Circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board, which has a first direction, a second direction and a third direction which are intersected pairwise, and comprises a substrate, the substrate is provided with at least one hollow-out opening, the hollow-out opening penetrates through the substrate along the first direction, and at least one part of the inner wall of the hollow-out opening is configured to be arc-shaped; the circuit layer is arranged on one side of the substrate along the first direction; each first bonding pad is arranged on one side, in the first direction, of the substrate and connected with the circuit layer, the first bonding pads are arranged at intervals in the second direction, the first bonding pads extend in the third direction, and at least one hollowed-out opening is formed between any two adjacent first bonding pads. The circuit board provided by the embodiment of the utility model has the advantages of low false soldering and tin connection probability and high yield.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely relates to circuit board. BACKGROUND

[0002] The circuit board in the prior art comprises a substrate and a solder pad, the solder pad is arranged on the substrate, when the solder pad of the circuit board is welded with an external electrical component, the solder of the solder pad can flow to the solder pad adjacent to the solder pad through the substrate, resulting in false welding and soldering phenomenon, and after welding, it is necessary to identify whether there is a false welding and soldering problem by human eyes or instruments, which not only wastes manpower, but also has the risk of not being identified, thereby reducing the yield, especially when the substrate is polyimide, the substrate is yellow or black, it is more difficult to identify whether there is a false welding and soldering problem. SUMMARY

[0003] Therefore, the utility model provides a circuit board to solve the problem of high false welding and soldering probability.

[0004] The utility model provides a kind of circuit board, with first direction, second direction and third direction intersecting each other, comprising: substrate, the substrate is equipped with at least one hollow, the hollow is along the first direction and penetrates the substrate, and at least a portion of the inner wall of the hollow is configured as arc shape;Circuit layer, the circuit layer is arranged on the substrate along the first direction one side;Multiple first solder pad, each first solder pad is arranged on the substrate along the first direction one side and is connected with the circuit layer, multiple first solder pad is spaced apart along the second direction, and the first solder pad extends along the third direction, and there is at least one hollow between any two adjacent first solder pads.

[0005] Beneficial effect: by being provided with hollow between any two adjacent first solder pads, the area of substrate between two adjacent first solder pads is reduced, and the solder (such as solder) on each first solder pad is not easy to spread to the adjacent first solder pad through the substrate, so that the problems such as soldering and false welding are greatly avoided, the product quality is improved, and the yield is ensured.Through the arc shape of at least a portion of the inner wall of the hollow, according to the principle of fluid mechanics, the solder can flow along the arc region of the inner wall of the hollow during welding, and will accumulate at the top end of the arc region, not easy to spread, which can reduce the phenomenon of soldering and false welding, and since the soldering is reduced, the workload of subsequent manual or machine inspection and solder scraping is saved, and the waste of manpower is avoided.

[0006] In an alternative embodiment, the hollow and the plurality of first solder pads are located on the same side of the circuit layer along the third direction, and the hollow penetrates the edge of the substrate from the side opposite to the circuit layer along the third direction.

[0007] Beneficial effects: The hollow opening can be constructed from the edge of the substrate, and the construction of the hollow opening is more convenient, improving the production efficiency.

[0008] In an alternative embodiment, the side wall of the hollow opening along the third direction is arc-shaped, and the two side walls of the hollow opening along the second direction are planar.

[0009] Beneficial effects: The inner walls of the hollow opening can be smoothly transitioned, avoiding the generation of obvious angles between the inner walls of the hollow opening, and the solder flows more smoothly on the inner walls of the hollow opening during the soldering of the circuit board, further reducing the probability of problems such as continuous soldering and false soldering.

[0010] In an alternative embodiment, the inner wall of the hollow opening is constructed as a closed ring.

[0011] Beneficial effects: Avoid tearing the edge of the substrate, which is conducive to ensuring the structural strength of the substrate and reducing the probability of damage to the substrate, thereby ensuring the structural integrity of the first pads and the circuit layer.

[0012] In an alternative embodiment, the hollow opening is constructed as a circle; or the two side walls of the hollow opening along the second direction are constructed as planes, and the two side walls of the hollow opening along the third direction are constructed as arc shapes.

[0013] Beneficial effects: The inner walls of the hollow opening are uniformly stressed and are not prone to tearing or breaking, thereby prolonging the service life of the circuit board. The arc-shaped proportion of the inner walls of the hollow opening is large, which can more effectively guide the flow of solder, thereby reducing the probability of problems such as continuous soldering and false soldering.

