 2 A structural schematic diagram of a chip testing system provided by the embodiments of the present application is shown in FIG. 2, which can include a chip testing device 21 and a chip 22. Figure 2 ​As shown, the chip testing system is loaded with Figure 1 As shown, the chip testing device can be provided with a tray 21 below the probe 111, the tray 21 can be placed on a wafer 22, and the wafer 22 can be formed with a plurality of chips, and the chips can be provided with pads or bumps. During chip testing, the probes 111 on the probe card 11 can directly contact the pads or bumps on the chips to form a circuit channel, so that the chip electrical signal can be extracted, and the electrical signal can be sent to the automatic test equipment (ATE) for analysis, so that the electrical property test results of each chip on the wafer 22 can be obtained.

[0036] Specifically, the ATE tester can include an ATE test head 31 and an ATE controller 32, and the upper surface of the probe card 11 can be provided with a data interface. The ATE tester can send various test signals such as voltage signals, current signals and clock signals to the probe card 11 through the ATE test head 31 and the data interface. The test signals can be transmitted to the chip surface through the probe card 11 to drive the chip to perform corresponding operations. The chip can generate output signals after receiving the signals, and these output signals can be fed back to the ATE tester through the probe card 11. The ATE controller 32 can compare and analyze the received output signals with the expected results, so as to determine whether the chip meets the design requirements, whether there is a functional defect or performance problem.

[0037] The probe card 11 and the ATE tester can transmit test signals and output signals through wired or wireless connection. In the embodiment of the present application, the test signals and output signals can be transmitted through transmission cables to improve the reliability of data transmission. The probe card 11 can be provided with a light transmission hole 112 for facilitating the testing of optical sensing type chips. The diameter of the light transmission hole 112 can be selected according to actual needs.

[0038] The first support 12 can be provided on one side of the light transmission hole 112, and the first support 12 can be vertically provided with a first sliding groove 121 on the side facing the light transmission hole 112. The first sliding groove 121 can be provided with at least one first sliding block 122.

[0039] The first lifting assembly can be connected with the first sliding block 122, and is used to drive the first sliding block 122 to vertically slide along the first sliding groove 121. Specifically, the first lifting assembly can include a first knob 141 and a first transmission assembly (not shown). The first knob 141 can be arranged on the side of the first support 12 away from the light transmission hole 112. One end of the first transmission assembly can be connected with the first knob 141, and the other end can be connected with the first sliding block 122 through the side wall of the first sliding groove 121. The first transmission assembly can convert the rotary motion of the first knob 141 into the linear motion of the first sliding block 122, so that the first knob 141 can drive the first sliding block 122 to vertically slide in the first sliding groove 121 when the first knob 141 rotates.

[0040] When the first knob 141 rotates clockwise, the first sliding block 122 can be controlled to move towards the probe card 11. Of course, in some embodiments, the first knob 141 can control the first sliding block 122 to move towards the probe card 11 when the first knob 141 rotates counterclockwise. The rotation direction of the first knob 141 and the corresponding movement direction of the first sliding block 122 can be selected according to actual needs, and the embodiments of the present application do not make special limitations thereon.

[0041] The light source assembly 13 can include a support plate 131, a light-emitting diode 132 fixed on the lower surface of the support plate 131, and a relay 16. The support plate 131 can be fixed on the first sliding block 122, so that the light-emitting diode 132 can move with the first sliding block 122, thereby adjusting the distance between the light-emitting diode 132 and the chip. In some embodiments, the distance between the light-emitting diode 132 and the chip can be adjusted within the range of 5-10 cm, and the specific adjustment range can be set according to actual needs. The light-emitting diode 132 can be located on the axis of the light transmission hole 112, so that when the light-emitting diode 132 emits light, the emitted light can pass through the light transmission hole 112 to irradiate on the chip as much as possible, thereby improving the utilization rate of light.

[0042] In some embodiments, two insertion holes corresponding to the two pins of the light-emitting diode 132 can be formed on the support plate 131, so that the two pins of the light-emitting diode 132 can be respectively inserted into the corresponding insertion holes.

[0043] The relay 16 can be arranged at any position of the chip testing device. In the embodiments of the present application, the relay 16 can be fixed on the upper surface of the probe card 11, and the fixing methods can include but are not limited to adhesion, welding and mechanical fixation.

[0044] In order to improve the stability of the chip testing device, in an optional implementation, the chip testing device can further include a second support 15 and a second lifting assembly arranged on the second support 15, and the second support 15 and the first support 12 can be arranged opposite to each other on both sides of the light transmission hole 112. A second sliding groove 151 can be vertically arranged on the side of the second support 15 facing the first support 12, and a second sliding block 152 can be arranged in the second sliding groove 151, and the number of the second sliding block 152 can be the same as that of the first sliding block 122. One end of the support plate 131 can be fixed on the first sliding block 122, and the other end of the support plate 131 can be fixed on the second sliding block 152, and the fixing mode can be welding.

