Semiconductor gluing and developing process module

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a semiconductor gluing and developing process module which comprises a machine frame, a flow guide mechanism is fixedly connected outside the machine frame, a gluing and developing machine body is fixedly connected to the top of the machine frame, and the flow guide mechanism comprises two sets of installation supports. The outer portion of the installation support is fixedly connected to the outer portion of the rack, a bolt is arranged in the installation support, the end, close to the rack, of the bolt is fixedly connected with a limiting frame, and the limiting frame is rotationally connected with a plurality of guide wheels. According to the utility model, the module can avoid the friction between the semiconductor article and the limiting frame through the guide wheels, prevent the semiconductor article from rotating and deviating in the conveying process, and realize automatic correction and pushing; the infrared sensor can trigger the air pump when the semiconductor article is moved below the portal frame, the nozzle blows high-pressure air to remove dust and impurities on the surface of the article, and the production quality and the product reliability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing especially relates to a semiconductor gluing and developing process module. BACKGROUND

[0002] A semiconductor is a material with special electrical conductivity properties, its electrical conductivity is between that of a conductor and an insulator, usually composed of elements such as silicon and germanium. The electrical conductivity of a semiconductor can be adjusted by doping different elements, so as to realize the function of conduction or insulation under certain conditions. This characteristic makes the semiconductor become the core material of electronic devices, and is widely used in the manufacture of integrated circuits, transistors, diodes and various electronic components. With the progress of science and technology, semiconductor technology plays a vital role in many fields such as information processing, communication, consumer electronics, energy, automobile and medical treatment, and is the basis of modern electronic products and intelligent devices.

[0003] With the continuous development of the semiconductor industry, especially the continuous reduction of the size of integrated circuits (IC) and microelectronic devices, the precision requirement of the manufacturing process is also higher and higher. In this context, the gluing and developing process as a key step in semiconductor manufacturing, its quality and stability directly affect the final performance and yield of the chip. Therefore, it is very important to ensure the accuracy of the gluing and developing process.

[0004] However, in the traditional semiconductor production process, the semiconductor carrier plate is prone to deviation when being processed and transported to the gluing device. This deviation may cause the gluing nozzle and the developing liquid nozzle to not correspond to the position of the carrier plate, thereby affecting the effect of gluing and developing, and further affecting the quality and yield of the final chip. UTILITY MODEL CONTENT

[0005] In order to make up for the above shortcomings, the utility model provides a semiconductor gluing and developing process module, which aims at improving the problem that the semiconductor material in the prior art is prone to cause the carrier plate to deviate when being processed and transported to the gluing device, causing the gluing nozzle and the developing liquid nozzle to not correspond to the carrier plate, and affecting the effect of gluing and developing.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor gluing and developing process module, comprising a rack, the outside of the rack is fixedly connected with a flow guide mechanism, the top of the rack is fixedly connected with a gluing and developing machine main body;

[0007] The flow guide mechanism comprises two groups of mounting brackets, the outside of the mounting bracket is fixedly connected to the outside of the rack, the inside of the mounting bracket is provided with a bolt, one end of the bolt close to the rack is fixedly connected with a limiting frame, a plurality of guide wheels are rotatably connected to the limiting frame, a guide sliding block is fixedly connected to the side of the limiting frame close to the mounting bracket, and a guide sliding rail is arranged outside the guide sliding block.

[0008] Further, the top of the rack is fixedly connected with a gantry, the top of the gantry is fixedly connected with an air pump, the output end of the air pump is fixedly connected with two gas conveying pipes, the end of the gas conveying pipe away from the air pump is fixedly connected with a gas storage box, and the top of the gas storage box is fixedly connected with a plurality of spray heads.

[0009] Further, the top of the gas storage box is fixedly connected to the inner top of the gantry, the outside of the gantry is fixedly connected with a mounting plate, and the bottom of the mounting plate is fixedly connected with an infrared sensor.

[0010] Further, the outside of the glue coating and developing machine body is fixedly connected with a control panel.

[0011] Further, the outside of the rack is fixedly connected with a motor, the output end of the motor is fixedly connected with a conveying device, and the two ends of the conveying device are arranged in the inside of the rack.