[0014] In an alternative embodiment, the hollow opening and the plurality of first pads are located on the same side of the circuit layer along the third direction; in the third direction, the side wall of the hollow opening facing the circuit layer protrudes from or is flush with the side of the first pad facing the circuit layer.

[0015] Beneficial effects: The hollow opening can completely separate adjacent first pads, more effectively reducing the probability of problems such as continuous soldering and false soldering.

[0016] In an alternative embodiment, the circuit board further comprises: a plurality of second pads, each of which is arranged on the substrate and connected to the circuit layer, the first pads and the second pads being located on opposite sides of the substrate along the first direction, the plurality of second pads being spaced apart along the second direction, the second pads extending along the third direction, and any two adjacent second pads having at least one hollow opening therebetween.

[0017] Beneficial effects: can increase the soldering point of the circuit board, increase the connection efficiency of the circuit board and the external electrical components, and improve the space utilization of the substrate. Moreover, there is at least one hollow opening between any two adjacent second pads, which can separate at least part of the two adjacent second pads and reduce the risk of tin connection and false welding of the two adjacent second pads.

[0018] In an optional embodiment, the hollow openings, the first pads and the second pads are located on the same side of the circuit layer along the third direction; along the third direction, the side of the first pad facing the circuit layer is beyond the side of the second pad facing the circuit layer, and the side wall of the hollow opening facing the circuit layer is protruding from or flush with the side of the second pad facing the circuit layer; or along the third direction, the side of the second pad facing the circuit layer is beyond the side of the first pad facing the circuit layer, and the side wall of the hollow opening facing the circuit layer is protruding from or flush with the side of the first pad facing the circuit layer.

[0019] Beneficial effects: on the one hand, it can ensure that the hollow opening can separate at least adjacent first pads or adjacent second pads, which is conducive to avoiding at least tin connection of adjacent first pads or tin connection of adjacent second pads, optimizing the welding effect, and the depth of the hollow opening will not be too large to avoid the distance between the hollow opening and the circuit layer being too close, which can easily cause the circuit layer to be torn, effectively ensuring the integrity of the circuit layer.

[0020] In an optional embodiment, along the third direction, the side of the first pad away from the circuit layer extends to the edge of the substrate; and / or along the third direction, the side of the second pad away from the circuit layer extends to the edge of the substrate.

[0021] Beneficial effects: increasing the size of the first pad and the second pad is conducive to increasing the soldering area of the circuit board and other electrical components, reducing the risk of false welding, and improving the reliability of the circuit board.

[0022] In an optional embodiment, the substrate is configured as a polygon, and at least one side edge of the substrate is provided with the hollow openings and the first pads; or the substrate is configured as a circle, and the first pads are arranged along the circumference of the substrate, and the hollow openings are arranged along the circumference of the substrate.

[0023] Beneficial effects: increasing the number of first pads improves the convenience of using the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings described below are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0025] Figure 1 The sectional view of the circuit board of the embodiment of the present application;

[0026] Figure 2 The structural schematic diagram one of the circuit board of the embodiment of the present application;

[0027] Figure 3 The structural schematic diagram two of the circuit board of the embodiment of the present application.

[0028] Explanation of reference signs:

[0029] 1, circuit board; 100, substrate; 110, hollow opening; 200, circuit layer; 210, circuit layering; 300, first pad; 400, second pad; 500, insulating cover film. Specific embodiments

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0031] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In the description of the present application, the meaning of "multiple" is two or more. In addition, the terms "first", "second", "third" are only for description purpose, and cannot be understood as indicating or implying relative importance.

[0033] In the description of the utility model, it is explained that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be direct connection, or indirect connection through intermediate medium, it can be internal communication of two elements. For ordinary skilled in the art, the above terms can be understood according to the specific meaning of the utility model.

[0034] The embodiments of the utility model are described below in combination with Figures 1 to 3

[0035] According to the embodiments of the utility model, a circuit board 1 is provided, and the circuit board 1 has a first direction Z, a second direction X and a third direction Y intersecting with each other. The circuit board 1 comprises a substrate 100, a circuit layer 200 and a plurality of first pads 300. The circuit board 1 is mainly applied to three types of consumer electronics product fields of computer (Computer), communication (Communication) and consumer electronics (Consumer Electronics), and the circuit board 1 can be directly applied to notebook computer battery, mobile phone battery, wearable device battery and the like equipment.

