Heat dissipation structure of intelligent door lock VCSEL laser

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to a heat dissipation structure of a VCSEL laser of an intelligent door lock, which greatly improves the stability of the whole intelligent door lock, improves the photoelectric conversion efficiency and prolongs the service life of the VCEL laser by solving the heat dissipation problem of the VCEL laser. Comprising an intelligent door lock circuit board and a VCSEL laser, and the VCSEL laser is installed on the outer side wall of the intelligent door lock circuit board; the intelligent door lock circuit board is provided with a mounting hole, the VCSEL laser is arranged at the mounting hole of the intelligent door lock circuit board, the first group of heat-conducting gel is arranged at the upper part of the outer side wall of the intelligent door lock circuit board, the first group of heat-conducting gel is connected with the outer side wall of the VCSEL laser, and the second group of heat-conducting gel is arranged at the upper part of the outer side wall of the VCSEL laser. The second group of heat-conducting gel is arranged at the bottom end of the VCSEL laser, the bottom end of the second group of heat-conducting gel is connected with the top end of the porous foamy copper, and the second group of porous foamy copper penetrates through the interior of a mounting hole of the intelligent door lock circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of heat dissipation structure, in particular to a kind of heat dissipation structure of intelligent door lock VCSEL laser. BACKGROUND

[0002] The existing intelligent door lock project uses VCSEL laser, mainly 3D sensing, face recognition, VCSEL generates heat when working, when temperature rises, it will cause the temperature of active region to be higher than the substrate temperature, and then cause lasing wavelength drift, threshold current increase, mode instability, photoelectric conversion efficiency reduction, in addition, temperature rise will also cause thermal stress between each material layer of active region, affect the life of laser, so a new type of heat dissipation structure is needed to cool VCSEL laser, reduce the high temperature failure condition. SUMMARY

[0003] To solve the above technical problems, the utility model provides a kind of heat dissipation structure of intelligent door lock VCSEL laser, greatly improve the stability of entire intelligent door lock, photoelectric conversion efficiency is improved, the life of VCEL laser is also improved.

[0004] The utility model discloses a kind of heat dissipation structure of intelligent door lock VCSEL laser, including intelligent door lock circuit board and VCSEL laser, VCSEL laser is installed on the outer side wall of intelligent door lock circuit board;It further includes two groups of heat-conducting gel and porous foam copper, the mounting hole is provided on intelligent door lock circuit board, VCSEL laser is set at the mounting hole of intelligent door lock circuit board, the first group of heat-conducting gel is set on the upper portion of the outer side wall of intelligent door lock circuit board, and the first group of heat-conducting gel is connected with the outer side wall of VCSEL laser, the second group of heat-conducting gel is set at the bottom end of VCSEL laser, and the bottom end of the second group of heat-conducting gel is connected with the top end of porous foam copper, the second group of porous foam copper passes through the inside of the mounting hole of intelligent door lock circuit board;By setting heat-conducting gel and porous foam copper on VCSEL laser, not only can utilize porous foam copper to rapidly conduct heat on VCSEL laser, but also can utilize porous foam copper to buffer shock, so that VCSEL laser is protected, simultaneously utilize heat-conducting gel as the connecting adhesive of VCSEL laser and porous foam copper, can improve the heat conduction performance, enhance the heat dissipation of VCSEL laser, conducive to realizing more practical a kind of heat dissipation structure of intelligent door lock VCSEL laser.

[0005] Preferably, the first group of heat-conducting gel is circumferentially and uniformly arranged on the outer side wall of the VCSEL laser;Improve the adhesion effect of heat-conducting gel on VCSEL laser, improve the positioning firmness of VCSEL laser, and at the same time improve the heat dissipation and cooling effect of heat-conducting gel on VCSEL laser.

[0006] Preferably, the cross section of the first group of heat-conducting gels is triangular; the filling effect of the heat-conducting gels on the joint of the intelligent door lock circuit board and the VCSEL laser is improved, the damage of the heat-conducting gels caused by external friction is reduced, the use amount of the heat-conducting gels is reduced, and the material saving effect is improved.

[0007] Compared with the prior art, the utility model has the advantages that: by setting the heat-conducting gel and the porous foam copper on the VCSEL laser, the heat on the VCSEL laser can be quickly conducted by the porous foam copper, and the porous foam copper can be used for shock absorption and buffering, so that the VCSEL laser is protected, the heat-conducting gel is used as the connecting and bonding material of the VCSEL laser and the porous foam copper, the heat-conducting performance is improved, the heat dissipation of the VCSEL laser is enhanced, and a more practical heat dissipation structure of the intelligent door lock VCSEL laser is realized. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 It is a structural schematic diagram of the utility model;

[0009] Figure 2 It is a structural schematic diagram of the connection of the VCSEL laser and the heat-conducting gel;

[0010] Figure 3 It is a structural schematic diagram of the connection of the intelligent door lock circuit board and the porous foam copper;

[0011] Figure 4 It is a local structural schematic diagram of the connection of the heat-conducting gel and the porous foam copper.