[0012] Further, the bottom corners of the rack are fixedly connected with supporting legs.

[0013] Further, the control panel is electrically connected with the glue coating and developing machine body, the motor, the air pump and the infrared sensor.

[0014] Further, the bottom of the guide rail is fixedly connected to the top of the rack.

[0015] The utility model has the advantages of the following beneficial effects:

[0016] 1、In the utility model, the carrier disc passes between two sets of limiting frames, the flanges of the guide wheels protrude from the limiting frames to contact the carrier disc, the rotation of the guide wheels can avoid friction between the carrier disc and the limiting frames, and the contact between the carrier disc and the guide wheels on both sides thereof can prevent the carrier disc from rotating and deviating during conveying, realize automatic correction and pushing, and thus avoid deviation during conveying.

[0017] 2、In the utility model, the infrared sensor at the bottom of the mounting plate can automatically trigger the infrared sensor when the semiconductor article moves below the gantry. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A perspective view of a semiconductor glue coating and developing process module is provided for the utility model;

[0019] Figure 2The utility model provides a kind of flow guide mechanism schematic diagram of semiconductor gluing developing process module is proposed.

[0020] Figure 3 A part structure schematic view of the semiconductor gluing developing process module is proposed.

[0021] Legend:

[0022] 1, rack;2, support leg;3, gluing developing machine main body;4, conveying device;5, motor;6, control panel;7, gantry;8, mounting plate;9, infrared sensor;10, air pump;11, gas pipe;12, gas storage box;13, spray head;14, limit support;15, guide wheel;16, guide sliding block;17, guide sliding rail;18, mounting bracket;19, bolt. Specific implementation

[0023] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0024] Reference Figure 1 And Figure 2 An embodiment provided by the utility model: a semiconductor gluing developing process module, comprising rack 1, the outside of rack 1 is fixedly connected with flow guide mechanism, the outside of rack 1 is fixedly connected with motor 5, the output end of motor 5 is fixedly connected with conveying device 4, the both ends of conveying device 4 are arranged in the inside of rack 1, the bottom four corners of rack 1 are fixedly connected with support leg 2, the top of rack 1 is fixedly connected with gluing developing machine main body 3, the outside of gluing developing machine main body 3 is fixedly connected with control panel 6, control panel 6 is electrically connected with gluing developing machine main body 3, motor 5, air pump 10 and infrared sensor 9, flow guide mechanism includes two groups of mounting bracket 18, the outside of mounting bracket 18 is fixedly connected in the outside of rack 1, the inside of mounting bracket 18 is provided with bolt 19, one end of bolt 19 close to rack 1 is fixedly connected with limit support 14, limit support 14 is rotatably connected with multiple guide wheels 15, the side of limit support 14 close to mounting bracket 18 is fixedly connected with guide sliding block 16, the outside of guide sliding block 16 is provided with guide sliding rail 17, the bottom of guide sliding rail 17 is fixedly connected in the top of rack 1.

[0025] The motor 5 is used to drive the conveying device 4, the supporting legs 2 are used to support the rack 1, the glue coating and developing machine body 3 is used to coat and develop the semiconductor material, the control panel 6 is used to control the whole equipment, the mounting bracket 18 is used to mount the limiting frame 14 through the bolt 19, the limiting frame 14 is used to slide in the guide sliding rail 17 through the guide sliding block 16, and the guide wheel 15 is used to guide the movement of the carrier plate.

[0026] With reference to Figure 1 And Figure 3 The top of the rack 1 is fixedly connected with a portal frame 7, the top of the portal frame 7 is fixedly connected with an air pump 10, the output end of the air pump 10 is fixedly connected with two gas conveying pipes 11, one end of the gas conveying pipe 11 away from the air pump 10 is fixedly connected with a gas storage box 12, the top of the gas storage box 12 is fixedly connected with a plurality of spray heads 13, the top of the gas storage box 12 is fixedly connected to the inner top of the portal frame 7, the outside of the portal frame 7 is fixedly connected with a mounting plate 8, and the bottom of the mounting plate 8 is fixedly connected with an infrared sensor 9.