[0036] The substrate 100 is provided with at least one hollow opening 110, the hollow opening 110 penetrates the substrate 100 along the first direction Z, at least a part of the inner wall of the hollow opening 110 is configured as an arc shape, the circuit layer 200 is arranged on one side of the substrate 100 along the first direction Z, each first pad 300 is arranged on one side of the substrate 100 along the first direction Z and connected with the circuit layer 200, the plurality of first pads 300 are arranged at intervals along the second direction X, the first pad 300 extends along the third direction Y, and there is at least one hollow opening 110 between any two adjacent first pads 300. Wherein, the first pad 300 and the circuit layer 200 can be located on the same side of the substrate 100 along the first direction Z, or the first pad 300 and the circuit layer 200 can be located on opposite sides of the substrate 100 along the first direction Z.

[0037] Wherein, the circuit board 1 can be a flexible circuit board (Flexible Printed Circuit, FPC), the substrate 100 is a flexible substrate, and the material of the substrate 100 can be polyimide (Polyimide, PI). The substrate 100 is convenient for setting the hollow opening 110, and the hollow opening 110 has higher adaptability with the circuit board 1.

[0038] ​In addition, the substrate 100 is polygonal in shape, and at least one side edge of the substrate 100 is provided with a cutout 110 and a first pad 300. The substrate 100 can be rectangular or an irregular polygon, etc., and the first pad 300 can be arranged on opposite sides of the substrate 100. Alternatively, the substrate 100 can be circular in shape, with the first pads 300 spaced apart circumferentially along the substrate 100, and the cutouts 110 spaced apart circumferentially along the substrate 100.

[0039] This increases the number of first pads 300, improves the ease of use of circuit board 1, and makes the shape of circuit board 1 more diverse, which is beneficial for its application in different devices and expands the application range of circuit board 1.

[0040] By providing a cutout 110 between any two adjacent first pads 300, thus reducing the area of ​​the substrate 100 between two adjacent first pads 300, when the circuit board 1 is soldered to other electrical components, such as when the circuit board 1 is soldered to a rigid circuit board (PCB), the solder (e.g., solder) on each first pad 300 is less likely to spread through the substrate 100 to the adjacent first pads 300, thereby greatly avoiding problems such as solder bridging and false soldering, improving product quality, and thus ensuring yield.

[0041] By constructing at least a portion of the inner wall of the cutout 110 as an arc shape, according to the principles of fluid dynamics, the solder can flow along the arc-shaped area of ​​the inner wall of the cutout 110 during welding, and will accumulate at the top of the arc-shaped area, making it less prone to diffusion. This can reduce the phenomenon of bridging and false soldering. Furthermore, by reducing bridging, it also saves the workload of subsequent manual or machine inspection and solder scraping, avoiding the waste of manpower.

[0042] like Figure 2 and Figure 3 As shown, in the technical solution of this embodiment, the cutout 110 and the plurality of first pads 300 are located on the same side of the circuit layer 200 along the third direction Y. Along the third direction Y, the sidewall of the cutout 110 facing the circuit layer 200 protrudes from the side of the first pads 300 facing the circuit layer 200, or the sidewall of the cutout 110 facing the circuit layer 200 is flush with the side of the first pads 300 facing the circuit layer 200.

[0043] In this way, the cutout 110 can completely separate the adjacent first pads 300, more effectively reducing the probability of solder bridging and false solder joints.

[0044] like Figure 1As shown, in this embodiment, the circuit board 1 further includes a plurality of second pads 400. Each second pad 400 is disposed on one side of the substrate 100 along the first direction Z and connected to the circuit layer 200. The first pad 300 and the second pad 400 are located on opposite sides of the substrate 100 along the first direction Z. The plurality of second pads 400 are arranged at intervals along the second direction X. The second pads 400 extend along the third direction Y. At least one cutout 110 is provided between any two adjacent second pads 400. That is, the first pad 300 and the circuit layer 200 are located on the same side of the substrate 100 along the first direction Z, or the second pad 400 and the circuit layer 200 are located on the same side of the substrate 100 along the first direction Z.