[0012] In the drawings, 1 is an intelligent door lock circuit board, 2 is a VCSEL laser, 3 is a heat-conducting gel, and 4 is a porous foam copper. DETAILED DESCRIPTION

[0013] In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The utility model can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0014] Embodiment 1

[0015] As Figures 1 to 4As shown in the utility model, a kind of heat dissipation structure of intelligent door lock VCSEL laser of the utility model, including intelligent door lock circuit board 1 and VCSEL laser 2, VCSEL laser 2 is installed on the outer side wall of intelligent door lock circuit board 1;It further includes two groups of heat-conducting gel 3 and porous foam copper 4, and the mounting hole is provided on intelligent door lock circuit board 1, and VCSEL laser 2 is arranged at the mounting hole of intelligent door lock circuit board 1, the first group of heat-conducting gel 3 is arranged on the upper portion of the outer side wall of intelligent door lock circuit board 1, and the first group of heat-conducting gel 3 is connected with the outer side wall of VCSEL laser 2, the second group of heat-conducting gel 3 is arranged at the bottom end of VCSEL laser 2, and the bottom end of the second group of heat-conducting gel 3 is connected with the top end of porous foam copper 4, and the second group of porous foam copper 4 passes through the inside of the mounting hole of intelligent door lock circuit board 1;

[0016] As Figure 1 Shown, the first group of heat-conducting gel 3 is circumferentially evenly arranged on the outer side wall of VCSEL laser 2;

[0017] In the embodiment, by setting heat-conducting gel 3 and porous foam copper 4 on VCSEL laser 2, not only the heat on VCSEL laser 2 can be quickly conducted by porous foam copper 4, but also damping and buffering can be carried out by porous foam copper 4, so that VCSEL laser 2 is protected, and heat-conducting gel 3 is used as the connecting adhesive of VCSEL laser 2 and porous foam copper 4, which can improve the heat conduction performance, enhance the heat dissipation of VCSEL laser 2, and be beneficial to realize a more practical heat dissipation structure of intelligent door lock VCSEL laser.

[0018] Embodiment 2

[0019] Based on embodiment 1, as Figure 2 Shown, a kind of heat dissipation structure of intelligent door lock VCSEL laser of the utility model, the cross section of the first group of heat-conducting gel 3 is set to triangle;

[0020] In the embodiment, the adhesion effect of heat-conducting gel 3 to VCSEL laser 2 is improved, the positioning firmness of VCSEL laser 2 is improved, the heat dissipation and cooling effect of heat-conducting gel 3 to VCSEL laser 2 is improved, the filling effect of heat-conducting gel 3 to the junction of intelligent door lock circuit board 1 and VCSEL laser 2 is improved, the situation that heat-conducting gel 3 is damaged by external friction is reduced, the amount of heat-conducting gel 3 is reduced, and material saving effect is improved.

[0021] The heat dissipation structure of the intelligent door lock VCSEL laser device of the utility model, when working, through setting heat-conducting gel 3 and porous foam copper 4 on the VCSEL laser device 2, not only can utilize the porous foam copper 4 to quickly conduct heat to the heat on the VCSEL laser device 2, but also can utilize the porous foam copper 4 to shock-absorb and buffer, so that the VCSEL laser device 2 is protected, simultaneously utilizes the heat-conducting gel 3 as the connecting adhesive of the VCSEL laser device 2 and the porous foam copper 4, can promote the heat conduction performance, enhances the heat dissipation of the VCSEL laser device 2.

[0022] The intelligent door lock circuit board 1 and the VCSEL laser device 2 of the heat dissipation structure of the intelligent door lock of the utility model are purchased on the market, and the technical personnel in the industry only needs to install and operate according to the attached instruction manual, without the creative labor of the technical personnel in the field.

[0023] The above is only the preferred embodiment of the utility model, and it should be pointed out that for the ordinary technical personnel in the technical field, without departing from the technical principle of the utility model, a number of improvements and modifications can be made, and these improvements and modifications should be regarded as the protection range of the utility model.

Claims

1. A heat dissipation structure of a smart door lock VCSEL laser, comprising a smart door lock circuit board (1) and a VCSEL laser (2), the VCSEL laser (2) is installed on the outer side wall of the smart door lock circuit board (1); characterized in that, Also include two groups of heat-conducting gel (3) and porous foam copper (4), the smart door lock circuit board (1) is provided with a mounting hole, the VCSEL laser (2) is arranged at the mounting hole of the smart door lock circuit board (1), the first group of heat-conducting gel (3) is arranged on the upper portion of the outer side wall of the smart door lock circuit board (1), and the first group of heat-conducting gel (3) is connected with the outer side wall of the VCSEL laser (2), the second group of heat-conducting gel (3) is arranged at the bottom end of the VCSEL laser (2), and the bottom end of the second group of heat-conducting gel (3) is connected with the top end of the porous foam copper (4), and the second group of porous foam copper (4) passes through the inside of the mounting hole of the smart door lock circuit board (1).

2. The heat dissipation structure of the intelligent door lock VCSEL laser according to claim 1, wherein, The first group of heat-conducting gel (3) is circumferentially and uniformly arranged on the outer side wall of the VCSEL laser (2).

3. The heat dissipation structure of the intelligent door lock VCSEL laser according to claim 1, wherein, The cross section of the first group of heat-conducting gel (3) is triangular.

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