[0045] By arranging the first support 12 and the second support 15 arranged opposite to the first support 12, the stability of the support can be improved. By fixing the two ends of the support plate 131 on the first sliding block 122 and the second sliding block 152 respectively, the light-emitting diode 132 can always be located on the axis of the light transmission hole 112, and the light transmission amount of the light transmission hole 112 can be improved.

[0046] The second lifting assembly can be connected with the second sliding block 152, and is used to drive the second sliding block 152 to vertically slide in the second sliding groove 151. Corresponding to the first lifting assembly, the second lifting assembly can include a second knob 171 and a second transmission assembly (not shown), the second knob 171 can be arranged on the side of the second support 15 away from the light transmission hole 112, one end of the second transmission assembly can be connected with the second knob 171, and the other end can be connected with the second sliding block 152 through the side wall of the second sliding groove 151, and the second transmission assembly can drive the second sliding block 152 to vertically slide in the second sliding groove 151 when the second knob 171 is rotated. By arranging the first knob 141 and the second knob 171 on the sides of the first support 12 and the second support 15 away from each other respectively, the height of the light-emitting diode 132 can be adjusted by the tester, and the operation convenience can be improved.

[0047] In a possible implementation, the chip testing device can further be provided with a driving motor, and the sliding block can be vertically moved by the driving motor, so that the use height of the light-emitting diode 132 can be adjusted according to the distance between the light-emitting diode 132 and the chip, and the use is flexible.

[0048] The bottom end of the first sliding block 122 can extend towards the second support 15 to form a first extension part, the bottom end of the second sliding block 152 can extend towards the first support 12 to form a second extension part, one end of the support plate 131 is fixed on the upper surface of the first extension part, and the other end of the support plate 131 is fixed on the upper surface of the second extension part, so that the fixing reliability of the support plate 131 can be improved.

[0049] The relay 16 can be electrically connected with the ATE tester and the light emitting diode 132 respectively, and can control the light emitting diode 132 to emit light after receiving the driving signal (or driving voltage) of the ATE tester. The relay 16 can be connected with the light emitting diode 132 through a flying wire, thereby improving the convenience of line connection.

[0050] The chip testing system can further include a motor driving module 23, a function control module 24, a loading module 25 and a communication module 26. The motor driving module 23 can drive the movement of the tray 21 through a motor, so that the probe 111 can test each chip on the wafer 22. The function control module 24 can include a motion controller, an image processor and a temperature controller, and of course can also include other controllers. The motion controller can be connected with the motor, and is used to output a movement signal to the motor. The movement signal can include the displacement amount of the tray 21 driven by the motor. The image processor can monitor the position of the needle tip of the probe 111. The temperature controller can change the temperature of the wafer 22 according to the preset working temperature of the chip, so as to improve the reliability of chip testing. The loading module 25 can load the wafer 22 on the tray 21. The communication module 26 can realize data communication with the ATE tester.

[0051] Figure 3 The control circuit schematic diagram of the light emitting diode provided by the embodiment of the present application is shown in the figure. Figure 3 For example, the model of the relay K3 is G6K-2P, the model of the light emitting diode D1 is SFH4555, the model of the triode Q1 is BC817-40, the resistance value of the resistor R1 is 50 ohms, and the capacity of the capacitor C3 is 10uf. The capacitor C3 can protect the circuit and improve the stability of the circuit. The ATE tester can be connected with the first pin of the relay K3. On the one hand, a +5V constant current source can be applied to the first pin as the working power supply of the relay K3. On the other hand, it can also be used as the working power supply of the light emitting diode D1. The third pin can be a chip pin to be tested. A square wave with a preset frequency can be applied to the pin to control the light emitting frequency of the light emitting diode D1. The eighth pin can be used as the Q1 UR pin for receiving the driving signal of the ATE tester.

[0052] Specifically, when the voltage difference between the first pin and the eighth pin is less than 0.7V, the relay K3 is not in the working state. The second pin of the normally closed end can be shorted with the third pin, and the sixth pin of the normally closed end can be shorted with the seventh pin. The light emitting diode D1 does not emit light, and thus can be applied to chip performance testing without light source.

[0053] When the voltage difference between the first pin and the eighth pin is greater than 0.7V, the relay K3 is in the working state, the third pin and the fourth pin of the normally open end are short-circuited, the fifth pin and the sixth pin of the normally open end are short-circuited, and the triode Q1 can be turned on at a high level. When the third pin sends a high level, the triode Q1 is turned on, and the light-emitting diode D1 can emit light. When the third pin sends a low level, the triode Q1 is cut off, and the light-emitting diode D1 does not emit light, so that it can be applied to the chip performance test requiring a light source. Through the above implementation manner, not only the high controllability and flexible switching of the light source can be realized, but also the requirements of the light source in each working state of the chip can be compatible, so that the practicability of the chip test device can be improved.