[0045] This increases the number of soldering points on the circuit board 1, improves the connection efficiency between the circuit board 1 and external electrical components, and enhances the space utilization on the substrate 100. Furthermore, at least one cutout 110 is provided between any two adjacent second solder pads 400. The cutout 110 can separate at least a portion of the two adjacent second solder pads 400, reducing the risk of solder bridging or false soldering between adjacent second solder pads 400, improving the interception of defective products, and increasing product quality and yield.

[0046] In some unillustrated technical solutions, the cutout 110, multiple first pads 300, and multiple second pads 400 are located on the same side of the circuit layer 200 along the third direction Y. Along the third direction Y, the side of the first pads 300 facing the circuit layer 200 extends beyond the side of the second pads 400 facing the circuit layer 200, the sidewall of the cutout 110 facing the circuit layer 200 protrudes beyond the side of the second pads 400 facing the circuit layer 200, or the sidewall of the cutout 110 facing the circuit layer 200 is flush with the side of the second pads 400 facing the circuit layer 200.

[0047] like Figure 2 and Figure 3 As shown, in the technical solution of this embodiment, the cutout 110, the plurality of first pads 300, and the plurality of second pads 400 are located on the same side of the circuit layer 200 along the third direction Y. Along the third direction Y, the side of the second pads 400 facing the circuit layer 200 extends beyond the side of the first pads 300 facing the circuit layer 200, and the sidewall of the cutout 110 facing the circuit layer 200 protrudes beyond the side of the first pads 300 facing the circuit layer 200, or the sidewall of the cutout 110 facing the circuit layer 200 is flush with the side of the first pads 300 facing the circuit layer 200.

[0048] When the first pad 300 and the second pad 400 are flush with the side of the circuit layer 200 along the third direction Y, the side wall of the hollow 110 facing the circuit layer 200 can protrude from the side of the first pad 300 facing the circuit layer 200, or the side wall of the hollow 110 facing the circuit layer 200 can be flush with the side of the first pad 300 facing the circuit layer 200.

[0049] In this way, on the one hand, the hollow 110 can at least separate two adjacent first pads 300 or two adjacent second pads 400, which is beneficial to at least avoid the soldering of two adjacent first pads 300 or two adjacent second pads 400, optimize the soldering effect, and the depth of the hollow 110 will not be too large to avoid the distance between the hollow 110 and the circuit layer 200 being too close, which can easily cause the circuit layer 200 to be torn, effectively ensuring the integrity of the circuit layer 200, improving the interception of defective products, and improving the quality rate of products.

[0050] As shown in Figure 2 In the technical solution of the embodiment, the hollow 110 and the plurality of first pads 300 are located on the same side of the circuit layer 200 along the third direction Y, and the hollow 110 penetrates the edge of the substrate 100 from the side of the circuit layer 200 along the third direction Y. In this way, the hollow 110 can be constructed from the edge of the substrate 100, and the construction of the hollow 110 is more convenient, which improves the production efficiency.

[0051] As shown in Figure 2 In the technical solution of the embodiment, the side wall of the hollow 110 along the third direction Y is arc-shaped, and the two side walls of the hollow 110 along the second direction X are planar and parallel to each other, wherein the central angle of the bottom wall of the hollow 110 can be 90°.

[0052] In this way, the inner wall of the hollow 110 can be smoothly transitioned, avoiding the inner wall of the hollow 110 from having a sharp angle, and the solder flows more smoothly on the inner wall of the hollow 110 when the circuit board 1 is soldered, further reducing the probability of problems such as soldering and false soldering, improving the interception of defective products, and improving the quality rate of products.

[0053] In addition, the plurality of first pads 300 can be parallel to each other, and the plurality of second pads 400 can be parallel to each other, so that the distance between two adjacent first pads 300 is always constant, and the distance between two adjacent second pads 400 is always constant, thereby reducing the probability of soldering between two adjacent first pads 300 and the probability of soldering between two adjacent second pads 400, improving the interception of defective products, improving the quality rate of products, and improving the space utilization rate on the circuit board 1.

[0054] It should be noted that the width of the multiple cutouts 110 can be exactly the same, or at least two of the multiple cutouts 110 can have different widths.

[0055] like Figure 3 As shown, in the technical solution of this embodiment, the inner wall of the cutout 110 is constructed as a closed ring. This avoids tearing the edge of the substrate 100, which helps to ensure the structural strength of the substrate 100, reduces the probability of damage to the substrate 100, and thus ensures the structural integrity of the first pad 300 and the circuit layer 200.