[0027] The portal frame 7 is used to mount the air pump 10 and the mounting plate 8, the infrared sensor 9 is mounted at the bottom of the mounting plate 8, whether there is an article passing through is monitored through the infrared sensor 9, high-pressure gas generated by the air pump 10 is conveyed through the gas conveying pipe 11, then the gas enters the inside of the gas storage box 12, and finally is sprayed out through the spray head 13, and the gas storage box 12 is used to store the gas.

[0028] Working principle: in use, the carrier plate loaded with semiconductor materials is placed on the conveying device 4, the carrier plate passes between the two groups of limiting frames 14, the flanges of the guide wheels 15 protrude from the limiting frames 14 so as to be in contact with the carrier plate, through the rotation of the guide wheels 15, friction between the carrier plate and the limiting frames 14 can be avoided, and meanwhile, through the contact between the carrier plate and the guide wheels 15 on both sides thereof, rotation deviation of the carrier plate in the conveying process is prevented, automatic correction and pushing are realized, the carrier plate is conveyed into the inside of the glue coating and developing machine body 3, and after a series of coating and developing operations, the carrier plate is continuously conveyed through the conveying device 4.

[0029] When the carrier plate passes through the infrared sensor 9 at the bottom of the mounting plate 8, the system can automatically trigger the infrared sensor 9 when the carrier plate moves to below the portal frame 7. At this time, the infrared sensor 9 is linked with the control system, the air pump 10 is immediately started, high-pressure air is blown downward through the spray head 13, dust and impurities attached to the surface of the semiconductor material are blown away, and therefore the production quality and the reliability of the product are improved.

[0030] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A semiconductor coating and developing process module comprising a frame (1), characterized in that: The outer part of the rack (1) is fixedly connected with a flow guide mechanism, and the top of the rack (1) is fixedly connected with a rubber coating and developing machine body (3). The flow guide mechanism comprises two groups of mounting brackets (18), the outer part of the mounting bracket (18) is fixedly connected to the outer part of the rack (1), the inner part of the mounting bracket (18) is provided with a bolt (19), one end of the bolt (19) close to the rack (1) is fixedly connected with a limiting frame (14), a plurality of guide wheels (15) are rotatably connected to the limiting frame (14), a guide sliding block (16) is fixedly connected to the side of the limiting frame (14) close to the mounting bracket (18), and the outer part of the guide sliding block (16) is provided with a guide sliding rail (17). 2.The semiconductor coating and developing process module according to claim 1, wherein: The top of the rack (1) is fixedly connected with a portal frame (7), the top of the portal frame (7) is fixedly connected with an air pump (10), the output end of the air pump (10) is fixedly connected with two gas conveying pipes (11), one end of the gas conveying pipe (11) away from the air pump (10) is fixedly connected with a gas storage box (12), and the top of the gas storage box (12) is fixedly connected with a plurality of spray heads (13). 3.The semiconductor coating and developing process module according to claim 2, wherein: The top of the gas storage box (12) is fixedly connected to the inner top of the portal frame (7), the outer part of the portal frame (7) is fixedly connected with a mounting plate (8), and the bottom of the mounting plate (8) is fixedly connected with an infrared sensor (9).

4. The semiconductor coating and developing process module of claim 1, wherein: The outer part of the rubber coating and developing machine body (3) is fixedly connected with a control panel (6).

5. The semiconductor coating and developing process module of claim 1, wherein: The outer part of the rack (1) is fixedly connected with a motor (5), the output end of the motor (5) is fixedly connected with a conveying device (4), and the two ends of the conveying device (4) are arranged in the inner part of the rack (1).

6. The semiconductor coating and developing process module of claim 1, wherein: The bottom corners of the rack (1) are fixedly connected with supporting legs (2).

7. The semiconductor coating and developing process module of claim 4, wherein: The control panel (6) is electrically connected with the rubber coating and developing machine body (3), the motor (5), the air pump (10) and the infrared sensor (9). 8.The semiconductor coating and developing process module of claim 1, wherein: The bottom of the guide sliding rail (17) is fixedly connected to the top of the rack (1).

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