[0054] The application provides a chip test device, which comprises a probe card, a first support fixed on the upper surface of the probe card, a first lifting assembly arranged on the first support, and a light source assembly; the probe card is provided with a light transmission hole; the first support is arranged on one side of the light transmission hole, a first sliding groove is vertically arranged on the side of the first support facing the light transmission hole, and a first sliding block is arranged in the first sliding groove; the light source assembly comprises a support plate, a light-emitting diode fixed on the lower surface of the support plate, and a relay; the support plate is fixed on the first sliding block, the light-emitting diode is located on the axis of the light transmission hole, the relay is electrically connected with the light-emitting diode, and is used for controlling the working state of the light-emitting diode; the first lifting assembly is connected with the first sliding block, and is used for driving the first sliding block to vertically slide along the first sliding groove. The chip test device provided in the application can realize the high controllability and flexible switching of the light source, can be compatible with the requirements of the light source in each working state of the chip, and has the advantages of simple structure, easy implementation, and the like, and can improve the sensitivity of the light source of the test chip and the convenience in the best working distance.

[0055] It should be understood that in the description of the specification and the appended claims of the application, the terms "comprise", "contain", "have" and any variations of them are intended to cover non-exclusive inclusion, and mean "including but not limited to", unless otherwise specifically emphasized.

[0056] In the description of the application, unless otherwise specified, " / " represents that the objects before and after are in an "or" relationship, for example, A / B can represent A or B; "and / or" in the application is used to describe the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B, which can represent three cases of A alone, A and B together, and B alone, wherein A and B can be singular or plural.

[0057] In addition, in the description of the application, unless otherwise specified, "multiple" means two or more than two. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items.

[0058] In addition, in the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "vertical", "horizontal", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0059] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise explicitly limited, the above-mentioned terms in the present application can be understood according to the specific meaning of the specific circumstances.

[0060] In addition, in the description of the present application and the appended claims, the terms "first", "second" and the like are used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the technical features indicated. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein; the features limited by "first", "second" can explicitly or implicitly include at least one of the features.

[0061] In the embodiments of the present application, the words "exemplarily" or "for example" and the like are used to represent as an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the use of "exemplarily" or "for example" and the like is intended to present the relevant concept in a specific manner.

[0062] Reference throughout this application to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" or "in a various embodiment" or "in some embodiment" or "in other embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment, but can refer to one or more of the same or different embodiments.

[0063] Finally, it should be noted that the above-described embodiments are merely intended for describing and illustrating, not limiting, the technical solutions of the present application; even though the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still make modifications to the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip testing apparatus characterized by comprising: The chip testing device comprises a probe card, a first support fixed on the upper surface of the probe card, a first lifting assembly arranged on the first support, and a light source assembly. The probe card is provided with a light transmission hole. The first support is arranged on one side of the light transmission hole, and a first sliding groove is vertically arranged on the side of the first support facing the light transmission hole. The light source assembly comprises a support plate, a light emitting diode fixed on the lower surface of the support plate, and a relay. The first lifting assembly is connected with the first sliding block and is used for driving the first sliding block to vertically slide along the first sliding groove. The support plate is provided with two insertion holes corresponding to the two pins of the light emitting diode.

2. The chip testing apparatus according to claim 1, wherein The first lifting assembly comprises a first knob and a first transmission assembly.

3. The chip testing apparatus according to claim 1, wherein The chip testing device further comprises a second support and a second lifting assembly arranged on the second support.

4. The chip testing apparatus according to claim 3, wherein The support plate is fixed on the upper surface of the first extension part at one end and is fixed on the upper surface of the second extension part at the other end. The lower surface of the probe card is arranged with probes, the lower part of the probes is arranged with a tray, the tray is placed with a wafer, and the probes are used to contact the pads or bumps of the chips on the wafer. The upper surface of the probe card is further provided with a data interface, and the probe card receives test signals of an ATE tester through the data interface.

5. The chip testing apparatus according to claim 4, wherein ​ 6. The chip testing apparatus according to claim 4, wherein ​ 7. The chip testing apparatus according to claim 1, wherein ​ 8. The chip testing apparatus according to claim 1, wherein ​ 9. The chip testing apparatus according to claim 8, wherein The relay is electrically connected with the ATE tester, and is used for controlling the light-emitting diode to emit light after receiving a driving signal of the ATE tester.

10. The chip testing apparatus according to any one of claims 1 to 9, wherein The relay is welded on the upper surface of the probe card, and the relay is electrically connected with the light-emitting diode through a flying wire.

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