[0056] In some unshown technical solutions, the cutout 110 is circular. Or, as... Figure 3 As shown, in the technical solution of this embodiment, the two side walls of the cutout 110 along the second direction X are planar and parallel to each other, and the two bottom walls of the cutout 110 along the third direction Y are arc-shaped. That is to say, the side of the cutout 110 facing away from the circuit layer 200 does not penetrate the edge of the substrate 100.

[0057] In this way, the inner wall of the cutout 110 is subjected to uniform stress, making it less prone to tearing or breakage, thus extending the service life of the circuit board 1. The large arc proportion of the inner wall of the cutout 110 can more effectively guide the flow of solder, thereby reducing the probability of solder bridging and false solder joints.

[0058] like Figure 3 As shown, in the technical solution of this embodiment, the cutout 110 and the plurality of first pads 300 are located on the same side of the circuit layer 200 along the third direction Y. Along the third direction Y, the side of the cutout 110 near the circuit board 1 extends beyond or is flush with the side of the first pads 300 near the circuit board 1, and the side of the cutout 110 away from the circuit board 1 extends beyond or is flush with the side of the first pads 300 away from the circuit board 1.

[0059] In this way, the cutout 110 can completely isolate the two adjacent first solder pads 300, effectively reducing the probability of solder bridging and false soldering, improving soldering reliability, increasing the interception of defective products, and improving product quality and yield.

[0060] In some embodiments not shown, the cutout 110 and the plurality of first pads 300 are located on the same side of the circuit layer 200 along the third direction Y. Along the third direction Y, the side of the cutout 110 near the circuit board 1 extends beyond or is flush with the side of the second pad 400 near the circuit board 1, and the side of the cutout 110 away from the circuit board 1 extends beyond or is flush with the side of the second pad 400 away from the circuit board 1.

[0061] In this way, the cutout 110 can completely isolate the two adjacent second solder pads 400, effectively reducing the probability of solder bridging and false soldering, improving soldering reliability, increasing the interception of defective products, and improving product quality and yield.

[0062] As shown in the technical scheme of the embodiment, the first pad 300 extends to the edge of the substrate 100 along the third direction Y from the side of the circuit layer 200. Figure 2

[0063] Since the side of the hollow opening 110 away from the circuit layer 200 penetrates the edge of the substrate 100, even if the side of the first pad 300 away from the circuit layer 200 extends to the edge of the substrate 100, the side of the adjacent first pad 300 away from the circuit layer 200 is separated by the hollow opening 110, and the size of the first pad 300 is increased, which is beneficial to increase the welding area of the circuit board 1 and other electrical components, reduce the risk of false welding, improve the reliability of the circuit board in use, improve the interception of defective products, and improve the quality yield of products.

[0064] As shown in the technical scheme of the embodiment, the second pad 400 extends to the edge of the substrate 100 along the third direction Y from the side of the circuit layer 200. Figure 1

[0065] Since the side of the hollow opening 110 away from the circuit layer 200 penetrates the edge of the substrate 100, even if the side of the second pad 400 away from the circuit layer 200 extends to the edge of the substrate 100, the side of the adjacent second pad 400 away from the circuit layer 200 is separated by the hollow opening 110, and the size of the second pad 400 is increased, which is beneficial to increase the welding area of the circuit board 1 and other electrical components, reduce the risk of false welding, improve the reliability of the circuit board in use, improve the interception of defective products, and improve the quality yield of products.

[0066] As shown in the technical scheme of the embodiment, the circuit board 1 further comprises an insulating cover film 500 covering the side of the circuit layer 200 away from the substrate 100. Figure 1 By arranging the insulating cover film 500, on the one hand, the circuit layer 200 is prevented from being exposed to the external environment, thereby effectively preventing the circuit layer 200 from being oxidized, and on the other hand, the circuit layer 200 is prevented from being mistakenly contacted with external substances to cause short circuit or wear, thereby reducing the damage probability of the circuit board 1, ensuring the normal use of the circuit board 1, improving the interception of defective products, and improving the quality yield of products.

[0067]

[0068] ​​​The circuit layer 200 can include two circuit sub-layers 210, one circuit sub-layer 210 and the first pad 300 are located on the same side of the substrate 100, and the other circuit sub-layer 210 and the second pad 400 are located on the same side of the substrate 100, and the insulating cover film 500 can also be provided with two, two insulating cover films 500 are arranged on opposite sides of the substrate 100, one insulating cover film 500 covers one side of the circuit sub-layer 210 on the same side of the first pad 300 and away from the substrate 100, and the other insulating cover film 500 covers one side of the circuit sub-layer 210 on the same side of the second pad 400 and away from the substrate 100.

[0069] In this way, the space utilization of the substrate 100 can be improved, and the electrical connection safety of the circuit board 1 can be ensured, and the circuit layer 200 can be prevented from being worn.

[0070] Although the embodiments of the present application are described in conjunction with the drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes fall within the scope defined by the appended claims.

Claims

1. A circuit board having a first direction (Z), a second direction (X), and a third direction (Y) intersecting in pairs, characterized in that, include: A substrate (100) is provided with at least one cutout (110), the cutout (110) penetrates the substrate (100) along the first direction (Z), and at least a portion of the inner wall of the cutout (110) is arc-shaped. A circuit layer (200) is disposed on one side of the substrate (100) along the first direction (Z); A plurality of first pads (300) are provided on one side of the substrate (100) along the first direction (Z) and connected to the circuit layer (200). The plurality of first pads (300) are arranged at intervals along the second direction (X). The first pads (300) extend along the third direction (Y). At least one cutout (110) is provided between any two adjacent first pads (300).

2. The circuit board according to claim 1, characterized in that, The cutout (110) and the plurality of first pads (300) are located on the same side of the circuit layer (200) along the third direction (Y), and the cutout (110) extends through the edge of the substrate (100) along the side opposite to the circuit layer (200) along the third direction (Y).

3. The circuit board according to claim 2, characterized in that, The cutout (110) is arc-shaped along the side wall of the third direction (Y), and the two side walls of the cutout (110) along the second direction (X) are planar.

4. The circuit board according to claim 1, characterized in that, The inner wall of the perforated opening (110) is a closed ring.

5. The circuit board according to claim 4, characterized in that, The perforation (110) is circular; or The two side walls of the cutout (110) along the second direction (X) are planar, and the two side walls of the cutout (110) along the third direction (Y) are arc-shaped.

6. The circuit board according to claim 1, characterized in that, The cutout (110) and the plurality of first pads (300) are located on the same side of the circuit layer (200) along the third direction (Y); In the third direction (Y), the cutout (110) protrudes from or is flush with the sidewall of the circuit layer (200) facing the first pad (300) on the side facing the circuit layer (200).

7. The circuit board according to claim 1, characterized in that, Also includes: A plurality of second pads (400) are provided on the substrate (100) and connected to the circuit layer (200). The first pad (300) and the second pads (400) are located on opposite sides of the substrate (100) along the first direction (Z). The plurality of second pads (400) are arranged at intervals along the second direction (X). The second pads (400) extend along the third direction (Y). At least one cutout (110) is provided between any two adjacent second pads (400).

8. The circuit board according to claim 7, characterized in that, The cutout (110), the plurality of first pads (300) and the plurality of second pads (400) are located on the same side of the circuit layer (200) along the third direction (Y); Along the third direction (Y), the side of the first pad (300) facing the circuit layer (200) extends beyond the side of the second pad (400) facing the circuit layer (200), and the cutout (110) protrudes from or is flush with the sidewall of the second pad (400) facing the circuit layer (200); or Along the third direction (Y), the side of the second pad (400) facing the circuit layer (200) extends beyond the side of the first pad (300) facing the circuit layer (200), and the cutout (110) protrudes from or is flush with the side of the first pad (300) facing the circuit layer (200).

9. The circuit board according to claim 8, characterized in that, Along the third direction (Y), the first pad (300) extends from the side opposite to the circuit layer (200) to the edge of the substrate (100); and / or Along the third direction (Y), the second pad (400) extends to the edge of the substrate (100) on the side opposite to the circuit layer (200).

10. The circuit board according to any one of claims 1-9, characterized in that, The substrate (100) is polygonal in shape, and at least one side edge of the substrate (100) is provided with the cutout (110) and the first pad (300); or The substrate (100) is circular in shape, the first pad (300) is spaced apart along the circumference of the substrate (100), and the cutouts (110) are spaced apart along the circumference of the substrate (100).

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